CN107775956B - A method of the optimization profile scan path for increasing material manufacturing - Google Patents
A method of the optimization profile scan path for increasing material manufacturing Download PDFInfo
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- CN107775956B CN107775956B CN201610744439.4A CN201610744439A CN107775956B CN 107775956 B CN107775956 B CN 107775956B CN 201610744439 A CN201610744439 A CN 201610744439A CN 107775956 B CN107775956 B CN 107775956B
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 title claims abstract description 16
- 238000005457 optimization Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000284 extract Substances 0.000 claims abstract description 10
- 230000000717 retained effect Effects 0.000 claims abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000007493 shaping process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D1/00—Control of position, course, altitude or attitude of land, water, air or space vehicles, e.g. using automatic pilots
- G05D1/02—Control of position or course in two dimensions
- G05D1/021—Control of position or course in two dimensions specially adapted to land vehicles
- G05D1/0212—Control of position or course in two dimensions specially adapted to land vehicles with means for defining a desired trajectory
- G05D1/0217—Control of position or course in two dimensions specially adapted to land vehicles with means for defining a desired trajectory in accordance with energy consumption, time reduction or distance reduction criteria
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
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Abstract
A kind of method in optimization profile scan path for increasing material manufacturing is disclosed in the present invention, comprising: S1 extracts the information of the point of the tri patch on one layer of the STL model after layering；Extract three continuity points A1, B1 and C1 thereon in the initial position of S2 self demixing profile；S3 obtains the distance H of B1 point to A1 and C1 point line；S4 is by H value compared with selected tolerance value θ carries out size；S5 is retained B1 point, and the starting point calculated using B1 point as a new round, repeats step S1 to S5 when H value is greater than θ；When H value is less than or equal to θ, delete B1 point, and the starting point calculated using C1 point as a new round, S1 is repeated to S5 step, it selects tolerance value θ for the quality requirement after workpiece shaping according to user, and the partial dot on layering profile is removed according to the tolerance value, to improve laser delay the phenomenon that putting rough surface caused by intensive locate, and shorten process time simultaneously.
Description
Technical field
The present invention relates to the generation methods of laser beam scan path in increases material manufacturing technology, in particular to a kind of for increasing material system
The method in the optimization profile scan path made.
Background technique
Increasing material manufacturing, also known as rapid shaping or 3D printing are to utilize existing CAD/CAM Software Create entity component
Threedimensional model, and by Slice Software by its " cutting " at several lamellas, then layer-by-layer powdering, sintering is finally printed and three
The consistent entity of dimension module.Processing of the mode of this layer-by-layer superposition printing especially suitable for some complex parts, especially one
A little parts have complicated internal cavity, when type chamber sheet is as closed or semi-closed structure, even state-of-the-art five axis
Machining tool is also difficult to realize, at this point, its incomparable advantage is just showed in the layer-by-layer printing of increasing material manufacturing.
Carry out successively print before, need to plan laser beam scan path, with after powdering according to draft path into
The sintering of row constituency, is sintered powder and is formed by curing final entity.In increasing material manufacturing, for planning laser beam scan path
The format of model is generally STL format, and the mode stored in a computer is the mode of tri patch, and each triangular facet
The information unit facet of piece is the tri patch with direction vector, therefore, there are a plurality of straight line on each face, these
Straight line is after slice, and the vertex for being under the jurisdiction of the triangle sheet body on different layers can be fallen on the layer after being sliced, this will lead to one
There are multiple noise spots, the even intensive point set of noise spot on a straight line；And stl file is in repair process, since there are one
The mistakes such as some holes hole, vertex dislocation, when repairing stl file, repair process itself can cause the Light deformation of entity, this is slightly variable
The vertex that shape can generate some multiple tri patch after slice connects the near linear to be formed；And when model surface accuracy compared with
Gao Shi, there are more more intensive points on the contour line after slice.
Final result caused by above three reason be layering after each layer of contour curve on there are more points, and
The path of post laser scanning is exactly the broken line that these points are in turn connected to form.Laser when being scanned on powder bed, each
The position of point can once pause, this will lead to, and roughness at the point is poor, and for the part after printing, surface is thick
Rugosity must satisfy requirement, however, the pause point of laser can be in a close quarters when the point on contour line is excessively intensive
It concentrates, causes the surface quality of part corresponding site very poor, it is difficult to meet the needs of user is for shaped article.
Summary of the invention
The purpose of the present invention is to provide a kind of methods in optimization profile scan path for increasing material manufacturing, according to work
Part form error after molding requires selected tolerance value, and removes the partial dot on layering profile according to the tolerance value, to improve
The phenomenon that laser delay concentrates caused local surfaces coarse at the intensive place of point.
Above-mentioned purpose of the invention has the technical scheme that a kind of optimization wheel for increasing material manufacturing
The method of wide scan path, comprising:
S1 extracts the information of the point of the tri patch on one layer of the STL model after layering；
Extract three continuity points A1, B1 and C1 thereon in the initial position of S2 self demixing profile；
S3 obtains the distance H of B1 point to A1 and C1 point line；
S4 is by H value compared with the maximum allowance value θ that setting allows carries out size；
S5 is retained B1 point, and the starting point calculated using B1 point as a new round, repeats step S2 to S5 when H value is greater than θ；When
When H value is less than or equal to θ, B1 point, and the starting point calculated using C1 point as a new round are deleted, repeats S2 to S5 step.
By using above-mentioned technical proposal, firstly, the contour line on each layer is whole presses after part is separated by layer
Be linked in sequence the broken line formed, and the length of broken line depends on the distance between two endpoints of broken line, and the length of broken line determines
The shape and precision of contour line after selecting maximum allowance value θ, can be sentenced then requiring according to actual processing part its difference
It is disconnected to delete whether point will affect the chamfered shape of forming part, that is, certain points are deleted in the allowed band of maximum allowance value θ,
Be will not influence the chamfered shape of final part, meanwhile, the closeness of point is greatly diminished, and makes laser beam in a region
Interior pause number is reduced, and is remarkably improved the surface quality of forming part；At the same time, the scan path of laser beam simplifies
Afterwards, the pause number of laser beam significantly reduces, and therefore, the time required for the profile scan after subtracting a little can be greatly shortened；?
When computer carries out subtracting point processing, operation is iterated for a unit with three points and subtract a little, complicated wheel is quite suitable for
The operating condition of profile.
Further, in step S3 obtain B1 point to A1 and C1 point line distance H method are as follows: be sequentially connected with A1, B1
With tri- points of C1 to form a triangle, the vertical line on side, the intersection point of vertical line and straight line A1C1 where doing B1 point to A1 and C1 point
It is set as D1 point, then the distance between B1 and D1 point are H value.
By using above-mentioned technical proposal, the vertical line of the B1 point that is done to A1 and C1 point line, the company between B1 and intersection point
Line length is distance H of the B1 point to A1 and C1 point line, this distance H and roughness allowable tolerance value θ are compared
To know whether the choice of B1 point will affect the final shape of contour line, not only calculation method is simple, and effect is reliable, also, this
Kind manner of comparison is quite convenient for being iterated operation with computer software, to obtain higher data-handling efficiency.
It is another object of the present invention to provide it is a kind of for increasing material manufacturing optimization profile scan path method,
Tolerance value is selected according to the quality requirement after workpiece shaping, and removes the partial dot on layering profile according to the tolerance value, to change
The phenomenon that kind laser delay rough surface caused by the intensive place of point, and shorten process time simultaneously.
Above-mentioned purpose of the invention has the technical scheme that a kind of optimization wheel for increasing material manufacturing
The method of wide scan path, comprising:
S1 extracts the information of the point of the tri patch on one layer of the STL model after layering；
Extract three continuity points A1, B1 and C1 thereon in the initial position of S2 self demixing profile；
S3 sets the maximum allowance value θ, tie point A1 and C1 that allow to form straight line A1C1, and apart from straight line A1C1 θ
Place is symmetrical to draw two parallel lines for being parallel to straight line A1C1；
S4 is when B1 exceeds the region between two parallel lines, the starting point for retaining B1 point and being calculated using B1 point as a new round,
Repeat step S2 to S4；When B1 point fall in two it is parallel between region when, delete B1 point, and calculate as a new round using C1 point
Starting point repeats S2 to S4 step.
By using above-mentioned technical proposal, using the line of A1 and C1 as symmetry axis, after drawing two parallel lines with θ for distance,
Check B1 point in the which side of parallel lines you can learn that whether B1 point impacts profile wire shaped, without meter under this mode
Specific value is calculated, can be further improved the formation speed of scan path.
In conclusion the invention has the following advantages: according to the form accuracy in actual processing for forming part
It is required that setting maximum allowance value and the choice using it as judgment basis, to the intermediate point of three points continuous on contour curve
Whether influence final profile wire shaped to be judged, if not influencing, deletes respective point to reduce density a little, if influencing
Determine that the point accurately generates necessary point for contour curve, it is retained, may be implemented do not influencing forming part
Under the premise of profile wire shaped, delete unnecessary point, reduce the concentration of the point of contour line, thus decrease or even eliminate because
Laser stagnates the problem of forming part surface quality caused by a certain region is too long reduces, while making the path letter of laser scanning
Change, obtains higher processing efficiency.
Detailed description of the invention
Fig. 1 is that point caused by the tri patch in stl file is intensive；
Fig. 2 is certain straight line outline line being layered in later layer；
Fig. 3 is the near linear that plane deformation caused by stl file reparation is formed after slice；
Fig. 4 be as surface accuracy it is too high caused by be sliced after one layer of upper curve point formed it is excessive；
Fig. 5 is that the first of broken-line type contour line subtracts point mode principle；
Fig. 6 is that the first of curve wheel profile subtracts point mode principle；
Fig. 7 is that second of broken-line type contour line subtracts point mode principle；
Fig. 8 is that second of curve wheel profile subtracts point mode principle；
Fig. 9 is contour optimization method block diagram described in embodiment 1；
Figure 10 is to subtract a schematic diagram for judgement in the case of being deleted using the method intermediate point in embodiment 1 twice；
Figure 11 is to subtract a schematic diagram for judgement in the case of being retained using the method intermediate point in embodiment 1 twice；
Figure 12 is contour optimization method block diagram described in embodiment 2；
Figure 13 is to subtract a schematic diagram for judgement in the case of being deleted using the method intermediate point in embodiment 2 twice；
Figure 14 is to subtract a schematic diagram for judgement in the case of being deleted using the method intermediate point in embodiment 2 twice.
Specific embodiment
Below in conjunction with attached drawing, invention is further described in detail.
Embodiment 1
A method of for the optimization profile scan path of increasing material manufacturing, as shown in fig. 1, to the STL model of part
One layer after being sliced is as shown in fig. 1, since the format of STL three-dimensional entity model is triangle sheet form, zero after slice
The problems in can exist more than three kinds of points as shown in Fig. 2 to 4 on the contour line of part model and collect: position form of straight lines in Fig. 2
More and more intensive situation is put on contour line；Fig. 3 is stl file caused plane deformation when repairing triangle sheet body, is being cut
Formed after piece broken line form point is more and intensive phenomenon；Fig. 4 is to put on slicing profile curve caused by surface accuracy is excessively high
More and more intensive phenomenons.
For the more and intensive phenomenon of point shown in Fig. 2 and Fig. 3, providing one kind with initial reference to Fig. 5 subtracts point mode, with optimization
Contour path.With three points for one group, three points are connected, form triangle shown in a Fig. 5 (when chamfered shape is Fig. 2
Shown in straight line when, can be regarded as triangle three sides be overlapped), vertical line is done to the line of the point on both sides by intermediate point, in
Between point to intersection point distance be H.
Referring to the form accuracy requirement to final molding part, a maximum allowable tolerance value θ is set, when H value is greater than θ
When, it is possible to determine that, influence of second point for chamfered shape is greater than the maximum allowance that chamfered shape allows, that is to say, that the
Two points are the necessary point that chamfered shape is constituted, and should be retained；When H value is less than θ, part wheel will not be made by deleting second point
This wide position is more than the maximum allowance allowed, that is, deleting influence of second point for chamfered shape can be neglected, can
To delete.So, more than the point of form of straight lines and in the case of intensive, visual H value is 0, can directly be deleted between two-end-point
Whole points.Similar therewith, as shown in Figure 6, the contour curve of form of arcs subtracts a principle as hereinbefore.
Subtract point methods according to above-mentioned, the specific method of contour curve optimization provided referring to Fig. 9:
S1 with the endpoint of contour line for first point, sequentially continuous three points on contouring line；
S2 connects three points referring to the above method and forms a triangle；
S3 does vertical line to two end point connecting line and obtains intersection point using intermediate point as starting point；
S4 obtains the line segment length H between intersection point and intermediate point；
S30 inputs maximum allowance value θ；
S5 judges the size relation of H and θ, as H > θ, enters step S6, otherwise carries out step S61；
S6 deletes intermediate point and enters step S60；
S60 picks up three points using second point of remaining two points as starting point again, and repeats step S1/S2/S3/
S4/
S30/S4 and S5；
S61 retains intermediate point, and is the starting point of next group of three points with it, and repeat step S1/S2/S3/S4/S30/
S4 and S5.
Under the above method, it is as shown in FIG. 10 and 11 to subtract point process, and Figure 10 is the case where H value is less than θ, deletes intermediate point；
The case where Figure 11 is that H value is greater than θ, retains intermediate point and is next group of point starting point with it.
Embodiment 2
It is same as Example 1 as shown in Fig. 7 to 8, three continuous points are taken from contour line, connect the point at both ends, with
θ is distance, two o'clock line is parallel lines that symmetry axis does two o'clock line, if intermediate point falls in the region between two parallel lines
It is interior, subtract point process and H value and be less than as θ, deletes intermediate point；If intermediate point subtracts beyond the region between two parallel lines
Point process and H value are greater than as θ, need to retain intermediate point at this time.
In this way, 2 providing the specific method that contour curve optimizes referring to Fig.1:
S1 with the endpoint of contour line for first point, sequentially continuous three points on contouring line；
S2 joins two endpoints to form straight line；
S30 inputs maximum allowance value θ；
S3 draws two parallel lines apart from straight line θ distance using the straight line in S2 as symmetry axis, in its two sides；
S4 judges the region whether intermediate point falls between two parallel lines；
S5 point midway deletes intermediate point, enters step S61 between two parallel lines；
S60 intermediate point retains intermediate point beyond region between two parallel lines, and with its three point for being next group
Starting point repeats step S1/S2/S3/S4/S30/S4；
S61 repeats step S1/S2/S3/S4/S30/S4 using second point in remaining two points as starting point.
Under the above method, subtract point process as shown in Figs. 13 and 14, Figure 13 is between without departing from two parallel lines of intermediate point
The case where region, deletion intermediate point；Figure 14 is intermediate point beyond region between two parallel lines, under retaining intermediate point and being with it
The case where starting point of one group of point.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the scope of the claims of invention.
Claims (3)
1. a kind of method in the optimization profile scan path for increasing material manufacturing, characterized in that include:
S1 extracts the information of the point of the tri patch on one layer of the STL model after layering；
Extract three continuity points A1, B1 and C1 thereon in the initial position of S2 self demixing profile；
S3 obtains the distance H of B1 point to A1 and C1 point line；
S4 is by H value compared with the maximum allowance value θ that setting allows carries out size；
S5 is retained B1 point, and the starting point calculated using B1 point as a new round, repeats step S2 to S5 when H value is greater than θ；When H value
When less than or equal to θ, B1 point, and the starting point calculated using C1 point as a new round are deleted, repeats S2 to S5 step.
2. a kind of method in optimization profile scan path for increasing material manufacturing according to claim 1, characterized in that step
The method of distance H of the B1 point to A1 and C1 point line is obtained in rapid S3 are as follows: be sequentially connected with tri- points of A1, B1 and C1 to form one
The intersection point of triangle, the vertical line on side where doing B1 point to A1 and C1 point, vertical line and straight line A1C1 are set as D1 point, then B1 and D1 point it
Between distance be H value.
3. a kind of method in the optimization profile scan path for increasing material manufacturing, characterized in that include:
S1 extracts the information of the point of the tri patch on one layer of the STL model after layering；
Extract three continuity points A1, B1 and C1 thereon in the initial position of S2 self demixing profile；
Maximum allowance the value θ, tie point A1 and C1 that S3 setting allows are to form straight line A1C1, and at straight line A1C1 θ pair
Two parallel lines for claiming picture to be parallel to straight line A1C1；
When B1 exceeds the region between two parallel lines, the starting point for retaining B1 point and being calculated using B1 point as a new round repeats S4
Step S2 to S4；When B1 point fall in two it is parallel between region when, delete B1 point, and be that a new round calculates using C1 point
Point repeats S2 to S4 step.
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| CN108556365B (en) * | 2018-03-12 | 2021-06-22 | 中南大学 | Composite filling optimization method and system of rapid prototyping machine |
| TWI670467B (en) * | 2018-10-15 | 2019-09-01 | 立普思股份有限公司 | Processing method using depth image detection |
| CN112846232B (en) * | 2020-12-31 | 2023-03-03 | 南京英尼格玛工业自动化技术有限公司 | Multi-layer and multi-channel arc additive automatic trajectory planning method and system for metal structure |
| CN114101861A (en) * | 2021-11-02 | 2022-03-01 | 北京航星机器制造有限公司 | Arc additive manufacturing off-line programming method with editable local path points |
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