CN107785286B

CN107785286B - Laser packaging method

Info

Publication number: CN107785286B
Application number: CN201610766719.5A
Authority: CN
Inventors: 黄元昊
Original assignee: Shanghai Micro Electronics Equipment Co Ltd
Current assignee: Shanghai Micro Electronics Equipment Co Ltd
Priority date: 2016-08-30
Filing date: 2016-08-30
Publication date: 2020-12-04
Anticipated expiration: 2036-08-30
Also published as: CN107785286A

Abstract

The invention discloses a laser packaging method, which uses laser to heat a frit pattern between two substrates, and comprises the following steps: step 1: dividing the path of the frit pattern into a plurality of subsections, wherein a section of overlapped area is arranged between every two adjacent subsections, and the overlapped area is called as a splicing area; step 2: using laser beams to repeatedly scan one of the subsections for many times, and moving to the starting point of the next subsection after the scanning is finished; and step 3: and (5) repeating the step (2) until all the frit patterns are scanned completely. According to the invention, by repeatedly scanning the subsections for multiple times, quasi-synchronous uniform heating is locally provided, so that the glass frit can reach a molten state in a short time, and a scanning effect similar to a contour is macroscopically generated, so that the whole glass frit is sequentially softened and encapsulated, and the glass wall with controllable bonding ratio and excellent encapsulation quality is obtained.

Description

Laser packaging method

Technical Field

The invention relates to the field of laser packaging, in particular to a laser packaging method.

Background

Optoelectronic semiconductor devices have been widely used in various fields of life. Among them, the OLED (organic light emitting diode) has become a hot point of research due to its characteristics of good color ratio, wide viewing angle, high response speed, and the like, and has a good application prospect. However, the electrodes and organic layers in OLED displays are very sensitive to oxygen and moisture. Oxygen and moisture permeating from the external environment into the interior of the OLED device can severely shorten the life of the OLED device. It is therefore important to provide an effective hermetic seal for OLED devices.

In recent years, a sealing method using frit-assisted laser heating is applied to the sealing of OLED displays. Wherein the frit is doped with a material having a high absorption rate for a specific wavelength of light, and has a low melting point characteristic. A hermetic seal is formed between the cover glass with the frit thereon and the substrate glass with the OLEDs thereon by heating and softening the frit using a high energy laser. The frit is typically about 0.7 to 1mm wide and 6 to 100 microns thick. The laser outputs controllable laser energy to irradiate the sealing line coated with the glass frit in sequence, so that the glass frit is heated and softened successively to form airtight sealing. However, this sequential type of heating of the frit can result in a non-uniform temperature distribution within the frit. Such an uneven temperature distribution within the frit can lead to the development of cracking, residual stress or delamination problems, which can prevent or impair the hermetic connection between the cover glass and the substrate glass. Meanwhile, the main parameters of the sealing process, such as laser power, scanning speed, etc., need to be selected, and the improvement of the yield is limited by the way.

The quasi-synchronous scanning mode provided in the prior art is applied to laser frit packaging, and has the advantages of wide process interval, high yield, good temperature distribution uniformity along the scanning direction and the like. Then, in practical application, due to characteristic constraints such as the shape (circular shape) and uniformity (10% -20%) of a laser spot focused on the frit layer, and the influence of factors such as the size of a packaging pattern and the upper limit of a scanning speed, when scanning and packaging are performed according to the above method, dense holes (bubbles) are formed in the frit and at the position close to the edge, and the packaging quality is influenced.

Disclosure of Invention

The invention provides a laser packaging method, which aims to solve the problem that the glass frit forms dense holes in the glass frit and at the position close to the edge.

In order to solve the above technical problem, the present invention provides a laser packaging method for heating a frit pattern located between two substrates using a laser, such that the heated frit pattern seals the two substrates, the method comprising: step 1: dividing the path of the frit pattern into a plurality of subsections, wherein a section of overlapped area is arranged between every two adjacent subsections, and the overlapped area is called as a splicing area; step 2: using laser beams to repeatedly scan one of the subsections for many times, and moving to the starting point of the next subsection after the scanning is finished; and step 3: and (5) repeating the step (2) until all the frit patterns are scanned completely.

Preferably, the shape of the plurality of sub-segments comprises a straight line, a circular arc and/or a combination of a plurality of straight lines and circular arcs.

Preferably, in step 1, the frit pattern is divided into a plurality of sub-segments with the same length and/or a plurality of sub-segments with different lengths.

Preferably, the length of the splicing region is less than half of the length of any of the plurality of sub-segments.

Preferably, the step 2 comprises: step 21: selecting a sub-segment as an initial scanning segment, and calculating and updating position coordinates of a starting point and an ending point of the initial scanning segment; step 22: planning the process parameters of the subsections; step 23: the laser beam moves from the starting point to the ending point of the subsection; step 24: skipping the laser beam to the starting point of the subsection, and repeatedly executing the step 23 until the skipping times reach the preset times and then executing the step 25; step 25: calculating the position coordinates of the starting point and the end point of the next scanning segment, and skipping the laser beam to the starting point of the next scanning segment; step 26: repeating steps 23-25 until the frit pattern is completely scanned.

Preferably, in the steps 24 and 25, the laser beam is in a no-output state during the laser beam jump.

Preferably, in step 25, there is a time delay before the laser beam jumps at the end point of the current sub-segment and/or after the laser beam jumps at the start point of the next sub-segment.

Preferably, each of the sub-segments has the same scanning period by controlling the scanning time, the jump time and the delay time of the laser beam.

Preferably, when scanning the sub-segments, if a special region exists, the output power and/or scanning speed of the laser beam is changed when scanning the special region to change the energy obtained by the special region, wherein the special region comprises a circular arc segment in the frit pattern, a straight line segment connected with the circular arc segment and a region through which an electrode passes.

Preferably, each of the plurality of sub-segments is further provided with a start area and/or a stop area, and the output power and/or the scanning speed of the laser beam is changed when the start area and/or the stop area is scanned, so as to change the energy obtained by the start area and/or the stop area.

Preferably, the start area and the stop area are both the splicing area.

Preferably, the method further comprises the step 4: the frit is cooled by natural cooling, by scanning the frit with a laser beam in a predetermined power curve and/or by scanning the frit with a laser beam in a temperature feedback manner.

Compared with the prior art, the invention divides the frit pattern with any length into a plurality of short subsections, and carries out quasi-synchronous scanning on the subsections, and because the subsections are short in length, good temperature rise can be obtained, so that the subsections have good packaging quality. According to the invention, by designing the splicing area between the sub-segments, the problem of connection between the sub-segments is effectively solved, so that the complete pattern can obtain excellent packaging quality finally, and the process window is wider. And due to the fixed length of the subsegment, the optimized process parameters can be suitable for patterns with different sizes, and a foundation is laid for the packaging process of large-size device patterns beyond the scanning view field.

Drawings

FIG. 1a is a schematic structural diagram of a laser scanning apparatus according to the present invention;

FIG. 1b is a schematic diagram of the structure of the frit pattern according to the present invention;

fig. 2 is a flowchart of a laser packaging method in embodiment 1 of the present invention;

FIGS. 3 to 6 are schematic diagrams illustrating the scanning path planning of the sealing frit pattern in example 1 of the present invention;

FIGS. 7 to 8 are schematic views illustrating the scanning path planning of the non-hermetic frit pattern in example 1 of the present invention;

FIG. 9 is a graph showing a comparison between temperature rise curve simulations of a dynamic quasi-synchronous scanning method and a segmented quasi-synchronous scanning method in example 1 of the present invention;

FIGS. 10 a-10 d are power-position control curves in a single scan cycle in example 1 of the present invention;

FIG. 11 is a schematic diagram illustrating the control of the segmented quasi-synchronous scanning path of the sealing frit pattern in example 1 of the present invention;

FIG. 12 is a top view of a frit after a single sub-segment is encapsulated in example 1 of the present invention;

fig. 13 is a top view of the frit profile after the encapsulation of adjacent sub-segments in example 1 of the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It is to be noted that the drawings are in simplified form and are not to precise scale, which is provided for the purpose of facilitating and distinctly claiming the embodiments of the present invention.

Example 1

The invention provides a laser packaging method, which adopts a laser scanning device as shown in figure 1a, and the laser scanning device comprises: controller module 110, laser scanning module 111, laser instrument module 112 and temperature monitoring module 113, wherein, controller module 100 respectively with laser scanning module 111, laser instrument module 112 and temperature monitoring module 113 are connected for control laser instrument module 112 reaches laser scanning module 111 and scanning temperature, laser instrument module 112 links to each other with laser scanning module 111, laser instrument module 111 is used for generating laser, with predetermined power with laser send to laser scanning module 111, laser scanning module 111 is used for changing laser direction of transfer and motion characteristic, temperature monitoring module 113 is used for monitoring the scanning temperature of laser. Further, the laser scanning apparatus further includes a computer 114, wherein the computer 114 is connected to the controller module 110 for exchanging data with the controller module 110.

This embodiment is used to form a hermetic seal with the OLED display 120 using a frit, where the OLED display 120 is a typical glass package, and the main structure of the OLED display 120 includes a cover glass 121, a frit 122, a substrate glass 123, an OLED layer 125, and an electrode 124. The frit 122 is located on the substrate glass 123 of the OLED display 120, and the top view thereof is shown in fig. 1 b. The frit 122 is pre-cured on the substrate glass 123 through a screen printing, pre-sintering step to form a rounded rectangular sealing line having a certain thickness. The OLED layer 125 on the substrate glass 123 is located inside the sealing line of the frit 122, while the electrode 124 connecting the inside and the outside of the OLED display 120 is present on the substrate glass 123.

As shown in fig. 2, the present invention provides a laser packaging method, which uses laser to heat a frit 122 pattern located between two substrate glasses 123, so that the heated frit 122 pattern seals the two substrate glasses 123, and specifically includes:

step 1: as shown in fig. 3 to 8, the path of the frit 122 pattern to be scanned is divided, the frit 122 pattern is divided into a plurality of sub-segments 132, and an overlapping area is formed between two adjacent sub-segments 132, and the overlapping area is referred to as a splicing area 131. Specifically, the sub-segment 132 may be a straight line or a circular arc, or a combination of a plurality of straight lines or circular arcs. The length L of the subsegment 132₁₃₂Refers to the cumulative length along the centerline of symmetry of the frit 122 pattern width, including the sum of the lengths of the straight line segments and the circular arc segments. Generally, take L₁₃₂<＝30mm。

Further, the sub-segment 132 has two end points, namely, a start point 133 and an end point 134. Wherein 132(k) represents the

kth sub-segment

132, 1 to N are taken, N is the total number of the divided sub-segments 132, and 133(k) and 134(k) represent the starting point and the ending point of the kth sub-segment 132 respectively.

The splicing region 131 is a region between an end point 134(K) of a previous sub-segment 132(K) and a start point 133(K +1) of a subsequent sub-segment 132(K +1), and has a certain length L₁₃₁Wherein L is₁₃₁<L₁₃₂/2. Further, L is generally taken₁₃₁<＝2mm。

It should be noted that the frit 122 pattern can be divided into several equal-length sub-segments 132, as shown in fig. 3, 5, and 7; of course, the frit 122 pattern can also be divided into several sub-segments 132 with approximately the same length and one sub-segment 132 with a slightly shorter or longer length, and of course, the slightly shorter and longer length is relative to the other sub-segments 132, as shown in fig. 4. Furthermore, the frit 122 pattern can be divided into several sub-segments 132 with approximately the same length and several sub-segments 132 with different lengths.

Of course, the frit 122 pattern in this embodiment may be a closed pattern, such as a rounded rectangle as shown in fig. 3 and 4, a circle as shown in fig. 5, and an ellipse as shown in fig. 6. Or may be a non-closed pattern such as a straight line pattern as shown in fig. 7 and 8.

Step 2: the laser beam is used to scan the sub-segment 132 repeatedly for a plurality of times, and after the scanning is completed, the scanning is moved to the starting point of the next sub-segment 132. Specifically, the step 2 includes:

step 21: selecting a subsection 132 as an initial scanning section, and calculating and updating position coordinates of a starting point 133 and an ending point 134 of the initial scanning section; typically the laser beam will be scanned from the order of increasing sequence number. However, for any shape of encapsulated pattern, the laser beam may be scanned starting with any number of subsegments 132, while for non-encapsulated patterns, the initial scan segment is typically selected to be the subsection 132 at one end of the frit 122.

Step 22: planning the process parameters for the sub-segment 132; the process parameters specifically include the speed, power and trajectory of the current sub-segment 132, and when the frit 122 has the same or similar printing and pre-sintering processes, the process parameters implemented may be consistent, so that the known process parameters may be conveniently applied to encapsulate frits 122 of different sizes;

step 23: the laser beam moves from the start point 133 to the end point 134 of the sub-segment 132;

step 24: skipping the laser beam to the starting point 133 of the sub-segment 132, and repeating the step 23 until the skipping times reaches the preset times and then executing the step 25;

step 25: calculating the position coordinates of the starting point 133 and the ending point 134 of the next sub-segment 132, and jumping the laser beam to the starting point 133 of the next sub-segment 132;

step 26: repeating steps 23-25 until the frit pattern is completely scanned.

Specifically, the controller module 110 controls the laser scanning module 111 to project the laser beam to the start point 133(k) of the current sub-segment 132, controls the laser to output the laser energy P at a higher power, and controls the laser beam to output the laser energy P at a higher speedMoving V_scanThe current subsection 132 is scanned, with the scan direction pointing from the start point 133(k) to the end point 134 (k). When the laser beam is scanned to the end point 134(k), the output of the laser energy is stopped and the laser beam is controlled at a higher speed V_jumpJumping to the start point 133 (k). Preferably, there may be a delay of a certain time before and after the laser beam jump, i.e., the laser beam remains staying at the start point 133(k) or the end point 134(k) for a certain time t_delayAnd is in a state of no laser output. The laser output time period is called a scanning phase, the laser non-output time period is called a jumping phase, and the scanning phase and the jumping phase are called a scanning period of the sub-segment package.

A number of the individual scan cycles described are repeated until the frit 122 is heated to soften and the desired quality of the connection is completed, the number of individual scan cycles required to complete the encapsulation of the current sub-end 132 being referred to as the sub-segment scan number M. Utilizing laser scanning of a plurality of single scanning periods to enable the frit 122 of the current sub-section 132 to obtain enough energy, and connecting the two glass substrates together to form local airtight sealing connection; the sufficient energy may be manifested as the temperature of the frit 122 reaching and exceeding its softening point (melting point). The laser scanning of the multiple scanning cycles may be performed using the same power curve for each scanning cycle, such that the frit 122 is heated with a temperature curve having a decreasing temperature rise, and the target temperature is achieved by increasing the number of scanning cycles. During the single scan cycle, the frit 122 absorbs the laser energy and is heated in sequence, and the frit of each sub-segment 132 is heated multiple times. Due to the length L of the sub-section 132₁₃₂Constrained to a smaller value (<30mm), compared with the quasi-synchronous scheme adopted in the past, when the segmented quasi-synchronous mode is adopted for the same scanning speed, power, scanning times and spot topography, the interval of heating by the light beam irradiation at the fixed position on the current subsection 132 is shorter, so that the temperature rise effect is better, and the simulated temperature curve is shown in fig. 9.

And step 3: and (3) repeating the step (2) until all the patterns of the glass frit 122 are scanned completely, preferably, the step determines whether all the scanning is completed or not by comparing the current scanning times with the preset total scanning times, if so, the scanning is finished, and if not, the step (2) is returned.

Further, the present invention can set the start region, the stop region, and other predetermined regions such as the electrode coverage area within a single sub-segment 132 according to actual needs (for example, when the laser power needs to be adjusted). The start zone and the stop zone of this embodiment may also be arranged within the splicing zone 131, i.e. coinciding with the splicing zone 131. In each of the above regions, the controller module 110 controls the laser module 112 and the laser scanning module 111 to synchronize the moving scanning operation and the laser power adjustment operation of the laser, that is, the laser beam may change the laser output power and/or the laser scanning speed linearly or nonlinearly in the above region, so that the other regions in the sub-section 132 except the above region may obtain relatively uniform energy, and at the positions of the start region, the stop region, and the preset region, the other regions may obtain relatively uniform energy different from the above regions, or may obtain relatively non-uniform energy different from the above other regions, so as to scan the sub-section 132 region through which the electrode or other device passes.

As shown in fig. 10a to 10d, fig. 10a to 10b are power-position control curves for simultaneously setting a start area, a stop area and an electrode coverage area in a single scanning period, respectively; FIG. 10c is a power-position control curve for setting only the stopping zone and the electrode coverage area; fig. 10d is a power-position control curve setting only the start zone and the electrode coverage area.

Further, the invention also comprises a step 4: the frit 122 is cooled. There are two cooling modes in the present invention, one is: after the frit 122 absorbs enough energy, the laser output is turned off to naturally cool the frit 122, and the frit 122 is heated approximately synchronously, so that the cooling rate is more moderate than that of the sequential type; the other cooling mode is as follows: the scanning cycle is still repeated, and the frit 122 is scanned at a lower laser power by a predetermined power curve or temperature feedback manner, so that the frit 122 is cooled according to a predetermined cooling curve. The cooling curve has a moderate cooling rate, so that the thermal stress generated in the cooling process can be better reduced. Of course, the manner of controlling the cooling of the frit 122 may be the control of the whole process of cooling the frit 122, or may be the control of a portion of the frit 122 with a faster cooling rate in the natural cooling process, and the rest of the time portion adopts the natural cooling.

As shown in fig. 11, in order to dynamically scan and plan the pattern of the frit with encapsulation 122, the pattern of the frit with encapsulation 122 is divided into a plurality of sub-segments 132 with equal length, where the length of the sub-segment 132 is 29mm, so as to obtain 4 sub-segments 132, and the length of the splicing region 131 is 1 mm;

selecting a subsection 132(1) to start packaging, scanning the laser beam output power of 115-130W from a starting point 133(1) to an end point 134(1) at a constant speed of 4m/s, wherein a power-position control curve is shown in a graph of fig. 10b, then closing the laser output, and jumping to the starting point 133(1) at a speed of 8 m/s; repeating the operation for 40 times, adopting power different from that of a straight line area for a fillet area for a sub-section covering the fillet pattern, generally, bringing a straight line area which is 0.1mm before the fillet enters and 0.1mm after the fillet exits into the fillet area, and using laser power of 105-110W;

then, the process is carried out. In the clockwise direction, sub-segment 132(2) is selected for encapsulation. Controlling the preset position of the laser spot to jump to an end point 133(2), and finishing packaging according to the steps 2-3; by analogy, the encapsulation of all the subsections 132 is completed, and the scanning path control thereof is as shown in fig. 11.

It should be noted that, in this embodiment, a certain sub-segment 132 is scanned by multiple laser irradiation, so that the temperature of the frit 122 at each position on the current sub-segment 132 is raised until sufficient energy is obtained to melt and soften the frit 122, and finally, the upper and lower glass substrates corresponding to the non-splicing region of the sub-segment 132 are connected together to form a locally uniform and dense glass wall. This process is called sub-segment encapsulation. The characteristics of the glass wall formed by sub-segment encapsulation are described as follows:

1. the non-spliced region of the sub-segment 132 forms an encapsulated region 201 with the same color, shape and the like along the width direction of the frit after encapsulation, or is divided into an encapsulated region 201 and an unencapsulated region 203, wherein the encapsulated region 201 which is dense and uniform and connects the upper glass substrate and the lower glass substrate occupies most of the region, and the width of the region is more than 85% of the total width of the frit 122 pattern, as shown in fig. 12.

2. The spliced region of the sub-segment 132 forms an encapsulated region 201 with the same color and shape or at least two parts with different colors or shapes along the width direction of the frit 122 after encapsulation, wherein the two parts are a spliced encapsulated region 202 and an unencapsulated region 203 respectively.

When the sub-segment encapsulation is not performed on the adjacent sub-segment 132 of the sub-segment 132, the width of the splice encapsulation area 202 on the side should be significantly smaller than the width of the encapsulated area 201; when the sub-segment encapsulation is performed on the adjacent sub-segment of the sub-segment 132, the width of the spliced encapsulation area 202 on the side should be the same as or close to the width of the encapsulated area 201.

And (3) sequentially packaging other subsections 132 by using laser, so that the other subsections 132 are sequentially heated, melted and softened, and finally, the whole frit 122 pattern is packaged to form a complete, uniform and compact glass wall so as to realize airtight sealing.

For a single scan cycle in a sub-segment package, the total time it consumes is referred to as the single scan cycle time t_onescanIt can be approximated by the following formula:

in this embodiment, the time t of any single scanning period of any sub-segment 132(k)_onescan(k) Are all equal.

Namely: for a single sub-segment 132(k), any single scan period time t thereof_onescan(k) All should be equal; for different sub-segments 132(k) and 132(j), its single scan cycle time t_onescanIt should satisfy:

t_onescan(k)≈t_onescan(j)

specifically, when the frit 122 pattern is divided into several subfields 132, its scanning speed V is_scanIs always a constant value, jump speed V_jumpIs also a constant value, and to obtain the shortest but scan cycle time, the delay time t is taken_delayAt 0, the time of a single scan cycle should be approximated by:

when the frit 122 pattern is divided into several sub-segments 132(1) -132 (N-1) with approximately the same length and a sub-segment 132(N) with a slightly shorter length, t is still taken for the sub-segments 132(1) -132 (N-1)_delayTo 0, the time of a single scan cycle is calculated by:

for the subsection 132(N), the jump speed and delay time may be adjusted to ensure time consistency of a single scan cycle, and should satisfy:

when the frit 122 pattern is divided into several sub-segments 132 with different lengths, any two sub-segments 132(k) and 132(j) should satisfy:

example 2

The present embodiment is different from embodiment 1 in that the present embodiment employs a galvanometer as a laser scanning device. Because the field of view of the galvanometer has size constraints, the scanning field of view of the galvanometer needs to be determined in the process of laser scanning. When the method is actually applied, the steps are as follows:

dividing the glass frit 122 pattern with the package into a plurality of subsections 132 with the same length, and taking the length of the subsections 132 as 29mm to obtain N subsections 132, wherein the length of the splicing area 131 is 1 mm;

moving the galvanometer to be above the subsection 132(1) to enable the scanning field of view of the galvanometer to cover the connected subsection 132 as much as possible;

selecting a subsection 132(1) to start packaging, scanning the laser beam output power of 115-130W from a starting point 133(1) to an end point 134(1) at a constant speed of 4m/s, wherein the power curve is as shown in a graph of fig. 10b, then closing the laser output, and jumping to the starting point 133(1) at a speed of 8 m/s; repeating the operation for 40 times, adopting power different from that of a straight line area for the fillet area for the sub-section 132 covering the fillet pattern, generally, bringing the straight line area of 0.1mm before the fillet into the fillet area and 0.1mm after the fillet out of the fillet into the fillet area, and using laser power of 105-110W;

the sub-section 132(2) is selected for encapsulation in a clockwise direction within the galvanometer scan field of view.

By analogy, after laser scanning and packaging of all the subsections 132 in the current scanning view field of the galvanometer are completed, the galvanometer is moved to the next position, and the position can cover the subsections 132 to be scanned adjacent to the subsections 132 which are subjected to scanning and packaging at the latest time as much as possible, so that scanning and packaging of all the subsections 132 in the current scanning view field are completed; and so on, the encapsulation of all sub-segments 132 is completed.

It will be apparent to those skilled in the art that various changes and modifications may be made in the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A laser packaging method using a laser to heat a frit pattern located between two substrates such that the heated frit pattern seals the two substrates, the method comprising:

step 1: dividing the path of the frit pattern into a plurality of subsections, wherein a section of overlapped area is arranged between every two adjacent subsections, and the overlapped area is called as a splicing area;

the length of each sub-segment is less than or equal to 30mm;

step 2: using laser beam to repeatedly scan from the starting point to the end point of one subsection in the subsections for many times, and moving to the starting point of the next subsection after the scanning is finished;

and step 3: and (5) repeating the step (2) until all the frit patterns are scanned completely.

2. The laser packaging method of claim 1, wherein the shape of the plurality of sub-segments comprises a straight line and/or a circular arc.

3. The laser packaging method of claim 1, wherein in step 1, the frit pattern is divided into a plurality of sub-segments of the same length and/or a plurality of sub-segments of different lengths.

4. The laser packaging method of claim 1, wherein the length of the splicing region is less than half of the length of any of the plurality of sub-segments.

5. The laser packaging method of claim 1, wherein the step 2 comprises: step 21: selecting a sub-segment as an initial scanning segment, and calculating and updating position coordinates of a starting point and an ending point of the initial scanning segment;

step 22: planning the process parameters of the subsections; step 23: the laser beam moves from the starting point to the ending point of the subsection;

step 24: skipping the laser beam to the starting point of the subsection, and repeatedly executing the step 23 until the skipping times reach the preset times and then executing the step 25;

step 25: calculating the position coordinates of the starting point and the ending point of the next subsegment, and jumping the laser beam to the starting point of the next subsegment;

step 26: repeating steps 23-25 until the frit pattern is completely scanned.

6. The laser packaging method of claim 5, wherein in steps 24 and 25, the laser beam is in a no-output state during jumping.

7. The laser packaging method of claim 5, wherein in step 25, there is a time delay before the laser beam jumps at the end point of the current sub-segment and/or after the laser beam jumps at the start point of the next sub-segment.

8. The laser packaging method of claim 7, wherein each of the sub-segments has the same scanning period by controlling a scanning time, a jump time, and a delay time of the laser beam.

9. The laser packaging method of claim 1, wherein when scanning the plurality of sub-segments, if a special region exists, the output power and/or scanning speed of the laser beam is changed when scanning the special region to change the energy obtained by the special region, wherein the special region comprises a circular arc segment in the frit pattern, a straight line segment connected with the circular arc segment, and a region through which an electrode passes.

10. The laser packaging method of claim 1, wherein each of the plurality of sub-segments is further provided with a start area and/or a stop area, and the output power and/or the scanning speed of the laser beam is changed when the start area and/or the stop area is scanned to change the energy obtained by the start area and/or the stop area.

11. The laser packaging method of claim 10, wherein the start zone and the stop zone are both the splicing zones.

12. The laser packaging method of claim 1, further comprising step 4: the frit is cooled by natural cooling, by scanning the frit with a laser beam in a predetermined power curve and/or by scanning the frit with a laser beam in a temperature feedback manner.

13. The laser packaging method of claim 1, wherein the shape of the plurality of sub-segments comprises a combination of straight lines and circular arcs.