CN107728761A - A kind of radiator and its service implementation method, cooling system - Google Patents
A kind of radiator and its service implementation method, cooling system Download PDFInfo
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- CN107728761A CN107728761A CN201711204244.1A CN201711204244A CN107728761A CN 107728761 A CN107728761 A CN 107728761A CN 201711204244 A CN201711204244 A CN 201711204244A CN 107728761 A CN107728761 A CN 107728761A
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- 238000001816 cooling Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000003507 refrigerant Substances 0.000 claims abstract description 167
- 230000005494 condensation Effects 0.000 claims abstract description 77
- 238000009833 condensation Methods 0.000 claims abstract description 77
- 238000001704 evaporation Methods 0.000 claims abstract description 59
- 230000008020 evaporation Effects 0.000 claims abstract description 59
- 239000002826 coolant Substances 0.000 claims description 68
- 239000007788 liquid Substances 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- VOPWNXZWBYDODV-UHFFFAOYSA-N Chlorodifluoromethane Chemical compound FC(F)Cl VOPWNXZWBYDODV-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a kind of radiator and its service implementation method, cooling system, the heat sink applications in server, including：Coldplate and at least one heat pipe；Wherein, at least one heat pipe forms at least one heat pipe heat, and each heat pipe heat corresponds to a server element to be cooled respectively；Each inside heat pipe is provided with refrigerant；Coldplate is connected with the cooling device of outside；The evaporation ends of each heat pipe are connected with corresponding server element to be cooled；The condensation end of each heat pipe is connected with coldplate；Each heat pipe, for carrying out heat exchange in the refrigerant of evaporation ends and corresponding server element to be cooled using currently building up, and by the refrigerant transfer after heat exchange to condensation end；Coldplate, for the cold provided using cooling device, the refrigerant currently built up to each inside heat pipe in condensation end cools down.Therefore, scheme provided by the invention can improve the radiating efficiency of server element.
Description
Technical field
The present invention relates to technical field of heat dissipation, more particularly to a kind of radiator and its service implementation method, cooling system.
Background technology
Server is due to abilities such as data processings, therefore commercially using more and more extensive.Due to each service
Device element can produce substantial amounts of heat in server running, in order to ensure each server element can normal operation,
Need to carry out continued down operation to each server element, to maintain the temperature of each server element within the specific limits.
At present, generally use sets radiator fan to carry out cooling processing to each server element in the server.Profit
Cold air is sucked with radiator fan so that cold air carries out forced-convection heat transfer to each server element, is produced after then exchanging heat
Raw hot-air discharge, so as to reach the purpose of cooling.But the heat exchange efficiency of air is relatively low, and the temperature of cold air easily by
Weather, the influence in season.Therefore, existing mode, the radiating efficiency of server element are relatively low.
The content of the invention
The embodiments of the invention provide a kind of radiator and its service implementation method, cooling system, server can be improved
The radiating efficiency of element.
In a first aspect, the embodiments of the invention provide a kind of radiator, the radiator includes：
Coldplate and at least one heat pipe；
Wherein, at least one heat pipe forms at least one heat pipe heat, and each described heat pipe heat corresponds to one respectively
Server element to be cooled；Each described inside heat pipe is provided with refrigerant；The coldplate and outside cooling device
It is connected；
The evaporation ends of each heat pipe are connected with corresponding server element to be cooled；Each heat pipe it is cold
Solidifying end is connected with the coldplate；
Each described heat pipe, for utilizing the refrigerant and corresponding server member to be cooled currently built up in evaporation ends
Part carries out heat exchange, and by the refrigerant transfer after heat exchange to condensation end；
The coldplate, for the cold provided using the cooling device, inside heat pipe each described is currently gathered
Product is cooled down in the refrigerant of condensation end.
Preferably,
Each inside heat pipe is provided with the refrigerant of preset vol；Wherein, the preset vol is less than the heat
Pipe internal volume；
Each described inside heat pipe includes refrigerant used area and vacant area；
Each described heat pipe, for utilizing the refrigerant and corresponding server member to be cooled currently built up in evaporation ends
After part carries out heat exchange, the refrigerant of steam condition is formed；By the vacant area by the refrigerant transfer of steam condition extremely
Condensation end；The refrigerant of the liquid condition after the coldplate cooling is received using the refrigerant used area；
The coldplate, for each described inside heat pipe currently to be built up in the refrigerant of the steam condition of condensation end
It is cooled to the refrigerant of liquid condition.
Preferably,
The heat pipe number that each described heat pipe heat includes meets formula (1)：
Wherein, the NiCharacterize the heat pipe number that i-th of heat pipe heat includes；The KiCharacterize i-th of heat pipe heat
Use the heat transfer coefficient of refrigerant；The QiCharacterize caused by server element to be cooled corresponding to i-th of heat pipe heat most
Big heat；The βiCharacterize the percentage composition of each inside heat pipe refrigerant in i-th of heat pipe heat；The LiCharacterize i-th
The length of each heat pipe in the individual heat pipe heat；The SiCharacterize the sectional area of each heat pipe in i-th of heat pipe heat；
The b characterizes constant.
Preferably,
The coldplate, including：Plate body, cover plate, coolant inlet and coolant outlet；
At least one conduit is provided with first face of the plate body；
First face of the cover plate and the plate body is tightly connected, and at least one conduit forms at least one runner；
The first end of each runner is connected with the coolant inlet, and the second end of each runner is equal
It is connected with the coolant outlet；
The coolant inlet, for receiving the cooling agent of the cooling device transmission, the cooling agent received is transmitted
To runner each described；
Each described runner, for the cold provided using the cooling agent of coolant inlet transmission, to each
The refrigerant that the inside heat pipe currently builds up in condensation end is cooled down；The cooling agent for using cold is transmitted to described cold
But agent exports；
The coolant outlet, the cooling agent for each described runner to be transmitted are transmitted to the cooling device.
Preferably,
The same heat pipe heat is directed to,
The evaporation ends of each heat pipe are connected at the first absolute altitude with corresponding server element to be cooled respectively；Often
The condensation end of one heat pipe is connected at the second absolute altitude with the coldplate respectively；Wherein, first absolute altitude is less than institute
State the second absolute altitude.
Preferably,
Have when the same heat pipe heat includes at least two heat pipes, between heat pipe described in each two between setting
Every.
Preferably,
The evaporation ends of each heat pipe are connected by welding manner with corresponding server element to be cooled；Each
The condensation end of the heat pipe is connected by welding manner with the coldplate.
Preferably,
The evaporation ends of each heat pipe are connected by snap fit with corresponding server element to be cooled；Each
The condensation end of the heat pipe is connected by snap fit with the coldplate.
Second aspect, the embodiments of the invention provide a kind of service implementation method based on any of the above-described radiator,
This method includes：
For server element to be cooled corresponding to the setting of each heat pipe；
The refrigerant currently built up in evaporation ends using heat pipe each described is entered with corresponding server element to be cooled
Row heat exchange, and by the refrigerant transfer after heat exchange to condensation end；
The cold of cooling device offer is provided using the coldplate, inside heat pipe each described is currently built up
Cooled down in the refrigerant of condensation end.
Preferably,
When each described inside heat pipe includes refrigerant used area and vacant area,
Refrigerant and the corresponding server member to be cooled currently built up using heat pipe each described in evaporation ends
Part carries out heat exchange, and by the refrigerant transfer after heat exchange to condensation end, including：
Each described heat pipe is entered using the refrigerant currently built up in evaporation ends with corresponding server element to be cooled
After row heat exchange, the refrigerant of steam condition is formed；
Each described heat pipe is by the vacant area by the refrigerant transfer of steam condition to condensation end；
The cold for utilizing the cooling device to provide using the coldplate, it is current to inside heat pipe each described
The refrigerant built up in condensation end is cooled down, including：
Each described inside heat pipe is currently built up in the refrigerant of the steam condition of condensation end using the coldplate
It is cooled to the refrigerant of liquid condition；
Each described heat pipe receives the system of the liquid body after the coldplate cooling using the refrigerant used area
Cryogen.
The third aspect, the embodiments of the invention provide a kind of radiator system, the radiator system includes：
Any of the above-described described radiator and cooling device；
The cooling device, for providing cold for the radiator.
The embodiments of the invention provide a kind of radiator and its service implementation method, cooling system, the radiator includes
Coldplate and the heat pipe for setting quantity, and it is provided with refrigerant in each heat pipe.Formed using the heat pipe for setting quantity
The heat pipe heat of quantity is set, and is server element to be cooled corresponding to the setting of each heat pipe heat.By the steaming of each heat pipe
Originator is connected with corresponding server element to be cooled and the condensation end of each heat pipe is connected with coldplate.In each heat
When pipe carries out heat exchange using the refrigerant currently built up in evaporation ends with corresponding server element to be cooled, after heat exchange
Refrigerant transfer to condensation end.Then coldplate utilizes the cold that cooling device provides, and each inside heat pipe is currently built up
Cooled down in the refrigerant of condensation end, so that the accumulation in each heat pipe has cold in the refrigerant of evaporation ends.By upper
State and understand, server element to be cooled is dissipated using with the heat pipe that server element to be cooled is joined directly together in this programme
Heat, and coldplate can maintain the cold of each heat pipe, so that each heat pipe can be continuously corresponding server member to be cooled
Part is cooled down, and therefore, scheme provided in an embodiment of the present invention can improve the radiating efficiency of server element.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is a kind of structural representation for radiator that one embodiment of the invention provides；
Fig. 2 is a kind of structural representation for radiator that another embodiment of the present invention provides；
Fig. 3 is a kind of structural representation for coldplate that one embodiment of the invention provides；
Fig. 4 is a kind of structural representation for coldplate that another embodiment of the present invention provides；
Fig. 5 is a kind of flow chart of the service implementation method for radiator that one embodiment of the invention provides；
Fig. 6 is a kind of structural representation for cooling system that one embodiment of the invention provides；
Fig. 7 is a kind of structural representation for cooling system that another embodiment of the present invention provides.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments, based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained on the premise of creative work is not made, belongs to the scope of protection of the invention.
As shown in figure 1, the embodiments of the invention provide a kind of radiator, the radiator can include：
Coldplate 101 and at least one heat pipe 102；
Wherein, at least one heat pipe 102 forms at least one heat pipe heat 103, and each described heat pipe heat 103 is distinguished
A corresponding server element to be cooled；Refrigerant is provided with inside each described heat pipe 102；The coldplate 101 with
Outside cooling device is connected；
The evaporation ends of each heat pipe 102 are connected with corresponding server element to be cooled；Each described heat pipe
102 condensation end is connected with the coldplate；
Each described heat pipe 102, for utilizing refrigerant and the corresponding service to be cooled currently built up in evaporation ends
Device element carries out heat exchange, and by the refrigerant transfer after heat exchange to condensation end；
The coldplate 101, for the cold provided using the cooling device, inside heat pipe each described 102
The refrigerant currently built up in condensation end is cooled down.
Embodiment according to Fig. 1, the radiator includes coldplate and sets the heat pipe of quantity, and each heat
Refrigerant is provided with pipe.The heat pipe heat of setting quantity is formed using the heat pipe for setting quantity, and is set for each heat pipe heat
Server element to be cooled corresponding to putting.The evaporation ends of each heat pipe and corresponding server element to be cooled are connected and
The condensation end of each heat pipe is connected with coldplate.Each heat pipe using the refrigerant currently built up in evaporation ends with it is corresponding
Server element to be cooled carry out heat exchange when, by the refrigerant transfer after heat exchange to condensation end.Then coldplate utilizes
The cold that cooling device provides, the refrigerant currently built up to each inside heat pipe in condensation end cools down, so that each heat
Accumulation in pipe has cold in the refrigerant of evaporation ends.By above-mentioned, utilized and server to be cooled in this programme
The heat pipe that element is joined directly together radiates to server element to be cooled, and coldplate can maintain the cold of each heat pipe,
So that each heat pipe can be continuously corresponding server element to be cooled and be cooled down, it is therefore, provided in an embodiment of the present invention
Scheme can improve the radiating efficiency of server element.
In an embodiment of the invention, the material of heat pipe can determine according to business need, for example can select heat conduction
Red copper of good performance.
In an embodiment of the invention, the species of the refrigerant of inside heat pipe can determine according to business need.Such as
R-22 (monochlorodifluoromethane) refrigerant.
In an embodiment of the invention, as shown in Fig. 2 each described heat pipe 102 is internally provided with preset vol
Refrigerant；Wherein, the preset vol is less than the inside heat pipe volume；
Each described inside of heat pipe 102 includes refrigerant used area and vacant area；
Each described heat pipe 102, for utilizing refrigerant and the corresponding service to be cooled currently built up in evaporation ends
After device element carries out heat exchange, the refrigerant of steam condition is formed；The refrigerant of steam condition is passed by the vacant area
Transport to condensation end；The refrigerant of the liquid condition after the coldplate 101 cools down is received using the refrigerant used area；
The coldplate 101, for by the current steam condition built up in condensation end in each inside of described heat pipe 102
Refrigerant is cooled to the refrigerant of liquid condition.
In the present embodiment, the preset vol of refrigerant can determine according to business need.But it should be noted that default
Volume should be less than inside heat pipe volume, so that inside heat pipe has the space of transmission steam condition refrigerant.
In the present embodiment, the refrigerant used area of inside heat pipe is the space for placing refrigerant, and vacant area is
The space of refrigerant is not placed.
Illustrated below by taking Fig. 2 (structural representation shown in Fig. 2 includes the sectional view of a heat pipe) as an example：Scheming
In 2, including a heat pipe 102, the evaporation ends A of heat pipe and server element 201 (such as central processor CPU) phase to be cooled
Even.The condensation end B of heat pipe is connected with coldplate 101.With the region of shadow representation it is refrigerant used area 1021 in inside heat pipe
(being placed with refrigerant).It is vacant area 1022 in the region of the unused shadow representation of inside heat pipe, for transmitting steam condition
Refrigerant.When being cooled down using the heat pipe to server element to be cooled, using currently building up in evaporation ends A refrigerant
Heat exchange is carried out with server element to be cooled.Enter currently building up the refrigerant in evaporation ends A with server element to be cooled
After row heat exchange, the heat of server element to be cooled due to refrigerant suction, therefore some refrigerant will be from liquid condition
It is changed into steam condition.And the refrigerant of steam condition will flow to condensation end B according to track a.In the refrigerant of steam condition
When reaching condensation end B, the refrigerant of steam condition is cooled to liquid condition by coldplate using the cold that cooling device provides
Refrigerant so that the refrigerant of liquid condition enters refrigerant used area according to track b.This enters the liquid of refrigerant used area
State refrigerant moves with the consumption of the liquid condition refrigerant in evaporation ends A, to reach evaporation ends A toward evaporation ends A
When continue as server element to be cooled and carry out heat exchange.
According to above-described embodiment, each inside heat pipe is provided with the refrigerant of preset vol, and preset vol is less than heat pipe
Internal volume, to form refrigerant used area and vacant area in each inside heat pipe.Refrigerant in each heat pipe can be with
According to heat pipe and server element to be cooled and the heat exchange situation of coldplate, refrigerant used area and vacant area it
Between circle transmission.To ensure that each heat pipe can continue to carry out heat exchange with server element to be cooled and coldplate.
In an embodiment of the invention, the heat pipe number that each described heat pipe heat 103 includes meets formula (1)：
Wherein, the NiCharacterize the heat pipe number that i-th of heat pipe heat includes；The KiCharacterize i-th of heat pipe heat
Use the heat transfer coefficient of refrigerant；The QiCharacterize caused by server element to be cooled corresponding to i-th of heat pipe heat most
Big heat；The βiCharacterize the percentage composition of each inside heat pipe refrigerant in i-th of heat pipe heat；The LiCharacterize i-th
The length of each heat pipe in the individual heat pipe heat；The SiCharacterize the sectional area of each heat pipe in i-th of heat pipe heat；
The b characterizes constant.
In the present embodiment, maximum heat caused by server element to be cooled can regard the actual feelings of server to be cooled
Condition determines.The heat transfer coefficient of refrigerant, the percentage composition of refrigerant, the length of heat pipe, the sectional area and constant of heat pipe
To be determined according to business need.The heat transfer coefficient for the refrigerant that should be noted, the percentage composition of refrigerant, the length of heat pipe, heat
The selection of the sectional area and constant of pipe should take into full account maximum heat caused by server element to be cooled, to utilize heat pipe can
So that the temperature of server element to be cooled is cooled within the scope of reasonable temperature.
In maximum heat, the heat transfer coefficient of refrigerant, the percentage composition of refrigerant, heat caused by server element to be cooled
After the length of pipe, the sectional area of heat pipe and constant determine, can calculate each heat pipe heat by formula (1) includes
Heat pipe number.
In the present embodiment, different heat pipe heats may correspond to different types of server element to be cooled, and due to not
Maximum heat caused by the server element to be cooled of same type may be different, therefore the heat pipe number that different heat pipe heats includes
May be different.
According to above-described embodiment, because the heat pipe number that each heat pipe heat includes can be according to corresponding to the heat pipe heat
Maximum heat caused by server element to be cooled, the heat transfer coefficient of refrigerant, the percentage composition of refrigerant, heat pipe length,
The sectional area and constant of heat pipe determine, therefore the heat pipe number that each heat pipe heat includes can meet to treat to greatest extent
Cool down the cooling requirement of server element.
In an embodiment of the invention, as shown in Figure 3 and Figure 4, the coldplate 101, including：Plate body 1011, cover plate
1012nd, coolant inlet 1013 and coolant outlet 1014；
At least one conduit is provided with first face of the plate body 1011；
First face of the cover plate 1012 and the plate body 1011 is tightly connected, and at least one conduit forms at least one
Individual runner 10111；
The first end of each runner 10111 is connected with the coolant inlet 1013, each described runner
10111 the second end is connected with the coolant outlet 1014；
The coolant inlet 1013, for receiving the cooling agent of the cooling device transmission, the cooling agent that will be received
Transmit to runner 10111 each described；
Each described runner 10111, the cold that the cooling agent for being transmitted using the coolant inlet 1013 is provided,
The refrigerant currently built up to the inside of heat pipe each described 101 in condensation end cools down；The cooling agent of cold will be used
Transmit to the coolant outlet 1014；
The coolant outlet 1014, the cooling agent for each described runner 10111 to be transmitted are transmitted to described cold
But equipment.
In the present embodiment, the cooling agent in coldplate can determine according to business need.Such as cooling water.And cooling is set
The temperature of the standby cooling agent provided can determine according to business need.It should be noted that the temperature should can meet each heat
The cooling requirement of pipe.
In the present embodiment, the shape of coldplate plate body and material can determine according to business need.In addition, cover plate
Shape should match with the shape of plate body, so that each conduit can form runner.
In the present embodiment, the quantity of conduit, length, size and placement shape can be according to business needs in plate body
It is determined that.For example as shown in Figure 3 and Figure 4 (Fig. 3 is front view, Fig. 4 is top view), a conduit, the conduit are provided with plate body
It is arranged on S types in plate body.When being tightly connected in the first face of cover plate and plate body, the S type grooves road of setting forms a runner
10111.The first end of the runner is connected with coolant outlet, and the second end is connected with coolant outlet.Therefore can receive in time
Cooling device is transferred in time to the cooling agent of cooling device transmission, and by the cooling agent after cold is provided for heat pipe, so as to cold
But equipment cools down to the cooling agent for using cold.
,, can when transmitting cooling agent using the runner due at least one runner in coldplate be present according to above-described embodiment
To increase residence time of the cooling agent in coldplate, with the cold for utilizing cooling agent to provide to greatest extent.And it can utilize
Cooling agent after using cold is transferred to cooling device by runner in time, and receives the cold with cold of cooling device transmission
But agent, therefore, coldplate can be continuously each connected heat pipe and provide cold.
In an embodiment of the invention, as shown in Fig. 2 being directed to the same heat pipe heat,
The evaporation ends of each heat pipe 102 respectively at the first absolute altitude with corresponding server element phase to be cooled
Even；The condensation end of each heat pipe is connected at the second absolute altitude with the coldplate 101 respectively；Wherein, first mark
Height is in second absolute altitude.
In the present embodiment, for same heat pipe heat, the first absolute altitude and the second absolute altitude can be according to business needs
It is determined that.But there should be certain difference in height between the first absolute altitude and the second absolute altitude that should be noted, and the first absolute altitude is less than the second mark
It is high.Difference in height can determine according to business need.Such as 50 millimeters.
In the present embodiment, because each heat pipe in same heat pipe heat and server to be cooled are in same absolute altitude
Place is connected, and each heat pipe is also connected with coldplate at same absolute altitude.So illustrated by taking Fig. 2 as an example：For same
One heat pipe heat, the evaporation ends A of each heat pipe 102 respectively at the first absolute altitude H1 with corresponding server element phase to be cooled
Even；The condensation end B of each heat pipe is connected at the second absolute altitude H2 with coldplate respectively.From figure 2 it can be seen that the first absolute altitude H1
Less than the second absolute altitude H2.
In the present embodiment, because the evaporation ends of heat pipe are less than condensation end, therefore the system of steam condition caused by evaporation ends
Cryogen can be transmitted smoothly to condensation end.And the refrigerant of liquid condition caused by condensation end can be according to the Action of Gravity Field of itself
Automatically flow into refrigerant used area.
According to above-described embodiment, the evaporation ends for each heat pipe being directed in same heat pipe heat and corresponding clothes to be cooled
The absolute altitude of business device element connecting place is below the condensation end of each heat pipe and the absolute altitude of coldplate connecting place.Due to each heat pipe
There is difference in height, hence in so that refrigerant can be transmitted smoothly between condensation end and evaporation ends between condensation end and evaporation ends.
In an embodiment of the invention, the same heat pipe heat is directed to,
The evaporation ends of each heat pipe can respectively at the 3rd different absolute altitudes with corresponding server element phase to be cooled
Even；The condensation end of each heat pipe can be connected in the 4th different absolute altitudes in coldplate respectively；
Wherein, a heat pipe is directed to, the 3rd absolute altitude is less than the 4th absolute altitude.
In an embodiment of the invention, the same heat pipe heat, the evaporation ends point of each heat pipe are directed to
It is not connected with the first fixed plate, then the first fixed plate is connected with corresponding server element to be cooled；Each described heat pipe
Condensation end be connected respectively with the second fixed plate, then the second fixed plate is connected with the coldplate.
In an embodiment of the invention, when the same heat pipe heat 103 includes at least two heat pipes 102,
There is the interval of setting between heat pipe 102 described in each two.
In the present embodiment, the setting at intervals of the interval between each two heat pipe outer wall.The interval can be according to industry
Business requires to determine.
With according to above-described embodiment, when same heat pipe heat includes at least two heat pipes, there is setting between each two heat pipe
Interval.To ensure not contact between each heat pipe, so as to reduce interfering between each heat pipe.
In an embodiment of the invention, the evaporation ends of each heat pipe 102 are treated by welding manner with corresponding
Cooling server element is connected；The condensation end of each heat pipe 102 is connected by welding manner with the coldplate 101.
In the present embodiment, each heat pipe is connected with welding manner with server element to be cooled and coldplate respectively.
Wherein welding manner can determine according to business need, for example be filled between heat pipe and server element to be cooled and cooled plate
Solder(ing) paste, welded using reflow soldering process.
According to above-described embodiment, each heat pipe is respectively with welding manner and server element to be cooled and coldplate phase
Even.Therefore, what each heat pipe was connected with server element to be cooled and coldplate is more firm.
In an embodiment of the invention, the evaporation ends of each heat pipe 102 are treated by snap fit with corresponding
Cooling server element is connected；The condensation end of each heat pipe 102 is connected by snap fit with the coldplate 101.
According to above-described embodiment, each heat pipe is respectively with snap fit and server element to be cooled and coldplate phase
Even.Therefore, dismantled between each heat pipe and server element to be cooled and coldplate more convenient.
As shown in figure 5, the embodiments of the invention provide the service implementation method based on any of the above-described radiator, the party
Method may include steps of：
Step 501：For server element to be cooled corresponding to the setting of each heat pipe；
Step 502：Refrigerant and the corresponding service to be cooled in evaporation ends are currently built up using heat pipe each described
Device element carries out heat exchange, and by the refrigerant transfer after heat exchange to condensation end；
Step 503：The cold of cooling device offer is utilized using the coldplate, to inside heat pipe each described
The refrigerant currently built up in condensation end is cooled down.
It is first server element to be cooled corresponding to the setting of each heat pipe according to embodiment as shown in Figure 5.Then
Refrigerant and the corresponding server element progress heat exchange to be cooled in evaporation ends are currently built up using each heat pipe, and will
Refrigerant transfer after heat exchange is to condensation end.The cold for recycling coldplate to utilize cooling device to provide, to each heat pipe
The internal current refrigerant built up in condensation end is cooled down.By above-mentioned, utilized and service to be cooled in this programme
The heat pipe that device element is joined directly together radiates to server element to be cooled, and coldplate can maintain the cold of each heat pipe
Amount, so that each heat pipe can be continuously corresponding server element to be cooled and be cooled down, therefore, the embodiment of the present invention provides
Scheme can improve the radiating efficiency of server element.
In an embodiment of the invention, when each described inside heat pipe includes refrigerant used area and vacant area
When,
Step 502 in flow chart shown in above-mentioned Fig. 5 currently builds up the refrigeration in evaporation ends using heat pipe each described
Agent and corresponding server element to be cooled carry out heat exchange, and by the refrigerant transfer after heat exchange to condensation end, can wrap
Include：
Each described heat pipe is entered using the refrigerant currently built up in evaporation ends with corresponding server element to be cooled
After row heat exchange, the refrigerant of steam condition is formed；
Each described heat pipe is by the vacant area by the refrigerant transfer of steam condition to condensation end；
Step 503 in flow chart shown in above-mentioned Fig. 5 utilizes the cold of cooling device offer using the coldplate,
The refrigerant currently built up to inside heat pipe each described in condensation end cools down, and can include：
Each described inside heat pipe is currently built up in the refrigerant of the steam condition of condensation end using the coldplate
It is cooled to the refrigerant of liquid condition.
Each described heat pipe receives the system of the liquid body after the coldplate cooling using the refrigerant used area
Cryogen.
As shown in fig. 6, the embodiments of the invention provide a kind of radiator system, the radiator system can include：
Any of the above-described described radiator 601 and cooling device 602；
The cooling device 602, for providing cold for the radiator 601.
In an embodiment of the invention, the pattern of cooling device can determine according to business need.For example can be to carry
The cooling tower of Cooling Water.
Illustrated below by taking radiator system as shown in Figure 7 as an example, it is (cold that the radiator system includes cooling device
But tower 701), radiator 702 and two server elements (CPU1 (7031) and CPU2 (7032)) to be cooled.
In the present embodiment, maximum heat, the heat transfer coefficient of refrigerant, refrigerant according to caused by CPU1 and CPU2
Percentage composition, the length of heat pipe, the sectional area and constant of heat pipe, determine that radiator includes 6 heat pipes 7021, and 6
Heat pipe forms two heat pipe heats, and each heat pipe heat includes 3 heat pipes.3 heat pipes in one heat pipe heat pass through evaporation ends A
It is connected with CPU1, is connected by condensation end B with coldplate.3 heat pipes in another heat pipe heat pass through evaporation ends A and CPU2 phases
Even, it is connected by condensation end B with coldplate.And same heat pipe heat is directed to, such as exemplified by the heat pipe heat to be connected with CPU1
Illustrate：The evaporation ends of 3 heat pipes are connected at the first absolute altitude with CPU1 respectively；The condensation end of 3 heat pipes is respectively second
It is connected at absolute altitude with coldplate, and the first absolute altitude is less than the second absolute altitude.In addition, each inside heat pipe is provided with refrigerant.
And each inside heat pipe includes refrigerant used area and vacant area.
In the present embodiment, because CPU1 and CPU2 type are identical, caused maximum heat is identical, therefore 6 heat
The size and refrigerant facilities all same of pipe.Just illustrated below by taking a heat pipe being connected with CPU1 as an example：Should
After heat pipe carries out heat exchange using the refrigerant currently built up in evaporation ends with CPU1, the refrigerant of steam condition is formed.And lead to
Internal vacant area is crossed by the refrigerant transfer of steam condition to condensation end, so that coldplate utilizes the cold that cooling tower provides
The refrigerant currently built up to the inside heat pipe in the steam condition of condensation end is cooled to the refrigerant of liquid condition.Then utilize
Refrigerant used area receives the refrigerant of the liquid condition after coldplate cooling.
In the present embodiment, coldplate 7022 is also included in radiator.Wherein, coldplate includes：It is plate body, cover plate, cold
But agent import and coolant outlet.A conduit is provided with first face of plate body.The sealing of first face of cover plate and plate body connects
Connect, conduit forms a runner 7022C.The first end of runner is connected with coolant inlet 7022A, the second end of runner with
Coolant outlet 7022B is connected.Coolant inlet receives the cooling agent (cooling water) of cooling tower transmission, the cooling agent that will be received
Transmit to runner.The cold that runner is provided using the cooling agent of coolant inlet transmission, it is current to connected each inside heat pipe
The refrigerant built up in condensation end is cooled down, and the cooling agent for using cold is transmitted to coolant outlet.Then cool down
The cooling agent of runner transmission is transmitted to cooling tower agent outlet.
In the present embodiment, the cooling agent that cooling tower comes to coldplate transmission cools down, and to transmitting the cooling agent come
Cooled down.Then the cooling agent after cooling is transferred to coldplate, so that coldplate provides cold for each heat pipe.
In summary, each embodiment of the present invention can at least realize following beneficial effect：
1st, in embodiments of the present invention, the radiator includes coldplate and sets the heat pipe of quantity, and each heat
Refrigerant is provided with pipe.The heat pipe heat of setting quantity is formed using the heat pipe for setting quantity, and is set for each heat pipe heat
Server element to be cooled corresponding to putting.The evaporation ends of each heat pipe and corresponding server element to be cooled are connected and
The condensation end of each heat pipe is connected with coldplate.Each heat pipe using the refrigerant currently built up in evaporation ends with it is corresponding
Server element to be cooled carry out heat exchange when, by the refrigerant transfer after heat exchange to condensation end.Then coldplate utilizes
The cold that cooling device provides, the refrigerant currently built up to each inside heat pipe in condensation end cools down, so that each heat
Accumulation in pipe has cold in the refrigerant of evaporation ends.By above-mentioned, utilized and server to be cooled in this programme
The heat pipe that element is joined directly together radiates to server element to be cooled, and coldplate can maintain the cold of each heat pipe,
So that each heat pipe can be continuously corresponding server element to be cooled and be cooled down, it is therefore, provided in an embodiment of the present invention
Scheme can improve the radiating efficiency of server element.
2nd, in embodiments of the present invention, each inside heat pipe is provided with the refrigerant of preset vol, and preset vol is less than
Inside heat pipe volume, to form refrigerant used area and vacant area in each inside heat pipe.Refrigerant in each heat pipe
Can be according to heat pipe and server element to be cooled and the heat exchange situation of coldplate, in refrigerant used area and vacant
Circle transmission between area.To ensure that each heat pipe can continue to carry out heat exchange with server element to be cooled and coldplate.
3rd, in embodiments of the present invention, because the heat pipe number that each heat pipe heat includes can be according to the heat pipe heat pair
Maximum heat, the heat transfer coefficient of refrigerant, the percentage composition of refrigerant, the length of heat pipe caused by the server element to be cooled answered
Degree, the sectional area of heat pipe and constant determine, therefore the heat pipe number that each heat pipe heat includes can expire to greatest extent
The cooling requirement of foot server element to be cooled.
4th, in embodiments of the present invention, due at least one runner in coldplate be present, cooling agent is transmitted using the runner
When, residence time of the cooling agent in coldplate can be increased, with the cold for utilizing cooling agent to provide to greatest extent.And can be with
The cooling agent after using cold is transferred to cooling device in time using runner, and receive cooling device transmission there is cold
Cooling agent, therefore, coldplate can be continuously each connected heat pipe and provide cold.
5th, in embodiments of the present invention, the evaporation ends for each heat pipe being directed in same heat pipe heat with it is corresponding treat it is cold
But the absolute altitude of server element connecting place is below the condensation end of each heat pipe and the absolute altitude of coldplate connecting place.Due to each heat
There is difference in height, hence in so that refrigerant can be passed smoothly between condensation end and evaporation ends between the condensation end and evaporation ends of pipe
It is defeated.
6th, in embodiments of the present invention, when same heat pipe heat includes at least two heat pipes, have between each two heat pipe
The interval of setting.To ensure not contact between each heat pipe, so as to reduce interfering between each heat pipe.
7th, in embodiments of the present invention, each heat pipe is respectively with welding manner and server element to be cooled and coldplate
It is connected.Therefore, what each heat pipe was connected with server element to be cooled and coldplate is more firm.
8th, in embodiments of the present invention, each heat pipe is respectively with snap fit and server element to be cooled and coldplate
It is connected.Therefore, dismantled between each heat pipe and server element to be cooled and coldplate more convenient.
It should be noted that herein, such as first and second etc relational terms are used merely to an entity
Or operation makes a distinction with another entity or operation, and not necessarily require or imply and exist between these entities or operation
Any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant be intended to it is non-
It is exclusive to include, so that process, method, article or equipment including a series of elements not only include those key elements,
But also the other element including being not expressly set out, or also include solid by this process, method, article or equipment
Some key elements.In the absence of more restrictions, the key element limited by sentence " including one ", is not arranged
Except other identical factor in the process including the key element, method, article or equipment being also present.
One of ordinary skill in the art will appreciate that：Realizing all or part of step of above method embodiment can pass through
Programmed instruction related hardware is completed, and foregoing program can be stored in computer-readable storage medium, the program
Upon execution, the step of execution includes above method embodiment；And foregoing storage medium includes：ROM, RAM, magnetic disc or light
Disk etc. is various can be with the medium of store program codes.
It is last it should be noted that：Presently preferred embodiments of the present invention is the foregoing is only, is merely to illustrate the skill of the present invention
Art scheme, is not intended to limit the scope of the present invention.Any modification for being made within the spirit and principles of the invention,
Equivalent substitution, improvement etc., are all contained in protection scope of the present invention.
Claims (10)
- A kind of 1. radiator, it is characterised in that applied to server, including：Coldplate and at least one heat pipe；Wherein, at least one heat pipe forms at least one heat pipe heat, each described heat pipe heat respectively correspond to one treat it is cold But server element；Each described inside heat pipe is provided with refrigerant；The coldplate is connected with the cooling device of outside；The evaporation ends of each heat pipe are connected with corresponding server element to be cooled；The condensation end of each heat pipe It is connected with the coldplate；Each described heat pipe, for being entered using the refrigerant currently built up in evaporation ends with corresponding server element to be cooled Row heat exchange, and by the refrigerant transfer after heat exchange to condensation end；The coldplate, for using the cooling device provide cold, inside heat pipe each described is currently built up in The refrigerant of condensation end is cooled down.
- 2. radiator according to claim 1, it is characterised in thatEach inside heat pipe is provided with the refrigerant of preset vol；Wherein, the preset vol is less than in the heat pipe Portion's volume；Each described inside heat pipe includes refrigerant used area and vacant area；Each described heat pipe, for being entered using the refrigerant currently built up in evaporation ends with corresponding server element to be cooled After row heat exchange, the refrigerant of steam condition is formed；The refrigerant transfer of steam condition is extremely condensed by the vacant area End；The refrigerant of the liquid condition after the coldplate cooling is received using the refrigerant used area；The coldplate, for each described inside heat pipe currently to be built up to the refrigerant cooling in the steam condition of condensation end For the refrigerant of liquid condition.
- 3. radiator according to claim 1, it is characterised in thatThe heat pipe number that each described heat pipe heat includes meets the first formula：First formula includes：<mrow> <msub> <mi>N</mi> <mi>i</mi> </msub> <mo>=</mo> <mfrac> <mrow> <mi>b</mi> <mo>&times;</mo> <msub> <mi>K</mi> <mi>i</mi> </msub> <mo>&times;</mo> <msub> <mi>Q</mi> <mi>i</mi> </msub> </mrow> <mrow> <msub> <mi>&beta;</mi> <mi>i</mi> </msub> <mo>&times;</mo> <msub> <mi>L</mi> <mi>i</mi> </msub> <mo>&times;</mo> <msub> <mi>S</mi> <mi>i</mi> </msub> </mrow> </mfrac> </mrow>Wherein, the NiCharacterize the heat pipe number that i-th of heat pipe heat includes；The KiI-th of heat pipe heat is characterized to use The heat transfer coefficient of refrigerant；The QiCharacterize maximum heat caused by server element to be cooled corresponding to i-th of heat pipe heat Amount；The βiCharacterize the percentage composition of each inside heat pipe refrigerant in i-th of heat pipe heat；The LiCharacterize i-th of institute State the length of each heat pipe in heat pipe heat；The SiCharacterize the sectional area of each heat pipe in i-th of heat pipe heat；It is described B characterizes constant.
- 4. radiator according to claim 1, it is characterised in thatThe coldplate, including：Plate body, cover plate, coolant inlet and coolant outlet；At least one conduit is provided with first face of the plate body；First face of the cover plate and the plate body is tightly connected, and at least one conduit forms at least one runner；The first end of each runner is connected with the coolant inlet, and the second end of each runner is and institute Coolant outlet is stated to be connected；The coolant inlet, for receiving the cooling agent of the cooling device transmission, the cooling agent received is transmitted to every One runner；Each described runner, for the cold provided using the cooling agent of coolant inlet transmission, to described in each The refrigerant that inside heat pipe currently builds up in condensation end is cooled down；The cooling agent for using cold is transmitted to the cooling agent Outlet；The coolant outlet, the cooling agent for each described runner to be transmitted are transmitted to the cooling device.
- 5. radiator according to claim 1, it is characterised in thatThe same heat pipe heat is directed to,The evaporation ends of each heat pipe are connected at the first absolute altitude with corresponding server element to be cooled respectively；Each The condensation end of the heat pipe is connected at the second absolute altitude with the coldplate respectively；Wherein, first absolute altitude is less than described the Two absolute altitudes.
- 6. radiator according to any one of claims 1 to 5, it is characterised in thatWhen the same heat pipe heat includes at least two heat pipes, there is the interval of setting between heat pipe described in each two.
- 7. radiator according to any one of claims 1 to 5, it is characterised in thatThe evaporation ends of each heat pipe are connected by welding manner with corresponding server element to be cooled；Described in each The condensation end of heat pipe is connected by welding manner with the coldplate；Or,The evaporation ends of each heat pipe are connected by snap fit with corresponding server element to be cooled；Described in each The condensation end of heat pipe is connected by snap fit with the coldplate.
- A kind of 8. service implementation method based on any radiator of claim 1 to 7, it is characterised in that including：For server element to be cooled corresponding to the setting of each heat pipe；Refrigerant and the corresponding server element progress heat to be cooled in evaporation ends are currently built up using heat pipe each described Exchange, and by the refrigerant transfer after heat exchange to condensation end；The cold of cooling device offer is provided using the coldplate, inside heat pipe each described is currently built up in cold The refrigerant at solidifying end is cooled down.
- 9. according to the method for claim 8, it is characterised in thatWhen each described inside heat pipe includes refrigerant used area and vacant area,The refrigerant currently built up in evaporation ends using heat pipe each described is entered with corresponding server element to be cooled Row heat exchange, and by the refrigerant transfer after heat exchange to condensation end, including：Each described heat pipe carries out heat using the refrigerant currently built up in evaporation ends with corresponding server element to be cooled After exchange, the refrigerant of steam condition is formed；Each described heat pipe is by the vacant area by the refrigerant transfer of steam condition to condensation end；The cold for utilizing the cooling device to provide using the coldplate, currently builds up to inside heat pipe each described Cooled down in the refrigerant of condensation end, including：Using the coldplate by each described inside heat pipe currently build up in the steam condition of condensation end refrigerant cooling For the refrigerant of liquid condition；Each described heat pipe receives the refrigerant of the liquid body after the coldplate cooling using the refrigerant used area.
- A kind of 10. radiator system, it is characterised in that including：Claim 1 to 7 any described radiator and cooling device；The cooling device, for providing cold for the radiator.
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| CN201711204244.1A CN107728761A (en) | 2017-11-27 | 2017-11-27 | A kind of radiator and its service implementation method, cooling system |
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Cited By (1)
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| CN111190472A (en) * | 2020-02-24 | 2020-05-22 | 大连理工大学 | High-power separated heat pipe radiator for server |
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