CN107661741A - It is a kind of to prepare Hole selective absorbent to handle the method for HMDS - Google Patents
It is a kind of to prepare Hole selective absorbent to handle the method for HMDS Download PDFInfo
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- CN107661741A CN107661741A CN201710932278.6A CN201710932278A CN107661741A CN 107661741 A CN107661741 A CN 107661741A CN 201710932278 A CN201710932278 A CN 201710932278A CN 107661741 A CN107661741 A CN 107661741A
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- hmds
- selective absorbent
- hole selective
- adsorption
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
- B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
- B01D53/0407—Constructional details of adsorbing systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/30—Processes for preparing, regenerating, or reactivating
- B01J20/305—Addition of material, later completely removed, e.g. as result of heat treatment, leaching or washing, e.g. for forming pores
- B01J20/3057—Use of a templating or imprinting material ; filling pores of a substrate or matrix followed by the removal of the substrate or matrix
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/55—Compounds of silicon, phosphorus, germanium or arsenic
- B01D2257/556—Organic compounds
Abstract
Hole selective absorbent is prepared to handle the method for HMDS, including step the invention discloses a kind of：S1, Hole selective absorbent preparation；S2, Hole selective absorbent is placed in adsorptive reactor；S3, the waste gas containing HMDS is delivered in adsorptive reactor and adsorbs removing HMDS；Adsorptive reactor is made up of housing, multiple columns, multiple adsorption plates and temperature control equipment；Filling Hole selective absorbent inside adsorption plate, upper and lower surface set equally distributed stomata；Enclosure interior sets multiple columns, and adsorption plate is fixed between adjacent upright posts, and all adsorption plates are mutually spliced to form the overall adsorption wall of a zigzag or comb teeth-shaped with column.The present invention removes the HMDS in waste gas using the sorbing material with selective absorption and the absorption of corresponding adsorptive reactor, simplifies waste gas subsequent treatment process, energy consumption and financial cost substantially reduce.
Description
Technical field
The present invention relates to it is a kind of prepare Hole selective absorbent be used for adsorb removing waste gas in the hexamethyl that contains
The method of disilazane, belongs to technical field of waste gas treatment.
Background technology
Double (trimethyl silicon substrate) amine (also known as HMDS, or HMDS), molecular formula [(CH3)3Si]2NH.The material
It is the derivative that two hydrogen atoms are substituted by trimethyl silicon substrate in ammonia.HMDS is a kind of colourless liquid, Ye Shiyi
Kind is widely used in organic synthesis and organometallic chemistry reaction reagent and main component.In photoetching technique, hexamethyl
Disilazane is often used as increasing the tackifier of photoresist surface-clinging ability.HMDS is used in heating in gaseous state
Best effect can be obtained on the substrate crossed.In electron microscope, HMDS can be used as in Sample Preparation Procedure
Critical point drying drier.In GLC is cracked, HMDS can be added in analyte in cracking,
To produce silanization analysis product, and with the detecting of polar functional group reinforcement compound.
HMDS belongs to VOC (Volatile Organic Compounds, VOCs) one of which,
VOCs refers to (20 DEG C, 760mmHg) in normal conditions that its vapour pressure is more than more than 0.1mmHg organic compound.HMDS master
To derive from the field such as photoelectric material and component manufacturing industry, semiconductor industry.Processing HMDS method has condensation method, heat to incinerate at present
Method, catalyst incinerate method, plasma-based destroys method and absorption method.Wherein, condensation method treatment effeciency is limited.Catalyst incinerates method and heat is incinerated
Method destroys VOCs due to needing higher temperature, so needing substantial amounts of fuel, and can produce particle issues and cause to increase
The expense of after-treatment.Plasma-based, which destroys method, can disturb board, and maintenance cost is high, and power supply unit manufacturing expense is expensive, manufacture
Technology still has bottleneck.And absorption method treatment effeciency is high, the time is short, not high to temperature requirement, with regard to that can carry out under low temperature environment, and
Occupation area of equipment is small, fuel consumption is few, treating capacity is big, the puzzlement of secondary pollution will not be also produced because of high temperature, therefore adsorb
Method is most potential in current processing HMDS technologies.
The content of the invention
It is an object of the invention to solve at least the above and/or defect, and provide at least will be described later it is excellent
Point.
A further object of the invention is to organically combine absorption method and burning method to use, to solve to burn in the prior art
Incineration temperature existing for the waste gas of the siliceous alkanes of method processing is high, and energy consumption is big, it is necessary to substantial amounts of fuel, and can produce particulate and cause
Incinerating container is blocked, increases the technical problems such as the expense of after-treatment.
In order to realize these purposes and further advantage of the invention, the invention provides one kind to prepare Hole selective absorption
To handle the method for HMDS, it comprises the following steps material：
S1, Hole selective absorbent preparation；
S2, the Hole selective absorbent of preparation is placed in adsorptive reactor；
S3, by the temperature control in adsorptive reactor at 25~70 DEG C, pending is then contained into HMDS
Waste gas be delivered in adsorptive reactor and carry out selective absorption and remove HMDS；
Wherein, the adsorptive reactor is by box housing, multiple columns, multiple square adsorption plates and temperature control equipment group
Into；The Hole selective absorbent that inside the adsorption plate prepared by filling, adsorption plate upper and lower surface set uniform
The stomata of distribution；
The relative two sides of the housing set air inlet and gas outlet respectively, and the top surface of housing is Demountable；
Enclosure interior uprightly sets equally distributed multiple columns from housing top surface to bottom surface, and leg surface sets two in the axial direction
For installing the bar limit slot of adsorption plate, stopper slot plug-in mounting of the adsorption plate along column is between adjacent upright posts, institute
There is adsorption plate to be mutually spliced to form the overall adsorption wall of a zigzag or comb teeth-shaped with column；The adsorption wall splits housing
For two parts, a part, which includes air inlet and the untreated exhaust gas free air space connected with air inlet, another part, includes outlet
Exhaust gas flow space after mouth and processing；The junction of adjacent adsorbent plate, and the junction in adsorption plate and inner walls face is with gas
The intransitable mode of body is completely closed；
The temperature control equipment includes heating element heater and temperature inductor in the housing, positioned at hull outside with
The controller that heating element heater connects with temperature inductor.
Preferably, the step S1 is specifically included：
S11, cetyl trimethylammonium bromide is dissolved in deionized water, and adds the hydroxide that mass concentration is 28%
Ammonium salt solution, obtain organic solution；
S12, silicon source solution is added dropwise in organic solution, and with sulfuric acid regulation solution pH value to 4, at room temperature, stirred
Mix reaction 8h；
S13, the mixed solution obtained by step S12 filtered, washed and dried, obtain just finished product；
S14, first finished product is carried out to high-temperature calcination, removing organic formwork, granular Hole selective absorption material is made
Material.
It may further be preferable that in the step S1 each raw material components mol ratio：Cetyl trimethylammonium bromide：
NH4OH：Si=145：3.5：1.5.
Preferably, in step S13, filter cake deionized water and ethanol wash after filtering, baking oven is subsequently placed in 100
± 5 DEG C of temperature dries 4~8h.
Preferably, in the step S14, for first finished product under the conditions of 550 DEG C of temperature, granular mesopore is made in calcination 6h
Hole selective absorbent.
Preferably, in the waste gas containing HMDS the concentration of HMDS for 500~
2000ppm。
Preferably, the flow velocity that the pending waste gas enters adsorptive reactor is 100~800mL/min, and waste gas is being inhaled
Residence time in reaction enclosure device is 0.4~2.4 second.
Preferably, the heating element heater is arranged in housing is arranged on close to air inlet position, the temperature inductor
In the untreated exhaust gas free air space connected in housing with air inlet.
Preferably, it is respectively arranged with barometer in two partitioning portions of the housing.
Preferably, the upper and lower surface of the adsorption plate sets metal net layer, and the edge of adsorption plate uses elongated metal
Piece seals the edge wrap of upper and lower metal net layer, the space filling Hole selective absorbent between two metal net layers
Particle, the particle diameter of sorbing material are more than the aperture of wire netting, and the lateral edge contacted on adsorption plate with column is provided with protuberance,
Protuberance is fixedly connected with stopper slot in the stopper slot of the protuberance insertion column and by screw.
Compared with prior art, the present invention is advantageous in that：
One, the Hole selective absorbent prepared have the property of silanes (HMDS) in selective absorption waste gas
Can, even across long-time operation use, the absorption property of sorbing material is still fine, continuous adsorption operations using 140min it
Efficiency of post treatment still can reach more than 99%, not yet reach penetration, can still maintain good adsorption effect.
Secondly, waste gas by adsorption treatment remove wherein HMDS, subsequent treatment process step is simplified, after effectively reducing
Continuous processing cost, for example, follow-up burning disposal temperature substantially reduces, pollutant is incinerated point in waste gas at a lower temperature
Solution, fuel consumption is reduced, and particles holography incinerating container will not be produced, no after-treatment expense.
Thirdly, using homemade graininess Hole selective absorbent, its preparation method is simple, by granular absorption material
Material is pre-machined to be assembled in specific adsorptive reactor again as absorption Slab element, adsorption plate, and novel adsorption reactor is made,
It is good for waste gas of the processing containing HDMS, adsorption reaction mild condition, adsorption effect under cryogenic conditions.
Particulate adsorbent material four, is made to adsorption plate in advance, job site is eliminated and directly loads adsorption particle to suction
Operation in reaction enclosure device, avoid scene filling existing for particle packing it is uneven, and easily be scattered waste the problems such as, use
The adsorption effect of adsorption plate is more preferable, and the operation such as it is installed, dismounting, replacing sorbing material is more simple and convenient.
Brief description of the drawings
Fig. 1, adsorptive reactor structural representation.
Fig. 2, adsorptive reactor top view.
The top view of adsorptive reactor in Fig. 3, another embodiment.
Fig. 4, embodiment central post top view and longitdinal cross-section diagram.
The structural representation of adsorption plate in Fig. 5, embodiment.
Fig. 6, Hole selective absorbent scanning electron microscope (SEM) photograph.
Fig. 7, use Hole selective absorbent absorption HDMS response diagrams.
Fig. 8, the result figure using waste gas caused by the method adsorption treatment semiconductor factory of the present invention.
Fig. 9, the method adsorption treatment semiconductor factory of the follow-on test present invention produce the result figure of waste gas.
Figure 10, Hole selective absorbent of the present invention A Rui Nice illustraton of model.
The measured value and model prediction results contrast that Figure 11, the present invention test.
Label in figure：
Housing 1, air inlet 11, gas outlet 12, column 2, stopper slot 21, adsorption plate 3, metal net layer 31, sheet metal 32, suction
Attached dose of particle 33, protuberance 34, temperature control equipment 4, heating element heater 41, temperature inductor 42, controller 43, barometer 5.
Embodiment
The preferred embodiments of the present invention are illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein preferred real
Apply example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
Hole selective absorbent preparation method of the present invention is as follows：
S11, prepare organic solution：Weigh 2.5g cetyl trimethylammonium bromides (CTABr) and be dissolved in 125 milliliters of deionizations
In water, 10 milliliters of mass concentration 28wt% Ammonia is added, at room temperature, 15 are continuously stirred through magnetic stirring apparatus
Minute, it is completely dissolved cetyl trimethylammonium bromide (CTABr).
S12, prepare mixed solution：Silicon source solution is added dropwise in the organic solution of step S11 preparations, and uses 4mol/L
Sulfuric acid solution adjusts pH value to 4, at room temperature, is continuously stirred 8 hours through magnetic stirring apparatus.
S13, just finished product is prepared, step S12 mixed solution is successively filtered, with deionized water and ethanol wash,
Baking oven is placed in again to dry 4 to 8 hours with 100 ± 5 DEG C of temperature.
S14, dried just finished product is placed in high temperature furnace, is calcined 6 hours with 550 DEG C of temperature, removes organic formwork,
Graininess Hole selective absorbent is made.
The mol ratio of each raw material components in above-mentioned preparation process：Cetyl trimethylammonium bromide：NH4OH：Si=145：
3.5：1.5.
The Hole selective absorbent of preparation is placed in adsorptive reactor.As shown in figures 1-4, the absorption is anti-
Device is answered to be made up of box housing 1, multiple columns 2, multiple square adsorption plates 3 and temperature control equipment 4.The housing side is by saturating
Bright material is made.The column is made of metal.Hole selective absorbent prepared by the inside of adsorption plate 3 filling
33, adsorption plate upper and lower surface sets equally distributed stomata.The relative two sides of the housing 1 set air inlet respectively
11 and gas outlet 12, the top surface of housing 1 is Demountable, is easy to the installation of adsorption plate 3.From housing top surface inside housing 1
Equally distributed multiple columns 2 are uprightly set to bottom surface, and the surface of column 2 sets two to be used to install adsorption plate in the axial direction
Bar limit slot 21, stopper slot 21 plug-in mounting of the adsorption plate 3 along column between adjacent upright posts 2, all adsorption plates 3 with
Column 2 is mutually spliced to form the overall adsorption wall (seeing Fig. 2 and Fig. 3 respectively) of a zigzag or comb teeth-shaped.The adsorption wall will
Housing is divided into two parts, and a part includes air inlet 11 and the untreated exhaust gas free air space a connected with air inlet, another portion
Subpackage includes exhaust gas flow space b after gas port 12 and processing；In the junction of adjacent adsorbent plate 3, and adsorption plate 3 and housing 1
The junction of wall is completely closed in a manner of gas is intransitable.Air pressure is respectively arranged with two partitioning portions of the housing
Meter 5, it is further preferred that, hull outside is provided with single-chip microcomputer, alarm and display screen, single-chip microcomputer respectively with two air pressure
Meter, alarm connect with display screen.Operation principle：The atmospheric pressure value of barometer measure is transferred to single-chip microcomputer, and single-chip microcomputer is by atmospheric pressure value
Display screen is transferred to, staff can check atmospheric pressure value by display screen.When atmospheric pressure value is higher, during higher than some setting value,
Single-chip microcomputer control alarm sends alarm, and air pressure is higher in prompting staff's reactor, takes related remedial measure in time, drops
Low pressure.
The temperature control equipment 4 includes the heating element heater 41 and temperature inductor 42 in housing 1, positioned at housing 1
The outside controller 43 being connected with heating element heater 41 and temperature inductor 42.Specifically：Heating element heater 41 is arranged in housing
Close to the position of air inlet 11, temperature inductor 42 is arranged in the untreated exhaust gas free air space a connected in housing with air inlet.
It can also be another middle embodiment：The heating element heater 41 is resistance wire, and it is evenly distributed on the inner bottom surface of housing 1 and side
On, it is further limited to, the untreated exhaust gas free air space a institutes that the resistance wire is arranged on air inlet 11 and connected with air inlet
On the enclosure interior bottom surface occupied and side.
In another embodiment, as shown in figure 5, the concrete structure of the adsorption plate 3 is：The upper and lower surface of adsorption plate 3 sets gold
Belong to stratum reticulare 31, the edge of adsorption plate is sealed the edge wrap of upper and lower metal net layer 31 using elongated metal piece 32, two metals
Space filling Hole selective absorbent particle 33 between stratum reticulare 31, the particle diameter of sorbing material is more than the hole of wire netting
Footpath.The lateral edge contacted on adsorption plate 3 with column 2 is provided with protuberance 34, and the protuberance 34 is embedded in the stopper slot of column
Protuberance is fixedly connected with stopper slot in 21 and by screw.
After above-mentioned adsorptive reactor installs, in adjustment control adsorptive reactor then temperature will at 25~70 DEG C
The pending waste gas containing HMDS, which is delivered in adsorptive reactor, carries out the selective absorption removing silicon of hexamethyl two
Azane.Waste gas enters adsorption reaction container by air inlet, is flowed in untreated exhaust gas free air space a, waste gas connects with adsorption plate 3
Touch, due to adsorption plate 3 and inner walls face junction in a manner of waste gas is intransitable it is completely closed, waste gas can only be by adsorbing
Gap in plate 3 between absorbent particles is by the way that waste gas is fully contacted with sorbent material during this, and HDMS is chosen in waste gas
Selecting property is adsorbed, and the waste gas after adsorption treatment is discharged by gas outlet, reaches the purpose of waste gas adsorption treatment.Wherein, it is described to contain
The concentration of HMDS is 500~2000ppm in the waste gas of HMDS.The pending waste gas, which enters, to be inhaled
The flow velocity of reaction enclosure device is 100~800mL/min, and residence time of the waste gas in adsorptive reactor is 0.4~2.4 second.
Performance evaluation and Application Example：
Electronic microscope photos, isothermal nitrogen are scanned to the Hole selective absorbent prepared in above-described embodiment below
Absorption/desorption instrument specificity analysis and absorption property analysis, and with Freund Leech model (Freundlich model), Lang Miao
That model (Langmuir model) and Arrhenius relationship (Arrhenius model) are inquired into Hole of the present invention and selectively inhaled
Enclosure material is used for the absorption behavior for handling HDMS.
A, B are the SEM figures of the Hole selective absorbent of the present invention in Fig. 6.It will be evident that mesopore in SEM
Hole selective absorbent profile is in spherical, and Hole selective absorbent is closed jointly by interfacial agent and silicate
Into it has the grain shapes such as circle, ellipse.
Hole sorbing material isothermal nitrogen adsorption/desorption instrument specificity analysis.Specific surface area and hole of the table 1 for sorbing material
Hole size test result.As can be seen that the specific surface area of Hole selective absorbent is 908.5 ± 18m2/ g, it is average
Pore volume is 0.598cm3/ g, the distribution of its bore hole size concentrate on 2.62nm.
The specific surface area and hole size of the sorbing material of table 1
In order to study adsorption capacity of the Hole selective absorbent to HMDS, will be containing HMDS concentration respectively
100ppm, 500ppm waste gas are delivered in adsorptive reactor using the induction air flow ratio of 100mL/min (residence time is 2.8 second)
Row adsorption experiment, experimental result are as shown in Figure 7.As can be seen that it is respectively 1070min and 340min through the time, adsorbance is divided
Wei not 40mg/g and 86mg/g.
Use the present invention processing method adsorption treatment semiconductor factory caused by waste gas (processing flow is 10m3/ min),
As a result Fig. 8 and Fig. 9 are seen.As can be seen that learnt by the follow-on test result of 3 days, its treatment effeciency can all reach 97% with
On, it was demonstrated that this sorbing material can be with waste gas caused by efficient process semiconductor factory.
The Freund Leech model (Freundlich model) of Hole selective absorbent of the present invention and bright Miao
You are shown in Table 2 at model (Langmuir model) analysis result.Figure 10 is the A Ruini of Hole selective absorbent of the present invention
This model (Arrhenius model) figure.As shown in table 3, from A Rui Nice equation can be seen that lnk (k be reaction rate it is normal
Number) it is directly proportional to activation energy with T rate of change.Therefore, activation energy is higher, and reaction rate increase must be faster when temperature raises,
Reaction rate is more sensitive to temperature.If the different reaction of multiple activation energies simultaneously be present, anti-high to activation energy of high temperature
Should be favourable, the low temperature reaction low to activation energy is favourable.
The isothermal adsorption patterns of table 2
The A Rui Nice model parameter calculation of table 3
As shown in figure 11, the calculated value of Freundlich patterns is sufficiently close to actual value.Therefore, in the single group of this experiment
Divide in adsorption system, be adapted to the absorption behavior that Hole selective absorbent is described using Freundlich patterns.
It is in summary, provided by the invention to utilize the Hole selective absorbent prepared to handle HMDS method,
With adsorption treatment efficiency high, used even across long-time operation, the absorption property of sorbing material is still fine, not yet reaches
Penetration, it can still maintain good adsorption effect.
The above described is only a preferred embodiment of the present invention, any formal limitation not is made to the present invention, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any to be familiar with this professional technology people
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification
For the equivalent embodiment of equivalent variations, as long as being the content without departing from technical solution of the present invention, the technical spirit according to the present invention
Any simple modification, equivalent change and modification made to above example, in the range of still falling within technical solution of the present invention.
Claims (10)
1. a kind of prepare Hole selective absorbent to handle the method for HMDS, it is characterised in that including
Following steps：
S1, Hole selective absorbent preparation；
S2, the Hole selective absorbent of preparation is placed in adsorptive reactor；
S3, by the temperature control in adsorptive reactor at 25~70 DEG C, then will be pending useless containing HMDS
Gas, which is delivered in adsorptive reactor, carries out selective absorption removing HMDS therein；
Wherein, the adsorptive reactor is made up of box housing, multiple columns, multiple square adsorption plates and temperature control equipment；
The Hole selective absorbent that inside the adsorption plate prepared by filling, adsorption plate upper and lower surface set and are uniformly distributed
Stomata；The relative two sides of the housing set air inlet and gas outlet respectively, and the top surface of housing is Demountable；Shell
Internal portion uprightly sets equally distributed multiple columns from housing top surface to bottom surface, and leg surface sets two use in the axial direction
In the bar limit slot of installation adsorption plate, stopper slot plug-in mounting of the adsorption plate along column is owned between adjacent upright posts
Adsorption plate is mutually spliced to form the overall adsorption wall of a zigzag or comb teeth-shaped with column；The adsorption wall is empty by enclosure interior
Between be divided into two parts, a part includes air inlet and the untreated exhaust gas free air space connected with air inlet, another part bag
Exhaust gas flow space after including gas port and handling；The junction of adjacent adsorbent plate, and adsorption plate and the connection in inner walls face
It is completely closed to sentence the intransitable mode of gas；
The temperature control equipment includes the heating element heater and temperature inductor in housing, positioned at hull outside and heating
The controller that element connects with temperature inductor.
2. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 1, its
It is characterised by, the step S1 is specifically included：
S11, cetyl trimethylammonium bromide is dissolved in deionized water, and it is molten to add the ammonium hydroxide that mass concentration is 28%
Liquid, obtain organic solution；
S12, silicon source solution is added dropwise in organic solution, and with sulfuric acid regulation solution pH value to 4, at room temperature, stirring is anti-
Answer 8h；
S13, the mixed solution obtained by step S12 filtered, washed and dried, obtain just finished product；
S14, first finished product is carried out to high-temperature calcination, removing organic formwork, granular Hole selective absorbent is made.
3. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 2, its
It is characterised by, the mol ratio of each raw material components in the step S1：Cetyl trimethylammonium bromide：NH4OH：Si=145：
3.5：1.5.
4. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 3, its
It is characterised by, in step S13, filter cake deionized water and ethanol wash after filtering, is subsequently placed in baking oven with 100 ± 5 DEG C
Temperature dries 4~8h.
5. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 4, its
It is characterised by, in the step S14, for first finished product under the conditions of 550 DEG C of temperature, granular Hole selectivity is made in calcination 6h
Sorbing material.
6. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 1, its
It is characterised by, the concentration of HMDS is 500~2000ppm in the waste gas containing HMDS.
7. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 6, its
It is characterised by, the flow velocity that the pending waste gas enters adsorptive reactor is 100~800mL/min, and waste gas is in adsorptive reactor
The interior residence time is 0.4~2.4 second.
8. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 1, its
Be characterised by, the heating element heater is arranged in housing close to air inlet position, the temperature inductor be arranged in housing with
In the untreated exhaust gas free air space of air inlet connection.
9. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 8, its
It is characterised by, barometer is respectively arranged with two partitioning portions of the housing.
10. Hole selective absorbent is prepared to handle the method for HMDS as claimed in claim 1, its
Be characterised by, the upper and lower surface of the adsorption plate sets metal net layer, the edge of adsorption plate using elongated metal piece will under,
The edge wrap of upper metal net layer seals, and the space filling Hole selective absorbent particle between two metal net layers, inhales
The particle diameter of enclosure material is more than the aperture of wire netting, and the lateral edge contacted on adsorption plate with column is provided with protuberance, described convex
Go out in the stopper slot of portion's insertion column and be fixedly connected with protuberance with stopper slot by screw.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109091977A (en) * | 2018-10-08 | 2018-12-28 | 深圳市净万嘉环保科技有限公司 | Industrial filter screen collector and preparation method thereof |
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