CN107718452A - A kind of plurality of rows of lead frame structure - Google Patents
A kind of plurality of rows of lead frame structure Download PDFInfo
- Publication number
- CN107718452A CN107718452A CN201710882818.4A CN201710882818A CN107718452A CN 107718452 A CN107718452 A CN 107718452A CN 201710882818 A CN201710882818 A CN 201710882818A CN 107718452 A CN107718452 A CN 107718452A
- Authority
- CN
- China
- Prior art keywords
- rows
- glue hole
- lead frame
- sprue
- several
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/32—Moulds having several axially spaced mould cavities, i.e. for making several separated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
- B29C45/401—Ejector pin constructions or mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C2045/4063—Removing or ejecting moulded articles preventing damage to articles caused by the ejector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of plurality of rows of lead frame structure, and it includes several frame units（3‑1）, each frame unit（3‑1）By the column unit of left and right two（3‑2）Composition, each column unit（3‑2）By multirow cellular construction（3‑3）Composition, each cellular construction（3‑3）By several products side by side（3‑4）Composition, the column unit of left and right two（3‑2）Between be vertically provided with several sprues and rush glue hole（3‑5）, two neighboring sprue rushes glue hole（3‑5）In at least one sprue rush glue hole（3‑5）Both sides in the horizontal direction on be provided with several virtual flow channels and rush glue hole（3‑6）.A kind of plurality of rows of lead frame structure of invention, it between lead frame row and row by setting virtual flow channel to rush glue hole, make to form the scrap rubber acted on for demoulding thimble by plastic packaging material on leadframes unit structure periphery in encapsulating so that in the demoulding, lead frame being capable of uniform force.
Description
Technical field
The present invention relates to a kind of plurality of rows of lead frame structure, belong to technical field of semiconductor encapsulation.
Background technology
Referring to Fig. 1, Fig. 2, the lead frame of existing compact package is usually following steps when plastic packaging is carried out：
Step 1: treat that plastic packaging product preheats；
Step 2: conveying products are to plastic package die；
Step 3: mold-closing injection after the preheating of plastic packaging material cake, the plastic packaging material pressure injection of liquid enter sprue 1-1；
Step 4: plastic packaging material enters cast gate 1-2 filling product die cavities 1-3 along sprue both sides；
Step 5: die sinking, the scrap rubber that lower mould thimble 1-4 is withstood in sprue make product break away from moulds；
Step 6: rushing glue, the product being stripped is transported to Chong Jiao areas, rushes sealing rubber die and rushes glue by what is reserved on framework sprue
Elliptical aperture washes out scrap rubber.
The shortcomings that above-mentioned process：
1st, due to the volume very little of compact package product, so thimble directly can not withstand product and can only push up main flow in the demoulding
Scrap rubber on road is stripped, so product is only capable of being stripped by the power in sprue direction, and because unbalance stress is de-
Easily cause product surface plastic packaging material that sticking to mould occurs and causes to be layered in mold process；
2nd, only it is adapted to sprue or so additionally by withstanding the plastic-sealing mould structure demoulding that sprue scrap rubber is stripped
Respectively fill a product（One note one）If there are more products sprue side（One note is more）, will be because of stress when being stripped not
Cause frame stressing and deform, can not be carried out so as to have influence on follow-up operation, this is also that compact package product can not be real
One of the reason for now a note is more.
3rd, existing lead frame is usually below 10 rows, because its row is more, lead frame is easier to be become
Shape, if being stripped if only the scrap rubber directly pushed up on sprue by thimble, unbalance stress when will be because of the demoulding and
Cause frame stressing and deform.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of plurality of rows of lead frame structure for above-mentioned prior art,
It can solve the problem that existing compact package is being layered caused by the demoulding and can not realized more than a note or the problem of multiple rows of.
Technical scheme is used by the present invention solves the above problems：A kind of plurality of rows of lead frame structure, if it includes
Dry frame unit, each frame unit are made up of the column unit of left and right two, and each column unit is made up of multirow cellular construction, often
Individual cellular construction is vertically provided with several main flows by several product forms side by side between the column unit of left and right two
Road Chong Jiao holes, if two neighboring sprue rush at least one sprue in glue hole rush glue hole both sides in the horizontal direction on be provided with
A dry virtual flow channel rushes glue hole, and the virtual flow channel rushes glue hole position above or below cellular construction.
The quantity of cellular construction is 14 rows, 16 rows, 18 rows or 20 rows in each column unit.
Compared with prior art, the advantage of the invention is that：
A kind of plurality of rows of lead frame structure of the present invention, it between lead frame row and row by setting virtual flow channel to rush glue
Hole, make to form the scrap rubber acted on for demoulding thimble by plastic packaging material on leadframes unit structure periphery in encapsulating, make
The demoulding when lead frame being capable of uniform force.
Brief description of the drawings
Fig. 1, Fig. 2 are that existing compact package lead frame is carrying out the view of plastic packaging.
Fig. 3 is a kind of schematic diagram of plurality of rows of lead frame structure of the present invention.
Fig. 4 is the structural representation of Fig. 3 middle frame units.
Fig. 5 is the structural representation of column unit in Fig. 4.
Fig. 6 is a kind of schematic diagram of the die cavity unit of the mould structure with virtual flow channel of the present invention.
Wherein：
Sprue 1-1
Cast gate 1-2
Product die cavity 1-3
Thimble 1-4
Lead frame 3
Frame unit 3-1
Column unit 3-2
Cellular construction 3-3
Product 3-4
Sprue rushes glue hole 3-5
Virtual flow channel rushes glue hole 3-6
Mould structure 4
Die cavity unit 4-1
Sprue 4-2
Virtual flow channel 4-3
Die cavity row unit 4-4
Product die cavity 4-5
Thimble 4-6.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing embodiment.
As shown in Fig. 3 ~ Fig. 5, a kind of plurality of rows of lead frame structure in the present embodiment, it includes several frame units
3-1, each frame unit 3-1 are made up of the column unit 3-2 of left and right two, and each column unit 3-2 is by multirow cellular construction 3-3 groups
Into each cellular construction 3-3 is made up of several product 3-4 side by side, is vertically set between the column unit 3-2 of left and right two
It is equipped with several sprues and rushes glue hole 3-5, two neighboring sprue rushes at least one sprue in the 3-5 of glue hole and rushes glue hole 3-5
Both sides in the horizontal direction on be provided with several virtual flow channels and rush glue hole 3-6, the virtual flow channel rushes glue hole 3-6 and is located at unit knot
Above or below structure 3-3；
Cellular construction 3-3 quantity is 14 rows, 16 rows, 18 rows or 20 rows in each column unit 3-2.
Referring to Fig. 6, a kind of mould structure with virtual flow channel in the present embodiment, it includes several die cavity units 4-
1, each die cavity unit 4-1 include sprue a 4-2, some virtual flow channel 4-3 and some die cavity row unit 4-4, described
Virtual flow channel 4-3 is located at left and right sides of sprue 4-2 and is connected with sprue 4-2, and the die cavity row unit 4-4 is located at virtual stream
Both sides, the die cavity row unit 4-4 are located at left and right sides of sprue 4-2 and are connected with sprue 4-2 road 4-3 up and down, the type
Chamber row unit 4-4 is some scalable including being provided with several product die cavities 4-5, the sprue 4-2 and virtual flow channel 4-3
Thimble 4-6；
When lead frame 3 is put into mould, the position that the thimble on sprue 4-2 rushes glue hole 3-5 with sprue is corresponding, empty
The position that thimble on plan runner 4-3 rushes glue hole 3-5 with virtual flow channel is corresponding.
During encapsulating, plastic packaging material injection sprue 4-2, and along sprue 4-2 filling product die cavity 4-5 and virtual flow channel 4-3,
And the position for corresponding to sprue and virtual flow channel on lead frame 3 forms scrap rubber.During die sinking, thimble, which can withstand scrap rubber, to be made
Product break away from moulds, because scrap rubber is located at around product line unit so that during the demoulding can uniform force, so as to avoid small
Product surface plastic packaging material occurs sticking to mould and causes to be layered in type encapsulating products knockout course；
Row unit is more side stress during additionally, due to the demoulding, so framework will not deform because of unbalance stress, especially sprue
There are more products side（One note is more）Or in the case of multi-row lead frame frame structure, effect of the invention is especially apparent.
In addition to the implementation, it is all to use equivalent transformation or equivalent replacement present invention additionally comprises there is other embodiment
The technical scheme that mode is formed, it all should fall within the scope of the hereto appended claims.
Claims (2)
- A kind of 1. plurality of rows of lead frame structure, it is characterised in that：It includes several frame units（3-1）, each framework list Member（3-1）By the column unit of left and right two（3-2）Composition, each column unit（3-2）By multirow cellular construction（3-3）Composition, each Cellular construction（3-3）By several products side by side（3-4）Composition, the column unit of left and right two（3-2）Between vertically set It is equipped with several sprues and rushes glue hole（3-5）, two neighboring sprue rushes glue hole（3-5）In at least one sprue rush glue hole （3-5）Both sides in the horizontal direction on be provided with several virtual flow channels and rush glue hole（3-6）, the virtual flow channel rushes glue hole（3-6） Positioned at cellular construction（3-3）Above or below.
- A kind of 2. plurality of rows of lead frame structure according to claim 1, it is characterised in that：Each column unit（3-2）In Cellular construction（3-3）Quantity be 14 rows, 16 rows, 18 rows or 20 rows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710882818.4A CN107718452A (en) | 2017-09-26 | 2017-09-26 | A kind of plurality of rows of lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710882818.4A CN107718452A (en) | 2017-09-26 | 2017-09-26 | A kind of plurality of rows of lead frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107718452A true CN107718452A (en) | 2018-02-23 |
Family
ID=61206979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710882818.4A Pending CN107718452A (en) | 2017-09-26 | 2017-09-26 | A kind of plurality of rows of lead frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107718452A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7247267B2 (en) * | 2003-08-12 | 2007-07-24 | Advanced Semiconductor Engineering, Inc. | Mold and method of molding semiconductor devices |
| CN102248638A (en) * | 2011-03-31 | 2011-11-23 | 浙江华越芯装电子股份有限公司 | Energy saving integrated circuit injection mold structure |
| CN204322436U (en) * | 2013-03-28 | 2015-05-13 | 上海浦东美灵塑料制品有限公司 | A kind of closed heat flow passage sprue |
| CN204525985U (en) * | 2015-01-16 | 2015-08-05 | 江西亚中电子科技有限公司 | Plastic mould runner |
| CN104842511A (en) * | 2015-05-08 | 2015-08-19 | 东莞市凯昶德电子科技股份有限公司 | LED (Light Emitting Diode) support injection moulding die and method |
-
2017
- 2017-09-26 CN CN201710882818.4A patent/CN107718452A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7247267B2 (en) * | 2003-08-12 | 2007-07-24 | Advanced Semiconductor Engineering, Inc. | Mold and method of molding semiconductor devices |
| CN102248638A (en) * | 2011-03-31 | 2011-11-23 | 浙江华越芯装电子股份有限公司 | Energy saving integrated circuit injection mold structure |
| CN204322436U (en) * | 2013-03-28 | 2015-05-13 | 上海浦东美灵塑料制品有限公司 | A kind of closed heat flow passage sprue |
| CN204525985U (en) * | 2015-01-16 | 2015-08-05 | 江西亚中电子科技有限公司 | Plastic mould runner |
| CN104842511A (en) * | 2015-05-08 | 2015-08-19 | 东莞市凯昶德电子科技股份有限公司 | LED (Light Emitting Diode) support injection moulding die and method |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |
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| RJ01 | Rejection of invention patent application after publication |