CN107658126A - The manufacture device of coil component - Google Patents
The manufacture device of coil component Download PDFInfo
- Publication number
- CN107658126A CN107658126A CN201710595529.6A CN201710595529A CN107658126A CN 107658126 A CN107658126 A CN 107658126A CN 201710595529 A CN201710595529 A CN 201710595529A CN 107658126 A CN107658126 A CN 107658126A
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- Prior art keywords
- mentioned
- laser
- wire
- dust
- laser oscillator
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/064—Winding non-flat conductive wires, e.g. rods, cables or cords
- H01F41/066—Winding non-flat conductive wires, e.g. rods, cables or cords with insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
Abstract
The present invention provides the manufacture device of the coil component for the failure that can prevent the laser oscillator caused by dust.The manufacture device of coil component has：Iron core support, it supports iron core；Nozzle, it is to iron core delivery guidewire；Laser oscillator, its guiding line irradiation laser beam peel off at least a portion of the dielectric film of wire；Laser radiation glass, it is configured between the illuminated part of the laser beam irradiation on wire and laser oscillator, and makes the laser beam transparent projected from laser oscillator；And dust removing mechanism, it produces the one side of side of wire of the air-flow on laser radiation glass, and attracts the dust of the one side of laser radiation glass, to remove the dust of the one side of laser radiation glass.
Description
Technical field
The present invention relates to the manufacture device of coil component.
Background technology
In the past, the manufacture device as coil component, there is Japanese Unexamined Patent Publication 2009-224599 publications (patent document 1) institute
The device of record.In the manufacture device, wire is being wound in the midway of iron core, from the dielectric film of laser oscillator guiding line
Laser beam is irradiated, to peel off the dielectric film of wire.
Patent document 1：Japanese Unexamined Patent Publication 2009-224599 publications
However it has been found that if the manufacture device of the above-mentioned conventional coil component of actual use, there is the problem of following.
When the dielectric film of guiding line irradiates laser beam to peel off dielectric film, dust is produced.Swash moreover, there is the dust to enter
In optical generator, and the worry that laser oscillator breaks down.In the case where laser oscillator breaks down, laser oscillator
Maintenance cost increase.
The content of the invention
Therefore, problem of the invention is, there is provided can prevent the coil of the failure of the laser oscillator caused by dust
The manufacture device of part.
In order to solve above-mentioned problem, the manufacture device of coil component of the invention is that manufacture has iron core, is wound in the iron
Core, and by the wire formed by dielectric film covering conductor and the iron core is arranged at, and the line for the electrode being connected with the wire
The manufacture device of the coil component of coil component, possesses：
Iron core support, it supports above-mentioned iron core；
Nozzle, it conveys above-mentioned wire to above-mentioned iron core；
Laser oscillator, it irradiates laser beam to peel off at least a portion of the dielectric film of above-mentioned wire to above-mentioned wire；
Laser radiation glass, it configures the illuminated part of the laser beam irradiation on above-mentioned wire and above-mentioned laser generation
Between device, and make the laser beam transparent projected from above-mentioned laser oscillator；And
Dust removing mechanism, it produces the one side of above-mentioned side of wire of the air-flow on above-mentioned laser radiation glass, and inhales
Draw the dust of the above-mentioned one side of above-mentioned laser radiation glass, to remove the dust of the above-mentioned one side of above-mentioned laser radiation glass.
According to the manufacture device of the coil component of the present invention, laser radiation configurations of glass is in the illuminated part of wire with swashing
Between optical generator, and make the laser beam transparent projected from laser oscillator.Thus, although being peeled off by the irradiation of laser beam
Dust is produced during dielectric film, but laser radiation glass prevents dust from entering laser oscillator.Therefore, it is possible to prevent laser oscillator
Broken down due to dust.
In addition, dust removing mechanism makes air-flow be produced in the one side of laser radiation glass, and attract laser radiation glass
Dust simultaneously, to remove the dust of the one side of laser radiation glass.Thus, dust is prevented to be attached to the one of laser radiation glass
Face.Therefore, dust will not block the light path of laser beam.
Therefore, it is possible to prevent the failure of the laser oscillator caused by dust, further, it is possible to prevent swashing caused by dust
The intensity decreases of light beam.
In addition, in an embodiment of the manufacture device of coil component, above-mentioned laser radiation configurations of glass is led above-mentioned
The downside of the illuminated part of line, above-mentioned laser oscillator configuration is in the downside of above-mentioned laser radiation glass.
According to above-mentioned embodiment, laser radiation configurations of glass is in the downside of the illuminated part of wire, laser oscillator
Configuration is in the downside of laser radiation glass.Thus, from the laser beam that laser oscillator projects from downside by laser radiation glass,
And irradiate wire from downside.Therefore, even if dust (the particularly dust of solid state) falls on laser due to the influence of gravity
The one side of protective glass, the dust fallen also can be effectively removed by dust removing mechanism.
In addition, in an embodiment of the manufacture device of coil component, above-mentioned laser radiation configurations of glass is led above-mentioned
The upside of the illuminated part of line, above-mentioned laser oscillator configuration is in the upside of above-mentioned laser radiation glass.
According to above-mentioned embodiment, laser radiation configurations of glass is in the upside of the illuminated part of wire, laser oscillator
Configuration is in the upside of laser radiation glass.Thus, from laser oscillator project laser from upside by laser radiation glass, and
Wire is irradiated from upside.Therefore, even if dust rises due to the influence of ascending air until arrival laser radiation glass, also can
The dust of rising is enough effectively removed by dust removing mechanism.
In addition, in an embodiment of the manufacture device of coil component,
Above-mentioned laser oscillator has first laser oscillator and second laser oscillator,
Above-mentioned first laser oscillator is with above-mentioned second laser oscillator configuration in the illuminated portion relative to above-mentioned wire
Divide mutually opposing position.
Here, opposed position refers to that the optical axis of the laser beam of first laser oscillator and second laser oscillator both can be with
, can not also be on coaxial on coaxial.Can also laser beam optical axis it is parallel to each other, and offset predetermined distance.Can also
The optical axis of laser beam is intersecting with not parallel angle (angle beyond 179 ° of 180 ° of grades) each other.
According to above-mentioned embodiment, first laser oscillator is shone with second laser oscillator configuration relative to wire
The mutually opposing position in part is penetrated, so can come from first laser oscillator and second laser oscillator irradiation laser beam
Peel off the whole circumference of the dielectric film of wire.
In addition, in an embodiment of the manufacture device of coil component, the injection of the laser beam of above-mentioned laser oscillator
Hole position is in the position for not overlapping and offseting with the underface of the illuminated part of above-mentioned wire.
According to above-mentioned embodiment, the ejection hole of the laser beam of laser oscillator positioned at not with the illuminated part of wire
The position that underface overlaps and offset, so the laser of laser oscillator can be irradiated from the obliquely downward of the illuminated part of wire
Beam.Thus, dust will not fall on the surface of the ejection hole of laser oscillator, and can prevent the intensity decreases of laser beam.
In addition, in an embodiment of the manufacture device of coil component,
With the substrate that above-mentioned iron core support is installed in upside,
Above-mentioned laser radiation glass and above-mentioned laser oscillator are configured in the downside of aforesaid substrate,
Aforesaid substrate has the through hole and the above-mentioned through hole of encirclement that the laser beam projected from above-mentioned laser oscillator passes through
Upside openend wall portion.
According to above-mentioned embodiment, through hole and surround that substrate passes through with the laser beam projected from laser oscillator
The wall portion of the openend of the upside of through hole.Thus, even if dust accumulation is in the upper surface of substrate, can also be prevented by wall portion
The dust of accumulation falls on the through hole of substrate.
In addition, in an embodiment of the manufacture device of coil component, above-mentioned wall portion when from above-below direction
Top overlaps with above-mentioned through hole, and the A/F on the top of above-mentioned wall portion opening than the openend of the upside of above-mentioned through hole
Mouth narrow width.
According to above-mentioned embodiment, the top of wall portion overlaps with through hole when from above-below direction, and wall portion is upper
The A/F in portion is narrower than the A/F of the openend of the upside of through hole.Thus, wall portion further can prevent dust from falling
To the through hole of substrate.
In addition, in an embodiment of the manufacture device of coil component, above-mentioned dust removing mechanism, which has to above-mentioned, to swash
Light protective glass it is above-mentioned the air blower for blowing air and attract above-mentioned laser radiation glass it is above-mentioned while dust
Vacuum cleaner.
According to above-mentioned embodiment, dust removing mechanism has air blower and vacuum cleaner.Thereby, it is possible to remove dust
Mechanism is gone to be formed to be simple.
According to the manufacture device of the coil component of the present invention, laser radiation configurations of glass is in the illuminated part of wire with swashing
Between optical generator, and make the laser beam transparent projected from laser oscillator, so can prevent the laser caused by dust from shaking
Swing the failure of device.In addition, dust removing mechanism makes air-flow be produced in the one side of laser radiation glass, attract laser radiation glass
Dust simultaneously, and the dust of the one side of laser radiation glass is removed, so the strong of the laser beam caused by dust can be prevented
Degree reduces.
Brief description of the drawings
Fig. 1 is the simple pie graph of the first embodiment for the manufacture device for representing the coil component of the present invention.
Fig. 2 is the simple stereogram of a part for the manufacture device for representing coil component.
Fig. 3 is explanation figure of the explanation by state during first laser oscillator irradiation laser beam.
Fig. 4 is explanation figure of the explanation by state during second laser oscillator irradiation laser beam.
Fig. 5 is the explanation figure for illustrating wire being wound in the state of iron core.
Fig. 6 is the simple pie graph of the second embodiment for the manufacture device for representing the coil component of the present invention.
Fig. 7 is the simple pie graph of the 3rd embodiment of the manufacture device for representing the coil component of the present invention.
Fig. 8 is the simple pie graph of the 4th embodiment of the manufacture device for representing the coil component of the present invention.
Embodiment
Hereinafter, according to embodiment illustrated, the present invention is described in detail.
(first embodiment)
Fig. 1 is the simple pie graph of the first embodiment for the manufacture device for representing the coil component of the present invention.Fig. 2 is table
The simple stereogram of a part for the manufacture device of timberline coil component.As depicted in figs. 1 and 2, the manufacture device 1 of coil component has
Have supporting coil component iron core 10 iron core support 60, to iron core 10 convey the first wire 21 first jet 19 and
The second nozzle 20 of the second wire 22 is conveyed to iron core 10.In addition, in Fig. 1, omit and describe second nozzle 20 and second lead
Line 22.
The manufacture device 1 of coil component, which also has to first, second wire 21,22, irradiates laser beam L strippings first, second
The first laser oscillator 31 of the dielectric film of wire 21,22, the laser beam L for making to project from first laser oscillator 31 pass through the
One laser radiation glass 41 and the first dust removing mechanism 51 for removing the dust on first laser protective glass 41.
The manufacture device 1 of coil component, which also has to first, second wire 21,22, irradiates laser beam L strippings first, second
The second laser oscillator 32 of the dielectric film of wire 21,22, the laser beam L for making to project from second laser oscillator 32 pass through the
Dual-laser protective glass 42 and the second dust removing mechanism 52 for removing the dust on second laser protective glass 42.
The manufacture device 1 of coil component is by making iron core 10 be rotated by rotary shaft of the axle center A of the core 13 of iron core 10
And first, second wire 21,22 is wrapped in the substantially overall of the core 13 of iron core 10, manufacture the coil portion of double structure
Part.The coil component is, for example, common mode choke coil.
Iron core 10 have core 13, be arranged on core 13 one end the first flange part 11 and be arranged on core
Second flange part 12 of the other end in portion 13.As the material of iron core 10, such as use aluminum oxide (nonmagnetic material), Ni-Zn systems
The materials such as ferrite (magnetic, insulator), resin.
The shape of core 13 is, for example, cube.The shape of first flange part 11 and the shape of the second flange part 12 are for example
For the flat board of rectangle.Be respectively arranged with the bottom surface of the bottom surface of the first flange part 11 and the second flange part 12 first electrode 14 with
And second electrode 15.The material of first, second electrode 14,15 is, for example, Ag etc..The of the front end of first wire 21 and iron core 10
The first electrode 14 of one flange part 11 engages.The front end of second wire 22 and the second electrode 15 of the first flange part 11 of iron core 10
Engagement.Iron core 10 is arranged on XY faces, and connects axle center A directions and the Y-direction one of the first flange part 11 and the second flange part 12
Cause.Z-direction is consistent with above-below direction.
First, second wire 21,22 is helically wound in core 13, and by covering conductor with dielectric film and structure
Into.For example, conductor is made up of copper cash, dielectric film is made up of the polyamidoimide (AIW) as heat-resisting material.First wire
21 are wound in iron core 10, so as to form first siding ring.Second wire 22 is wound in iron core 10, so as to form second siding ring.
Iron core support 60 is arranged on the upside of substrate 70.Substrate 70 is arranged on horizontal plane via support foot 75.Iron core branch
Bearing portion 60 is configured to keep the first flange part 11 of a side of iron core 10.In addition, iron core support 60 is configured to support
Rotated in the axle center A of the core 13 of the iron core 10 of iron core support 60 for rotary shaft.Twined by first, second wire 21,22
When being around in the core 13 of iron core 10, rotated by the state for making iron core 10 to be supported by iron core support 60, so as to iron core 10
Also rotated by rotary shaft of the axle center A of core 13, first, second wire 21,22 pulled out from first, second nozzle 19,20
It is wound in core 13.
In addition, be provided with clamp 61 in iron core support 60, clamp 61 clamp respectively respectively from first, second nozzle 19,
20 pull out first, second wires 21,22 one end, it is clamped 61 clamping first, second wires 21,22 one end relative to
Iron core support 60 is fixed.Therefore, when moving first, second nozzle 19,20, one end of first, second wire 21,22 is consolidated
It is fixed, thus with the movement of first, second nozzle 19,20 and first, second wire 21,22 respectively from first, second nozzle 19,
20 pull out.
First, second laser oscillator 31,32 is respectively facing first, second wire of configuration position near iron core 10
21st, 22 irradiation laser beam L, at least a portion of the dielectric film of first, second wire 21,22 is peeled off.In first, second wire
21st, in 22, the laser beam L parts irradiated are set to illuminated part 21a, 22a respectively.Illuminated part 21a, 22a are in Fig. 1
Shown with stain, shown in fig. 2 with hachure.
Here, first, second laser oscillator 31,32 is able to make laser beam L scan the model for irradiating 300 milli rads
Enclose, make the configuration of first, second wire 21,22 in the laser beam range of exposures of the 300 milli rad and irradiate laser beam L respectively.This
Outside, irradiation time once is about number ms or so, and multiple strippings are repeatedly carried out even if continuously irradiating, it is overall spent when
Between also about within 1 second.
Laser beam L is, for example, second harmonic (SHG (second harmonic generation)) laser beam, the laser
Wavelength be about 532nm or so.Therefore, it is possible to through each the by being formed as the polyamidoimide of heat-resisting material
First, the dielectric film of the second wire 21,22, can most preferably be removed in the interface location of dielectric film and each first, second wire 21,22
Remove dielectric film.
First laser oscillator 31 is configured in the illuminated part relative to the first wire 21 with second laser oscillator 32
The position mutually opposing illuminated part 22a of 21a and the second wire 22.Here, opposed position refers to that first laser is shaken
The optical axis for swinging the device 31 and laser beam L of second laser oscillator 32 both can be on coaxial, can not also be on coaxial.Can also
Laser beam L optical axis is parallel to each other, and offsets predetermined distance.Can also laser beam L optical axis each other with not parallel angle
(angle beyond 179 ° of 180 ° of grades) is intersecting.
First laser oscillator 31 is configured in illuminated part 21a, 22a of first, second wire 21,22 downside, the
Dual-laser oscillator 32 is configured in illuminated part 21a, 22a of first, second wire 21,22 upside.Thereby, it is possible to from
One laser oscillator 31 and second laser oscillator 32 irradiate laser beam L, to peel off the insulation of first, second wire 21,22
The whole circumference of film.Therefore, it is possible to further shorten the working procedure duration (production interval time) required for stripping dielectric film.
First laser oscillator 31 is configured in the downside of substrate 70.Substrate 70 has what is projected from first laser oscillator 31
The through hole 71 that laser beam L passes through.Through hole 71 can be along slit scan for example formed as slit-shaped, laser beam L.
First laser protective glass 41 configures to swash in illuminated part 21a, 22a of first, second wire 21,22 and first
Between optical generator 31, and pass through the laser beam L projected from first laser oscillator 31.First laser protective glass 41 configures
In illuminated part 21a, 22a of first, second wire 21,22 downside, first laser oscillator 31 is configured in first laser
The downside of protective glass 41.First laser protective glass 41 is configured in the downside of substrate 70.The through hole 71 of substrate 70 is upper and lower
Direction overlaps with first laser protective glass 41.
Second laser protective glass 42 configures to swash in illuminated part 21a, 22a of first, second wire 21,22 and second
Between optical generator 32, and pass through the laser beam L projected from second laser oscillator 32.Second laser protective glass 42 configures
In illuminated part 21a, 22a of first, second wire 21,22 upside, second laser oscillator 32 is configured in second laser
The upside of protective glass 42.Second laser protective glass 42 is configured in the upside of substrate 70.
First dust removing mechanism 51 makes wire 21, the one side 41a of 22 sides of the air-flow on first laser protective glass 41
(being above in this embodiment) produces, and attracts the one side 41a of first laser protective glass 41 dust, and removes first and swash
The one side 41a of light protective glass 41 dust.First dust removing mechanism 51 has the one side to first laser protective glass 41
41a blows the air blower 55 of air and attracts the vacuum cleaner 56 of the one side 41a of first laser protective glass 41 dust.
Air blower 55 is configured in the one side 41a sides of first laser protective glass 41, and the discharge side of air blower 55 with vacuum cleaner 56
It is opposed with the suction side of vacuum cleaner 56.So, the first dust removing mechanism 51 is by air blower 55 and vacuum cleaner 56
Form, so the first dust removing mechanism 51 can be made to be formed to be simple.
Second dust removing mechanism 52 makes wire 21, the one side 42a of 22 sides of the air-flow on second laser protective glass 42
(being following in this embodiment) produces, and attracts the one side 42a of second laser protective glass 42 dust, and removes second and swash
The one side 42a of light protective glass 42 dust.Second dust removing mechanism 52 is identical with the first dust removing mechanism 51, have to
Second laser protective glass 42 42a blow the air blower 55 of air and attract second laser protective glass 42 while
The vacuum cleaner 56 of 42a dust.
Next, the manufacture method of coil component is illustrated.In the manufacture method of coil component, while by two
First, second wire 21,22 is wound in iron core 10, and is engaged respectively with first, second electrode 14,15.The process is entered below
Row describes in detail.
As shown in Fig. 2 the first flange part 11 of a simultaneously side of secured core 10 is caught by iron core support 60.Here,
Iron core 10 can rotate by rotary shaft of the axle center A of the core 13 of iron core 10.
Then, first, second wire 21,22 is pulled out respectively from first, second nozzle 19,20, and clamped using clamp 61
One end of each first, second wire 21,22, is fixed relative to iron core support 60.
Then, first, second wire 21,22 respectively engaged first, second electrode 14,15 with the first flange part 11
Bonding station dielectric film whole circumference peel off.Specifically, move the bonding station of first, second wire 21,22
Shone to the laser beam L of first, second laser oscillator 31,32 range of exposures, and from first, second laser oscillator 31,32
Laser beam L is penetrated, the whole circumference of illuminated part 21a, 21b of first, second wire 21,22 dielectric film is peeled off.
State when here, to irradiating laser beam L by first laser oscillator 31 illustrates.As shown in figure 3, from
The laser beam L that one laser oscillator 31 projects irradiates the first wire from downside by first laser protective glass 41, and from downside
21.In addition, the second wire 22 is also identical with the first wire 21, so the description thereof will be omitted.
In the dielectric film for the illuminated part 21a that the first wire 21 is peeled off in the irradiation by laser beam L, dust F is produced.
Dust F (the particularly dust F of solid state) falls on first and swashed due to the influence of gravity, and by the through hole 71 of substrate 70
The side of optical generator 31.In figure 3, in order to be readily appreciated that, dust F amount is more depicted.Now, first laser protective glass
41 prevent dust F from entering first laser oscillator 31.Therefore, it is possible to prevent first laser oscillator 31 from occurring due to dust F
Failure.
Also, the air blower 55 of the first dust removing mechanism 51 blows sky to the one side 41a of first laser protective glass 41
Gas, the vacuum cleaner 56 of the first dust removing mechanism 51 attract the one side 41a of first laser protective glass 41 dust F.By
This, even if dust F falls on the one side 41a of first laser protective glass 41, by the first dust removing mechanism 51, can also remove
The dust F fallen, dust F is prevented to be deposited in the one side 41a of first laser protective glass 41.Therefore, dust F will not block laser
Beam L light path.
So, because there is the manufacture device 1 of coil component the dust of first laser protective glass 41 and first to remove machine
Structure 51, so the failure of the first laser oscillator 31 caused by dust F can be prevented, further, it is possible to prevent caused by dust F
Laser beam L intensity decreases.
State when then, to irradiating laser beam L by second laser oscillator 32 illustrates.As shown in figure 4, from
The laser beam L that dual-laser oscillator 32 projects irradiates the first wire from upside by second laser protective glass 42, and from upside
21.In addition, the second wire 22 is also identical with the first wire 21, so the description thereof will be omitted.
In the dielectric film for the illuminated part 21a that the first wire 21 is peeled off in the irradiation by laser beam L, dust F is produced.
Dust F rises until reaching second laser protective glass 42 due to the influence of ascending air.In Fig. 4, in order to easily say
It is bright, more depict dust F amount.Now, second laser protective glass 42 prevents dust F from entering second laser oscillator
32.Therefore, it is possible to prevent second laser oscillator 32 from being broken down due to dust F.
Also, the air blower 55 of the second dust removing mechanism 52 blows sky to the one side 42a of second laser protective glass 42
Gas, the vacuum cleaner 56 of the second dust removing mechanism 52 attract the one side 42a of second laser protective glass 42 dust F.By
This, even if dust F reaches the one side 42a of second laser protective glass 42, by the second dust removing mechanism 52, can also remove
The dust F of rising, dust F is prevented to be attached to the one side 42a of second laser protective glass 42.Therefore, dust F will not block laser
Beam L light path.
So, because there is the manufacture device 1 of coil component the dust of second laser protective glass 42 and second to remove machine
Structure 52, so the failure of the second laser oscillator 32 caused by dust F can be prevented, further, it is possible to prevent caused by dust F
Laser beam L intensity decreases.
Thereafter, first, second wire 21,22 is wound in the core 13 of iron core 10.As shown in figure 5, make the He of iron core 10
Iron core support 60 is rotated using the axle center A for being supported on the core 13 of the iron core 10 of iron core support 60 as rotary shaft, and is made
Axial movement of first, second nozzle 19,20 to the core 13 of iron core 10, throughout whole core 13 winding first, second
Wire 21,22.Moreover, the rotation for stopping iron core support 60 at the time of the winding of the previous circle of last circle is acted and completed is moved
Make, stop winding action.
Then, first, second wire 21,22 being respectively connected first, second electrode 14,15 with the second flange part 12
Link position dielectric film whole circumference peel off.Specifically, move the link position of first, second wire 21,22
Shone to the laser beam L of first, second laser oscillator 31,32 range of exposures, and from first, second laser oscillator 31,32
Laser beam L is penetrated, the whole circumference of illuminated part 21a, 21b of first, second wire 21,22 dielectric film is peeled off.Here,
By first, second laser oscillator 31,32 irradiate laser beam L when state as illustrated by above-mentioned Fig. 3, Fig. 4 as.
Thereafter, the coiling action of last circle is carried out.That is, the core 13 by first, second wire 21,22 to iron core 10
Wind a circle.Thus, whole coiling actions completions to core 13 of first, second wire 21,22.
Then, by hot pressing, laser welding by first, second wire 21,22 start winding stripping position (connection position
Put) it is connected with first, second electrode 14,15 of the first flange part 11, also, led by hot pressing, laser welding by first, second
The stripping position (link position) of the end winding of line 21,22 is connected with first, second electrode 14,15 of the second flange part 12.
Finally, first, second flange part 11 of the cutter (not shown) successively to iron core 10, the movement of 12 neighbouring positions are made, point
One end (top) portion and the other end (terminal) portion of each first, second wire 21,22 are not cut off.Thus, coil component is manufactured.
According to the manufacture device 1 of above-mentioned coil component, due to first, second laser radiation glass 41,42, institute to prevent
Only dust enters first, second laser oscillator 31,32.Therefore, it is possible to prevent first, second laser oscillator 31,32 due to
Dust and break down.
Further, since there is first, second dust removing mechanism 51,52, so preventing dust to be attached to first, second and swash
One side 41a, 42a of light protective glass 41,42.Therefore, dust will not block laser beam L light path.
Therefore, it is possible to prevent the failure of first, second laser oscillator 31,32 caused by dust, further, it is possible to prevent
The intensity decreases of laser beam L caused by dust.
(second embodiment)
Fig. 6 is the simple pie graph of the second embodiment for the manufacture device for representing the coil component of the present invention.Second is real
The position for applying mode first laser oscillator compared with first embodiment is different.The composition different to this illustrates below.
In addition, with first embodiment identical reference formed with first embodiment identical in this second embodiment,
So the description thereof will be omitted.
As shown in fig. 6, the laser beam L of first laser oscillator 31 ejection hole 31a is positioned at the not quilt with the first wire 21
Irradiate the position that part 21a underface (arrow Z-direction) overlaps and offset.In other words, laser beam L optical axis is not with being shone
The underface for penetrating part 21a unanimously intersects to (arrow Z-direction).Similarly, although it is not shown, but first laser oscillator 31
Ejection hole 31a be located at the position that does not overlap and offset with the illuminated part 22a of the second wire 22 underface.
Thereby, it is possible to the obliquely downward of illuminated part 21a, 22a from first, second wire 21,22 to irradiate first laser
The laser beam L of oscillator 31.Therefore, dust will not fall on the ejection hole 31a of first laser oscillator 31 surface, and can
Prevent laser beam L intensity decreases.
(the 3rd embodiment)
Fig. 7 is the simple pie graph of the 3rd embodiment of the manufacture device for representing the coil component of the present invention.3rd is real
The composition for applying mode substrate compared with first embodiment is different.The composition different to this illustrates below.In addition, the 3rd
With first embodiment identical reference formed with first embodiment identical, so omitting it in embodiment
Explanation.
As shown in fig. 7, substrate 70A has the openend 71a for the upside for surrounding through hole 71 wall portion 72.Wall portion 72 is formed
Around covering openend 71a.Wall portion 72, but can also be along opening preferably along being continuously formed around the 71a of openend
Intermittently formed around mouth end 71a.
Thus, even if dust F is deposited in substrate 70A upper surface, by wall portion 72, the dust F accumulated can also be prevented
Fall on substrate 70A through hole 71.
(the 4th embodiment)
Fig. 8 is the simple pie graph of the 4th embodiment of the manufacture device for representing the coil component of the present invention.4th is real
The composition for applying mode wall portion of substrate compared with the 3rd embodiment is different.The composition different to this illustrates below.In addition,
With the 3rd embodiment identical reference formed with the 3rd embodiment identical in the 4th embodiment, so
The description thereof will be omitted.
As shown in figure 8, substrate 70B wall portion 72B top overlaps when from above-below direction with through hole 71.Change
Sentence is talked about, and wall portion 72B top rolls tiltedly to through hole 71.Moreover, the A/F H1 on wall portion 72B top is than through hole 71
Upside openend 71a A/F H2 it is narrow.
Thus, even if dust is fallen due to the influence of gravity to the side of through hole 71, the narrower of A/F H1 is passed through
Wall portion 72B, it can also reduce dust and fall on through hole 71.In addition, even if dust accumulation in substrate 70B upper surface, passes through wall
Portion 72B, also it can prevent dust from falling on through hole 71.Therefore, by wall portion 72B, it can further prevent dust from falling on insertion
Hole 71.
In addition, the present invention is not limited to above-mentioned embodiment, can be without departing from the spirit and scope of the invention
It is designed change.For example, it is also possible to various combinations are carried out to each characteristic point of the first~the 4th embodiment.
In the above-described embodiment, using two upper and lower laser oscillators, but can also be on the downside of use first laser
Any one of oscillator or the second laser oscillator of upside.Now, preferably by laser oscillator towards first,
After a part for second wire carries out the substantially half for the circumferencial direction that first, second wire is peeled off in laser irradiation, make stripping
The side reversion of dielectric film and make the side of residual dielectric film opposed with laser oscillator and carry out laser irradiation stripping again
The dielectric film of residual is so as to peeling off whole circumference.
In the above-described embodiment, in two laser oscillators of configuration, but two can also be configured in the horizontal direction up and down
Laser oscillator.Now, it is right relative to the illuminated part of first, second wire to be preferably configured to two laser oscillators
Put.
In the above-described embodiment, by making iron core rotate using the axle center of the core of iron core as rotary shaft to make first,
Second wire is wound in core, but nozzle can also be made to be revolved round the sun around iron core, and first, second wire is wound in into iron
The core of core.
In the above-described embodiment, two wires are wound in iron core, but one or more than three can also be led
Line is wound in iron core.
Description of reference numerals
The manufacture device of 1 ... coil component, 10 ... iron cores, 11 ... first flange parts, 12 ... second flange parts, 13 ... core
Portion, 14 ... first electrodes, 15 ... second electrodes, 19 ... first jets, 20 ... second nozzles, 21 ... first wires, 21a ... are shone
Part is penetrated, 22 ... second wires, the illuminated parts of 22a ..., 31 ... first laser oscillators, 31a ... ejection hole, 32 ... second swash
Optical generator, 32a ... ejection hole, 41 ... first laser protective glass, 41a ... simultaneously, 42 ... second laser protective glass,
42a ... simultaneously, 51 ... first dust removing mechanisms, 52 ... second dust removing mechanisms, 55 ... air blowers, 56 ... vacuum cleanings
Device, 60 ... iron core supports, 61 ... clamps, 70,70A, 70B ... substrate, 71 ... through holes, 71a ... openends, 72,72B ... walls
Portion, F ... dust, L ... laser beams, H1 ... (wall portion) A/F, H2 ... (through hole) A/F.
Claims (8)
1. a kind of manufacture device of coil component, it is that manufacture has iron core, is wound in the iron core and by being led by dielectric film covering
Wire that body forms and the manufacture dress for being arranged on the iron core and the coil component of the coil component for the electrode being connected with the wire
Put, wherein, possess：
Iron core support, it supports above-mentioned iron core；
Nozzle, it conveys above-mentioned wire to above-mentioned iron core；
Laser oscillator, it peels off at least a portion of the dielectric film of above-mentioned wire to above-mentioned wire irradiation laser beam；
Laser radiation glass, its configure on above-mentioned wire laser beam irradiation illuminated part and above-mentioned laser oscillator it
Between, and make the laser beam transparent projected from above-mentioned laser oscillator；And
Dust removing mechanism, it produces the one side of above-mentioned side of wire of the air-flow on above-mentioned laser radiation glass, and in attraction
The dust of the above-mentioned one side of laser radiation glass is stated, to remove the dust of the above-mentioned one side of above-mentioned laser radiation glass.
2. the manufacture device of coil component according to claim 1, wherein,
Above-mentioned laser radiation configurations of glass is configured above-mentioned in the downside of the illuminated part of above-mentioned wire, above-mentioned laser oscillator
The downside of laser radiation glass.
3. the manufacture device of coil component according to claim 1, wherein,
Above-mentioned laser radiation configurations of glass is configured above-mentioned in the upside of the illuminated part of above-mentioned wire, above-mentioned laser oscillator
The upside of laser radiation glass.
4. the manufacture device of coil component according to claim 1, wherein,
Above-mentioned laser oscillator has first laser oscillator and second laser oscillator,
Above-mentioned first laser oscillator is with above-mentioned second laser oscillator configuration in the illuminated part phase relative to above-mentioned wire
Mutually opposed position.
5. the manufacture device of coil component according to claim 2, wherein,
The ejection hole of the laser beam of above-mentioned laser oscillator positioned at not overlapping with the underface of the illuminated part of above-mentioned wire and
The position of skew.
6. the manufacture device of coil component according to claim 2, wherein,
With the substrate that above-mentioned iron core support is installed in upside,
Above-mentioned laser radiation glass and above-mentioned laser oscillator are configured in the downside of aforesaid substrate,
The through hole and surround the upper of above-mentioned through hole that aforesaid substrate passes through with the laser beam projected from above-mentioned laser oscillator
The wall portion of the openend of side.
7. the manufacture device of coil component according to claim 6, wherein,
The top of above-mentioned wall portion overlaps with above-mentioned through hole when from above-below direction, the A/F on the top of above-mentioned wall portion
A/F than the openend of the upside of above-mentioned through hole is narrow.
8. the manufacture device of coil component according to claim 1, wherein,
Above-mentioned dust removing mechanism has on the air blower and attraction for blowing air to the above-mentioned one side of above-mentioned laser radiation glass
State the vacuum cleaner of the dust of the above-mentioned one side of laser radiation glass.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016145431A JP6596393B2 (en) | 2016-07-25 | 2016-07-25 | Coil parts manufacturing equipment |
| JP2016-145431 | 2016-07-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107658126A true CN107658126A (en) | 2018-02-02 |
| CN107658126B CN107658126B (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710595529.6A Active CN107658126B (en) | 2016-07-25 | 2017-07-20 | Coil component manufacturing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6596393B2 (en) |
| CN (1) | CN107658126B (en) |
| TW (1) | TWI623001B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52114493U (en) * | 1976-02-27 | 1977-08-31 | ||
| CN1355603A (en) * | 2000-10-17 | 2002-06-26 | 株式会社村田制作所 | Subassembly electronic component |
| EP1318532A1 (en) * | 2001-12-10 | 2003-06-11 | cubit electronics Gmbh | Coil assembly and manufacturing thereof |
| JP2009224599A (en) * | 2008-03-17 | 2009-10-01 | Tdk Corp | Method of manufacturing coil component, apparatus of manufacturing coil component, and coil component |
| JP2013216921A (en) * | 2012-04-04 | 2013-10-24 | Sanyo Special Steel Co Ltd | Method for producing dust core powder |
| CN105074841A (en) * | 2013-03-13 | 2015-11-18 | 日立金属株式会社 | Wound magnetic core and method for manufacturing same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6112714B2 (en) * | 2013-04-12 | 2017-04-12 | 日特エンジニアリング株式会社 | Coil manufacturing equipment |
-
2016
- 2016-07-25 JP JP2016145431A patent/JP6596393B2/en active Active
-
2017
- 2017-07-07 TW TW106122772A patent/TWI623001B/en active
- 2017-07-20 CN CN201710595529.6A patent/CN107658126B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52114493U (en) * | 1976-02-27 | 1977-08-31 | ||
| CN1355603A (en) * | 2000-10-17 | 2002-06-26 | 株式会社村田制作所 | Subassembly electronic component |
| EP1318532A1 (en) * | 2001-12-10 | 2003-06-11 | cubit electronics Gmbh | Coil assembly and manufacturing thereof |
| JP2009224599A (en) * | 2008-03-17 | 2009-10-01 | Tdk Corp | Method of manufacturing coil component, apparatus of manufacturing coil component, and coil component |
| JP2013216921A (en) * | 2012-04-04 | 2013-10-24 | Sanyo Special Steel Co Ltd | Method for producing dust core powder |
| CN105074841A (en) * | 2013-03-13 | 2015-11-18 | 日立金属株式会社 | Wound magnetic core and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6596393B2 (en) | 2019-10-23 |
| JP2018018852A (en) | 2018-02-01 |
| CN107658126B (en) | 2020-04-10 |
| TWI623001B (en) | 2018-05-01 |
| TW201807721A (en) | 2018-03-01 |
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