CN107665870A - A kind of copper palladium-silver bonding line - Google Patents
A kind of copper palladium-silver bonding line Download PDFInfo
- Publication number
- CN107665870A CN107665870A CN201711128391.5A CN201711128391A CN107665870A CN 107665870 A CN107665870 A CN 107665870A CN 201711128391 A CN201711128391 A CN 201711128391A CN 107665870 A CN107665870 A CN 107665870A
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- Prior art keywords
- plating
- fixedly connected
- bonding line
- palladium
- copper
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 48
- 238000007747 plating Methods 0.000 claims abstract description 34
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 21
- 230000004888 barrier function Effects 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 229910052709 silver Inorganic materials 0.000 claims abstract description 21
- 239000004332 silver Substances 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 235000019270 ammonium chloride Nutrition 0.000 claims description 4
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 4
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 4
- 125000003963 dichloro group Chemical group Cl* 0.000 claims description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 10
- 238000005260 corrosion Methods 0.000 abstract description 10
- 238000005452 bending Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000003507 refrigerant Substances 0.000 abstract description 6
- 238000005987 sulfurization reaction Methods 0.000 abstract description 6
- 239000002966 varnish Substances 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- -1 amide imide Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000009938 salting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a kind of copper palladium-silver bonding line, its structure includes spiral roller, the both sides up and down of the spiral roller are fixedly connected with baffle plate, the middle of the baffle plate is fixedly connected with bearing, the spiral roller is provided with bonding line, the mode of the outside plating of the bonding line is fixedly connected with copper plate, the outside of the copper plate is fixedly connected with silver coating by way of chemical plating, the outside of the silver coating is fixedly connected with plating palladium layers by way of plating, and the outside of the plating palladium layers is fixedly connected with insulating barrier by way of chimeric.With good electric conductivity and become clear and the surface of gloss, and there is very high corrosion resistance and fabulous dispersibility, in the process energy sulfuration resistant used, creep resistant is corroded and bending extension, it is used as the material of insulating barrier by polyamidoimide, mechanical strength, freon-resistant refrigerant can be effectively raised, there is good compatibility with impregnating varnish, the features such as heat resistance, impact resistance, oil resistivity can be met.
Description
Technical field
The present invention relates to a kind of technical field of metal material, specially a kind of copper palladium-silver bonding line.
Background technology
At present, existing bonding line is also there is the place of some shortcomings, such as；Existing bonding line electric conductivity compares
Difference, and corrosion resistance is low and dispersibility is weaker, is unable to sulfuration resistant in the process used, creep resistant corrosion and bending are prolonged
Stretch, and the insulating barrier mechanical strength of existing bonding line is low, it is impossible to freon-resistant refrigerant, have with impregnating varnish poor compatible
Property, it is impossible to the shortcomings of meeting heat resistance, impact resistance, oil resistivity.
The content of the invention
The technical problem to be solved in the present invention is the defects of overcoming prior art, there is provided a kind of copper palladium-silver bonding line, is had
Good electric conductivity and the bright and surface of gloss, and there is very high corrosion resistance and fabulous dispersibility,
The process energy sulfuration resistant used, creep resistant corrosion and bending extension, the material of insulating barrier is used as by polyamidoimide, can be had
Effect improves mechanical strength, freon-resistant refrigerant, has good compatibility with impregnating varnish, can meet heat resistance, impact resistance
The features such as property, oil resistivity.
To solve the above problems, the present invention provides following technical scheme：A kind of copper palladium-silver bonding line, including spiral roller, institute
The both sides up and down for stating spiral roller are fixedly connected with baffle plate, and the middle of the baffle plate is fixedly connected with bearing, and the spiral roller is provided with
Bonding line, the mode of the outside plating of the bonding line are fixedly connected with copper plate, and the outside of the copper plate passes through chemical plating
Mode is fixedly connected with silver coating, and the outside of the silver coating is fixedly connected with plating palladium layers by way of plating, the plating palladium layers
Outside is fixedly connected with insulating barrier by way of chimeric.
As the present invention a kind of preferred embodiment, the baffle plate is rounded, and by way of welding with it is described
Spiral roller is connected, and the bearing is connected by way of chimeric with the baffle plate, and is communicated with the spiral roller.
As a kind of preferred embodiment of the present invention, the electrolyte of the copper plate is cyanide, the copper plate
Thickness is 20gm~25gm, and the silver coating chemical liquids are silver potassium cyanide solution, and the silver coating needs to be placed in chromate
Carry out plating posttreatment.
As the present invention a kind of preferred embodiment, it is described plating palladium layers electroplate liquid mainly have dichloro diamino palladium 10~
40g/L, ammonium chloride 10g/L and ammonium sulfate 25g/L, solution ph 8.5~9, the thickness of the plating palladium layers is 2~5 μm.
As a kind of preferred embodiment of the present invention, the insulating barrier is connected by way of brushing with the plating palladium layers
Connect, the insulating barrier is made using the material of polyamidoimide, and the heat resisting temperature of the insulating barrier is between 160-180 DEG C.
Compared with prior art, beneficial effects of the present invention are as follows：
A kind of copper palladium-silver bonding line of the present invention, there is good electric conductivity and become clear and the surface of gloss, and with very
High corrosion resistance and fabulous dispersibility, in the process energy sulfuration resistant used, creep resistant corrosion and bending extension, by poly-
Material of the amide imide as insulating barrier, mechanical strength can be effectively raised, freon-resistant refrigerant, is had with impregnating varnish good
Good compatibility, the features such as heat resistance, impact resistance, oil resistivity can be met.
Brief description of the drawings
Fig. 1 is a kind of sectional view of copper palladium-silver bonding line of the present invention；
Fig. 2 is the structural representation of spiral roller of the present invention.
In figure：Spiral roller 1, baffle plate 2, bearing 3, bonding line 4, copper plate 5, silver coating 6, plate palladium layers 7, insulating barrier 8.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes.
Fig. 1-2 is referred to, the present invention provides a kind of technical scheme：A kind of copper palladium-silver bonding line, including spiral roller 1, it is described
The both sides up and down of spiral roller 1 are fixedly connected with baffle plate 2, and the middle of the baffle plate 2 is fixedly connected with bearing 3, set on the spiral roller 1
There is bonding line 4, the mode of the outside plating of the bonding line 4 is fixedly connected with copper plate 5, the passing through of outside of the copper plate 5
The mode for learning plating is fixedly connected with silver coating 6, and the outside of the silver coating 6 is fixedly connected with plating palladium layers 7 by way of plating, described
The outside for plating palladium layers 7 is fixedly connected with insulating barrier 8 by way of chimeric.
The baffle plate 2 is rounded, and is connected by way of welding with the spiral roller 1, and the bearing 3 is by embedding
The mode of conjunction is connected with the baffle plate 2, and is communicated with the spiral roller 1, and its role is to can effectively raise bonding
Convenience when line uses.
The electrolyte of the copper plate 5 is cyanide, and the thickness of the copper plate 5 is 20gm~25gm, has peracid low
Copper feature, there are fabulous dispersibility and covering power, property that the layers of copper after plating is glossy, the chemical liquids of silver coating 6 are cyaniding
Silver-colored potassium solution, the silver coating 6, which needs to be placed on, carries out plating posttreatment in chromate, its role is to good electric conductivity
Can, and become clear and the surface of gloss, and silver layer has very high corrosion resistance.
The electroplate liquid of the plating palladium layers 7 mainly has dichloro diamino 10~40g/L of palladium, ammonium chloride 10g/L and ammonium sulfate 25g/
L, solution ph 8.5~9, the thickness of the plating palladium layers 7 is 2~5 μm, and its role is to the effective sulfuration resistant of energy, creep resistant are rotten
The advantages that erosion and bending extend, and hardness is strong.
The insulating barrier 8 is connected by way of brushing with the plating palladium layers 7, and the insulating barrier 8 uses polyamide acyl
The material of imines makes, and for the heat resisting temperature of the insulating barrier 8 between 160-180 DEG C, its role is to have higher machinery strong
Degree, freon-resistant refrigerant, has good compatibility with impregnating varnish, the features such as meeting heat resistance, impact resistance, oil resistivity.
Bonding line 4 is put into the solution of electro-coppering first and carries out copper electroplating layer, will then cover the key of copper plate 5 again
Zygonema 4 is put into the chemical liquids containing silver the formation for carrying out silver coating 6, and chromic acid is put it into again after the formation of silver coating 6
Plating posttreatment is carried out in salting liquid, the bonding line 4 for covering copper plate 5 and silver coating 6 is then put into dichloro diamino palladium 10 again
~40g/L, ammonium chloride 10g/L and ammonium sulfate 25g/L, solution ph 8.5~9 carry out the plating of Metal Palladium, finally bonding line 4 again
Outer layer coat polyamidoimide material making insulating barrier 8.
The spiral roller 1 of the present invention, baffle plate 2, bearing 3, bonding line 4, copper plate 5, silver coating 6, plate palladium layers 7, insulating barrier 8 etc.
The part that part is universal standard part or those skilled in the art know, its structure and principle all can lead to for this technology personnel
Cross technical manual to learn or by normal experiment method know, there is good electric conductivity and become clear and the surface of gloss,
And there is very high corrosion resistance and fabulous dispersibility, and in the process energy sulfuration resistant used, creep resistant corrosion and bending
Extension, the material of insulating barrier 8 is used as by polyamidoimide, can effectively raise mechanical strength, freon-resistant refrigerant,
There is good compatibility with impregnating varnish, the features such as heat resistance, impact resistance, oil resistivity can be met.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above, for this area skill
For art personnel, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and without departing substantially from the present invention spirit or
In the case of essential characteristic, the present invention can be realized in other specific forms.Which point therefore, no matter from the point of view of, all should incite somebody to action
Embodiment regards exemplary as, and be it is nonrestrictive, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that all changes fallen in the implication and scope of the equivalency of claim are included in the present invention
It is interior.Any reference in claim should not be considered as to the involved claim of limitation.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, although with reference to foregoing reality
Apply example the present invention is described in detail, for those skilled in the art, it still can be to foregoing each implementation
Technical scheme described in example is modified, or carries out equivalent substitution to which part technical characteristic.All essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (5)
1. a kind of copper palladium-silver bonding line, including spiral roller（1）, it is characterised in that：The spiral roller（1）Both sides up and down fix connect
Connect baffle plate（2）, the baffle plate（2）Middle be fixedly connected with bearing（3）, the spiral roller（1）It is provided with bonding line（4）, institute
State bonding line（4）Outside plating mode be fixedly connected with copper plate（5）, the copper plate（5）Outside pass through chemical plating
Mode is fixedly connected with silver coating（6）, the silver coating（6）Outside plating palladium layers are fixedly connected with by way of plating（7）, it is described
Plate palladium layers（7）Outside be fixedly connected with insulating barrier by way of chimeric（8）.
A kind of 2. copper palladium-silver bonding line according to claim 1, it is characterised in that：The baffle plate（2）It is rounded, and lead to
Cross the mode of welding and the spiral roller（1）It is connected, the bearing（3）By way of chimeric with the baffle plate（2）It is connected
Connect, and with the spiral roller（1）Communicate.
A kind of 3. copper palladium-silver bonding line according to claim 1, it is characterised in that：The copper plate（5）Electrolyte be
Cyanide, the copper plate（5）Thickness be 20gm~25gm, the silver coating（6）Chemical liquids are silver potassium cyanide solution, described
Silver coating（6）Need to be placed on and plating posttreatment is carried out in chromate.
A kind of 4. copper palladium-silver bonding line according to claim 1, it is characterised in that：The plating palladium layers（7）Electroplate liquid master
There are dichloro diamino 10~40g/L of palladium, ammonium chloride 10g/L and ammonium sulfate 25g/L, solution ph 8.5~9, the plating palladium layers 7
（7）Thickness be 2~5 μm.
A kind of 5. copper palladium-silver bonding line according to claim 1, it is characterised in that：The insulating barrier（8）Pass through brushing
Mode and the plating palladium layers（7）It is connected, the insulating barrier（8）Made using the material of polyamidoimide, the insulating barrier
（8）Heat resisting temperature between 160-180 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711128391.5A CN107665870A (en) | 2017-11-15 | 2017-11-15 | A kind of copper palladium-silver bonding line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711128391.5A CN107665870A (en) | 2017-11-15 | 2017-11-15 | A kind of copper palladium-silver bonding line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107665870A true CN107665870A (en) | 2018-02-06 |
Family
ID=61143789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711128391.5A Pending CN107665870A (en) | 2017-11-15 | 2017-11-15 | A kind of copper palladium-silver bonding line |
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-
2017
- 2017-11-15 CN CN201711128391.5A patent/CN107665870A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1559355A (en) * | 1976-11-05 | 1980-01-16 | Empire Plating Co | Coating of metal articles |
| JPH10233121A (en) * | 1997-02-18 | 1998-09-02 | Hitachi Cable Ltd | Lead wire |
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| CN103219246A (en) * | 2013-03-01 | 2013-07-24 | 溧阳市虹翔机械制造有限公司 | Manufacturing method of palladium-plated silver-plated double-plating bonding copper wire |
| WO2017155469A1 (en) * | 2016-03-10 | 2017-09-14 | Rokko Leadframes Pte Ltd | Semiconductor device and method of manufacture |
| CN106757281A (en) * | 2016-12-29 | 2017-05-31 | 广东工业大学 | A kind of protective agent composition and anticorrosive bonding wire and preparation method thereof |
| CN207441693U (en) * | 2017-11-15 | 2018-06-01 | 贵溪博远金属有限公司 | A kind of copper palladium-silver bonding line |
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Application publication date: 20180206 |