CN107787122A - Circuit board line compensation method and device - Google Patents
Circuit board line compensation method and device Download PDFInfo
- Publication number
- CN107787122A CN107787122A CN201610716988.0A CN201610716988A CN107787122A CN 107787122 A CN107787122 A CN 107787122A CN 201610716988 A CN201610716988 A CN 201610716988A CN 107787122 A CN107787122 A CN 107787122A
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- Prior art keywords
- line
- circuit
- compensated
- spacing
- compensation
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Abstract
A kind of circuit board line compensation method, including：Obtain circuit to be compensated；Obtain the circuit to be compensated line width and the circuit to be compensated and the circuit plate element of adjacent both sides between First Line away from the second line-spacing；The compensation policy of the circuit to be compensated is determined away from, second line-spacing according to the line width and the First Line；The circuit to be compensated is compensated according to the compensation policy, is compensated rear circuit board line figure.The application furthermore provides a kind of circuit board line compensation device.By obtaining the line width and line-spacing of circuit to be compensated, it is determined that it is adapted to the compensation policy of the circuit to be compensated, and the circuit board line figure formed after compensation, so as to be controlled according to the design parameter of the circuit board line figure after compensation to the processing procedure of circuit board.
Description
Technical field
The present invention relates to circuit board making field, more particularly to a kind of circuit board line compensation method and use the circuit board
The circuit board line compensation device of line build-out method.
Background technology
Printed wiring board (Printed Circuit Board, PCB) be on insulation board base material according to be pre-designed selection
Property arrangement conductive pattern and intercommunicating pore, realize that signal transmits between flaggy, its generally by cover Copper base material through press mold, exposure, development,
The technique such as etching, gold-plated is made.In recent years, as the function of various portable consumer electronics products is continuously increased, and volume will
Ask less and less, the pcb board of inevitable requirement carrying electronic component is also quickly to light, thin, short, smallization development, high density interconnection
Pcb board (High Density Interconnection, HDI) application it is also more and more extensive, such as mobile phone, semiconductor packages base
The fields such as plate, automobile satellite navigation system, tablet personal computer must be supported by HDI plates, increasing to the demand of HDI plates,
It is required that also more and more higher.HDI line width line-spacings high-end at present have reached 2mil (Mill), to HDI plate face copper uniformity requirements
More and more higher, any defect in its precise circuit can be evolved into that circuit is bad, and the consequence directly resulted in is formed into product once
The decline of qualification rate, the rising of cost, the series of malpractice such as the reduction of production efficiency and life cycle of the product extension.
In the precise circuit etching process of current printed circuit board, the etching of the etch-rates of general edges of boards than plate center
Speed is fast, for this phenomenon, it is necessary to correction-compensation subsequent etching processes parameter, realizes the making of fine-line.However, in general
It is manually to be operated to change circuit etching technological parameter, and workload is big, and is unable to reach the mesh for the amendment that becomes more meticulous
Mark.
The content of the invention
Based on this, it is necessary to provide a kind of circuit board line compensation method for being able to ensure that quality of circuit board and device.
A kind of circuit board line compensation method, including：
Obtain circuit to be compensated；
Between the line width and the circuit to be compensated and the circuit plate element of adjacent both sides that obtain the circuit to be compensated
First Line away from the second line-spacing；
The compensation policy of the circuit to be compensated is determined away from, second line-spacing according to the line width and the First Line；
The circuit to be compensated is compensated according to the compensation policy, is compensated rear circuit board line figure.
A kind of circuit board line compensation device, including：
First acquisition module, for obtaining circuit to be compensated；
Second acquisition module, obtain the line width and the circuit to be compensated and the electricity of adjacent both sides of the circuit to be compensated
First Line between the plate element of road away from the second line-spacing；
Compensation policy determining module, described in being determined according to the line width and the First Line away from, second line-spacing
The compensation policy of circuit to be compensated；
Compensating module, for being compensated according to the compensation policy to the circuit to be compensated, it is compensated rear circuit
Plate line map.
The road compensation method of foregoing circuit printed line and device, by obtaining the line width and line-spacing of circuit to be compensated, it is determined that being adapted to
The compensation policy of the circuit to be compensated, and the circuit board line figure formed after compensation, with setting for the circuit board line figure after compensation
Parameter is counted as the design parameter during board production, according to the design parameter of circuit in the circuit board line figure after compensation
The processing procedure of circuit board is controlled, so as to may be such that the circuit on circuit board that production obtains can be with actually required line width and line
Away from identical, lifting circuit board making yield, it is ensured that the quality of circuit board.
Brief description of the drawings
Fig. 1 is the schematic diagram of circuit board line compensation method in an embodiment；
Fig. 2 is the schematic diagram of circuit etching in an embodiment；
Fig. 3 is the schematic diagram of circuit board line compensation method in another embodiment；
Fig. 4 is the schematic diagram of circuit board line compensation device in one embodiment；
Fig. 5 is the schematic diagram of circuit board line compensation device in another embodiment；
Fig. 6 be it is compensated after circuit board line design drawing schematic diagram.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
In order to ensure the making of current printed circuit board fine-line, the embodiment of the application one provides a kind of circuit board
Line build-out method, specifically comprises the following steps.
Step 101, circuit to be compensated is obtained.
For printed circuit board, the generation technique of precise circuit is relative difficult control and easily causes to make bad
's.Generally, the circuit of printed circuit board all leads to overetched mode and generated, and etches the phenomenon hair for necessarily having lateral erosion
It is raw, if as shown in Fig. 2 require the width of circuit connection 100, i.e., the width requirement of circuit on board design line map
For A, the effective width for the actual track produced if being produced using width A as actual track G- Design parameter as B,
The effective width B of obvious actual track is less than width A, bad so as to cause to make appearance, therefore is needed before producing to circuit
100 compensate.Using the circuit of circuit board respectively successively as circuit to be compensated, it is compensated with so that final production obtains
The effective width B of the actual track arrived can be identical with the width required by circuit reality.
In the present embodiment, obtain circuit to be compensated and obtained by board design line map.Wherein, the board design line
Size with each circuit plate element on the circuit board of actual production of the size of each circuit plate element, position relationship in the figure of road,
Position relationship is identical, i.e., the required size, position relationship with each circuit plate element on the circuit board of actual production are consistent.Make
For another optional embodiment, obtain circuit to be compensated can also be by image processing apparatus during circuit board making it is right
The circuit board that need to be compensated is taken pictures and analysis obtains.
Step 103, between the line width and circuit to be compensated and the circuit plate element of adjacent both sides that obtain circuit to be compensated
First Line away from the second line-spacing.
Circuit plate element mainly includes circuit 100, pad 110 and hole 120 (referring to Fig. 6).Electronic component is passed through into weldering
Disk 110 is welded on circuit board, and electronic component is attached by circuit 100 to form default circuit diagram.Usual circuit board
Size in addition to by the complex effects of the circuit formed needed for it, mainly influenceed by route arrangement, and circuit board
The line width of upper circuit and the control of line-spacing are most important for optimization route arrangement.Obtain circuit to be compensated line width and with its phase
Line-spacing size between the circuit plate element of adjacent both sides, the wherein line width and the line-spacing are its line requirements after board production
Actual linewidth and line-spacing.
Step 105, the compensation policy of circuit to be compensated is determined away from, the second line-spacing according to line width and First Line.
Compensation policy is determined according to line width and First Line away from, the second line-spacing, and the line of compensated line is treated by compensation policy
Width compensates.Because the line width of circuit connection and the control of line-spacing require precision height, it is therefore desirable to according to be compensated
The actual requirement line width of circuit and line-spacing size between adjacent other circuit plate elements and determine compensation policy respectively, to keep away
Exempt from overcompensation and cause the oversized of circuit board or cause new bad or compensation effect that is very few and not reaching compensation.
Step 107, treat compensated line according to compensation policy to compensate, be compensated rear circuit board line figure.
Compensated line is treated by compensation policy to compensate, the circuit board line figure after being compensated, so as to mend
Circuit board line figure after repaying is produced, and lifts circuit board making yield, it is ensured that the quality of circuit board.
In above circuit board line compensation method, by obtaining the line width and line-spacing of circuit to be compensated, it is determined that being adapted to this to treat
The compensation policy of compensated line, and the circuit board line figure formed after compensation, are joined with the design of the circuit board line figure after compensation
Number is as the design parameter during board production, according to the design parameter of the circuit board line figure after compensation to circuit board
Processing procedure is controlled, so as to may be such that the circuit on circuit board that production obtains be it is after compensation and with required line width and line-spacing
It is identical.
Referring to Fig. 3, the circuit board line compensation method provided by another embodiment, wherein, step 105, according to line
Wide and First Line determines the compensation policy of circuit to be compensated away from, the second line-spacing, including：
Step 1051, judge First Line away from whether being more than or equal to pre-determined distance with the second line-spacing；
Step 1052, when First Line with the second line-spacing away from pre-determined distance is more than or equal to, it is determined that be according to etching
Compensating factor treats the entire compensation strategy that compensated line is fully compensated.
First Line away from for the circuit to be compensated with positioned at the distance between adjacent other circuit plate elements in its side, the
Two line-spacings are the distance between the wiring board to be compensated other circuit plate elements adjacent with being located at its relative opposite side.Its
In, pre-determined distance is actually required line width and line-spacing according to the circuit on circuit board with being tested to obtain according to production equipment
The corresponding etching to compensate factor determined by, referring to Fig. 2, the calculation formula of the corresponding etching to compensate factor is D/C, wherein, D is circuit
Thickness, C are (A-B)/2, and the corresponding etching to compensate factor can carry out circuit etching by experiment and calculate acquisition after carrying out parameter detecting；
After rational pre-determined distance is set to ensure circuit to be compensated line width according to needed for etching factor is fully compensated to obtain, line
Away from size also can reasonably be controlled, avoid the circuit board after compensation from short circuit, etching occur unclean etc. bad.Work as First Line
During away from being more than or equal to pre-determined distance with the second line-spacing, the region I in Fig. 6 is referred to, is shown by corresponding etching to compensate factor pair
After circuit is fully compensated, it is ensured that the actual linewidth and line-spacing of the circuit of the circuit board obtained by after compensated are still
So disclosure satisfy that requirements, thus the available width according to corresponding etching to compensate factor pair circuit to be compensated according to required ratio increase with
The entire compensation strategy being fully compensated, the full remuneration in the present embodiment, which refers to directly be calculated according to the corresponding etching to compensate factor, to be treated
The line on circuit board that the compensation multiple of compensated line, the width of the circuit after the compensation of entire compensation strategy and production obtain
The actual linewidth on road is identical.
Preferably, step 105, the compensation policy of circuit to be compensated is determined away from, the second line-spacing according to line width and First Line, also
Including：
Step 1053, when First Line more than or equal to pre-determined distance and the second line-spacing away from pre-determined distance is less than, then really
It is set to the unilateral compensation plan being fully compensated according to corresponding etching to compensate factor pair circuit to be compensated towards side of the First Line away from place
Slightly.
When First Line is away from more than or equal to pre-determined distance, show by corresponding etching to compensate factor pair circuit towards described
After side where one line-spacing is fully compensated, it is ensured that the reality of the circuit of the circuit board obtained by after compensated
Line width and line-spacing remain able to meet requirement, and the second line-spacing is less than pre-determined distance, shown by corresponding etching to compensate factor pair circuit court
Being returned after being fully compensated to the side where second line-spacing causes the circuit board line-spacing of production too small, therefore available root
According to the width of circuit to be compensated described in corresponding etching to compensate factor pair towards side of the First Line away from place according to required ratio increase
With the unilateral compensation policy being fully compensated, the circuit II in Fig. 6 is referred to.
Preferably, step 105, the compensation policy of circuit to be compensated is determined away from, the second line-spacing according to line width and First Line, also
Including：
Step 1054, when First Line with the second line-spacing away from pre-determined distance is less than, it is determined that respectively with circuit two to be compensated
The adjacent circuit plate element in side is circuit, hole or pad；
Step 1055, when the adjacent circuit plate element in both sides is circuit, then judge First Line away from being with the second line-spacing
It is no to be more than minimum range, when First Line no more than minimum range and line width with the second line-spacing away from preset value is more than or equal to,
Then it is defined as zero-compensation strategy, when First Line no more than minimum range and line width with the second line-spacing away from preset value is less than, then really
Be set to move line compensation policy, when First Line away from least one is more than minimum range with the second line-spacing when, calculating minimum range
Ratio between pre-determined distance, is defined as treating compensated line according to the corresponding etching to compensate factor and the ratio and proportionally reduces
The proportional compensation strategy of the corresponding etching to compensate factor.
When First Line with the second line-spacing away from pre-determined distance is less than, the circuit board member adjacent with circuit both sides to be compensated is judged
Element is circuit, hole or pad, and corresponding suitable compensation policy is determined according to the type of circuit plate element difference.
When the circuit plate element of both sides adjacent with circuit to be compensated is circuit, first line and second are determined whether
The relation between relation and line width and preset value between circuit and minimum range, minimum range refer to the circuit board after production
The minimum value that the distance between upper circuit must be kept, when First Line away from the second line-spacing no more than minimum range and line width it is big
When preset value, the region III in Fig. 6 is referred to, shows also not interfering with without compensating the circuit
Occur during circuit etching bad, it is determined that for the zero-compensation strategy not compensated to circuit.When First Line is away from second
When line-spacing is less than preset value no more than minimum range and line width, show that the compensation to any ratio of circuit progress may cause life
The circuit board of production because line-spacing is too small and it is unclean etc. bad to produce short circuit, etching, it is therefore desirable to according to the space situation on circuit board
It is compensated again after shifting line is carried out to it.It is determined that when treating compensated line and move line compensation policy, can be automatically according to
Space situation on circuit board obtains nearby moves line scheme, wherein the shifting line scheme obtained automatically can be multiple, then by obtaining
Take the selection instruction at family and confirm final shifting line scheme.As another optional embodiment, user can also be directly obtained
The shifting line scheme of input is as final shifting line scheme.
When First Line away from least one is more than minimum range with the second line-spacing when, calculate minimum range and pre-determined distance
Between ratio, determine to treat the ratio that compensated line compensates according to the corresponding etching to compensate factor and the ratio so that pass through
The line width of circuit to be compensated after compensation can be compensated to a certain degree, and ensure it is compensated after circuit between line
Required away from disclosure satisfy that, yield can be lifted to the full extent and ensure quality.Therefore, when First Line away from the second line-spacing at least
When one of them is more than minimum range, it is defined as proportionally reducing the corresponding etching to compensate factor to the circuit to be compensated, passes through phase
The proportional compensation strategy compensated to less corresponding etching to compensate factor pair circuit to be compensated.Proportional compensation refers in the present embodiment
It is compensated according to the compensation multiple of the ratio calculation circuit to be compensated between the corresponding etching to compensate factor and minimum range and pre-determined distance
The actual linewidth for the circuit on circuit board that the width of the circuit of circuit to be compensated afterwards obtains relatively closer to production.
Step 1056, when when both sides, adjacent circuit plate element includes pad, then according to First Line away from the second line-spacing
Size and the relation in the pad and hole, it is determined that cutting whether pad can cause holes, if being otherwise defined as according to the etching
Compensating factor cuts pad compensation policy to what the circuit to be compensated was fully compensated；If then according to the circuit to be compensated
The line segment segmentation that position relationship between the pad is defined as staggering to the circuit to be compensated with the pad is mended
The interval compensation policy repaid.
When the circuit plate element of both sides adjacent with circuit to be compensated includes pad, i.e. adjacent both sides when circuit to be compensated
In when wherein side is pad, can determine to cut the size of pad according to the distance between circuit to be compensated and pad, and according to
The relation in pad and hole judges to cut whether pad can cause holes, shows to carry out cutting at pad if it will not cause holes
Reason, is defined as cutting pad and cuts pad compensation policy according to what corresponding etching to compensate factor pair circuit to be compensated was fully compensated, please
Refering to the region IV in Fig. 6, in this way, i.e. be avoided that other elements institute possibility caused by circuit board quality problem, and ensure through
The line width and line-spacing of circuit after compensation obtain effective guarantee., can be according to circuit to be compensated if holes can be caused by cutting pad
Position between pad using circuit to be compensated and pad it is interleaved between section as compensator section, compensated it is determined that being segmented to it
Interval compensation policy, that is, one section of circuit face pad to be compensated without compensation, and wrong with the part of pad face
One section opened compensates, and refers to the region V in Fig. 6, by be spaced compensation can ensure to the full extent it is compensated after
The line width and line-spacing of circuit obtain effective guarantee.
Step 1057, when when both sides, adjacent circuit plate element includes hole, then according to the position between circuit to be compensated and hole
The relation of putting is defined as treating the interval compensation policy that the line segment segmentation that compensated line staggers with hole compensates.
When the circuit plate element of both sides adjacent with circuit to be compensated includes hole, i.e., when in the adjacent both sides of circuit to be compensated
When wherein side is hole, determine what the circuit to be compensated and hole were staggered according to the position relationship between circuit to be compensated and hole
The interval compensation policy that compensates of line segment segmentation, that is, one section of the positive device to hole of circuit to be compensated without compensation, and and hole
Stagger one section of the part of face compensates, and refers to the region VI in Fig. 6, can be true to the full extent by being spaced compensation
Protect it is compensated after circuit line width and line-spacing obtain effective guarantee.
The circuit board line compensation method provided by above-described embodiment, can automatically determine the compensation to different circuits
Strategy, actual linewidth according to needed for circuit connection and the optimization corresponding etching to compensate of the line-spacing between adjacent circuit plate element because
Son, form entire compensation strategy, unilateral compensation policy, motion compensation strategy, cut pad compensation policy and interval compensation policy,
With ensure it is compensated after circuit line width and line-spacing obtain effective guarantee, it is ensured that the quality of circuit board.
Referring to Fig. 4, in one embodiment, there is provided a kind of circuit board line compensation device, in addition to the first acquisition
Module 10, the second acquisition module 20, compensation policy determining module 30 and compensating module 40.First acquisition module 10 is used to obtain
Circuit to be compensated.Second acquisition module 20 is used for the line width for obtaining the circuit to be compensated and circuit to be compensated and adjacent both sides
Circuit plate element between First Line away from the second line-spacing.Compensation policy determining module 30 is used for according to the line width and described
First Line determines the compensation policy of the circuit to be compensated away from, second line-spacing.Compensating module 40 is used for according to the compensation
Strategy compensates to the circuit to be compensated, is compensated rear circuit board line figure.Preferably, the first acquisition module 10 is specific
For obtaining board design line map, circuit to be compensated is identified according to the board design line map.
Referring to Fig. 5, the circuit board line compensation device provided by another embodiment, wherein, compensation policy determines mould
Block 30 includes judging unit 31 and policy determining unit 35.Judging unit 31 be used for judge the First Line away from second line
Away from whether being more than or equal to pre-determined distance.Policy determining unit 35 is used for when the First Line with second line-spacing away from being more than
Or during equal to the pre-determined distance, it is determined that circuit to be compensated is fully compensated according to corresponding etching to compensate factor pair
Entire compensation strategy.
Preferably, policy determining unit 35 is additionally operable to when the First Line is away from more than or equal to the pre-determined distance and institute
When stating the second line-spacing and being less than the pre-determined distance, it is determined that be according to corresponding etching to compensate factor pair circuit to be compensated towards described the
The unilateral compensation policy that side where one line-spacing is fully compensated.
Preferably, compensation policy determining module 30 also includes element determining unit 33.Element determining unit 33 is used to work as institute
When stating First Line away from the pre-determined distance is less than with second line-spacing, it is determined that adjacent with the circuit both sides to be compensated respectively
The circuit plate element be circuit, hole or pad.Policy determining unit 35 is used for when the adjacent circuit board member in the both sides
When element is circuit, then judge the First Line away from whether being more than minimum range with second line-spacing, when the First Line away from
When being more than or equal to preset value no more than the minimum range and the line width with second line-spacing, it is determined that be zero-compensation
Strategy, when the First Line no more than the minimum range and the line width with second line-spacing away from being less than the preset value
When, it is determined that to move line compensation policy, when the First Line is away from least one is more than the minimum with second line-spacing
Apart from when, calculate the ratio between the minimum range and the pre-determined distance, be defined as according to the corresponding etching to compensate factor and described
Ratio proportionally reduces the proportional compensation strategy of the corresponding etching to compensate factor to the circuit to be compensated.Policy determining unit 35
Be additionally operable to when the adjacent circuit plate element in the both sides includes pad, then according to the First Line away from second line-spacing
Size and the relation in the pad and hole, it is determined that cutting whether pad causes holes, if being otherwise defined as mending according to the etching
That repays that circuit to be compensated described in factor pair is fully compensated cuts pad compensation policy；If then according to the circuit to be compensated with
The line segment segmentation that position relationship between the pad is defined as staggering to the circuit to be compensated with the pad compensates
Interval compensation policy.The policy determining unit 35 is additionally operable to when the adjacent circuit plate element in the both sides includes hole, then
It is defined as staggering to the circuit to be compensated with the hole according to the position relationship between the circuit to be compensated and the pad
The interval compensation policy that compensates of line segment segmentation.
The road compensation method of foregoing circuit printed line and device, can automatically determine the compensation policy to different circuits, according to electricity
Actual linewidth on the plate of road needed for circuit and the line-spacing optimization corresponding etching to compensate factor between adjacent circuit plate element, are formed overall
Compensation policy, unilateral compensation policy, motion compensation strategy, cut pad compensation policy and interval compensation policy, with ensure through mend
The line width and line-spacing of circuit after repaying obtain effective guarantee, it is ensured that the quality of circuit board.
One of ordinary skill in the art will appreciate that realize all or part of flow in above-described embodiment method, being can be with
The hardware of correlation is instructed to complete by computer program, described program can be stored in a computer read/write memory medium
In, the program is upon execution, it may include such as the flow of the embodiment of above-mentioned each method.Wherein, described storage medium can be magnetic
Dish, CD, read-only memory (Read-Only Memory, ROM) or random access memory (Random Access
Memory, RAM) etc..
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.
Claims (10)
1. a kind of circuit board line compensation method, including：
Obtain circuit to be compensated；
Obtain the circuit to be compensated line width and the circuit to be compensated and the circuit plate element of adjacent both sides between
One line-spacing and the second line-spacing；
The compensation policy of the circuit to be compensated is determined away from, second line-spacing according to the line width and the First Line；
The circuit to be compensated is compensated according to the compensation policy, is compensated rear circuit board line figure.
2. circuit board line compensation method according to claim 1, it is characterised in that：It is described according to the line width and described
Line-spacing determines that the step of compensation policy of the circuit to be compensated includes：
Judge the First Line away from whether being more than or equal to pre-determined distance with second line-spacing；
When the First Line with second line-spacing away from the pre-determined distance is more than or equal to, it is determined that be to be mended according to etching
Repay the entire compensation strategy that circuit to be compensated described in factor pair is fully compensated.
3. circuit board line compensation method according to claim 1, it is characterised in that：It is described according to the line width and described
Line-spacing determines that the step of compensation policy of the circuit to be compensated includes：
Judge the First Line away from whether being more than or equal to pre-determined distance with second line-spacing；
When the First Line more than or equal to the pre-determined distance and second line-spacing away from the pre-determined distance is less than, then
It is defined as what the circuit to be compensated according to corresponding etching to compensate factor pair was fully compensated towards side of the First Line away from place
Unilateral compensation policy.
4. circuit board line compensation method according to claim 1, it is characterised in that：It is described according to the line width and described
Line-spacing determines that the step of compensation policy of the circuit to be compensated includes：
Judge the First Line away from whether being more than or equal to pre-determined distance with second line-spacing；
When the First Line with second line-spacing away from the pre-determined distance is less than, it is determined that respectively with the circuit to be compensated
The adjacent circuit plate element in both sides is circuit, hole or pad；
When the adjacent circuit plate element in the both sides is circuit, then judge the First Line away from second line-spacing whether
More than minimum range, when the First Line away from being more than with second line-spacing no more than the minimum range and the line width or
During equal to preset value, it is determined that be zero-compensation strategy, when the First Line with second line-spacing away from being not more than the most narrow spacing
From and the line width be less than the preset value when, it is determined that for move line compensation policy, when the First Line away from second line
When being more than the minimum range away from least one, the ratio between the minimum range and the pre-determined distance is calculated, really
It is set to and the corresponding etching to compensate factor is proportionally reduced to the circuit to be compensated according to the corresponding etching to compensate factor and the ratio
Proportional compensation strategy；
When the both sides, adjacent circuit plate element includes pad, then according to the First Line away from big with second line-spacing
Small and described pad and the relation in hole, it is determined that cutting whether pad causes holes, if being otherwise defined as according to the corresponding etching to compensate
What circuit to be compensated was fully compensated described in factor pair cuts pad compensation policy；If then according to the circuit to be compensated and institute
State what the line segment segmentation that the position relationship between pad is defined as staggering to the circuit to be compensated and the pad compensated
It is spaced compensation policy；
When the both sides, adjacent circuit plate element includes hole, then according to the position between the circuit to be compensated and the pad
The interval compensation policy that the line segment segmentation that the relation of putting is defined as staggering to the circuit to be compensated and the hole compensates.
5. circuit board line compensation method according to claim 1, it is characterised in that：The step for obtaining circuit to be compensated
Suddenly include：
Board design line map is obtained, circuit to be compensated is identified according to the board design line map.
6. a kind of circuit board line compensation device, including：
First acquisition module, for obtaining circuit to be compensated；
Second acquisition module, for obtaining the line width and the circuit to be compensated and the electricity of adjacent both sides of the circuit to be compensated
First Line between the plate element of road away from the second line-spacing；
Compensation policy determining module, for waiting to mend described in being determined away from, second line-spacing according to the line width and the First Line
Repay the compensation policy of circuit；
Compensating module, for being compensated according to the compensation policy to the circuit to be compensated, it is compensated rear circuit printed line
Lu Tu.
7. circuit board line compensation device according to claim 6, it is characterised in that：The compensation policy determining module tool
Body includes：
Judging unit, for judging the First Line away from whether being more than or equal to pre-determined distance with second line-spacing；
Policy determining unit, for when the First Line with second line-spacing away from the pre-determined distance is more than or equal to,
Then it is defined as the entire compensation strategy that the circuit to be compensated according to corresponding etching to compensate factor pair is fully compensated.
8. circuit board line compensation device according to claim 6, it is characterised in that：The compensation policy determining module tool
Body includes：
Judging unit, for judging the First Line away from whether being more than or equal to pre-determined distance with second line-spacing；
Policy determining unit, for when the First Line more than or equal to the pre-determined distance and second line-spacing away from being less than
During the pre-determined distance, it is determined that be according to corresponding etching to compensate factor pair circuit to be compensated towards one of the First Line away from place
The unilateral compensation policy that side is fully compensated.
9. circuit board line compensation device according to claim 6, it is characterised in that：The compensation policy determining module tool
Body includes：
Judging unit, for judging the First Line away from whether being more than or equal to pre-determined distance with second line-spacing；
Element determining unit, for when the First Line with second line-spacing away from the pre-determined distance is less than, it is determined that point
The circuit plate element adjacent with the circuit both sides to be compensated is not circuit, hole or pad；
Policy determining unit, for when the adjacent circuit plate element in the both sides is circuit, then judge the First Line away from
Whether it is more than minimum range with second line-spacing, when the First Line with second line-spacing away from being not more than the minimum range
And the line width is when being more than or equal to preset value, it is determined that be zero-compensation strategy, when the First Line away from second line
During away from being less than the preset value no more than the minimum range and the line width, it is determined that to move line compensation policy, when described the
One line-spacing and second line-spacing at least one when being more than the minimum range, calculate the minimum range with it is described default
Ratio between distance, is defined as proportionally reducing institute to the circuit to be compensated according to the corresponding etching to compensate factor and the ratio
State the proportional compensation strategy of the corresponding etching to compensate factor；
The policy determining unit, it is additionally operable to when the adjacent circuit plate element in the both sides includes pad, then according to described
The size and the relation in the pad and hole of one line-spacing and second line-spacing, it is determined that cutting whether pad causes holes, if not
Then be defined as that the circuit to be compensated according to the corresponding etching to compensate factor pair is fully compensated cuts pad compensation policy；If
Then it is defined as according to the position relationship between the circuit to be compensated and the pad to the circuit to be compensated and the pad
The interval compensation policy that the line segment segmentation staggered compensates；
The policy determining unit, it is additionally operable to when the adjacent circuit plate element in the both sides includes hole, then waits to mend according to
Repay the position relationship between circuit and the pad be defined as being segmented the line segment that the circuit to be compensated staggers with the hole into
The interval compensation policy of row compensation.
10. circuit board line compensation device according to claim 6, it is characterised in that：First acquisition module is specific
For obtaining board design line map, circuit to be compensated is identified according to the board design line map.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610716988.0A CN107787122B (en) | 2016-08-24 | 2016-08-24 | Circuit board line compensation method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610716988.0A CN107787122B (en) | 2016-08-24 | 2016-08-24 | Circuit board line compensation method and device |
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| CN107787122A true CN107787122A (en) | 2018-03-09 |
| CN107787122B CN107787122B (en) | 2020-05-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108668444A (en) * | 2018-06-25 | 2018-10-16 | 广州兴森快捷电路科技有限公司 | Harmomegathus control method, processing method and system, computer storage media and equipment |
| CN111465220A (en) * | 2020-04-23 | 2020-07-28 | 胜宏科技（惠州）股份有限公司 | Compensation method for gold finger etching |
| CN112067968A (en) * | 2019-06-10 | 2020-12-11 | 北大方正集团有限公司 | V-shaped groove detection method and equipment |
| US11149706B2 (en) | 2018-03-23 | 2021-10-19 | Jiangsu Goldwind Science & Technology Co., Ltd. | Hydraulic driving system and driving method for barring |
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| CN103167736A (en) * | 2011-12-16 | 2013-06-19 | 北大方正集团有限公司 | Printed circuit board (PCB) compensation processing method, equipment and PCB |
| CN104010445A (en) * | 2014-05-09 | 2014-08-27 | 东莞市五株电子科技有限公司 | Dynamic compensation manufacturing method for fine circuit |
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| US4934045A (en) * | 1988-02-05 | 1990-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of producing electric circuit patterns |
| CN103167736A (en) * | 2011-12-16 | 2013-06-19 | 北大方正集团有限公司 | Printed circuit board (PCB) compensation processing method, equipment and PCB |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US11149706B2 (en) | 2018-03-23 | 2021-10-19 | Jiangsu Goldwind Science & Technology Co., Ltd. | Hydraulic driving system and driving method for barring |
| CN108668444A (en) * | 2018-06-25 | 2018-10-16 | 广州兴森快捷电路科技有限公司 | Harmomegathus control method, processing method and system, computer storage media and equipment |
| CN108668444B (en) * | 2018-06-25 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Collapsible control method, machining method and system, computer storage medium and device |
| CN112067968A (en) * | 2019-06-10 | 2020-12-11 | 北大方正集团有限公司 | V-shaped groove detection method and equipment |
| CN111465220A (en) * | 2020-04-23 | 2020-07-28 | 胜宏科技（惠州）股份有限公司 | Compensation method for gold finger etching |
| CN111465220B (en) * | 2020-04-23 | 2022-11-08 | 胜宏科技（惠州）股份有限公司 | Compensation method for gold finger etching |
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| CN107787122B (en) | 2020-05-26 |
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