CN107705950A - A kind of surface mount method of direct insertion piezo-resistance - Google Patents
A kind of surface mount method of direct insertion piezo-resistance Download PDFInfo
- Publication number
- CN107705950A CN107705950A CN201710933623.8A CN201710933623A CN107705950A CN 107705950 A CN107705950 A CN 107705950A CN 201710933623 A CN201710933623 A CN 201710933623A CN 107705950 A CN107705950 A CN 107705950A
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- China
- Prior art keywords
- piezo
- resistance
- surface mount
- direct insertion
- slot
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of surface mount method of direct insertion piezo-resistance, comprise the following steps：The piezo-resistance after bonding wire or the piezo-resistance after powder coating are flattened first, two pins of piezo-resistance are flattened to 0.8 ~ 1.2mm of width by flattening mould, the piezo-resistance after being flattened；Then piezo-resistance is encapsulated in engineering plastics by plastic encapsulation process the piezo-resistance after flattening, and two pins is obtained the piezo-resistance after plastic packaging perpendicular to bottom surface；By cutting mould and according to follow-up bending scheme pin is prescinded according to required length, again by Bending Mould the pin bending for exposing plastic packaging body portion, and a pin is caused to bend towards plastic-sealed body front end by slot to make way A, another pin bends towards plastic-sealed body rear end by slot to make way B, obtains the piezo-resistance of vertical paster, and meets the requirement of surface mount process, make direct insertion piezo-resistance that there is surface mount function, surface mount process is adapted to, improves efficiency, saves labour.
Description
Technical field
The present invention relates to electronic device surface mounting technology field, specially a kind of surface mount of direct insertion piezo-resistance
Method.
Background technology
Aluminum base circuit board has good heat conductivility, is widely used in the high environment of cooling requirements, as LED shines
It is bright, photovoltaic generation etc..Because aluminum base circuit board does not have via pad to cause to weld electronic component by surface mount process
It is connected on aluminum base circuit board.When direct insertion piezo-resistance needs to be welded on aluminum-based circuit board, because aluminum-based circuit board is not logical
Eyelet welding disk, welding work as trouble, it is necessary to which the pin of direct insertion piezo-resistance is cut short then manual welding to wiring board, efficiency
Low, cost of labor is high, does not adapt to high-speed automated operation.
When needing direct insertion piezo-resistance to be welded on aluminum-based circuit board, can not be made with efficient surface mount process
Industry, can only the relatively low manual or semi-automatic plug-in unit welding procedure of service efficiency.For direct insertion piezo-resistance in aluminium base electricity
Welding Problems on the plate of road make straight disclosure sets forth a kind of method for making direct insertion piezo-resistance have surface mount function
The formula of inserting piezo-resistance can also be welded in the circuit board by surface mount process, improved direct insertion piezo-resistance and be welded to wiring board
On efficiency, save labour.
The content of the invention
In order to overcome the shortcomings of prior art, the present invention provides a kind of surface mount side of direct insertion piezo-resistance
Method, make direct insertion piezo-resistance that there is surface mount function, adapt to surface mount process.Eliminate direct insertion piezo-resistance welding
Cumbersome process during to aluminum base circuit board, efficiency is improved, save labour, can effectively solve the problem that the problem of background technology proposes.
The technical solution adopted for the present invention to solve the technical problems is：A kind of surface mount side of direct insertion piezo-resistance
Method, it is characterised in that：Comprise the following steps：
S100, the piezo-resistance after bonding wire or the piezo-resistance after powder coating are flattened first, by flattening mould handle
Two pins of piezo-resistance are flattened to 0.8 ~ 1.2mm of width, the piezo-resistance after being flattened；
S200 and then piezo-resistance is set to be encapsulated in engineering plastics by plastic encapsulation process the piezo-resistance after flattening,
And two pins are made to obtain the piezo-resistance after plastic packaging perpendicular to bottom surface；
S300, by cutting mould and according to follow-up bending scheme pin is prescinded according to required length, then pass through bender
Tool causes a pin to bend towards plastic-sealed body front end by slot to make way A the pin bending for exposing plastic packaging body portion, and another draws
Pin bends towards plastic-sealed body rear end by slot to make way B, obtains the piezo-resistance of vertical paster；
As a kind of preferable technical scheme of the present invention, in the step S300 two pins can also be made to pass through slot to make way respectively
A and b then upward bending, makes two pins concordant with trailing flank respectively along slot to make way a and b, crouched to trailing flank bending
The piezo-resistance of formula paster.
As a kind of preferable technical scheme of the present invention, the top surface of the plastic-sealed body is a plane, facilitates surface mount
Drawn during operation from top surface, and the slot to make way A and slot to make way B being parallel to each other are provided with the bottom surface of plastic-sealed body.
As a kind of preferable technical scheme of the present invention, the plastic-sealed body using more than 250 degree of heat distortion temperature plastics
It is made.
As a kind of preferable technical scheme of the present invention, the groove width of the slot to make way A and slot to make way B are 1.4 ~ 2.0mm,
Depth is 0.25 ~ 0.4mm.
As a kind of preferable technical scheme of the present invention, the surface mount method leaf is applied to direct insertion Y capacitance and straight cutting
Formula thermistor.
As a kind of preferable technical scheme of the present invention, after piezo-resistance plastic packaging, two pins and plane perpendicular.
Compared with prior art, the beneficial effects of the invention are as follows：A kind of table of direct insertion piezo-resistance of the present invention
Face attaching method, make direct insertion piezo-resistance that there is surface mount function, adapt to surface mount process, eliminate direct insertion pressure-sensitive
Cumbersome process when resistance welding is to aluminum base circuit board, efficiency is improved, save labour.
Brief description of the drawings
Fig. 1 be plastic packaging of the present invention after piezo-resistance schematic diagram
Fig. 2 is the piezo-resistance schematic diagram after bonding wire of the present invention or powder coating；
Fig. 3 is the schematic diagram of the piezo-resistance after the present invention flattens；
Fig. 4 is the schematic diagram of the piezo-resistance of the vertical paster of the present invention；
Fig. 5 is the schematic diagram of the piezo-resistance of the horizontal paster of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
The explanation of following embodiment is refer to the attached drawing, can be to the specific embodiment implemented to the example present invention.
The direction and position term that the present invention is previously mentioned, for example, " on ", " in ", " under ", "front", "rear", "left", "right", " interior ", "
Outside ", " side " etc., only it is direction and position with reference to annexed drawings.Therefore, the direction and position term used is to illustrate
And understand the present invention, and it is not used to the limitation present invention.
Embodiment：
The invention provides a kind of surface mount method of direct insertion piezo-resistance, comprise the following steps：
S100, first by the piezo-resistance after bonding wire（As shown in Figure 2）Or the piezo-resistance after powder coating（Such as institute in Fig. 2
Show）Flattened, two pins of piezo-resistance are flattened to 0.8 ~ 1.2mm of width by flattening mould, after being flattened
Piezo-resistance is (as shown in Figure 3）；
S200 and then piezo-resistance is set to be encapsulated in engineering plastics by plastic encapsulation process the piezo-resistance after flattening,
And two pins are made to obtain the piezo-resistance after plastic packaging (as shown in Figure 1 perpendicular to bottom surface）；
S300, by cutting mould and according to follow-up bending scheme pin is prescinded according to required length, then pass through bender
Tool causes a pin to bend towards plastic-sealed body front end by slot to make way A the pin bending for exposing plastic packaging body portion, and another draws
Pin bends towards plastic-sealed body rear end by slot to make way B, obtains the piezo-resistance of vertical paster（As shown in Figure 4）；
In the step S300 two pins can also then be rolled over upwards respectively by slot to make way a and b to trailing flank bending
It is curved, make two pins concordant with trailing flank respectively along slot to make way a and b, obtain the piezo-resistance of horizontal paster（Such as Fig. 5 institutes
Show）.
The top surface of the plastic-sealed body is a plane, is drawn when facilitating surface mount operation from top surface, and in plastic-sealed body
Bottom surface be provided with the slot to make way A and slot to make way B that are parallel to each other.
The plastic-sealed body is made of the plastics of more than 250 degree of heat distortion temperature.
The groove width of the slot to make way A and slot to make way B are 1.4 ~ 2.0mm, and depth is 0.25 ~ 0.4mm.
The surface mount method leaf is applied to direct insertion Y capacitance and direct insertion thermistor.
After piezo-resistance plastic packaging, two pins and plane perpendicular.
In summary, the main characteristic of the invention lies in that：
1. encapsulation more than heat deformations temperature 250oC used.
2. plastic-sealed body has two slots to make way to extend respectively into trailing flank in bottom surface, 1.4 ~ 2.0mm of groove width, and depth 0.25 ~
0.4mm。
3. the pin of piezo-resistance be crushed after 0.2 ~ 0.3mm of thickness.
4. this method is also applied for direct insertion Y capacitance and direct insertion thermistor.
5. after piezo-resistance plastic packaging, two pins and plane perpendicular.
6. during using cutting mould, the length needed for pin is set in advance, according to bending scheme one so that after follow-up bending,
Pin is without departing from slot to make way.According to bending scheme two so that after follow-up bending, pin is without departing from slot to make way
7. it is directed to bending scheme one:One pin bending forward of piezo-resistance after plastic packaging, the bending backward of another pin, and
And two pins are concordant with bottom surface.
8. it is directed to bending scheme two:Two pins of piezo-resistance after plastic packaging are respectively along bending after slot to make way a and b, then
Upward bending is simultaneously concordant with trailing flank.
9. plastic packaging rear top surface and front are planes in order to be drawn during surface mount.
Disclosure sets forth a kind of surface mount method of direct insertion piezo-resistance, make direct insertion piezo-resistance that there is surface
Function is mounted, adapts to surface mount process.Eliminate direct insertion piezo-resistance and be welded to process cumbersome during aluminum base circuit board, carry
High efficiency, save labour.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.
Claims (7)
- A kind of 1. surface mount method of direct insertion piezo-resistance, it is characterised in that：Comprise the following steps：S100, the piezo-resistance after bonding wire or the piezo-resistance after powder coating are flattened first, by flattening mould handle Two pins of piezo-resistance are flattened to 0.8 ~ 1.2mm of width, the piezo-resistance after being flattened；S200 and then piezo-resistance is set to be encapsulated in engineering plastics by plastic encapsulation process the piezo-resistance after flattening, And two pins are made to obtain the piezo-resistance after plastic packaging perpendicular to bottom surface；S300, by cutting mould and according to follow-up bending scheme pin is prescinded according to required length, then pass through bender Tool causes a pin to bend towards plastic-sealed body front end by slot to make way A the pin bending for exposing plastic packaging body portion, and another draws Pin bends towards plastic-sealed body rear end by slot to make way B, obtains the piezo-resistance of vertical paster.
- A kind of 2. surface mount method of direct insertion piezo-resistance according to claim 1, it is characterised in that：The step Two pins can also be made then upward bending, to make two pins respectively by slot to make way a and b to trailing flank bending in S300 It is concordant with trailing flank respectively along slot to make way a and b, obtain the piezo-resistance of horizontal paster.
- A kind of 3. surface mount method of direct insertion piezo-resistance according to claim 1, it is characterised in that：The plastic packaging The top surface of body is a plane, is drawn when facilitating surface mount operation from top surface, and be provided with the bottom surface of plastic-sealed body and mutually put down Capable slot to make way A and slot to make way B.
- A kind of 4. surface mount method of direct insertion piezo-resistance according to claim 1 or 2, it is characterised in that：It is described Plastic-sealed body is made of the plastics of more than 250 degree of heat distortion temperature.
- A kind of 5. surface mount method of direct insertion piezo-resistance according to claim 1 or 2, it is characterised in that：It is described Slot to make way A and slot to make way B groove width are 1.4 ~ 2.0mm, and depth is 0.25 ~ 0.4mm.
- A kind of 6. surface mount method of direct insertion piezo-resistance according to claim 1, it is characterised in that：Paste on the surface Dress method leaf is applied to direct insertion Y capacitance and direct insertion thermistor.
- A kind of 7. surface mount method of direct insertion piezo-resistance according to claim 1, it is characterised in that：Piezo-resistance After plastic packaging, two pins and plane perpendicular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710933623.8A CN107705950A (en) | 2017-10-10 | 2017-10-10 | A kind of surface mount method of direct insertion piezo-resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710933623.8A CN107705950A (en) | 2017-10-10 | 2017-10-10 | A kind of surface mount method of direct insertion piezo-resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107705950A true CN107705950A (en) | 2018-02-16 |
Family
ID=61184775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710933623.8A Pending CN107705950A (en) | 2017-10-10 | 2017-10-10 | A kind of surface mount method of direct insertion piezo-resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107705950A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493119A (en) * | 2018-05-11 | 2018-09-04 | 朱同江 | Production method of patch electronics components and products thereof |
| CN108899284A (en) * | 2018-07-19 | 2018-11-27 | 朱同江 | Production method of patch electronics components and products thereof |
| CN110189879A (en) * | 2019-05-28 | 2019-08-30 | 东莞为勤电子有限公司 | A kind of projective table type patch installs hot varistor preparation method and product |
| CN110931192A (en) * | 2019-11-06 | 2020-03-27 | 兴勤（常州）电子有限公司 | Integrated miniaturized patch piezoresistor |
| CN111968811A (en) * | 2020-09-15 | 2020-11-20 | 兴勤（常州）电子有限公司 | Surface-mounted piezoresistor and manufacturing method thereof |
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| JP2004119181A (en) * | 2002-09-26 | 2004-04-15 | Mitsumi Electric Co Ltd | Memory card connector |
| CN101765891A (en) * | 2007-06-29 | 2010-06-30 | 兴亚株式会社 | Resistor |
| CN202058519U (en) * | 2011-05-28 | 2011-11-30 | 董飞 | Novel precise metal film plastic package resistor |
| CN202282254U (en) * | 2011-09-19 | 2012-06-20 | 厦门万明电子有限公司 | Novel horizontal type electronic component |
| CN203085305U (en) * | 2012-12-28 | 2013-07-24 | 深圳顺络电子股份有限公司 | Piezoresistor |
| CN203536146U (en) * | 2013-10-16 | 2014-04-09 | 广东风华邦科电子有限公司 | Novel 40D lightning protection piezoresistor |
| CN106128666A (en) * | 2016-08-30 | 2016-11-16 | 广西新未来信息产业股份有限公司 | A kind of multiway direct insertion Plastic Package piezoresistor |
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2017
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004119181A (en) * | 2002-09-26 | 2004-04-15 | Mitsumi Electric Co Ltd | Memory card connector |
| CN101765891A (en) * | 2007-06-29 | 2010-06-30 | 兴亚株式会社 | Resistor |
| CN202058519U (en) * | 2011-05-28 | 2011-11-30 | 董飞 | Novel precise metal film plastic package resistor |
| CN202282254U (en) * | 2011-09-19 | 2012-06-20 | 厦门万明电子有限公司 | Novel horizontal type electronic component |
| CN203085305U (en) * | 2012-12-28 | 2013-07-24 | 深圳顺络电子股份有限公司 | Piezoresistor |
| CN203536146U (en) * | 2013-10-16 | 2014-04-09 | 广东风华邦科电子有限公司 | Novel 40D lightning protection piezoresistor |
| CN106128666A (en) * | 2016-08-30 | 2016-11-16 | 广西新未来信息产业股份有限公司 | A kind of multiway direct insertion Plastic Package piezoresistor |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493119A (en) * | 2018-05-11 | 2018-09-04 | 朱同江 | Production method of patch electronics components and products thereof |
| CN108899284A (en) * | 2018-07-19 | 2018-11-27 | 朱同江 | Production method of patch electronics components and products thereof |
| CN108899284B (en) * | 2018-07-19 | 2023-11-14 | 朱同江 | Method for producing surface mounted electronic component and product thereof |
| CN110189879A (en) * | 2019-05-28 | 2019-08-30 | 东莞为勤电子有限公司 | A kind of projective table type patch installs hot varistor preparation method and product |
| CN110931192A (en) * | 2019-11-06 | 2020-03-27 | 兴勤（常州）电子有限公司 | Integrated miniaturized patch piezoresistor |
| CN111968811A (en) * | 2020-09-15 | 2020-11-20 | 兴勤（常州）电子有限公司 | Surface-mounted piezoresistor and manufacturing method thereof |
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Application publication date: 20180216 |