CN107696160A - For mould under the punching press of circuit board punching mechanism - Google Patents
For mould under the punching press of circuit board punching mechanism Download PDFInfo
- Publication number
- CN107696160A CN107696160A CN201710989307.2A CN201710989307A CN107696160A CN 107696160 A CN107696160 A CN 107696160A CN 201710989307 A CN201710989307 A CN 201710989307A CN 107696160 A CN107696160 A CN 107696160A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- punching press
- lifter plate
- punching
- mould under
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Press Drives And Press Lines (AREA)
Abstract
The present invention relates to mould under a kind of punching press for circuit board punching mechanism, belong to Stamping Die Technology field, including horizontally disposed lifter plate, array distribution has several raised on lifter plate, the elevating mechanism for lifter plate lifting is provided with below lifter plate, being horizontally disposed with directly over lifter plate has baffle plate, is offered on baffle plate for the raised through hole pass through up and down, it is cased with sliding up and down the block rubber of cooperation in each projection, block rubber is arranged in through hole.Pass through mould under the punching press of the present invention for circuit board punching mechanism, its is simple in construction, cleaning work after facilitating circuit board punching press while former design punching press effect is ensured, it is ensured that the good circuit board of punching press is disposably subjected to cleaning collection, convenient punching operation next time.
Description
Technical field
The present invention relates to mould under a kind of punching press for circuit board punching mechanism, belong to Stamping Die Technology field.
Background technology
With the progress of science and technology, various circuit boards are more and more, and many old circuit boards can not be again
Renovated, it is necessary to recycling be crushed, so as to which copper useful on circuit board be reclaimed.At present before shredding stage is carried out
It is directly to be cut off circuit board by cutting machine, then immediately proceeds to crush, this sample loading mode pulverizer working time compares
It is long, and the circuit board after crushing will be screened sometimes, and the circuit board of bulky grain is crushed again.Therefore applicant's design
Go out circuit kit plate punch press structure, including workbench, the parallel lead in left and right is vertically arranged with the table, in lead
Between installing plate is installed, the upper die and lower die that mutual punching press coordinates, lower mould installation are provided between installing plate and workbench
On the table, it is raised that several are provided with lower mould, respective protrusions are provided for raised embedded groove on upper mould,
Upper mould left and right ends are provided with guide pin bushing, and guide pin bushing is enclosed on lead and in cooperation is slided up and down, is provided with use on a mounting board
Material cleaning mechanism is provided with the left of the punching press actuating unit of mould in punching press, lower mould；The material cleaning mechanism includes push pedal,
Push pedal bottom is provided with several hairbrush, and propulsion power mechanism is provided with the left of push pedal, and propulsion power mechanism is arranged on work
On platform.
Above-mentioned technical proposal is mainly provided with a punching press workshop section between cutting machine and pulverizer, will can so cut
The circuit board having no progeny carries out punching press, and some copper wires will separate with circuit substrate appearance point, and pass through the circuit after punching press
After plate enters pulverizer, its crushing effect is very good, and grinding time is relative to shorten.But also there is weak point in application, it is as follows
The material cleaning mechanism that mould upper left side is set, when in use, because circuit board has simply carried out press work, the circuit after punching press
The meeting that plate has is connected together, and some can also be scattered, and in addition under several raised settings, the old circuit board after punching press sometimes can
Block between bumps, in cleaning, due under the obstruction of projection, in cleaning, sometimes can not disposably clean out, have
When need be repeated several times.
The content of the invention
Deficiency of the prior art, the technical problem to be solved in the present invention are more than：One kind is provided and is used for circuit board
Mould under the punching press of punching mechanism, its is simple in construction, after facilitating circuit board punching press while former design punching press effect is ensured
Cleaning work, it is ensured that the good circuit board of punching press is disposably subjected to cleaning collection, convenient punching operation next time.
Mould under punching press of the present invention for circuit board punching mechanism, including horizontally disposed lifter plate, are being lifted
Array distribution has several raised on plate, and the elevating mechanism for lifter plate lifting is provided with below lifter plate, and its feature exists
In：It is horizontally disposed directly over lifter plate to have baffle plate, offered on baffle plate for the raised through hole pass through up and down, each
It is cased with sliding up and down the block rubber of cooperation in projection, block rubber is arranged in through hole.
Further, preferably described convex top is spherical structure.
Further, preferably described elevating mechanism is hydraulic cylinder.
Further, the aperture lines of " ten " word intersection are offered on preferably described block rubber.
Compared with prior art, the invention has the advantages that：
By mould under the punching press of the present invention for circuit board punching mechanism, its is simple in construction, is ensuring former design
The cleaning work after circuit board punching press is facilitated while punching press effect, it is ensured that disposably carry out the good circuit board of punching press clear
Reason is collected, convenient punching operation next time.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is Fig. 1 overlooking the structure diagram；
Fig. 3 is the overlooking the structure diagram of baffle plate in Fig. 1；
In figure：1st, elevating mechanism 2, lifter plate 3, block rubber 4, baffle plate 5, projection 6, aperture lines.
Embodiment
The present invention is described further below in conjunction with the accompanying drawings：
Below by way of specific embodiment, the invention will be further described, but not to limit the present invention, it is all in the present invention
Within spirit and principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Embodiment
As shown in Figure 1 to Figure 3, mould under the punching press for circuit board punching mechanism, including horizontally disposed lifter plate
2, array distribution has several projections 5 on lifter plate 2, and the lift lifted for lifter plate 2 is provided with below lifter plate 2
Structure 1, the surface of lifter plate 2 is horizontally disposed baffle plate 4, and the through hole passed through up and down for the progress of projection 5 is offered on baffle plate 4,
It is cased with sliding up and down the block rubber 3 of cooperation on each raised 5, block rubber 3 is arranged in through hole.
In the present embodiment, raised 5 top is spherical structure；Improve the effect after punching press.
The elevating mechanism 1 is hydraulic cylinder；Its application is steady, service life length, and noise is low.
As shown in figure 3, offer the aperture lines 6 of " ten " word intersection on the block rubber 3, when in use, convenient projection 5 to
Passed during upper motion；During by projection 5 under baffle plate 4, under the elastic reaction of itself of block rubber 3, the upper surface of block rubber 3 will
A plane is reverted to, so that it is guaranteed that the upper surface of baffle plate 4 is a plane, has further facilitated former design material cleaning mechanism
Cleaning work, it is ensured that a property time is cleared up successfully.
It is during installation, the upper surface of baffle plate 4 is concordant with the upper surface of former design work platform, the cylinder body of hydraulic cylinder is arranged on work
On work, piston rod and the lifter plate 2 of its hydraulic cylinder are fixed, and during off working state, projection 5 is positioned at the lower section of baffle plate 4.Carrying out punching press
In use, starting hydraulic cylinder, lifter plate 2 is lifted, so as to drive the ejection of projection 5 projection 5, you can carried out according to original design
Press work, it is to be punched it is good after, then projection 5 resetted, you can carry out cleaning work.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The skill of the industry
For art personnel it should be appreciated that the present invention is not limited to the above embodiments, described in above-described embodiment and specification is explanation
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these
Changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and
Its equivalent thereof.
Claims (4)
1. mould under a kind of punching press for circuit board punching mechanism, including horizontally disposed lifter plate (2), on lifter plate (2)
Array distribution has several raised (5), and the elevating mechanism (1) for lifter plate (2) lifting is provided with below lifter plate (2),
It is characterized in that：It is horizontally disposed directly over lifter plate (2) to have baffle plate (4), offer on baffle plate (4) and carried out for raised (5)
The through hole passed through up and down, is cased with sliding up and down the block rubber (3) of cooperation on each raised (5), and block rubber (3) is arranged on through hole
It is interior.
2. mould under the punching press according to claim 1 for circuit board punching mechanism, it is characterised in that：The projection (5)
Top is spherical structure.
3. mould under the punching press according to claim 1 or 2 for circuit board punching mechanism, it is characterised in that：The lifting
Mechanism (1) is hydraulic cylinder.
4. mould under the punching press according to claim 3 for circuit board punching mechanism, it is characterised in that：The block rubber
(3) aperture lines (6) of " ten " word intersection are offered on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710989307.2A CN107696160A (en) | 2017-10-23 | 2017-10-23 | For mould under the punching press of circuit board punching mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710989307.2A CN107696160A (en) | 2017-10-23 | 2017-10-23 | For mould under the punching press of circuit board punching mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107696160A true CN107696160A (en) | 2018-02-16 |
Family
ID=61181432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710989307.2A Pending CN107696160A (en) | 2017-10-23 | 2017-10-23 | For mould under the punching press of circuit board punching mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107696160A (en) |
-
2017
- 2017-10-23 CN CN201710989307.2A patent/CN107696160A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180216 |
|
| WD01 | Invention patent application deemed withdrawn after publication |