CN107694867A - A kind of gluing process - Google Patents
A kind of gluing process Download PDFInfo
- Publication number
- CN107694867A CN107694867A CN201711138332.6A CN201711138332A CN107694867A CN 107694867 A CN107694867 A CN 107694867A CN 201711138332 A CN201711138332 A CN 201711138332A CN 107694867 A CN107694867 A CN 107694867A
- Authority
- CN
- China
- Prior art keywords
- conductive silver
- silver paste
- bobbin
- gluing process
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
Landscapes
- Die Bonding (AREA)
Abstract
The present invention, a kind of gluing process, gluing process during primarily directed to load, utilize constent temperature heater, heated at constant temperature control is carried out to the bobbin of conductive silver paste, it is ensured that the temperature of conductive silver paste is maintained at 33 DEG C 35 DEG C during use, near-final 35 DEG C of operating temperature, ensure that the viscosity of conductive silver paste in work is relatively uniform, the consistent of dispensing amount in dispensing operation process is ensured with this.Meanwhile by standard operation step and process conditions, ensure the stability of dispensing operation, finally ensure the stabilization of load quality, reliable, raising yield rate.
Description
Technical field
The present invention relates to chip package industry, and in particular to gluing process during load.
Background technology
With development in science and technology, electronic industry is advanced by leaps and bounds, and various integrated, control circuit demand sharp increases, chip is sealed
The demand of dress also increases rapidly.
Chip package refers to, the semiconductor integrated circuit chip of precision is installed on framework, then using lead by core
Piece is connected with frame pin, and finally semiconductor integrated circuit chip sealing is got up with epoxy resin, it is extraneous by pin with
Internal chip carries out signal transmission.Encapsulation mainly carries out sealing to the semiconductor integrated circuit chip of precision, makes semiconductor
IC chip is not influenceed while playing a role by ambient humidity, dust, while provides good resistance to mechanical vibration
Or surge protection, improve the applicability of semiconductor integrated circuit chip.It is encapsulated in simultaneously on metal framework, adds radiating surface
Product, improve the operational reliability of chip.
Load, as an important link in chip package, i.e., using binding agent by tiny semiconductor integrated circuit
Chip is tentatively fixed on framework load bearing seat, and support is provided for follow-up lead welding and sealing.
In traditional role, mainly use conductive silver paste Epoxy Adhesive Composition and chip is bonded at load bearing seat
On, because present chip the more does the more accurate, area more do it is smaller, tradition drop glue employed in technique, silver paste used with
The growth of time, viscosity change after into operating room, if drop glue operating type not with silver paste the time in operating room
Change and cause viscosity B coefficent to be adjusted, then start operation when dispensing amount and start operate the long period after dispensing amount meeting
It is obvious to produce difference, and then cause chip overflow gel quantity different, and chip area is minimum now, such glue amount difference is easy
Cause the unqualified of final load.Therefore it is badly in need of providing a kind of new gluing process to realize stable glue amount control, guarantee product
Uniformity for dispensing glue, improve yield rate.
The content of the invention
It is an object of the invention to provide a kind of gluing process, to make up above-mentioned deficiency.
In order to achieve the above object, the invention provides a kind of gluing process, step are as follows：
Step 1: estimating 1 order of classes or grades at school glue consumption of 8 hours according to scheduling of production, appropriate conductive silver is taken out from refrigerator in advance
Slurry, it is placed in operating room and carries out material of waking up, the material time of waking up need to be more than 1 hour；
Step 2: the conductive silver paste after expecting of waking up will be completed in step 1, load point gum machine；
Step 3: setting heater outside the conductive silver paste bobbin for loading onto point gum machine, and temperature is set as 33 DEG C -35
℃；
Step 4: it is 35 DEG C by the dispensing mouth temperature setting of the point gum machine；
Step 5: start dispensing operation.
Preferably, the conductive silver paste in above-mentioned steps one wake up material when, conductive silver paste bobbin is disposed vertically, and gum outlet to
On.
Preferably, when the awake material of the conductive silver paste in above-mentioned steps one proceeds to 30 minutes, in conductive silver paste bobbin outer sheath
If the heater, and by temperature setting at 35 DEG C -40 DEG C.
Preferably, the heater is woven into fabric by heating wire and is formed bag-shaped, is set on the outside of conductive silver paste bobbin.
Preferably, temperature sensor is additionally provided with the heater, and is externally provided with radiator valve.
Preferably, above-mentioned steps five, the remaining conductive silver paste after operation is closed together with the progress of its bobbin, reapposes
Refrigerator is returned, and records the time.
Preferably, the conductive silver paste time allowable for leaving refrigerator environment is total 48 hours；The above-mentioned awake material time is also
It need to be included in the time allowable for leaving refrigerator environment.
A kind of gluing process of the present invention, for for the load process in chip package.The beneficial effects of the invention are as follows：
33 DEG C -35 DEG C are maintained at using the temperature of conductive silver paste during thermostatic control use, near-final operating temperature, ensures work
The viscosity of conductive silver paste is relatively uniform in work, ensures the consistent of dispensing amount in dispensing operation process with this.
Brief description of the drawings
Fig. 1 is the heater schematic diagram of invention.
Embodiment
Present invention is generally directed to the load process during chip package, there is provided a kind of gluing process, realize that the time is controlled
During dispensing processed, gel quantity is consistent；Mainly by controlling the operating temperature of conductive silver paste, conductive silver paste viscosity is ensured with this, realized
Gel quantity is controllable, comprises the following steps that：
Step 1: estimating 1 order of classes or grades at school glue consumption of 8 hours according to scheduling of production, appropriate conductive silver is taken out from refrigerator in advance
Slurry, it is placed in operating room and carries out material of waking up.
In order to ensure the quality of conductive silver paste, refrigerated storage temperature needs to control at -40 DEG C.As every order of classes or grades at school glue consumption is larger
When, can be according to reality glue situation, 1-2 hours gradually taking-up from refrigerator in advance, it is not necessary to disposably by use on duty
Amount all takes out material of waking up.The purpose expected of waking up is that the temperature of conductive silver paste is progressivelyed reach into operating temperature, when the temperature of conductive silver paste
During less than 30 DEG C, viscosity is relatively low, causes mobility very poor, is not easy to extrude.
After conductive silver paste is taken out together with bobbin from refrigerator, when carrying out awake material, conductive silver paste bobbin is disposed vertically, and is gone out
Jiao Kou is upward, and so as the rising of conductive silver paste temperature, viscosity gradually increase, the bubble in conductive silver paste can be gradually increasing,
To exit.
Preferably, when conductive silver paste wake up material proceed to 30 minutes when, the temperature of conductive silver paste gradually heats up；In order to enter one
Step accelerates material of waking up, and the heater can be arranged on the outside of conductive silver paste bobbin, and by temperature setting at 35 DEG C -40 DEG C.The temperature
The slightly above operating temperature of conductive silver paste, material of waking up can be accelerated.
Step 2: the conductive silver paste after expecting of waking up will be completed in step 1, load point gum machine.
Step 3: set heater outside the conductive silver paste bobbin for loading onto point gum machine, and by temperature be set as 33 DEG C-
35℃。
Preferably, the heater is woven into fabric by heating wire and is formed bag-shaped, is set on the outside of conductive silver paste bobbin.Institute
State and temperature sensor is additionally provided with heater, and be externally provided with radiator valve.Pass through voltage of the controlled loading at heating wire both ends
Just, the size of control caloric value is realized；Temperature sensor is arranged on heater and is close to conductive silver paste bobbin side, by real-time
The wall surface temperature of conductive silver paste bobbin is measured, in this, as the temperature of inner conductive silver paste, is used as control heater caloric value
Control foundation.
Heater size dimension of conductive silver paste bobbin used in is configured, and need to fully wrap up bobbin, is realized more
Good heating.
As shown in figure 1, the schematic diagram of as described heater, including fabric is woven into by heating wire and forms bag-shaped calandria
2, it is configured according to the size of conductive silver paste bobbin 1, it is ensured that can fully wrap bobbin 1；Calandria 2 is provided with
Current collecting equipment 3, and be connected in outer controller 4；Calandria 2 is provided with temperature sensor 5, the temperature with the phase-contact surface of bobbin 1
The induction zone of degree sensor 5 is close to bobbin 1, and the back side is provided with heat-barrier material, prevents temperature caused by heating wire work from being passed to temperature
Sensor 5 impacts.Temperature sensor 5 collects the surface temperature of bobbin 1, and outer controller 4 is transferred to by current collecting equipment 3,
After outer controller 4 is handled measurement data, 33 DEG C -35 DEG C of the temperature value with setting, or 35 DEG C -40 DEG C be compared, and
Adjustment is applied to the magnitude of voltage at heating wire both ends accordingly, so as to realize thermostatic control.
It can be same set of heater for using heater in above-mentioned steps one, step 3, move and be attached to together with heater
On point gum machine；It can also be 2 sets of different heaters, be separately mounted on different stations.
Step 4: it is 35 DEG C by the dispensing mouth temperature setting of the point gum machine；
Step 5: start dispensing operation.
Above-mentioned steps five, the remaining conductive silver paste after operation is closed together with the progress of its bobbin, relays and puts back into refrigerator,
And record the time.
The conductive silver paste time allowable for leaving refrigerator environment is total 48 hours；The above-mentioned awake material time also needs to be included in perhaps
With leaving in the time of refrigerator environment.
General principle, the main features and advantages of the present invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, the original for simply illustrating the present invention described in above-described embodiment and specification
Reason, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (7)
1. a kind of gluing process, it is characterised in that comprise the following steps：
Step 1: estimating 1 order of classes or grades at school glue consumption of 8 hours according to scheduling of production, appropriate conductive silver is taken out from refrigerator in advance
Slurry, it is placed in operating room and carries out material of waking up, the material time of waking up need to be more than 1 hour；
Step 2: the conductive silver paste after expecting of waking up will be completed in step 1, load point gum machine；
Step 3: setting heater outside the conductive silver paste bobbin for loading onto point gum machine, and temperature is set as 33 DEG C -35
℃；
Step 4: it is 35 DEG C by the dispensing mouth temperature setting of the point gum machine；
Step 5: start dispensing operation.
2. a kind of gluing process according to claim 1, it is characterised in that the conductive silver paste in above-mentioned steps one, which is waken up, expects
When, conductive silver paste bobbin is disposed vertically, and gum outlet is upward.
A kind of 3. gluing process according to claim 1, it is characterised in that conductive silver paste in above-mentioned steps one wake up expect into
When row was by 30 minutes, the heater is arranged on the outside of conductive silver paste bobbin, and by temperature setting at 35 DEG C -40 DEG C.
4. a kind of gluing process according to claim 1 or 3, it is characterised in that the heater is knitted by heating wire
Thing simultaneously forms bag-shaped, is set on the outside of conductive silver paste bobbin.
5. a kind of gluing process according to claim 4, it is characterised in that be additionally provided with TEMP in the heater
Device, and it is externally provided with radiator valve.
6. a kind of gluing process according to claim 1, it is characterised in that above-mentioned steps five, the residue after operation
Conductive silver paste is closed together with the progress of its bobbin, relays and puts back into refrigerator, and records the time.
7. a kind of gluing process according to claim 1, it is characterised in that the conductive silver paste is allowable to leave refrigerator environment
Time be total 48 hours；The above-mentioned awake material time also needs to be included in the time allowable for leaving refrigerator environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711138332.6A CN107694867A (en) | 2017-11-16 | 2017-11-16 | A kind of gluing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711138332.6A CN107694867A (en) | 2017-11-16 | 2017-11-16 | A kind of gluing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107694867A true CN107694867A (en) | 2018-02-16 |
Family
ID=61179783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711138332.6A Pending CN107694867A (en) | 2017-11-16 | 2017-11-16 | A kind of gluing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107694867A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111804530A (en) * | 2020-06-10 | 2020-10-23 | 浙江锋锂新能源科技有限公司 | Micro-concave coating weight control method, storage medium and device for lithium battery production |
-
2017
- 2017-11-16 CN CN201711138332.6A patent/CN107694867A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111804530A (en) * | 2020-06-10 | 2020-10-23 | 浙江锋锂新能源科技有限公司 | Micro-concave coating weight control method, storage medium and device for lithium battery production |
| CN111804530B (en) * | 2020-06-10 | 2022-05-17 | 浙江锋锂新能源科技有限公司 | Micro-concave coating weight control method, storage medium and device for lithium battery production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180216 |
|
| WD01 | Invention patent application deemed withdrawn after publication |