CN107768954B - A kind of board to board connector packaging method and waterproof foam - Google Patents
A kind of board to board connector packaging method and waterproof foam Download PDFInfo
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- CN107768954B CN107768954B CN201710980650.0A CN201710980650A CN107768954B CN 107768954 B CN107768954 B CN 107768954B CN 201710980650 A CN201710980650 A CN 201710980650A CN 107768954 B CN107768954 B CN 107768954B
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- board
- waterproof foam
- material layer
- board connector
- btb
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/005—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing
Abstract
The present invention provides a kind of board to board connector packaging method and a kind of foams, are related to board to board connector process field, and method includes: that waterproof foam is fitted in board to board connector receptacle periphery on mainboard；The waterproof foam includes expandable polymeric material layer；The height of the waterproof foam is lower than engagement height setting value；The engagement height is after the board to board connector plug and the board to board connector socket fasten, the flexible printed circuit board of the board to board connector plug to the height between mainboard；Board to board connector plug and board to board connector socket are fastened；The waterproof foam is heated, the expandable polymeric material layer is expanded, is bonded until the waterproof foam is expanded to the flexible printed circuit board.The embodiment of the present invention is realized in the case where not interfering board to board connector plug and board to board connector socket fastens to the well packaged of board to board connector by using the waterproof foam of heating expansion.
Description
Technical field
The present embodiments relate to board to board connector process field more particularly to a kind of encapsulation of board to board connector and prevent
Bubble cotton.
Background technique
Currently, usually making in the encapsulation process of BTB (Board-to-board Connectors, board to board connector)
With waterproof foam, for preventing in BTB component to contact with water, keep normally using function.
In the prior art, preferable anti-in order to reach using the waterproof foam that height is fixed during encapsulating BTB
Water effect, BTB waterproof foam height, after being fastened than BTB plug and socket, the flexible printed circuit board of BTB plug to mainboard
Between height want high.
Shown in referring to Fig.1, in the prior art, before BTB plug and BTB socket fasten, BTB vertical section structure schematic diagram.
BTB plug 101 by flexible printed circuit board steel strengthening course 1011, FPC layer 1012 (Flexible Printed Circuit, it is soft
Property layer printed circuit board), plug layer 1013 form.102 be BTB socket in figure, and 103 be waterproof foam, and 104 be mainboard.
Plastic material is wrapped up around the electrical connections of the BTB plug, which is used to be the electrical connections
Waterproof.Plastic material has also been wrapped up around the electrical connections of the same BTB socket.
In order to reach preferable waterproof effect, before BTB is fastened, the height of waterproof foam is than the FPC layer of BTB plug is extremely
Height between mainboard wants high.
During BTB is fastened, BTB plug can first contact waterproof foam and generate interference, will affect the fastening contraposition of BTB
With fastening feel, BTB plug fastens deviation, leads to the plastic cement that electrical connections are wrapped up in be collapsed BTB plug and socket, and then drop
The reliability of low BTB connection results in the need for carrying out a large amount of BTB maintenance even replacement.
Summary of the invention
The present invention provides a kind of board to board connector packaging method and waterproof foam, to solve BTB waterproof in first technology
Foam height is higher, causes BTB plug to fasten deviation, the plastic cement of electrical connections, BTB are wrapped up in be collapsed BTB plug and socket
The problem of connection reliability bottom.
According to the first aspect of the invention, board to board connector packaging method is provided, which comprises
On mainboard, waterproof foam is fitted in board to board connector receptacle periphery；The waterproof foam includes that expansion is high
Molecular material layer；The height of the waterproof foam is lower than engagement height setting value；The engagement height is that the plate connects plate
After device plug and the board to board connector socket fasten, the flexible printed circuit board of the board to board connector plug to mainboard
Between height；
Board to board connector plug and board to board connector socket are fastened；
The waterproof foam is heated, expands the expandable polymeric material layer, until the waterproof foam is swollen
It is swollen to be extremely bonded with the flexible printed circuit board.
According to the second aspect of the invention, another board to board connector packaging method is provided, which comprises
Waterproof foam is bonded in the setting position of the flexible printed circuit board of board to board connector plug；The setting position
After being fastened for the board to board connector plug and board to board connector socket, around the region of board to board connector socket；Institute
Stating waterproof foam includes expandable polymeric material layer；The height of the waterproof foam is lower than engagement height setting value；The cooperation
After height is the board to board connector plug and board to board connector socket fastening, the board to board connector plug
Flexible printed circuit board is to the height between mainboard；
Board to board connector plug and board to board connector socket are fastened；
The waterproof foam is heated, expands the expandable polymeric material layer, until the waterproof foam is swollen
It is swollen to be extremely bonded with the mainboard.
According to the third aspect of the invention we, a kind of waterproof foam is provided, the waterproof foam includes:
First release film layer, the first layers of two-sided, expandable polymeric material layer, the second layers of two-sided, porous material layer,
Three layers of two-sided, the second release film layer；
The first surface of the expandable polymeric material layer is bonded by the first layers of two-sided with the first release film layer；
The second surface of the expandable polymeric material layer passes through the second layers of two-sided and first table of porous material layer
Face paste is closed；
The porous material layer second surface is bonded by third layers of two-sided with the second release film layer.
A kind of board to board connector packaging method provided in an embodiment of the present invention, due to being heated in the waterproof foam of use
Afterwards, it can expand, therefore, using being highly lower than, after BTB is fastened, the flexible printed circuit board of BTB plug to the height between mainboard
The waterproof foam for spending setting value makes its expansion, until waterproof foam and flexibility by heating to waterproof foam after fastening
Printed circuit board or mainboard fitting, not only ensure that good waterproof effect；Simultaneously as before fastening, the height of waterproof foam
It is lower than, after BTB is fastened, the flexible printed circuit board of BTB plug is to the height set between mainboard, and therefore, waterproof foam is not
The fastening of BTB plug and socket can be interfered, the fastening contraposition of BTB and fastening good hand touch, BTB plug closed position are rectified, will not
The plastic cement for wrapping up electrical connections in BTB plug and socket is influenced, and then improves the reliability of BTB connection.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by institute in the description to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without any creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is that board to board connector is inserted into diagrammatic cross-section in first technology；
Fig. 2 is a kind of flow chart of board to board connector packaging method provided in an embodiment of the present invention；
Fig. 3 is diagrammatic cross-section before the encapsulation of board to board connector of the embodiment of the present invention is inserted into；
Fig. 4 is the schematic diagram in board to board connector socket part stickup waterproof foam of the embodiment of the present invention；
Fig. 5 is the embodiment of the present invention based on the schematic diagram after the board to board connector insertion of Fig. 3；
Fig. 6 is the embodiment of the present invention based on the result schematic diagram after Fig. 5 waterproof foam expanded by heating；
Fig. 7 is the flow chart of another board to board connector packaging method provided in an embodiment of the present invention；
Fig. 8 is a kind of structural schematic diagram of waterproof foam provided in an embodiment of the present invention；
Fig. 9 is the flow chart of another board to board connector packaging method provided in an embodiment of the present invention；
Figure 10 is the schematic diagram provided in an embodiment of the present invention that waterproof foam is pasted in board to board connector plug.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Embodiment one
Referring to Fig. 2, a kind of flow chart of board to board connector packaging method according to an embodiment of the invention is shown,
It can specifically include following steps:
Step 101, on mainboard, waterproof foam is fitted in board to board connector receptacle periphery；The waterproof foam packet
Include expandable polymeric material layer；The height of the waterproof foam is lower than engagement height setting value；The engagement height is the plate
After being fastened to connector for substrate plug and the board to board connector socket, the flexible print circuit of the board to board connector plug
Plate is to the height between mainboard.
Referring to Fig. 3, it illustrates in a kind of board to board connector encapsulation process provided in an embodiment of the present invention, BTB plug
Vertical section structure schematic diagram before being fastened with BTB socket, in BTB receptacle periphery, after being bonded waterproof foam, wherein BTB plug
101 by flexible printed circuit board steel strengthening course 1011, FPC (Flexible Printed Circuit, flexible printed circuit board)
Layer 1012, plug layer 1013 form.102 be BTB socket in figure, and 103 be waterproof foam, and 104 be mainboard, in the embodiment of the present invention
In, mainboard can be pcb board (Printed circuit board, printed circuit board).
Plastic material is wrapped up around the electrical connections of the BTB plug, which is used to be the electrical connections
Waterproof.Plastic material has also been wrapped up around the electrical connections of the same BTB socket.
Above-mentioned mainboard is located at the lower section of BTB socket, and on mainboard, above-mentioned waterproof foam is fitted in around BTB socket.
Referring to Fig. 4, Fig. 4 is, on mainboard, after above-mentioned waterproof foam is fitted in around BTB socket, and the cross-sectional structure of the BTB
Schematic diagram, in Fig. 4,104 be mainboard, and 103 be waterproof foam, and 102 be BTB socket.The waterproof foam, should around the BTB socket
Distance of the waterproof foam apart from above-mentioned BTB socket meets waterproof demand, and it is not limited in the embodiment of the present invention.
In traditional BTB encapsulation process, the waterproof foam used is different, in the waterproof foam selected in the embodiment of the present invention
Including expandable polymeric material layer, volume expansion after the expandable polymeric material layer is heated.
In order to not influence the fastening of BTB plug and socket, the height of the waterproof foam, it is necessary to it is lower than, after fastening, the BTB
To the setting value of the height between mainboard, setting value herein can be the flexible printed circuit board of plug, after fastening, the BTB
The flexible printed circuit board of plug is to 50% of the height between mainboard, in embodiments of the present invention, the height of the waterproof foam,
As long as can guarantee, BTB plug and socket is not interfered to fasten, it is not limited in the embodiment of the present invention.
In embodiments of the present invention, the width and length of the waterproof foam need to not only interfere the BTB plug and socket button
It closes, after heating expansion, can satisfy BTB encapsulation and require, in embodiments of the present invention, in this regard, being not especially limited.
By limiting the height of the waterproof foam, the waterproof foam ensure that, will not interfere with BTB plug and socket fastening,
Therefore, the fastening contraposition of BTB and fastening good hand touch, BTB plug closed position are rectified, will not influence and wrap in BTB plug and socket
The plastic cement of electrical connections is wrapped up in, and then improves the reliability of BTB connection.
Step 102, board to board connector plug and board to board connector socket are fastened.
The plug of BTB and socket are fastened, guarantee that the electrical connections of plug and the electrical connections of socket are abundant in BTB
Contact.It is board to board connector vertical section structure schematic diagram after BTB plug and BTB socket fastening referring to Fig. 5, Fig. 5, wherein
BTB plug 101 is by flexible printed circuit board steel strengthening course 1011, FPC (Flexible Printed Circuit, flexible printing
Circuit board) layer 1012, the composition of plug layer 1013,102 be BTB socket, and 103 be waterproof foam, and 104 be mainboard, and the h in Fig. 5 is
For in above-mentioned steps 101, after board to board connector plug and the board to board connector socket fasten, board to board connector plug
Flexible printed circuit board to the height between mainboard.
Step 103, the waterproof foam is heated, expands the expandable polymeric material layer, until described anti-
Bubble cotton is expanded to be bonded with the flexible printed circuit board.
It referring to Fig. 6, shows in the embodiment of the present invention, after waterproof foam is heated, expansion is until with the flexible printing electricity
The fitting of road plate, board to board connector vertical section structure schematic diagram.Wherein, BTB plug 101 is by flexible printed circuit board steel strengthening course
1011, FPC (English: Flexible Printed Circuit, flexible printed circuit board) layer 1012, plug layer 1013 form,
In Fig. 6,102 be BTB socket, and 103 be waterproof foam, and 104 be mainboard.
Due to, after the waterproof foam of the embodiment of the present invention includes heated, the expanding molecules material that volume can expand, because
This heats the waterproof foam after the plug and socket of BTB fasten, and inserts until the waterproof foam is expanded to the BTB
The FPC layer fitting of head.
In embodiments of the present invention, by controlling the height of the expandable polymeric material layer, the height of waterproof foam, heating
Temperature and heating time, and then guarantee, the waterproof foam after heating expansion can be just bonded with the FPC of BTB plug layer,
It is unlikely to expand too high or too low.
Simultaneously by controlling the length and width of the expandable polymeric material layer, the length and width of waterproof foam, heating
Temperature and heating time, and then guarantee, the waterproof foam after heating expansion can meet on length and width direction
The encapsulation requirement of the BTB.In embodiments of the present invention, to the length and width of the expandable polymeric material layer, waterproof foam
Length and width is not especially limited.
Board to board connector packaging method provided in an embodiment of the present invention, before fastening, the height of waterproof foam is lower than,
After BTB is fastened, the flexible printed circuit board of BTB plug is to the height set between mainboard, and therefore, waterproof foam will not interfere with
The fastening of BTB plug and socket, the fastening contraposition of BTB and fastening good hand touch, BTB plug closed position are rectified, and will not influence BTB
The plastic cement of electrical connections is wrapped up in plug and socket, and then improves the reliability of BTB connection；Meanwhile after BTB is fastened, lead to
It crosses and waterproof foam is heated, make its expansion, until waterproof foam is bonded with flexible printed circuit board, ensure that good anti-
Water effect.
Embodiment two
Referring to Fig. 7, a kind of flow chart of board to board connector packaging method according to an embodiment of the invention is shown,
It can specifically include following steps:
Step 201, the release film layer on waterproof foam surface is torn off, exposed two-face suction glue-line.
The waterproof foam includes release film layer, is mainly used to, and the layers of two-sided on the waterproof foam is protected, will before fitting
The release film layer is torn off, exposed two-face suction glue-line.In embodiments of the present invention, which is not especially limited.
Preferably, which includes: release film layer, layers of two-sided, porous material layer, expandable polymeric material layer.
Preferably, the initial total height of the waterproof foam is 0.4~0.6 millimeter.
Referring to Fig. 8, a kind of structural schematic diagram of the waterproof foam is shown.In fig. 8, wherein 10 be the first release film
Layer, 20 be the first layers of two-sided, and 30 be expandable polymeric material layer, and 40 be the second layers of two-sided, and 50 be porous material layer, and 60 are
Third layers of two-sided, 70 be the second release film layer.
The first surface of expandable polymeric material layer is bonded by the first layers of two-sided with the first release film layer, and high score is expanded
The second surface of sub- material layer is bonded by the second layers of two-sided with porous material layer first surface, porous material layer second surface
It is bonded by third layers of two-sided with the second release film layer.
The intumescent material, release film layer, layers of two-sided, the size of porous material layer need to meet BTB encapsulation and require,
The waterproof foam being consequently formed simultaneously does not interfere the fastening of the BTB, and after heated, and the size after waterproof foam expansion is same
Need to meet the encapsulation and use of the BTB.Optionally, in the waterproof foam, expandable polymeric material layer can have multilayer.It is optional
, which can be modified PP (Polypropylene, polypropylene), and (Polystyrene gathers by PP, PS
Styrene), above-mentioned expandable polymeric material, after being heated, volume can expand.The thickness of the expandable polymeric material can be 0.2
~0.3 millimeter.
Optionally, in the waterproof foam, porous material layer may be multilayer.Optionally, which can be
PU (Polyurethane, polyurethane), above-mentioned porous material, during the expansion of heated and above-mentioned expandable polymeric material its
Performance can also meet the encapsulation requirement of the BTB.The thickness of the porous material layer can be 0.2~0.3 millimeter.
Optionally, in the waterproof foam, layers of two-sided is multilayer.Optionally, which can be acrylic resin
Adhesive, while the layers of two-sided, its performance can also meet during the expansion of heated and above-mentioned expandable polymeric material
The encapsulation requirement of the BTB.The thickness of the layers of two-sided can be 10~20 microns.
Step 202, on mainboard, waterproof foam is fitted in board to board connector receptacle periphery；The waterproof foam packet
Include expandable polymeric material layer；The height of the waterproof foam is lower than engagement height setting value；The engagement height is the plate
After being fastened to connector for substrate plug and the board to board connector socket, the flexible print circuit of the board to board connector plug
Plate is to the height between mainboard.
The step can be with reference to the step 101 in above-described embodiment one, and details are not described herein again.It should be noted that pasting
During conjunction, by exposed layers of two-sided, realize, waterproof foam is bonded with mainboard.
By limiting the height of the waterproof foam, the waterproof foam ensure that, will not interfere with BTB plug and socket fastening,
Therefore, the fastening contraposition of BTB and fastening good hand touch, BTB plug closed position are rectified, will not influence and wrap in BTB plug and socket
The plastic cement of electrical connections is wrapped up in, and then improves the reliability of BTB connection.
Step 203, board to board connector plug and board to board connector socket are fastened.
The step can be with reference to the step 102 in above-described embodiment one, and details are not described herein again.
Step 204, the waterproof foam is heated using hot wind, uses temperature for 80~100 degrees Celsius of hot wind,
The waterproof foam is heated 20~30 seconds.
Due to, after the waterproof foam of the embodiment of the present invention includes heated, the expanding molecules material that volume can expand, because
This heats the waterproof foam, after the plug and socket of BTB fasten since there are numerous electronics member devices in BTB
Part will not influence the electric property of above-mentioned electronic component using Hot-blast Heating.
Meanwhile the electric property in order to guarantee above-mentioned electronic component, it needs to control the temperature of hot wind and be taken the photograph 80~100
Family name's degree, heating time control 20~30 seconds.Under above-mentioned heating condition, the height after the waterproof foam is heated can satisfy BTB
Encapsulation requires.
Step 205, after expanding the expandable polymeric material layer, pass through the layers of two-sided and flexible printing electricity
The fitting of road plate.
In above-mentioned steps 201, the release film layer of waterproof foam is torn off, exposed two-face suction glue-line；The waterproof foam is passed through
After the heating of above-mentioned steps 204, in step 202, another layers of two-sided not being bonded is just bonded with the FPC of BTB plug.
In embodiments of the present invention, by controlling the height of the expandable polymeric material layer, the height of waterproof foam, heating
Temperature and heating time, and then guarantee, the waterproof foam after heating expansion can be just bonded with the FPC of the BTB plug, no
It is too high or too low as expanding.
Meanwhile the layers of two-sided that the waterproof foam is exposed, it is bonded with the FPC of BTB plug layer, even if the waterproof foam is to the cold
Contraction or the BTB stress, the layers of two-sided of the waterproof foam, or fitted closely with the FPC layer of BTB plug, it is not in sky
Gap ensure that the good waterproof effect of BTB.
The length and width of above-mentioned expandable polymeric material layer, the determination of the length and width of waterproof foam, reference are above-mentioned
Step 103 in embodiment one, details are not described herein again.
Board to board connector packaging method provided in an embodiment of the present invention, before fastening, the height of waterproof foam is lower than,
After BTB is fastened, the flexible printed circuit board of BTB plug is to the height set between mainboard, and therefore, waterproof foam will not interfere with
The fastening of BTB plug and socket, the fastening contraposition of BTB and fastening good hand touch, BTB plug closed position are rectified, and will not influence BTB
The plastic cement of electrical connections is wrapped up in plug and socket, and then improves the reliability of BTB connection；Meanwhile after BTB is fastened, lead to
It crosses and waterproof foam is heated, make its expansion, until waterproof foam is bonded with flexible printed circuit board, ensure that good anti-
Water effect；Meanwhile the layers of two-sided exposed by the waterproof foam, it is bonded with the FPC of BTB plug, even if the waterproof foam is met
Cold events or the BTB stress, the layers of two-sided of the waterproof foam, or fitted closely with the FPC of BTB plug, it is not in sky
Gap ensure that the good waterproof effect of BTB.
Embodiment three
Referring to Fig. 9, a kind of flow chart of board to board connector packaging method according to an embodiment of the invention is shown,
It can specifically include following steps:
Step 301, waterproof foam is bonded in the setting position of the flexible printed circuit board of board to board connector plug；It is described
Setting position is after the board to board connector plug is fastened with board to board connector socket, around board to board connector socket
Region；The waterproof foam includes expandable polymeric material layer；The height of the waterproof foam is lower than engagement height setting value；Institute
Stating engagement height is the board to board connector after the board to board connector plug and board to board connector socket fastening
The flexible printed circuit board of plug is to the height between mainboard；
The relative position of the BTB plug construction, the BTB socket structure and plug, socket and mainboard, waterproof foam, waterproof
The length of foam, width, referring to step 101 in the embodiment of the present invention one, details are not described herein again.
It should be noted that be fitted in waterproof foam on the FPC of the BTB plug herein, 0, Figure 10 is in plate referring to Fig.1
After the setting position fitting waterproof foam of the flexible printed circuit board of connector for substrate plug, board to board connector cross-sectional structure
Schematic diagram.In figure 1012 be BTB plug FPC layer, 103 be waterproof foam region example, 1013 for BTB plug plug
Layer region example, which surround the plug layer of BTB plug, at this point, the bonding position of the waterproof foam, not competent
It relates to, which fastens.Therefore, which is inserted after being set as BTB plug and socket fastening around BTB
The region of seat.The bonding position of waterproof foam is corresponding in step 101 in the bonding position with embodiment one of waterproof foam herein.
Likewise, in order to not influence the fastening of BTB plug and socket, the height of the waterproof foam, it is necessary to be lower than, fasten
Afterwards, to the setting value of the height between mainboard, setting value herein can be the FPC of the BTB plug, after fastening, the BTB plug
Flexible printed circuit board to 50% of the height between mainboard, after fastening, the flexible printed circuit board of the BTB plug to mainboard
Between height be referred to the height h in above-mentioned Fig. 5.In embodiments of the present invention, the height of the waterproof foam, as long as can
Guarantee, does not interfere BTB plug and socket to fasten, it is not limited in the embodiment of the present invention.
By limiting the height of the waterproof foam, the waterproof foam ensure that, will not interfere with BTB plug and socket fastening,
Therefore, the fastening contraposition of BTB and fastening good hand touch, BTB plug closed position are rectified, will not influence and wrap in BTB plug and socket
The plastic cement of electrical connections is wrapped up in, and then improves the reliability of BTB connection.
Step 302, board to board connector plug and board to board connector socket are fastened.
The step can be with reference to the step 102 in above-described embodiment one, and details are not described herein again.
Step 303, the waterproof foam is heated, expands the expandable polymeric material layer, until described anti-
Bubble cotton is expanded to be bonded with the mainboard.
Due to, after the waterproof foam of the embodiment of the present invention includes heated, the expanding molecules material that volume can expand, because
This heats the waterproof foam after the plug and socket of BTB fasten, one end expansion which is not bonded, directly
It is expanded to the waterproof foam and is bonded with the BTB mainboard.
In embodiments of the present invention, by controlling the height of the expandable polymeric material layer, the height of waterproof foam, heating
Temperature and heating time, and then guarantee, the waterproof foam after heating expansion can be just bonded with the BTB mainboard, be unlikely to
It expands too high or too low.
The length and width of the expandable polymeric material layer, the length and width of waterproof foam, heating temperature and heating
The determination of time is not especially limited in embodiments of the present invention referring to above-mentioned steps 103.
Board to board connector packaging method provided in an embodiment of the present invention, before fastening, the height of waterproof foam is lower than,
After BTB is fastened, the flexible printed circuit board of BTB plug is to the height set between mainboard, and therefore, waterproof foam will not interfere with
The fastening of BTB plug and socket, the fastening contraposition of BTB and fastening good hand touch, BTB plug closed position are rectified, and will not influence BTB
The plastic cement of electrical connections is wrapped up in plug and socket, and then improves the reliability of BTB connection；Meanwhile after BTB is fastened, lead to
It crosses and waterproof foam is heated, make its expansion, until waterproof foam is bonded with mainboard, ensure that good waterproof effect.
Example IV
Referring to Fig. 8, a kind of structural schematic diagram of waterproof foam according to an embodiment of the invention, a kind of waterproof are shown
Foam, the waterproof foam include: the first release film layer, the first layers of two-sided, expandable polymeric material layer, the second double-sided adhesive
Layer, porous material layer, third layers of two-sided, the second release film layer；
The first surface of the expandable polymeric material layer is bonded by the first layers of two-sided with the first release film layer；
The second surface of the expandable polymeric material layer passes through the second layers of two-sided and first table of porous material layer
Face paste is closed；
The porous material layer second surface is bonded by third layers of two-sided with the second release film layer.
Fig. 8 is a kind of structural schematic diagram of one layer of waterproof foam for expandable polymeric material layer and porous material.
In fig. 8, wherein 10 be the first release film layer, and 20 be the first layers of two-sided, and 30 be expandable polymeric material layer,
40 be the second layers of two-sided, and 50 be porous material layer, and 60 be third layers of two-sided, and 70 be the second release film layer.
For waterproof foam embodiment, related place is referring to the part explanation of waterproof foam in BTB packaging method
Can, details are not described herein again.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.
In the instructions provided here, numerous specific details are set forth.It is to be appreciated, however, that implementation of the invention
Example can be practiced without these specific details.In some instances, well known method, structure is not been shown in detail
And technology, so as not to obscure the understanding of this specification.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of the various inventive aspects,
Above in the description of exemplary embodiment of the present invention, each feature of the invention is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the disclosed method should not be interpreted as reflecting the following intention: i.e. required to protect
Shield the present invention claims features more more than feature expressly recited in each claim.More precisely, as above
Claims reflect as, inventive aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim itself
All as a separate embodiment of the present invention.
In addition, it will be appreciated by those of skill in the art that although some embodiments described herein include other embodiments
In included certain features rather than other feature, but the combination of the feature of different embodiments mean it is of the invention
Within the scope of and form different embodiments.For example, in the following claims, embodiment claimed is appointed
Meaning one of can in any combination mode come using.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and ability
Field technique personnel can be designed alternative embodiment without departing from the scope of the appended claims.In the claims,
Any reference symbol between parentheses should not be configured to limitations on claims.Word "comprising" does not exclude the presence of not
Element or step listed in the claims.Word "a" or "an" located in front of the element does not exclude the presence of multiple such
Element.The present invention can be by means of including the hardware of several different elements and being come by means of properly programmed computer real
It is existing.In the unit claims listing several devices, several in these devices can be through the same hardware branch
To embody.The use of word first, second, and third does not indicate any sequence.These words can be explained and be run after fame
Claim.
Those of ordinary skill in the art may be aware that the embodiment in conjunction with disclosed in the embodiment of the present invention describe it is each
Exemplary unit and algorithm steps can be realized with the combination of electronic hardware or computer software and electronic hardware.These
Function is implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Profession
Technical staff can use different methods to achieve the described function each specific application, but this realization is not answered
Think beyond the scope of this invention.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In embodiment provided herein, it should be understood that disclosed method and waterproof foam can pass through it
Its mode is realized.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (8)
1. a kind of board to board connector packaging method, which is characterized in that the described method includes:
On mainboard, waterproof foam is fitted in board to board connector receptacle periphery；The waterproof foam includes expandable polymeric
Material layer；The height of the waterproof foam is lower than engagement height setting value；The engagement height be board to board connector plug with
After the board to board connector socket fastens, the flexible printed circuit board of the board to board connector plug to the height between mainboard
Degree；
Board to board connector plug and board to board connector socket are fastened；
The waterproof foam is heated, expands the expandable polymeric material layer, until the waterproof foam is expanded to
It is bonded with the flexible printed circuit board.
2. the method according to claim 1, wherein the waterproof foam further include:
First release film layer, the first layers of two-sided, the second layers of two-sided, porous material layer, third layers of two-sided, the second release film
Layer；
The first surface of the expandable polymeric material layer is bonded by the first layers of two-sided with the first release film layer；
The second surface of the expandable polymeric material layer is pasted by the second layers of two-sided and the porous material layer first surface
It closes；
The porous material layer second surface is bonded by third layers of two-sided with the second release film layer.
3. method according to claim 1 or 2, which is characterized in that the described the step of waterproof foam is heated,
Include:
The waterproof foam is heated using hot wind.
4. according to the method described in claim 3, it is characterized in that, described using hot wind heat the waterproof foam
Step, comprising:
It uses temperature for 80~100 degrees Celsius of hot wind, the waterproof foam is heated 20~30 seconds.
5. according to the method described in claim 2, it is characterized in that, waterproof foam being fitted in plate and is connected to plate on mainboard
Before the step of device receptacle periphery, further includes:
The release film layer on waterproof foam surface is torn off, exposed two-face suction glue-line.
6. according to the method described in claim 5, making described swollen it is characterized in that, described heat the waterproof foam
Swollen polymer material layer expansion, until the waterproof foam is expanded to the step of being bonded with the flexible printed circuit board, comprising:
The waterproof foam is heated, after expanding the expandable polymeric material layer, passes through the layers of two-sided and institute
State flexible printed circuit board fitting.
7. a kind of board to board connector packaging method, which is characterized in that the described method includes:
Waterproof foam is bonded in the setting position of the flexible printed circuit board of board to board connector plug；The setting position is institute
After stating board to board connector plug and board to board connector socket fastening, around the region of board to board connector socket；It is described anti-
Bubble cotton includes expandable polymeric material layer；The height of the waterproof foam is lower than engagement height setting value；The engagement height
After being fastened for the board to board connector plug and the board to board connector socket, the flexibility of the board to board connector plug
Printed circuit board is to the height between mainboard；
Board to board connector plug and board to board connector socket are fastened；
The waterproof foam is heated, expands the expandable polymeric material layer, until the waterproof foam is expanded to
It is bonded with the mainboard；
The mainboard is the mainboard that the board to board connector socket is arranged.
8. a kind of waterproof foam, which is characterized in that the waterproof foam includes:
First release film layer, the first layers of two-sided, expandable polymeric material layer, the second layers of two-sided, porous material layer, third are double
Face glue-line, the second release film layer；
The first surface of the expandable polymeric material layer is bonded by the first layers of two-sided with the first release film layer；
The second surface of the expandable polymeric material layer is pasted by the second layers of two-sided and the porous material layer first surface
It closes；
The porous material layer second surface is bonded by third layers of two-sided with the second release film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710980650.0A CN107768954B (en) | 2017-10-19 | 2017-10-19 | A kind of board to board connector packaging method and waterproof foam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710980650.0A CN107768954B (en) | 2017-10-19 | 2017-10-19 | A kind of board to board connector packaging method and waterproof foam |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107768954A CN107768954A (en) | 2018-03-06 |
| CN107768954B true CN107768954B (en) | 2019-07-26 |
Family
ID=61269993
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| CN201710980650.0A Active CN107768954B (en) | 2017-10-19 | 2017-10-19 | A kind of board to board connector packaging method and waterproof foam |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102447195A (en) * | 2011-12-26 | 2012-05-09 | 广东步步高电子工业有限公司 | Waterproof method of BTB (board to board) connector |
| US9755337B2 (en) * | 2014-09-02 | 2017-09-05 | Apple Inc. | Waterproof board-to-board connectors |
| CN205303745U (en) * | 2015-11-30 | 2016-06-08 | 上海闻泰电子科技有限公司 | Electronic equipment and board are to board connector |
| CN206558780U (en) * | 2017-02-28 | 2017-10-13 | 维沃移动通信有限公司 | A kind of connector and mobile terminal |
| CN107142038A (en) * | 2017-06-26 | 2017-09-08 | 东莞市明信高分子科技有限公司 | A kind of peelable waterproof foam tape and preparation method thereof |
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2017
- 2017-10-19 CN CN201710980650.0A patent/CN107768954B/en active Active
Also Published As
| Publication number | Publication date |
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| CN107768954A (en) | 2018-03-06 |
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