CN107702829A - A kind of laser preparation method of copper-based flexible wearable formula pressure sensor - Google Patents

A kind of laser preparation method of copper-based flexible wearable formula pressure sensor Download PDF

Info

Publication number
CN107702829A
CN107702829A CN201710851343.2A CN201710851343A CN107702829A CN 107702829 A CN107702829 A CN 107702829A CN 201710851343 A CN201710851343 A CN 201710851343A CN 107702829 A CN107702829 A CN 107702829A
Authority
CN
China
Prior art keywords
copper
pressure sensor
laser
solution
ethylene glycol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710851343.2A
Other languages
Chinese (zh)
Inventor
胡安明
白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing University of Technology
Original Assignee
Beijing University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing University of Technology filed Critical Beijing University of Technology
Priority to CN201710851343.2A priority Critical patent/CN107702829A/en
Publication of CN107702829A publication Critical patent/CN107702829A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

A kind of laser preparation method of copper-based flexible wearable formula pressure sensor, belongs to laser micro/nano manufacturing field.The preparation of copper electrode in sensor, formed by infrared band laser device secondary process.The material for preparing of copper electrode is made up of cupric nitrate trihydrate, ethylene glycol, formic acid, water, first the film on glass, and then laser direct-writing, is transcribed using dimethyl silicone polymer;The flexible material of sensor is dimethyl silicone polymer.This kind of pliable pressure sensor as electrode material, greatly reduces the cost of raw material using copper.Using laser direct writing method, machining accuracy is high, and processing mode is flexible, and noncontact procession can be achieved.Dimethyl silicone polymer encapsulates copper electrode as flexible substrate so that electrode part has the characteristic such as anti-oxidant, corrosion-resistant.Generally speaking, manufacturing cost of the present invention is relatively low, features simple and practical process, the service life length of sensor.

Description

A kind of laser preparation method of copper-based flexible wearable formula pressure sensor
Technical field
The invention belongs to laser micro/nano manufacturing technology field, is related to laser direct-writing process equipment, specifically a kind of laser straight Reduction mantoquita material is write to be used to prepare wearable voltage sensitive sensor.
Background technology
At present, wearable device is greatly enhanced in the production and living fields such as man-machine interaction, information identification, medical treatment & health The production work efficiency and living standard of people.Simultaneously because the wide application of wearable device and the use operation side of simplicity Method, also it is increasingly subject to the favor of general public.
In general, flexible wearable equipment usually requires Sensitive Apparatus being worked into flexible substrate, the flexible substrate Need that there is certain ductility, preferable recovery capability after bending property and deformation.When have outer signals (such as sound, light, Electricity or external force etc.) when being loaded on device, the sensor of device inside will produce the signal generation corresponding with outer signals or Change.Measured by the external receiver of sensor and be can be achieved by the signal of sensor to certain specific outer signals in real time Dynamic instrumentation.
Especially because such a device architectures are on flexible substrates, when there is external force to put in equipment, it will be produced can Restorative deformation.And deformation will bring the structure or change in shape to device inner sensor, and then sensing can be set up Corresponding relation between device signal and external force.
In numerous materials for preparing wearable flexible sensor, metal_based material is wherein important one kind.Due to working as When flexible substrate deforms upon, respective change also occurs for the structure of conductive material, thus resistance or electric capacity change rapidly, leads to The size of external force can be detected by crossing the situation of change of test resistance or electric capacity.Gold, ag material due to its good electric conductivity with Anticorrosive antioxygenic property turns into the first choice for preparing Metal Substrate flexible wearable sensor.Then due to precious metal materials such as gold and silver With high costs, which results in the high enterprise of the price of product after commercialization.The copper-based material that thus electric conductivity can be comparable with silver Become the alternative materials for preparing flexible sensing device.At present, the method for preparing copper-based flexible sensing device has a lot, such as:It is low Warm sintering, the irradiation of high brightness xenon lamp, plane spraying process etc..Copper product used is generally copper particle, cupric oxide powdered granule Deng.Can be interweaved copper particle using above-mentioned means the electrode part reticulated as sensor.But Metal Substrate is sensed at present It is mainly still plane manufacture that device, which prepares common approach, and which results in the preparation technology of the sensor to 3-d modelling is non- It is often complicated, therefore it is badly in need of a kind of simple, efficient, cost is cheap three-dimensional processing method.On the other hand, due to the copper used at present Presoma be usually copper or cupric oxide powder, copper powders due to being easily oxidized into nonconducting cupric oxide in atmosphere, Therefore autoxidation can occur for copper particle in process;And it is difficult all to go back cupric oxide if using cupric oxide powder Original is into copper, and because the copper after cupric oxide is easy to and reduce in the fabrication process combines, therefore it is difficult to will be unnecessary Cupric oxide removes.In a word, due to the presence of cupric oxide, the electric conductivity of electrode is greatly diminished in sensor.
It is an object of the invention to provide a kind of easy to operate, copper-based sensor processing method of the cheap practicality of cost. The present invention provides copper using copper nitrate as precursor material, with reference to laser assisted direct writing technology in flexible material (poly dimethyl silicon Oxygen alkane) on prepare pressure sensor.The senser element has high sensitivity, and stability is good, dependable performance, can measure in real time Pressure change.Further, since the cellar area of this kind of sensor is small, pressure is enough measured simultaneously after multiple sensor combinations are encapsulated Power position.
The content of the invention
The technical problem to be solved in the present invention is:Solve the Three-dimension process and Gao Ling of the existing copper-based sensor of presser sensor formula The problem of sensitivity.A kind of preparation method for preparing low, good reliability the pressure sensor of cost is provided.
Technical scheme is as follows:
1) cupric nitrate trihydrate, ethylene glycol and deionized water are mixed evenly, until cupric nitrate trihydrate is complete Portion dissolves, and obtains the precursor material of cupric;
2) ethylene glycol solution of copper nitrate is heated, needs to stir and to be aerated during heating;
3) after solution is cooled to room temperature, formic acid solution is instilled, and stir ultrasonic atomizatio;
4) reacted copper nitrate solution is spun in glass substrate;
5) by the laser of laser by focusing radiation after focusing objective len directly to the copper nitrate film scanning on glass;
6) after the completion of scanning, redundant nitric acid copper solution is cleaned up and dried with deionized water;
7) uncured dimethyl silicone polymer (before solidification) solution is covered on the copper film obtained by step 6);
8) device is integrally heated so that polydimethyl siloxane material solidifies;
9) dimethyl silicone polymer is peeled off from glass;
Each component is preferably in the precursor material of step (1) cupric:40~50wt% of cupric nitrate trihydrate, ethylene glycol 30 ~50wt%, solvent are water surplus, and preferably water is not 0.
Step (3) formic acid is preferably (10-100) with ethylene glycol volume ratio:1;Ultrasonic atomizatio, its supersonic frequency are 20 kilo hertzs Hereby.
Step 5) laser wavelength is 808 nanometers, and laser type is semiconductor continuous laser, and focusing objective len multiplying power is 5- 20 times, laser power is 1-3W before focusing, and sweep speed is that 1-10 millimeters are per second;
Step 6) dimethyl silicone polymer solution includes dimethyl silicone polymer, curing agent.
Using automatically controlled Three-dimension process platform courses, the operating path in control can be individual layer plane, multi-layer three-dimension structure, With straight line, netted, circular, spiral shape, the three-dimensional geometrical pattern to interweave.
The present invention principle be:When in laser irradiation to copper nitrate ethylene glycol solution, the area near laser facula Domain is heated rapidly.When temperature rises to 200 DEG C or so, ethylene glycol is decomposed and generates the aldehydes with reproducibility Matter.In a heated condition, due to the presence of reproducibility aldehyde radical, the cupric in copper nitrate can be reduced to copper simple substance.Change sentence Talk about, by the copper for producing electric conductivity and adhered on a glass substrate by the copper nitrate ethylene glycol solution after laser scanning.Will After dimethyl silicone polymer solidification, the adhesiveness and pliability that have due to itself, the copper electrode on glass substrate can be turned Record on dimethyl silicone polymer.Thus there can be flexible pressure sensor to use as a kind of.
Compared with prior art, the invention has the advantages that:
(1) this method carries out in-situ reducing to the presoma of copper using semiconductor infrared laser device, laser use so that Machining accuracy greatly increases, and the untouchable processing mode of laser is also easy to carry out the flexible processing of three dimensional constitution;
(2) this method use copper nitrate as copper electrode presoma, due to abandoning copper and copper oxide particle Use so that the electric conductivity for the copper electrode prepared greatly increases.Preparation technology is simplified simultaneously, it is not necessary to first prepare copper Nano-particle material, reach reduction with preparing the purpose of copper electrode using laser writing technology one step of energy.
(3) ultrasonic atomizatio has refining effect for the granular precursor of copper.This can greatly reduce the size of particle simultaneously The fastness of copper electrode is lifted, the generation of numerous stomatas is effectively prevent, so as to improve the electric conductivity of electrode and stability.
(4) this method is packaged using dimethyl silicone polymer as flexible substrate material and to copper electrode, Neng Gouyou Effect prevents the problem of oxidation of copper electrode under general condition.
Brief description of the drawings
Fig. 1 laser machines copper electrode schematic diagram
The copper-based sensor simple diagrams of Fig. 2
In figure:1 808 nano wave length semiconductor lasers;2 plane mirrors;3 focusing objective lens;4 copper nitrate ethylene glycol are thin Film;5 glass substrates;6 Three-dimension process platforms;7 signals receive line;8 dimethyl silicone polymer flexible substrates;9 copper-based sensors;
The sensor of Fig. 3 embodiments 9 at various pressures, the situation of change of resistivity
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Thus It is not intended that the limitation of the scope of the present invention.
Embodiment 1:
1) by cupric nitrate trihydrate, ethylene glycol, water in mass ratio 10:10:1 be mixed and stirred for it is thoroughly molten to copper nitrate Solution;
2) solution is heated with stirring to 100 DEG C and is incubated 10 minutes, 300 revs/min of stir speed (S.S.), this process is needed logical Carried out under wind environment;
3) solution is naturally cooled into room temperature after, formic acid is added dropwise and stirs, wherein formic acid and ethylene glycol volume ratio 100: 1;
4) solution is subjected to ultrasound 30 minutes, the KHz of supersonic frequency 20, stirred;
5) solution is spun in glass substrate, 1000 revs/min of spin speed;
6) copper nitrate ethylene glycol film is scanned using the semiconductor laser of 808 nano wavebands, using 10 times of things Mirror is focused, and laser power is 3W before focusing, and sweep speed is 5 millimeters per second;
7) redundant nitric acid copper ethylene glycol is washed away with deionized water;
8) by polymethyl siloxane matrix and curing agent according to 10:1 ratio is well mixed, vacuum exhaust 30 minutes, flow coat On the electrode prepared, solidify 6 hours at 100 DEG C;
9) polydimethylsiloxanefilm film after solidification is peeled off from glass substrate, and by electrode both ends and external signal Receiving device connects;
Embodiment 2:
Present embodiment is as different from Example 1:Cupric nitrate trihydrate described in step 1), second two
Alcohol, water are 15 in mass ratio:10:1.Other are same as Example 1.
Embodiment 3:
Present embodiment is unlike embodiment 1 or 2:The volume ratio of formic acid described in step 3) and ethylene glycol is 20: 1.Other are identical with embodiment 1 or 2.
Embodiment 4:
Present embodiment is unlike embodiment 1 or 2:Described in step 5 by copper nitrate ethylene glycol spin coating after, Preheated 1 minute under the conditions of 50 DEG C.Other are identical with embodiment 1 or 2.
Embodiment 5:
Present embodiment is unlike embodiment 1 or 2:20 zoom and focus object lens, laser power are used described in step 6) For 1W.Other are identical with embodiment 1 or 2.
Embodiment 6:
Present embodiment is unlike embodiment 1 or 2:Use laser scanning speed every for 1 millimeter described in step 6) Second.Other are identical with embodiment 1 or 2.
Embodiment 7:
Present embodiment is unlike embodiment 1 or 2:Four copper electrodes are prepared described in step 9, are coupled in parallel to External signal receiving device.Other are identical with embodiment 1 or 2.
It is pointed out that on the premise of design concept of the present invention is not departed from, technology of the those skilled in the art to the present invention The all variations and modifications that method is made, all should drop into protection scope of the present invention, and the scope of the present invention will by appended right Ask rather than described above limits, it is intended that all changes in the implication and scope of the equivalency of claim will be fallen Include in the present invention, any reference in claim should not be considered as to the involved claim of limitation.
Using the effect of following verification experimental verifications present invention:
Embodiment 8:Copper-based pressure sensor method is prepared using laser assisted, prepares the pressure switch of electronic device. Specifically complete according to the following steps:
1) by cupric nitrate trihydrate, ethylene glycol, water in mass ratio 10:10:1 be mixed and stirred for it is thoroughly molten to copper nitrate Solution;
2) solution is heated with stirring to 100 DEG C and is incubated 10 minutes, 300 revs/min of stir speed (S.S.), this process is needed logical Carried out under wind environment;
3) solution is naturally cooled into room temperature after, methanol is added dropwise and stirs, wherein methanol and ethylene glycol volume ratio 100: 1;
4) solution is subjected to ultrasound 30 minutes, the KHz of supersonic frequency 20, stirred;
5) solution is spun in glass substrate, 1000 revs/min of spin speed, spin-coating time is 30 seconds;
6) copper nitrate ethylene glycol film is scanned using the semiconductor laser of 808 nano wavebands, using 10 times of things Mirror is focused, and laser power is 3W before focusing, and sweep speed is 5 millimeters per second;
7) redundant nitric acid copper ethylene glycol is washed away with deionized water;
8) by polymethyl siloxane matrix and curing agent according to 10:1 ratio is well mixed, vacuum exhaust 30 minutes, flow coat On the electrode prepared, solidify 6 hours at 100 DEG C;
9) polydimethylsiloxanefilm film after solidification is peeled off from glass substrate, and by electrode both ends and required control Circuit connects;
10) by touching sensor surface, it is possible to achieve by the switch of control device.
Embodiment 9:Copper-based pressure sensor method is prepared using laser assisted, the pressure for preparing foot force analysis passes Inductor component.Specifically complete according to the following steps:
1) by cupric nitrate trihydrate, ethylene glycol, water in mass ratio 10:10:1 be mixed and stirred for it is thoroughly molten to copper nitrate Solution;
2) solution is heated with stirring to 100 DEG C and is incubated 10 minutes, 300 revs/min of stir speed (S.S.), this process is needed logical Carried out under wind environment;
3) solution is naturally cooled into room temperature after, methanol is added dropwise and stirs, wherein methanol and ethylene glycol volume ratio 100: 1;
4) solution is subjected to ultrasound 30 minutes, the KHz of supersonic frequency 20, stirred;
5) solution is spun in glass substrate, 1000 revs/min of spin speed;
6) copper nitrate ethylene glycol film is scanned using the semiconductor laser of 808 nano wavebands, using 10 times of things Mirror is focused, and laser power is 3W before focusing, and sweep speed is 5 millimeters per second;
7) redundant nitric acid copper ethylene glycol is washed away with deionized water;
8) by polymethyl siloxane matrix and curing agent according to 10:1 ratio is well mixed, vacuum exhaust 30 minutes, flow coat On the electrode prepared, solidify 6 hours at 100 DEG C;
9) polydimethylsiloxanefilm film after solidification is peeled off from glass substrate;
10) repeat the above steps 1) to step 9) for several times, multiple sensor parallels are arranged in foot bottom or shoes Lining, and connect the sensor to the signal receiver of outside, you can the pressure distribution at each position of measurement human foot.

Claims (8)

  1. A kind of 1. method for preparing copper-based pliable pressure sensor, it is characterised in that comprise the following steps:
    1) cupric nitrate trihydrate, ethylene glycol and deionized water are mixed evenly, until cupric nitrate trihydrate is all molten Solution, obtains the precursor material of cupric;
    2) ethylene glycol solution of copper nitrate is heated, needs to stir and to be aerated during heating;
    3) after solution is cooled to room temperature, formic acid solution is instilled, and stir ultrasonic atomizatio;
    4) reacted copper nitrate solution is spun in glass substrate;
    5) by the laser of laser by focusing radiation after focusing objective len directly to the copper nitrate film scanning on glass;
    6) after the completion of scanning, redundant nitric acid copper solution is cleaned up and dried with deionized water;
    7) uncured dimethyl silicone polymer solution is covered on the copper film obtained by step 6);
    8) device is integrally heated so that polydimethyl siloxane material solidifies;
    9) dimethyl silicone polymer is peeled off from glass.
  2. 2. according to a kind of method for preparing copper-based pliable pressure sensor described in claim 1, it is characterised in that step (1) Each component is preferably in the precursor material of cupric:40~50wt% of cupric nitrate trihydrate, 30~50wt% of ethylene glycol, solvent are Water surplus, preferably water are not 0.
  3. 3. according to a kind of method for preparing copper-based pliable pressure sensor described in claim 1, it is characterised in that step (3) Formic acid is preferably (10-100) with ethylene glycol volume ratio:1.
  4. 4. according to a kind of method for preparing copper-based pliable pressure sensor described in claim 1, it is characterised in that ultrasound, its Supersonic frequency is 20 KHzs.
  5. 5. according to a kind of method for preparing copper-based pliable pressure sensor described in claim 1, it is characterised in that step 5) swashs Light device wavelength is 808 nanometers, and laser type is semiconductor continuous laser, and focusing objective len multiplying power is 5-20 times, laser before focusing Power is 1-3W, and sweep speed is that 1-10 millimeters are per second.
  6. 6. according to a kind of method for preparing copper-based pliable pressure sensor described in claim 1, it is characterised in that step 6) is poly- Dimethyl siloxane solution includes dimethyl silicone polymer, curing agent.
  7. 7. according to a kind of method for preparing copper-based pliable pressure sensor described in claim 1, it is characterised in that using automatically controlled Three-dimension process platform courses, the operating path in control are individual layer plane or multi-layer three-dimension structure, have straight line, it is netted, circular, One or more of geometrical patterns in spiral shape, three-dimensional intertexture.
  8. 8. according to the copper-based pliable pressure sensor described in claim any one of 1-7.
CN201710851343.2A 2017-09-20 2017-09-20 A kind of laser preparation method of copper-based flexible wearable formula pressure sensor Pending CN107702829A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710851343.2A CN107702829A (en) 2017-09-20 2017-09-20 A kind of laser preparation method of copper-based flexible wearable formula pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710851343.2A CN107702829A (en) 2017-09-20 2017-09-20 A kind of laser preparation method of copper-based flexible wearable formula pressure sensor

Publications (1)

Publication Number Publication Date
CN107702829A true CN107702829A (en) 2018-02-16

Family

ID=61172988

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710851343.2A Pending CN107702829A (en) 2017-09-20 2017-09-20 A kind of laser preparation method of copper-based flexible wearable formula pressure sensor

Country Status (1)

Country Link
CN (1) CN107702829A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109489542A (en) * 2018-11-15 2019-03-19 华东理工大学 Strain transducer and its manufacturing method
CN110006334A (en) * 2019-04-26 2019-07-12 华东理工大学 A kind of flexible strain transducer and preparation method thereof based on laser direct-writing pomelo peel
CN110137183A (en) * 2019-04-23 2019-08-16 深圳市华星光电技术有限公司 Array substrate and its manufacturing method
CN113091970A (en) * 2021-04-07 2021-07-09 西京学院 Self-healing intelligent all-optical flexible diaphragm

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558954A (en) * 2012-03-01 2012-07-11 复旦大学 Preparation method for nano-copper ink applied to printed electronics
CN104411429A (en) * 2012-09-12 2015-03-11 M技术株式会社 Method for manufacturing metal microparticles
CN106399980A (en) * 2016-10-13 2017-02-15 北京工业大学 Method for preparing high-bonding-strength silver electrode on flexible substrate through laser direct writing technology
CN107073651A (en) * 2014-08-08 2017-08-18 于利奇研究中心有限公司 Sensor and the method for manufacturing sensor
CN107073432A (en) * 2014-08-28 2017-08-18 国立研究开发法人产业技术综合研究所 The preparation method and its preparation facilities of dispersion
CN107096997A (en) * 2017-05-10 2017-08-29 华中科技大学 A kind of three-dimensional microstructures based on continuous laser inscribe system and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558954A (en) * 2012-03-01 2012-07-11 复旦大学 Preparation method for nano-copper ink applied to printed electronics
CN104411429A (en) * 2012-09-12 2015-03-11 M技术株式会社 Method for manufacturing metal microparticles
CN107073651A (en) * 2014-08-08 2017-08-18 于利奇研究中心有限公司 Sensor and the method for manufacturing sensor
CN107073432A (en) * 2014-08-28 2017-08-18 国立研究开发法人产业技术综合研究所 The preparation method and its preparation facilities of dispersion
CN106399980A (en) * 2016-10-13 2017-02-15 北京工业大学 Method for preparing high-bonding-strength silver electrode on flexible substrate through laser direct writing technology
CN107096997A (en) * 2017-05-10 2017-08-29 华中科技大学 A kind of three-dimensional microstructures based on continuous laser inscribe system and method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
李东风 等: "《有机化学》", 31 August 2007, 华中科技大学出版社 *
李梅 等: "《普通化学》", 31 July 2015, 上海交通大学出版社 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109489542A (en) * 2018-11-15 2019-03-19 华东理工大学 Strain transducer and its manufacturing method
CN110137183A (en) * 2019-04-23 2019-08-16 深圳市华星光电技术有限公司 Array substrate and its manufacturing method
US11443945B2 (en) 2019-04-23 2022-09-13 Tcl China Star Optoelectronics Technology Co., Ltd. Manufacturing method for array substrate
CN110006334A (en) * 2019-04-26 2019-07-12 华东理工大学 A kind of flexible strain transducer and preparation method thereof based on laser direct-writing pomelo peel
CN113091970A (en) * 2021-04-07 2021-07-09 西京学院 Self-healing intelligent all-optical flexible diaphragm

Similar Documents

Publication Publication Date Title
CN107702829A (en) A kind of laser preparation method of copper-based flexible wearable formula pressure sensor
Xu et al. High‐resolution patterning of liquid metal on hydrogel for flexible, stretchable, and self‐healing electronics
CN111248888B (en) Elastomer film with surface multilevel microstructure, preparation method thereof and flexible pressure sensor containing elastomer film
JP2009095971A (en) Multifunctional microstructure and manufacture thereof
CN110118624A (en) A kind of pressure sensor and preparation method thereof
CN109265643A (en) A kind of sunlight selfreparing transparent flexible strain sensing composite material and preparation method and application
CN110108376B (en) Method for preparing patterned graphene temperature sensor by using laser
CN110251125A (en) A kind of flexible extensible nerve electrode and its preparation method and application
CN104105353A (en) Preparation method of high-accuracy ceramic printed circuit board
CN209841246U (en) Flexible sensor of multi-functional sensing
Chu et al. 3D printed smart silk wearable sensors
CN107850834A (en) Autoregistration metal pattern based on metal nanoparticle photon sintering
CN113776719A (en) Flexible multi-dimensional force sensor, preparation method and application thereof
Zhang et al. Nanoarchitectonics and Applications of Gallium‐Based Liquid Metal Micro‐and Nanoparticles
CN106399980B (en) A method of high bond strength silver electrode is prepared on flexible substrate using laser writing technology
CN109788656A (en) A kind of method and device thereof preparing 2.5D copper circuit on flexible parent metal
CN104914073A (en) Localized surface plasmon resonance gas-liquid sensor based on sub-wavelength hypostyle column array and preparation method of localized surface plasmon resonance gas-liquid sensor
CN116811256A (en) Coaxial probe preparation method and 3D printing equipment
CN106601368A (en) Method for preparing conducting film on substrate surface based on silver nanoparticle ink
CN113514996B (en) Electrochromic visual pressure sensor and construction method thereof
CN110146114A (en) A kind of flexible array microelectrode preparation method
JP4466109B2 (en) Micro-insulation-coated metal conductor, method for manufacturing micro-insulation-coated metal conductor, and cell electric signal detection device
CN107966586A (en) Gas flow transducer based on graphene oxide and preparation method and application
CN105651816A (en) Novel ammonia gas sensor and preparation method thereof
KR20220067506A (en) Method of Manufacturing Flexible Pressure Sensor Having Concentration Gradation Profile

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180216

WD01 Invention patent application deemed withdrawn after publication