CN107743345A - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN107743345A CN107743345A CN201710891249.XA CN201710891249A CN107743345A CN 107743345 A CN107743345 A CN 107743345A CN 201710891249 A CN201710891249 A CN 201710891249A CN 107743345 A CN107743345 A CN 107743345A
- Authority
- CN
- China
- Prior art keywords
- mating surface
- electronic equipment
- plane
- front shell
- shell assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000013011 mating Effects 0.000 claims abstract description 83
- 230000000712 assembly Effects 0.000 claims abstract description 39
- 238000000429 assembly Methods 0.000 claims abstract description 39
- 230000005611 electricity Effects 0.000 claims description 2
- 230000006978 adaptation Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
Abstract
The disclosure is directed to a kind of electronic equipment, the electronic equipment includes front shell assemblies and backboard, and the front shell assemblies include the first mating surface, and the backboard includes the second mating surface, and inclined-plane is formed between second mating surface and first mating surface and is coordinated.The first mating surface of front shell assemblies can form inclined-plane cooperation between the second mating surface of backboard in the disclosure, so that larger tolerance limit can be allowed between front shell assemblies and backboard when being assembled, it still can be assembled with exceeding in actual fit tolerance in the certain limit of maximum allowable tolerance, be advantageous to improve the yields of electronic equipment.
Description
Technical field
This disclosure relates to field of terminal technology, more particularly to a kind of electronic equipment.
Background technology
Currently, the appearance member of electronic equipment generally includes backboard and front shell assemblies, can be with by the front shell assemblies and backboard
Receiving space is cooperatively formed, the receiving space can place electroplax, mainboard and other FPCs etc., these electroplaxs, master
It is connected with each other between plate and FPC to maintain the normal operation of electronic equipment.
The content of the invention
The disclosure provides a kind of electronic equipment, to solve the deficiency in correlation technique.
In accordance with an embodiment of the present disclosure, there is provided a kind of electronic equipment, including front shell assemblies and backboard, the front shell assemblies bag
The first mating surface is included, the backboard includes the second mating surface, is formed between second mating surface and first mating surface oblique
Face coordinates.
Optionally, first mating surface is located at an at least side edge for the front shell assemblies and towards the electronic equipment
Outside in inclined-plane set.
Optionally, first mating surface include positioned at the front shell assemblies one group of relative side at the first inclined-plane and
Second inclined-plane, first inclined-plane and second inclined-plane are towards the outside of the electronic equipment.
Optionally, first mating surface include positioned at the front shell assemblies one group of relative side at the 3rd inclined-plane and
4th inclined-plane, it is parallel to each other between the 3rd inclined-plane and the 4th inclined-plane.
Optionally, first mating surface include positioned at the front shell assemblies one group of relative side at the 5th inclined-plane and
Vertical plane, outside, described vertical plane thickness direction along the electronic equipment of the 5th inclined-plane towards the electronic equipment
Set.
Optionally, first mating surface and the thickness direction angle of the electronic equipment are not more than 30 degree.
Optionally, second mating surface and the thickness direction angle of the electronic equipment are matched somebody with somebody not less than described first
Conjunction face and the thickness direction angle of the electronic equipment.
Optionally, on the assembly direction of first mating surface and second mating surface, first mating surface
Specification is adapted to the specification of second mating surface.
Optionally, after first mating surface and second mating surface coordinate in place, the outward appearance of the front shell assemblies
Face is engaged with the appearance of the backboard.
Optionally, dispensing is fixed between first mating surface and second mating surface.
From above-described embodiment, the first mating surface of disclosure front shell assemblies can be between the second mating surface of backboard
Inclined-plane is formed to coordinate, so that larger tolerance limit can be allowed between front shell assemblies and backboard when being assembled, with
Exceeding in actual fit tolerance in the certain limit of maximum allowable tolerance still can be assembled, and be advantageous to improve electronic equipment
Yields.
It should be appreciated that the general description and following detailed description of the above are only exemplary and explanatory, not
The disclosure can be limited.
Brief description of the drawings
Accompanying drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the disclosure
Example, and be used to together with specification to explain the principle of the disclosure.
Fig. 1 is the decomposing schematic representation of a kind of electronic equipment according to an exemplary embodiment.
Fig. 2 is the schematic cross-section of a kind of electronic equipment according to an exemplary embodiment.
Fig. 3 is the structural representation of a kind of electronic equipment according to an exemplary embodiment.
Fig. 4 is the schematic cross-section of another electronic equipment according to an exemplary embodiment.
Fig. 5 is the schematic cross-section of another electronic equipment according to an exemplary embodiment.
Fig. 6 is the schematic cross-section of another electronic equipment according to an exemplary embodiment.
Fig. 7 is the assembling schematic diagram of a kind of electronic equipment according to an exemplary embodiment.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects be described in detail in claims, the application.
It is only merely for the purpose of description specific embodiment in term used in this application, and is not intended to be limiting the application.
" one kind " of singulative used in the application and appended claims, " described " and "the" are also intended to including majority
Form, unless context clearly shows that other implications.It is also understood that term "and/or" used herein refers to and wrapped
Containing the associated list items purpose of one or more, any or all may be combined.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the application
A little information should not necessarily be limited by these terms.These terms are only used for same type of information being distinguished from each other out.For example, do not departing from
In the case of the application scope, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as
One information.Depending on linguistic context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determining ".
Fig. 1 is the decomposing schematic representation of a kind of electronic equipment according to an exemplary embodiment.As shown in figure 1, the electricity
Sub- equipment 100 includes front shell assemblies 1 and the backboard 2 mutually assembled, and receiving is cooperatively formed between the backboard 2 and front shell assemblies 1
The inner space of the electronic component of electronic equipment 100.Wherein, as shown in Fig. 2 front shell assemblies 1 can include the first mating surface 11,
Backboard 2 can include the second mating surface 21, and inclined-plane cooperation can be formed between the second mating surface 21 and the first mating surface 11, so as to
It can allow larger tolerance limit when front shell assemblies 1 and backboard 2 are assembled, it is maximum fair to exceed in actual fit tolerance
Perhaps it still can be assembled in the certain limit of tolerance, be advantageous to improve the yields of electronic equipment.
In the present embodiment, the inclined-plane formed between the first mating surface 11 and the second mating surface 12, which coordinates, can be located at electronics
Any one side edge of equipment 100, for example, the side edge shown in arrow A and arrow B as shown in Figure 3 has inclined-plane and matched somebody with somebody
Close.Accordingly, the first mating surface 11 in front shell assemblies 1 can also be located at any one side edge of front shell assemblies 1, for example, such as
Shown in Fig. 4, the first mating surface 11 is located at first side 12, or first mating surface 11 can also be located in front shell assemblies 1
At the second side 13 being oppositely arranged with first side 12, the disclosure is limited not to this.
In one embodiment, still by taking embodiment illustrated in fig. 4 as an example, the first mating surface 11 can include being located at front shell assemblies 1
One group of side edge being oppositely arranged the first inclined-plane 111 and the second inclined-plane 112.For example, the first inclined-plane 111 can be located at Fig. 2
Shown in first side 12 at, the second inclined-plane 112 can be located at the second side 13 that is oppositely arranged with first side.Accordingly
, the second mating surface 21 can include the first inclined-plane mating surface 211 for being engaged with the first inclined-plane 111 and with the second inclined-plane
112 the second inclined-plane mating surfaces 212 being engaged.Wherein, the first inclined-plane 111 can be set with the second inclined-plane 112 toward electronics
Standby outside, so that when assembling electronic equipment 100, one group of side being oppositely arranged goes out allow actual cooperation public
Difference exceedes maximum allowable tolerance certain limit, improves assembling yields.Wherein, two groups of sides being oppositely arranged in front shell assemblies 1
Place is set into inclined-plane, and the disclosure is limited not to this.
In another embodiment, as shown in figure 5, the first mating surface 11 can be relative including being located at one group of front shell assemblies 1
3rd inclined-plane 113 of the side edge of setting and the 4th inclined-plane 114.For example, the 3rd inclined-plane 113 can be located at the first of electronic equipment
At side 12, the 4th inclined-plane 114 is located at the second side 13 of electronic equipment.Accordingly, the second mating surface 21 can include with
3rd the 3rd inclined-plane mating surface 213 being engaged of inclined-plane 113 and the 4th inclined-plane mating surface being engaged with the 4th inclined-plane 114
214.Wherein, can be parallel to each other between the 3rd inclined-plane 113 and the 4th inclined-plane 114, you can with a wherein side inclined-plane towards electronics
Equipment 100 it is outside set, the opposing party then sets towards the inside of electronic equipment 100, so as to which backboard 2 can be by obliquely
Mode is assembled to front shell assemblies 1, and the 3rd inclined-plane 113 and the 4th inclined-plane 114 can provide guiding, improves efficiency of assembling.
In another embodiment, as shown in fig. 6, the first mating surface 11 can be relative including being located at one group of front shell assemblies 1
The 5th inclined-plane 115 and vertical plane 116 of the side edge of setting.For example, the 5th inclined-plane 115 can be located at the first side of electronic equipment
At side 12, vertical plane 116 is located at the second side 13 of electronic equipment.Accordingly, the second mating surface 21 can include and the 5th
The 5th inclined-plane mating surface 215 that inclined-plane 115 is engaged and the vertical plane mating surface 216 being engaged with vertical plane 116.Wherein,
5th inclined-plane 115 can be towards setting, the opposing party outside electronic equipment 100 then with any one party inclined-plane in vertical plane 116
Set along the thickness direction of electronic equipment 100, such as the 5th inclined-plane 115 shown in Fig. 6 is toward the outer of electronic equipment 100
Portion is set, thickness direction of the vertical plane 116 along electronic equipment is set.
It should be noted that the side of first side 12 and second in above-described embodiment only to be oppositely arranged in front shell assemblies 1
Illustrated exemplified by side 13.In fact, two groups of sides being oppositely arranged of front shell assemblies 1 can be formed tiltedly between backboard 2
Face coordinates；Or inclined-plane cooperation etc. is formed between the adjacent side and backboard 2 of front shell assemblies 1, no longer repeat one by one herein.
In above-mentioned each embodiment, the first mating surface 11 does not surpass with angle formed by the thickness direction of electronic equipment 100
30 degree are crossed, to avoid causing the area of front shell assemblies 11 to increase because angle is larger, is advantageous to keep the conjunction of electronic equipment 100
Manage size.Further, the second mating surface 21 and the thickness direction angle of electronic equipment 100 are not less than the first mating surface 11
With the thickness direction angle of electronic equipment 100, the first mating surface 11 can be smoothly assembled to the second mating surface 21 of guarantee
What is formed is in horn-like space, improves yields.
In the present embodiment, as shown in fig. 7, on the assembly direction C of the first mating surface 11 and the second mating surface 21 (referring to
In Fig. 7 side elevation view to underside view assembly state diagram), the specification phase of the specification of the first mating surface 11 and the second mating surface 12
Adaptation, for example, it may be the chamfer length of the first mating surface 11 and the chamfer length of the second mating surface 12 etc., or can also be
First mating surface 11 and angle formed by the thickness direction of electronic equipment 100 and the second mating surface 12 and the thickness of electronic equipment 100
Direction angle adaptation is spent, to allow backboard 2 to be smoothly assembled to front shell assemblies 1.
Wherein, after coordinating in place between the first mating surface 11 and the second mating surface 21, the appearance and the back of the body of front shell assemblies 1
The appearance of plate 2 is engaged, and ensures the joint smoothness transition in front shell assemblies 1 and backboard 2.For example, such as side view under Fig. 7
Shown in figure, arc transition between the appearance of front shell assemblies 1 and the appearance of backboard 2, outward appearance U.S. of raising electronic equipment 100
Sense.Further, after the completion of coordinating between the first mating surface 11 and the second mating surface 21, can be provided by dispensing,
Backboard 2 is avoided to slip.Wherein, electronic equipment 100 can include mobile phone, tablet personal computer or electronic reader etc., and the disclosure is simultaneously
Limited not to this.
Those skilled in the art will readily occur to the disclosure its after considering specification and putting into practice disclosure disclosed herein
Its embodiment.The application is intended to any modification, purposes or the adaptations of the disclosure, these modifications, purposes or
Person's adaptations follow the general principle of the disclosure and including the undocumented common knowledges in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope of the disclosure and spirit are by following
Claim is pointed out.
It should be appreciated that the precision architecture that the disclosure is not limited to be described above and is shown in the drawings, and
And various modifications and changes can be being carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.
Claims (10)
1. a kind of electronic equipment, it is characterised in that including front shell assemblies and backboard, the front shell assemblies include the first mating surface,
The backboard includes the second mating surface, and inclined-plane is formed between second mating surface and first mating surface and is coordinated.
2. electronic equipment according to claim 1, it is characterised in that first mating surface is located at the front shell assemblies
An at least side edge and towards the outside of the electronic equipment in inclined-plane set.
3. electronic equipment according to claim 1, it is characterised in that first mating surface includes being located at the fore shell group
The first inclined-plane and the second inclined-plane at one group of relative side of part, first inclined-plane and second inclined-plane are towards the electricity
The outside of sub- equipment.
4. electronic equipment according to claim 1, it is characterised in that first mating surface includes being located at the fore shell group
The 3rd inclined-plane and the 4th inclined-plane at one group of relative side of part are mutually flat between the 3rd inclined-plane and the 4th inclined-plane
OK.
5. electronic equipment according to claim 1, it is characterised in that first mating surface includes being located at the fore shell group
The 5th inclined-plane and vertical plane at one group of relative side of part, the 5th inclined-plane is towards the outside, described of the electronic equipment
Thickness direction of the vertical plane along the electronic equipment is set.
6. electronic equipment according to claim 1, it is characterised in that first mating surface and the thickness of the electronic equipment
Spend direction angle and be not more than 30 degree.
7. electronic equipment according to claim 1, it is characterised in that second mating surface and the thickness of the electronic equipment
Direction angle is spent not less than first mating surface and the thickness direction angle of the electronic equipment.
8. electronic equipment according to claim 1, it is characterised in that in first mating surface and second mating surface
Assembly direction on, the specification of first mating surface is adapted to the specification of second mating surface.
9. electronic equipment according to claim 1, it is characterised in that in first mating surface and second mating surface
After coordinating in place, the appearance of the front shell assemblies is engaged with the appearance of the backboard.
10. electronic equipment according to claim 1, it is characterised in that first mating surface and second mating surface
Between dispensing fix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710891249.XA CN107743345A (en) | 2017-09-27 | 2017-09-27 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710891249.XA CN107743345A (en) | 2017-09-27 | 2017-09-27 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107743345A true CN107743345A (en) | 2018-02-27 |
Family
ID=61236182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710891249.XA Pending CN107743345A (en) | 2017-09-27 | 2017-09-27 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107743345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310462A (en) * | 2019-10-15 | 2021-02-02 | 宁德时代新能源科技股份有限公司 | Assembling device and assembling method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201075554Y (en) * | 2007-07-17 | 2008-06-18 | 番禺得意精密电子工业有限公司 | Electric Connector |
| CN201247842Y (en) * | 2008-07-10 | 2009-05-27 | 上海莫仕连接器有限公司 | Flange connector |
| US20100302718A1 (en) * | 2009-05-29 | 2010-12-02 | Fujitsu Limited | Electronic device, housing, and gasket |
| TW201126556A (en) * | 2010-01-20 | 2011-08-01 | Pegatron Corp | Key and electronic apparatus using the same |
| CN202045224U (en) * | 2010-12-09 | 2011-11-23 | 中山市奥美森工业有限公司 | Lift positioning mechanism for bending device of long U pipe bender |
| EP2725447A2 (en) * | 2012-10-25 | 2014-04-30 | Fujitsu Limited | Electronic device and electronic device manufacturing method |
| CN105357922A (en) * | 2015-11-26 | 2016-02-24 | 苏州佳世达光电有限公司 | Housing and electronic device |
| CN205105269U (en) * | 2015-11-03 | 2016-03-23 | 广东欧珀移动通信有限公司 | Shells assembly and mobile device of mobile device |
| CN207218773U (en) * | 2017-09-27 | 2018-04-10 | 北京小米移动软件有限公司 | Electronic equipment |
-
2017
- 2017-09-27 CN CN201710891249.XA patent/CN107743345A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201075554Y (en) * | 2007-07-17 | 2008-06-18 | 番禺得意精密电子工业有限公司 | Electric Connector |
| CN201247842Y (en) * | 2008-07-10 | 2009-05-27 | 上海莫仕连接器有限公司 | Flange connector |
| US20100302718A1 (en) * | 2009-05-29 | 2010-12-02 | Fujitsu Limited | Electronic device, housing, and gasket |
| TW201126556A (en) * | 2010-01-20 | 2011-08-01 | Pegatron Corp | Key and electronic apparatus using the same |
| CN202045224U (en) * | 2010-12-09 | 2011-11-23 | 中山市奥美森工业有限公司 | Lift positioning mechanism for bending device of long U pipe bender |
| EP2725447A2 (en) * | 2012-10-25 | 2014-04-30 | Fujitsu Limited | Electronic device and electronic device manufacturing method |
| CN205105269U (en) * | 2015-11-03 | 2016-03-23 | 广东欧珀移动通信有限公司 | Shells assembly and mobile device of mobile device |
| CN105357922A (en) * | 2015-11-26 | 2016-02-24 | 苏州佳世达光电有限公司 | Housing and electronic device |
| CN207218773U (en) * | 2017-09-27 | 2018-04-10 | 北京小米移动软件有限公司 | Electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310462A (en) * | 2019-10-15 | 2021-02-02 | 宁德时代新能源科技股份有限公司 | Assembling device and assembling method |
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