CN107745549B - A kind of method of increasing material manufacturing built-in circuit composite metal plate - Google Patents
A kind of method of increasing material manufacturing built-in circuit composite metal plate Download PDFInfo
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- CN107745549B CN107745549B CN201710828680.XA CN201710828680A CN107745549B CN 107745549 B CN107745549 B CN 107745549B CN 201710828680 A CN201710828680 A CN 201710828680A CN 107745549 B CN107745549 B CN 107745549B
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- Prior art keywords
- circuit
- metal plate
- composite metal
- consolidation
- metal foil
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 67
- 239000002184 metal Substances 0.000 title claims abstract description 67
- 239000000463 material Substances 0.000 title claims abstract description 51
- 239000002131 composite material Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000007596 consolidation process Methods 0.000 claims abstract description 45
- 239000011888 foil Substances 0.000 claims abstract description 32
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 239000011810 insulating material Substances 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000003973 paint Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 2
- 230000008439 repair process Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 17
- 238000009825 accumulation Methods 0.000 description 4
- KCZFLPPCFOHPNI-UHFFFAOYSA-N alumane;iron Chemical compound [AlH3].[Fe] KCZFLPPCFOHPNI-UHFFFAOYSA-N 0.000 description 4
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 4
- 239000005030 aluminium foil Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of methods of increasing material manufacturing built-in circuit composite metal plate, belong to material increasing field；The technical problem to be solved is that providing one kind circuit can be write direct composite metal plate, circuit is prepared simultaneously with composite metal plate, the method that integrated increasing material manufacturing built-in circuit composite metal plate is made；Solve the technical solution of technical problem use are as follows: a kind of method of increasing material manufacturing built-in circuit composite metal plate, by being cut into the circuit paths set in advance in metal foil, metal foil is shaped by ultrasonic consolidation, then it is sequentially filled insulating materials, conductive material, insulating materials in circuit paths, circuit and composite metal plate preparation are integrated；It the composite can be widely applied to material increasing field.
Description
Technical field
A kind of method of increasing material manufacturing built-in circuit composite metal plate of the present invention, belongs to increases material manufacturing technology field.
Background technique
Metal ultrasonic consolidation technology utilizes metal using metal foil as raw material using large power supersonic energy
Layer vibrates the heat that friction generates with layer, makes material that violent plastic deformation locally occur, to reach interatomic physics smelting
Gold combines, and realizes a kind of specific process of solid-state connection between of the same race or different metal materials.In metal ultrasonic consolidation skill
On the basis of art, the techniques such as combining with digital control milling are, it can be achieved that ultrasonic wave increasing material forming is integrated with intelligence manufacture.The technology is because of tool
There is the advantage of energy conservation and environmental protection, efficient, low cost etc. and get the attention, in aerospace, auto industry, weapon dress
Standby equal fields have broad application prospects, at present ultrasonic wave increase material forming technique be gradually applied to high of the same race of preparation intensity or
The metal laminated material of dissimilar metal laminated material, preparation can be used for the fields such as plate armour, aerospace.In order to more preferably measure equipment
Operating status and connect with other circuit systems, often in the composite inner implantation circuit plate.Tradition implantation side at present
Method is to process groove in the composite board internal prepared, is then filled with circuit board, then be packaged with fillings such as resins.This side
The clad metal sheet and internal circuit board of method preparation can't be an entirety, reduce the mechanical property of composite plate, increase
Processing cost.
Summary of the invention
The invention overcomes the deficiencies of the prior art, and provides one kind circuit can be write direct metal composite
Plate prepares circuit with composite metal plate simultaneously, the method that integrated increasing material manufacturing built-in circuit composite metal plate is made.
In order to solve the above-mentioned technical problem, a kind of the technical solution adopted by the present invention are as follows: increasing material manufacturing built-in circuit metal
The method of composite plate carries out as follows:
(1) composite metal plate for needing built-in circuit is modeled, circuit paths and position in composite metal plate is set,
Model is repaired with Magic software, then the model is sliced with Autofab software；
(2) circuit paths are cut into according to the circuit paths set out on metal foil；
(3) by ultrasonic consolidation device, by metal foil consolidation, with cutter by excess metal foil after consolidation
Material is cut away；
(4) one layer of insulating materials is laid in the circuit trace of the metal foil after consolidation；
(5) layer of conductive material is sprayed on the insulating materials after consolidation；
(6) one layer of insulating materials is being laid with above the conductive material after consolidation；
(7) step 2-step 6 is repeated, the compound of next layer of metal foil is carried out；
(8) it repeats the above steps, metal foil, which is successively accumulated, to add up, and obtains the composite metal plate of built-in circuit.
Preferably, in the step 1, slice thickness is metal foil thickness, and forming accuracy is controlled in ± 1mm.
Preferably, in the step 2, metal foil is 50-200r/s with a thickness of 0.1-0.5mm, cutter rotation speed, is cut
Knife movement speed is 0.5-1m/s, and cutter boundary chamfering is 0.5-2mm；It with alcohol washes metal foil and is dried up after cutting.
Preferably, in the step 3, ultrasonic consolidation power is 2-4KW.Cutter cutting speed is 1-3m/s, cutter pressure
Power is 1-2 tons.
Preferably, in the step 4, laying insulating materials is ABS or PLA insulating polymeric material, and laying speed is
0.5-1m/s, boundary chamfering are 0.5-1mm.
Preferably, in the step 5, spraying conductive material is the conductive materials such as conductive ink, conductive paint.
Compared with the prior art, the invention has the following beneficial effects: can be by circuit and composite metal plate by this method
One is made, improves the mechanical property of composite metal plate, can be expanded application field in extreme circumstances, be dropped simultaneously
Low manufacturing cost, improves forming efficiency, can realize the personalized customization of circuit board according to demand.
Detailed description of the invention
Fig. 1 is increasing material manufacturing built-in circuit composite metal plate method schematic diagram.
Fig. 2 is the iron-based composite plate of the built-in circuit of preparation.
Specific embodiment
As shown in Figure 1 and Figure 2, a kind of method of increasing material manufacturing built-in circuit composite metal plate of the present invention, as follows into
Row:
(1) composite metal plate for needing built-in circuit is modeled, circuit paths and position in composite metal plate is set,
Model is repaired with Magic software, then the model is sliced with Autofab software, slice thickness is metal foil
Material thickness, forming accuracy are controlled in ± 1mm；
(2) it is cut into circuit paths 7-2 according to the circuit paths set out on metal foil 7-1, a is walked as shown in figure 1.Gold
Belong to foil with a thickness of 0.1-0.5mm, cutter rotation speed is 50-200r/s, and cutter movement speed is 0.5-1m/s, cutter boundary
Chamfering is 0.5-2mm；It with alcohol washes metal foil and is dried up after cutting；
(3) by ultrasonic consolidation device, by metal foil consolidation, b is walked as shown in figure 1.Ultrasonic consolidation power is
2-4KW.Excess metal foil is cut away with cutter after consolidation, cutter cutting speed is 1-3m/s, and cutter pressure is 1-2
Ton；
(4) one layer of ABS or PLA insulating polymeric material 7- is laid in the circuit trace 7-2 of the metal foil after consolidation
3, c is walked as shown in figure 1.Laying speed is 0.5-1m/s, and boundary chamfering is 0.5-1mm；
(5) one layer of conductive ink, conductive paint etc. are sprayed on the insulating materials of the circuit trace of the metal foil after consolidation
Conductive material 7-4, d is walked as shown in figure 1；
(6) one layer of ABS or PLA insulating polymeric material is being laid with above the conductive material of the metal foil after consolidation；
(7) step 2-step 6 is repeated, the compound of next layer of metal foil is carried out；
(8) it repeats the above steps, successively accumulation superposition, to obtain the composite metal plate of built-in circuit.
A kind of embodiment 1: increasing material manufacturing built-in circuit iron-aluminium composite board method
(1) iron-aluminium composite board for needing built-in circuit is modeled, circuit paths and position in iron-aluminium composite board is set,
Model is repaired with Magic software, then the model is sliced with Autofab software, slice thickness is iron foil material
Thickness, wherein iron foil material is of uniform thickness with aluminium foil.Forming accuracy is controlled in 1mm；
(2) circuit paths are cut into according to the circuit paths set out on iron foil material.Iron foil material is cut with a thickness of 0.5mm
Knife rotation speed is 50r/s, and cutter movement speed is 0.5m/s, and cutter boundary chamfering is 0.5mm；Alcohol washes iron foil is used after cutting
Material simultaneously dries up；
(3) by ultrasonic consolidation device, by iron foil material consolidation.Ultrasonic consolidation power is 2KW.After consolidation
Extra iron foil material is cut away with cutter, cutter cutting speed is 1m/s, and cutter pressure is 1 ton；
(4) one layer of ABS insulating polymeric material is laid in the circuit trace of the iron foil material after consolidation.Laying speed is
0.5m/s, boundary chamfering are 0.5mm；
(5) one layer of conductive ink is sprayed on the insulating materials of the circuit trace of the iron foil material after consolidation；
(6) one layer of ABS insulating polymeric material is being laid with above the conductive material of the iron foil material after consolidation；
(7) step 2-step 6 is repeated, the compound of next layer of aluminium foil is carried out；
(8) it repeats the above steps, successively accumulation superposition, to obtain the iron-aluminium composite board of built-in circuit, as shown in Figure 2.
Embodiment 2:
A kind of increasing material manufacturing built-in circuit titanium aluminum composite plate method
(1) titanium aluminum composite plate for needing built-in circuit is modeled, circuit paths and position in titanium aluminum composite plate is set,
Model is repaired with Magic software, then the model is sliced with Autofab software, slice thickness is titanium foil
Thickness, wherein titanium foil is of uniform thickness with aluminium foil.Forming accuracy is controlled in 1mm；；
(2) circuit paths are cut into according to the circuit paths set out on titanium foil.Titanium foil is cut with a thickness of 0.2mm
Knife rotation speed is 80r/s, and cutter movement speed is 0.8m/s, and cutter boundary chamfering is 0.8mm；Alcohol washes iron foil is used after cutting
Material simultaneously dries up；
(3) by ultrasonic consolidation device, by titanium foil consolidation.Ultrasonic consolidation power is 3KW.After consolidation
Extra iron foil material is cut away with cutter, cutter cutting speed is 2m/s, and cutter pressure is 2 tons；
(4) one layer of ABS insulating polymeric material is laid in the circuit trace of the titanium foil after consolidation.Laying speed is
0.8m/s, boundary chamfering are 0.5mm；
(5) one layer of conductive paint is sprayed on the insulating materials of the circuit trace of the titanium foil after consolidation；
(6) one layer of PLA insulating polymeric material is being laid with above the conductive material of the titanium foil after consolidation；
(7) step 2-step 6 is repeated, the compound of next layer of aluminium foil is carried out；
(8) it repeats the above steps, successively accumulation superposition, to obtain the titanium aluminum composite plate of built-in circuit.
Embodiment 3:
A kind of increasing material manufacturing built-in circuit ferrotianium composite plate method
(1) the ferrotianium composite plate for needing built-in circuit is modeled, circuit paths and position in ferrotianium composite plate is set,
Model is repaired with Magic software, then the model is sliced with Autofab software, slice thickness is titanium foil
Thickness, wherein titanium foil is of uniform thickness with iron foil material.Forming accuracy is controlled in 0.5mm；；
(2) circuit paths are cut into according to the circuit paths set out on titanium foil.Titanium foil is cut with a thickness of 0.3mm
Knife rotation speed is 90r/s, and cutter movement speed is 0.75m/s, and cutter boundary chamfering is 0.5mm；Alcohol washes iron is used after cutting
Foil simultaneously dries up；
(3) by ultrasonic consolidation device, by titanium foil consolidation.Ultrasonic consolidation power is 4KW.After consolidation
Extra titanium foil is cut away with cutter, cutter cutting speed is 2.5m/s, and cutter pressure is 1.5 tons；
(4) one layer of ABS insulating polymeric material is laid in the circuit trace of the titanium foil after consolidation.Laying speed is
0.75m/s, boundary chamfering are 0.45mm；
(5) one layer of conductive paint is sprayed on the insulating materials of the circuit trace of the titanium foil after consolidation；
(6) one layer of PLA insulating polymeric material is being laid with above the conductive material of the titanium foil after consolidation；
(7) step 2-step 6 is repeated, the compound of next layer of iron foil material is carried out；
(8) it repeats the above steps, successively accumulation superposition, to obtain the ferrotianium composite plate of built-in circuit.
The embodiment of the present invention is explained in detail above in conjunction with attached drawing, but the present invention is not limited to above-mentioned implementations
Example, within the knowledge of a person skilled in the art, can also make without departing from the purpose of the present invention
Various change out.
Claims (6)
1. a kind of method of increasing material manufacturing built-in circuit composite metal plate, which is characterized in that carry out as follows:
(1) composite metal plate for needing built-in circuit is modeled, circuit paths and position in composite metal plate is set, used
Magic software repairs model, is then sliced with Autofab software to the model；
(2) circuit paths are cut into according to the circuit paths set out on metal foil；
(3) by ultrasonic consolidation device, metal foil consolidation is cut excess metal foil with cutter after consolidation
Fall；
(4) one layer of insulating materials is laid in the circuit paths of the metal foil after consolidation；
(5) layer of conductive material is sprayed on the insulating materials after consolidation；
(6) one layer of insulating materials is being laid with above the conductive material after consolidation；
(7) step 2-step 6 is repeated, the compound of next layer of metal foil is carried out；
(8) it repeats the above steps, metal foil, which is successively accumulated, to add up, and obtains the composite metal plate of built-in circuit.
2. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described
In step (1), slice thickness is metal foil thickness, and forming accuracy is controlled in ± 1mm.
3. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described
In step (2), for metal foil with a thickness of 0.1-0.5mm, cutter rotation speed is 50-200r/s, and cutter movement speed is 0.5-
1m/s, cutter boundary chamfering are 0.5-2mm；It with alcohol washes metal foil and is dried up after cutting.
4. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described
In step (3), ultrasonic consolidation power is 2-4KW, and cutter cutting speed is 1-3m/s, and cutter pressure is 1-2 tons.
5. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described
In step (4), laying insulating materials is ABS or PLA insulating polymeric material, and laying speed 0.5-1m/s, boundary chamfering is
0.5-1mm。
6. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described
In step (5), spraying conductive material is conductive ink or conductive paint conductive material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710828680.XA CN107745549B (en) | 2017-09-14 | 2017-09-14 | A kind of method of increasing material manufacturing built-in circuit composite metal plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710828680.XA CN107745549B (en) | 2017-09-14 | 2017-09-14 | A kind of method of increasing material manufacturing built-in circuit composite metal plate |
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| Publication Number | Publication Date |
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| CN107745549A CN107745549A (en) | 2018-03-02 |
| CN107745549B true CN107745549B (en) | 2019-08-13 |
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| CN112229363A (en) * | 2020-10-01 | 2021-01-15 | 陕西理工大学 | Polylactic acid material increasing and decreasing process design and roughness measurement method |
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| CN106903310A (en) * | 2017-01-12 | 2017-06-30 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on Stereo Lithography forming technique |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206409B (en) * | 2015-05-08 | 2019-05-07 | 华邦电子股份有限公司 | Stack electronic device and its manufacturing method |
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| CN1381069A (en) * | 2000-03-17 | 2002-11-20 | 松下电器产业株式会社 | Module with built-in electronic elements and method of manufacture thereof |
| CN104411122A (en) * | 2014-05-31 | 2015-03-11 | 福州大学 | Three dimension (3D) printing method for multilayer flexible circuit board |
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