CN107696665B - Control method and device for automatic lamination of PCB - Google Patents
Control method and device for automatic lamination of PCB Download PDFInfo
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- CN107696665B CN107696665B CN201710983894.4A CN201710983894A CN107696665B CN 107696665 B CN107696665 B CN 107696665B CN 201710983894 A CN201710983894 A CN 201710983894A CN 107696665 B CN107696665 B CN 107696665B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- Fluid Mechanics (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Abstract
The invention discloses a control method for automatic lamination of a PCB, which relates to the field of PCB manufacturing and comprises the following steps: inputting lamination curing parameters into a control system, wherein the lamination curing parameters comprise a heating rate, a pressure point temperature and a full pressure value; heating the material; collecting material temperature data; before the temperature of the material reaches the pressure point temperature, controlling the temperature rise of the material according to the temperature rise rate; when the temperature of the material reaches the temperature of the pressure conversion point, starting a pressure boosting program to pressurize to a full pressure value; and curing the material. The invention also discloses a device for automatically laminating the PCB, which comprises a control system, a laminating furnace, a heating table and a pressing mechanism, wherein the heating table is provided with a temperature sensor which is in signal connection with the control system. Inputting lamination curing parameters of the PCB material to be laminated into a control system, and monitoring and adjusting each step in the lamination curing process by a subsequent control system according to the lamination curing parameters to realize the automation of lamination curing.
Description
Technical Field
The invention relates to the field of PCB manufacturing, in particular to a control method and a device for PCB automatic lamination.
Background
In the PCB laminating process, the laminating procedure ensures that the actual material temperature curve meets the curing requirement of the material, wherein the key points comprise the temperature rise rate, the rotating pressure point, the full pressure, the curing temperature, the curing time and the like. At present, a method of setting a fixed program on a material is adopted for manufacturing, in order to ensure that the processing of all the materials meets the requirements, a laminating program with higher requirements is often adopted for manufacturing, and when a product with lower layers or requirements is manufactured, the curing time of the laminating program greatly exceeds the required time, so that the waste of efficiency and capacity is brought.
Disclosure of Invention
An object of the present invention is to provide a method for controlling automatic lamination of a PCB, which automatically controls a lamination curing process in a PCB production process according to lamination curing parameters.
Another object of the present invention is to provide an apparatus for automatically laminating PCBs, which can automatically perform lamination curing on the PCBs according to lamination curing parameters.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, a control method for automatic lamination of a PCB is provided, which includes the following steps:
inputting lamination curing parameters into a control system, wherein the lamination curing parameters comprise a heating rate, a pressure point temperature and a full pressure value;
heating the material;
collecting material temperature data;
before the temperature of the material reaches the pressure conversion point temperature, controlling the temperature rise of the material according to the temperature rise rate;
when the temperature of the material reaches the pressure conversion point temperature, starting a pressure boosting program, and boosting to the full pressure value;
and curing the material.
The control system is used for collecting and processing various signals and adjusting the temperature and the pressure according to the collected data. The control system may be comprised of a programmable controller such as a PLC and a control and execution unit of the laminating apparatus.
Preferably, the steps of: the heating of the material is specifically as follows:
the material is heated by heat transfer between the heating stage and the material.
Preferably, the lamination cure parameters further include a cure point temperature and a cure time, the steps of: the curing treatment of the material specifically comprises the following steps:
when the material temperature reaches the curing point temperature, reducing the temperature of the heating table to the curing point temperature;
and finishing the curing treatment when the time for which the material temperature reaches the curing point temperature is equal to the curing time.
Preferably, in the step: when the material temperature reaches the curing point temperature, before the temperature of the heating table is reduced to the curing point temperature, the method further comprises the following steps:
when the material temperature is 5-20 ℃ lower than the solidification point temperature, the temperature of the heating table is reduced to 5-10 ℃ higher than the solidification point temperature.
Preferably, the lamination cure parameters further include a cooling rate, at which: when the time for the material temperature to reach the curing point temperature is equal to the curing time, after the curing treatment is finished, the method further comprises the following steps:
and starting a cooling program, and controlling the cooling of the material according to the cooling rate.
Preferably, the lamination curing parameters further include a cooling end point temperature, at which: starting a cooling program, and after the material is controlled to be cooled according to the cooling rate, further comprising the following steps:
and when the temperature of the material reaches the temperature of the cooling end point, ending the cooling program.
Preferably, the lamination cure parameters further include vacuum.
On the other hand, the device for automatically laminating the PCB comprises a control system and a laminating furnace, wherein a heating table and a laminating mechanism are arranged in the laminating furnace, the heating table and the laminating mechanism are in signal connection with the control system, a temperature sensor is arranged on the heating table, and the temperature sensor is in signal connection with the control system.
Preferably, the temperature sensor is a thermocouple wire.
Preferably, the system further comprises a vacuum control device, and the vacuum control device is in signal connection with the control system.
The invention has the beneficial effects that: inputting lamination curing parameters of the PCB material to be laminated into a control system, and monitoring and adjusting each step in the lamination curing process by a subsequent control system according to the lamination curing parameters to realize the automation of lamination curing.
Drawings
Fig. 1 is a flow chart of a control method for PCB automatic lamination according to an embodiment of the present invention;
fig. 2 is a flow chart of a control method for PCB automatic lamination according to a second embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Example one
As shown in fig. 1, a control method for PCB automatic lamination includes the following steps:
s101, inputting laminating curing parameters in a control system, wherein the laminating curing parameters comprise a heating rate, a pressure point temperature and a full pressure value.
The control system is used for acquiring and processing various signals and adjusting the temperature and the pressure according to the acquired data. The control system includes a programmable controller such as a PLC and a control and execution unit of the laminating apparatus.
Specifically, laminating curing parameters of the PCB material to be laminated are input into the control system, and the subsequent control system monitors and adjusts each step in the laminating curing process according to the laminating curing parameters, so that the automation of laminating curing is realized.
And S102, heating the material.
The material is heated by a heating device, and meanwhile, a pressing mechanism in the laminating device applies pressure to the material.
Specifically, the materials are various raw materials required in the PCB laminating process, such as core boards and bonding sheets connecting adjacent core boards.
S103, collecting material temperature data.
The temperature of the material is monitored in real time using a temperature sensor, such as a thermocouple wire, and the temperature data is transmitted to a control system.
And S104, controlling the temperature rise of the material according to the temperature rise rate before the temperature of the material reaches the pressure conversion point temperature.
The control system compares the material temperature with the pressure point temperature in real time, controls the temperature rise of the material according to the preset temperature rise rate before the material temperature reaches the pressure point temperature, ensures that the temperature rise meets the preset temperature rise rate, and particularly controls the working state of the heating device so as to realize the control of the temperature rise of the material.
And S105, starting a boosting program when the temperature of the material reaches the pressure conversion point temperature, and pressurizing to the full pressure value.
And when the temperature of the material reaches the pressure point temperature, starting a pressurizing program, and lifting the pressure of the material by a pressing mechanism in the laminating device, wherein the duration of the pressurizing process is 1.5-3 min.
S106, curing the material.
Example two
As shown in fig. 2, a control method for PCB automatic lamination includes the following steps:
s201, inputting lamination curing parameters in a control system, wherein the lamination curing parameters comprise a heating rate, a pressure point temperature, a full pressure value, a curing point temperature, curing time, a cooling rate, a cooling ending point temperature and a vacuum degree.
The control system is used for collecting and processing various signals and adjusting the temperature and the pressure according to the collected data. The control system may be comprised of a programmable controller such as a PLC and a control and execution unit of the laminating apparatus.
Specifically, laminating curing parameters of the PCB material to be laminated are input into the control system, and the subsequent control system monitors and adjusts each step in the laminating curing process according to the laminating curing parameters, so that the automation of laminating curing is realized.
S202, heating the material through heat transfer between the heating table and the material.
The material is placed on a heating table and heat exchange takes place between the material and the heating table, and the temperature of the heating table is monitored by means of a temperature sensor, such as a thermocouple wire, and temperature data is transmitted to a control system.
Specifically, the materials are various raw materials required in the PCB laminating process, such as core boards and bonding sheets connecting adjacent core boards.
And S203, collecting material temperature data.
The temperature of the material is monitored in real time using a temperature sensor, such as a thermocouple wire, and the temperature data is transmitted to a control system.
And S204, controlling the temperature rise of the material according to the temperature rise rate before the temperature of the material reaches the pressure conversion point temperature.
The control system compares the material temperature with the pressure point temperature in real time, controls the temperature rise of the material according to the preset temperature rise rate before the material temperature reaches the pressure point temperature, ensures that the temperature rise meets the preset temperature rise rate, and particularly controls the working state of the heating device so as to realize the control of the temperature rise of the material.
And S205, starting a boosting program when the temperature of the material reaches the pressure conversion point temperature, and pressurizing to the full pressure value.
And when the temperature of the material reaches the pressure point temperature, starting a pressurizing program, and lifting the pressure of the material by a pressing mechanism in the laminating device, wherein the duration of the pressurizing process is 1.5-3 min.
And after the preset time is met under the full pressure condition, controlling the pressure in the pressure reduction process according to the conditions of actual material temperature, curing time and the like.
S206, when the temperature of the material is 5-20 ℃ lower than the curing point temperature, reducing the temperature of the heating table to 5-10 ℃ higher than the curing point temperature.
Specifically, the adaptive adjustment is carried out according to the heating rate, when the heating rate is 2 ℃/min, the temperature of the heating table is reduced when the material temperature is 5 ℃ lower than the temperature of the curing point, when the heating rate is 3 ℃/min, the temperature of the heating table is reduced when the material temperature is 10 ℃ lower than the temperature of the curing point, when the heating rate is 4 ℃/min, the temperature of the heating table is reduced when the material temperature is 15 ℃ lower than the temperature of the curing point, and when the heating rate is 5 ℃/min, the temperature of the heating table is reduced when the material temperature is 20 ℃ lower than the temperature of the curing point.
That is, the temperature of the heating table is reduced to the temperature close to the solidification point before the temperature of the material reaches the solidification point, so that the temperature difference between the heating table and the material is small when the temperature of the material reaches the solidification point, the temperature of the material cannot continuously rise to a large value, and the error is reduced.
And S207, when the temperature of the material reaches the curing point temperature, reducing the temperature of the heating table to the curing point temperature.
And when the temperature of the material reaches the curing point temperature, the temperature of the heating table is reduced to the curing point temperature, so that no temperature difference exists between the heating table and the material, and the temperature of the material is kept stable.
And S208, when the time lasting after the material temperature reaches the curing point temperature is equal to the curing time, finishing the curing treatment.
And finishing the curing treatment when the time for which the material temperature is kept at the curing point temperature meets the curing time.
And S209, starting a cooling program, and controlling the cooling of the material according to the cooling rate.
The control system detects the temperature of the material in the cooling program in real time and finely adjusts the temperature in real time to ensure that the material is cooled according to a preset cooling rate, and preferably, the material is cooled according to the preset cooling rate in the process of reducing the curing temperature to the temperature 20 ℃ lower than the curing temperature.
And S210, ending the cooling program when the temperature of the material reaches the temperature of the cooling ending point.
Further, when the actual material temperature reaches the tapping temperature, the procedure is ended.
Controlling the vacuum degree in each step to ensure that the vacuum degree meets the preset requirement in the manufacturing process; and collecting and analyzing the material temperature and the temperature of the heating table in real time.
EXAMPLE III
The embodiment provides an automatic PCB laminating device, which comprises a control system and a laminating furnace, wherein a heating table and a laminating mechanism are arranged in the laminating furnace, the heating table and the laminating mechanism are in signal connection with the control system, a temperature sensor is arranged on the heating table, and the temperature sensor is in signal connection with the control system.
Firstly, inputting a heating rate, a pressure point temperature, a full pressure value, a solidification point temperature, solidification time, a cooling rate and a cooling end point temperature into a control system.
Specifically, the material is placed on a heating table and pressed by a pressing mechanism, while a temperature sensor such as a thermocouple wire is also provided on the material for detecting the temperature of the material and transmitting the temperature of the material to a control system in real time.
The control system compares the material temperature with the pressure point temperature in real time, controls the temperature rise of the material according to a preset temperature rise rate before the material temperature reaches the pressure point temperature, ensures that the temperature rise accords with the preset temperature rise rate, and particularly controls the working state of the heating table so as to realize the temperature rise control of the material. And when the temperature of the material reaches the pressure point temperature, starting a pressurizing program, and increasing the pressure of the material by a pressing mechanism in the laminating furnace, wherein the duration of the pressurizing process is 1.5-3 min.
When the temperature of the material is 5-20 ℃ lower than the temperature of the curing point, the temperature of the heating table is reduced to 5-10 ℃ higher than the temperature of the curing point.
Specifically, the adaptive adjustment is carried out according to the heating rate, when the heating rate is 2 ℃/min, the temperature of the heating table is reduced when the material temperature is 5 ℃ lower than the temperature of the curing point, when the heating rate is 3 ℃/min, the temperature of the heating table is reduced when the material temperature is 10 ℃ lower than the temperature of the curing point, when the heating rate is 4 ℃/min, the temperature of the heating table is reduced when the material temperature is 15 ℃ lower than the temperature of the curing point, and when the heating rate is 5 ℃/min, the temperature of the heating table is reduced when the material temperature is 20 ℃ lower than the temperature of the curing point.
That is, the temperature of the heating table is reduced to the temperature close to the solidification point before the temperature of the material reaches the solidification point, so that the temperature difference between the heating table and the material is small when the temperature of the material reaches the solidification point, the temperature of the material cannot continuously rise to a large value, and the error is reduced.
When the temperature of the material reaches the temperature of the curing point, the temperature of the heating table is reduced to the temperature of the curing point, so that no temperature difference exists between the heating table and the material, and the temperature of the material is kept stable. And finishing the curing treatment when the time for which the material temperature is kept at the curing point temperature meets the curing time.
And then starting a cooling program of the material, and cooling according to a preset cooling rate. The control system detects the temperature of the material in the cooling program in real time and finely adjusts the temperature in real time to ensure that the cooling process conforms to the preset cooling rate, and preferably, the material is cooled according to the preset cooling rate in the process of reducing the curing temperature to the temperature 20 ℃ lower than the curing temperature. When the temperature reaches the temperature of the temperature reduction point, ending the temperature reduction program; and meanwhile, when the temperature of the material reaches the preset tapping temperature, the program is ended.
Specifically, the temperature sensor is a thermocouple wire. The thermocouple wires detect the temperature of the heating stage and the material in real time.
The laminating machine particularly comprises a vacuum control device which is in signal connection with the control system and is used for controlling the vacuum degree in the laminating process.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. A control method for PCB automatic lamination is characterized by comprising the following steps:
inputting lamination curing parameters into a control system, wherein the lamination curing parameters comprise a heating rate, a pressure point temperature and a full pressure value;
heating the material;
collecting material temperature data;
before the temperature of the material reaches the pressure conversion point temperature, controlling the temperature rise of the material according to the temperature rise rate;
when the temperature of the material reaches the pressure conversion point temperature, starting a pressure boosting program, and boosting to the full pressure value;
curing the material;
heating the material by heat transfer between the heating stage and the material;
the laminate curing parameters further include a cure point temperature and a cure time, the steps of: the curing treatment of the material specifically comprises the following steps:
when the material temperature reaches the curing point temperature, reducing the temperature of the heating table to the curing point temperature;
when the time for which the material temperature lasts after reaching the curing point temperature is equal to the curing time, finishing the curing treatment;
the control system compares the material temperature with the pressure point temperature in real time, controls the temperature rise of the material according to a preset temperature rise rate before the material temperature reaches the pressure point temperature, ensures that the temperature rise meets the preset temperature rise rate, and particularly controls the working state of the heating device so as to realize the control of the temperature rise of the material;
in the step: before the temperature of the heating table is reduced to the curing point temperature, the method further comprises the following steps:
when the material temperature is 5-20 ℃ lower than the solidification point temperature, the temperature of the heating table is reduced to 5-10 ℃ higher than the solidification point temperature.
2. The method for controlling automatic lamination of PCB according to claim 1, wherein said lamination curing parameters further includes a cooling rate, in said step: when the time for the material temperature to reach the curing point temperature is equal to the curing time, after the curing treatment is finished, the method further comprises the following steps:
and starting a cooling program, and controlling the cooling of the material according to the cooling rate.
3. The method of claim 2, wherein the lamination curing parameters further include a cooling end point temperature, and wherein in the step of: starting a cooling program, and after the material is controlled to be cooled according to the cooling rate, further comprising the following steps:
and when the temperature of the material reaches the temperature of the cooling end point, ending the cooling program.
4. A control method for automatic lamination of PCBs according to any one of claims 1-3, wherein the lamination curing parameters further include vacuum degree.
5. An apparatus for automatically laminating PCB, which is used for executing the control method of any one of claims 1-4, and comprises a control system and a laminating furnace, wherein a heating table and a laminating mechanism are arranged in the laminating furnace, the heating table and the laminating mechanism are both in signal connection with the control system, a temperature sensor is arranged on the heating table, and the temperature sensor is in signal connection with the control system.
6. The apparatus for PCB automated lamination as recited in claim 5, wherein the temperature sensor is a thermocouple wire.
7. An apparatus for automated PCB lamination according to claim 5, further comprising a vacuum control device in signal connection with the control system.
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| CN201710983894.4A CN107696665B (en) | 2017-10-20 | 2017-10-20 | Control method and device for automatic lamination of PCB |
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| CN201710983894.4A CN107696665B (en) | 2017-10-20 | 2017-10-20 | Control method and device for automatic lamination of PCB |
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| CN107696665B true CN107696665B (en) | 2020-06-26 |
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| JP3392066B2 (en) * | 1998-01-19 | 2003-03-31 | 三井金属鉱業株式会社 | Composite copper foil, method for producing the same, copper-clad laminate and printed wiring board using the composite copper foil |
| CN104827613B (en) * | 2015-05-13 | 2017-05-10 | 航天材料及工艺研究所 | Low-cost quick solidifying method for composite material |
| CN105346187A (en) * | 2015-11-16 | 2016-02-24 | 嘉兴市上村电子有限公司 | Copper-clad plate energy storage circulation hydraulic pressure forming device |
| CN106476405B (en) * | 2016-09-30 | 2019-04-16 | 生益电子股份有限公司 | The lamination sheeting process and PCB of PCB |
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