CN107652940A - Diaphragm suitable for photovoltaic and preparation method thereof - Google Patents
Diaphragm suitable for photovoltaic and preparation method thereof Download PDFInfo
- Publication number
- CN107652940A CN107652940A CN201710972248.8A CN201710972248A CN107652940A CN 107652940 A CN107652940 A CN 107652940A CN 201710972248 A CN201710972248 A CN 201710972248A CN 107652940 A CN107652940 A CN 107652940A
- Authority
- CN
- China
- Prior art keywords
- weight
- parts
- photovoltaic
- adhesive
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses diaphragm suitable for photovoltaic and preparation method thereof; the diaphragm includes substrate layer and the adhesive layer being located on substrate layer; and the peel ply on adhesive layer is fitted in, the adhesive layer is silicone adhesive layer, including following parts by weight of component composition：The parts by weight of organic silicon adhesive 30 50, the parts by weight of polysiloxanes 10 20, the parts by weight of silica 10 15, the parts by weight of MQ resins 20 30, the parts by weight of hydroxymethyl cellulose 10 20, the parts by weight of natural rubber 15 20, the parts by weight of nano zine oxide 58, the parts by weight of tackifying resin 10 15, the parts by weight of curing agent 8 12.Not only adhesion strength is good for diaphragm of the present invention, and has the advantages of not cull.
Description
Technical field
The present invention relates to protection technical field of membrane, and in particular to suitable for diaphragm of photovoltaic and preparation method thereof.
Background technology
With the continuous development of electronic industry, the application of all kinds of photoelectric materials is more and more extensive, specifically by photoelectric material system
Standby to protect electronic product into various terminals, for the ease of protecting above-mentioned electronic product, be typically sticked diaphragm on product.Protect
Cuticula mainly includes substrate layer and the adhesive layer being arranged on substrate layer, and be sticked peel ply outside adhesive layer.
The using effect of diaphragm is mainly reflected in adhesion strength, and also has certain weatherability and chemical-resistant resistance
Property, have and attach not degumming, not cull for a long time, the advantages of not staying ghost after stripping.
The content of the invention
It is an object of the invention to provide the diaphragm suitable for photovoltaic, not only adhesion strength is good for the diaphragm, and
The advantages of with not cull.
In addition, the present invention also provides the preparation method of said protection film.
The present invention is achieved through the following technical solutions：
Suitable for the diaphragm of photovoltaic, including substrate layer and the adhesive layer that is located on substrate layer, and be fitted in viscous
The peel ply on layer is closed, the adhesive layer be silicone adhesive layer, including following parts by weight of component forms：
Organic silicon adhesive 30-50 parts by weight, polysiloxanes 10-20 parts by weight, silica 1 0-15 parts by weight, MQ trees
Fat 20-30 parts by weight, hydroxymethyl cellulose 10-20 parts by weight, natural rubber 15-20 parts by weight, nano zine oxide 5-8 weight
Part, tackifying resin 10-15 parts by weight, curing agent 8-12 parts by weight.
Each component of the present invention is prior art, is conventional commercial.
The invention objective of the present invention is to add other components in existing organic silicon adhesive to strengthen its adhesion strength, simultaneously
Avoid cull.
Wherein, polysiloxanes has certain heat resistance and water proofing property, it is possible to increase organic silicon adhesive at high temperature and
Adhesion strength in wet environment.
Wherein, silica and nano zine oxide are filler, by increasing capacitance it is possible to increase the intensity of organic silicon adhesive.
Wherein, MQ resins have good mechanical performance and high temperature resistant, are cooperated together with other components, can be effective
Improve the adhesion strength of organic silicon adhesive.
Wherein, hydroxymethyl cellulose not only itself has certain intensity, and can be used in connecting each component, then
The stability and adhesion strength of organic silicon adhesive are effectively improved, the addition of hydroxymethyl cellulose can not be excessive, although excessive
Intensity increase, but adhesion strength can reduce.
Wherein, natural rubber has stronger viscous stickiness, can effectively improve the adhesion strength for improving organic silicon adhesive.
Wherein, tackifying resin can also improve the adhesion strength of organic silicon adhesive.
Applicant is had found by lot of experiments：The component of ratio of the present invention is added into organic silicon adhesive, especially
It is rationally to add a certain amount of hydroxymethyl cellulose, can not only effectively strengthens the adhesion strength of organic silicon adhesive, avoid simultaneously
Cull；Compared with existing organic silicon adhesive, adhesion strength improves 20%-30%.
Further, the weight of organic silicon adhesive and hydroxymethyl cellulose ratio is 2-3:1.
Applicant is had found by many experiments：The weight of organic silicon adhesive and hydroxymethyl cellulose ratio is 2-3:1 full
On the premise of sufficient strength demand, the adhesion strength of organic silicon adhesive can be effectively increased.
Further, the thickness of adhesive layer is the 2/3 of substrate layer thickness.
There is preferable adhesion strength under aforementioned proportion.
Further, machine si adhesion layer is made up of following parts by weight of component：
Organic silicon adhesive 30-50 parts by weight, polysiloxanes 10-20 parts by weight, silica 1 0-15 parts by weight, MQ trees
Fat 20-30 parts by weight, hydroxymethyl cellulose 10-20 parts by weight, natural rubber 15-20 parts by weight, nano zine oxide 5-8 weight
Part, tackifying resin 10-15 parts by weight, curing agent 8-12 parts by weight.
Further, machine si adhesion layer is made up of following parts by weight of component：
Organic silicon adhesive 35-40 parts by weight, polysiloxanes 15-20 parts by weight, silica 1 0-15 parts by weight, MQ trees
Fat 25-30 parts by weight, hydroxymethyl cellulose 10-15 parts by weight, natural rubber 15-20 parts by weight, nano zine oxide 5-8 weight
Part, tackifying resin 10-15 parts by weight, curing agent 8-10 parts by weight.
Further, machine si adhesion layer is made up of following parts by weight of component：
The parts by weight of organic silicon adhesive 40, the parts by weight of polysiloxanes 15, the parts by weight of silica 12, the weight of MQ resins 25
Part, the parts by weight of hydroxymethyl cellulose 15, the parts by weight of natural rubber 20, the parts by weight of nano zine oxide 8, the parts by weight of tackifying resin 15,
The parts by weight of curing agent 12.
Further, machine si adhesion layer also includes acrylic resin 10-12 parts by weight.
The addition of the acrylic resin can improve the adhesion strength of organic silicon adhesive to a certain extent.
Further, machine si adhesion layer also includes antioxidant 5-6 parts by weight, preservative 8-10 parts by weight.
The antioxidant and preservative are prior art, are commercially available.
The antioxidant and preservative can improve the stability of silicone adhesive layer, it is ensured that the persistence of adhesion strength.
Further, machine si adhesion layer also includes toughener 10-12 parts by weight, reinforcing agent 8-10 parts by weight.
The toughener and reinforcing agent are prior art, are commercially available.
The addition of toughener and reinforcing agent can increase the toughness and intensity of silicone adhesive layer.
A kind of preparation method of diaphragm, comprises the following steps：
1), required each component raw material is weighed by fraction scale；
2), take organic silicon adhesive, polysiloxanes, MQ resins and natural rubber to be put into reactor, heat, start simultaneously at
Stirring, is well mixed each material；
3), when temperature is heated to 80-90 DEG C, silica, hydroxymethyl cellulose, nano zine oxide are added into reactor
And tackifying resin, after 30-60min, curing agent is added, 30-40min is persistently stirred and obtains silicone adhesive；
4), the machine silicon adhesive that step 3) obtains uniformly is applied on substrate layer and forms adhesive layer, then peel ply is pasted
Close and obtain diaphragm in adhesive layer, the thickness that the machine silicon adhesive is smeared is the 2/3 of substrate layer thickness.
By rationally controlling the order of addition of each component with rationally controlling temperature in the method for the invention so that prepare
Machine silicon adhesive uniformity it is good, adhesion strength is high.
The present invention compared with prior art, has the following advantages and advantages：
Diaphragm of the present invention can not only effectively strengthen the adhesion strength of organic silicon adhesive, while avoid cull, with
Existing organic silicon adhesive is compared, and adhesion strength improves 20%-30%.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment, the present invention is made
Further to describe in detail, exemplary embodiment of the invention and its explanation are only used for explaining the present invention, are not intended as to this
The restriction of invention.
Embodiment 1：
Suitable for the diaphragm of photovoltaic, including substrate layer and the adhesive layer that is located on substrate layer, and be fitted in viscous
The peel ply on layer is closed, the thickness of the adhesive layer is the 2/3 of substrate layer thickness, and the adhesive layer is silicone adhesive layer, by
Following parts by weight of component composition：
The parts by weight of organic silicon adhesive 30, the parts by weight of polysiloxanes 20, the parts by weight of silica 15, the weight of MQ resins 20
Part, the parts by weight of hydroxymethyl cellulose 20, the parts by weight of natural rubber 15, the parts by weight of nano zine oxide 8, the parts by weight of tackifying resin 10,
The parts by weight of curing agent 8.
Embodiment 2：
The present embodiment is based on embodiment 1, and the difference with embodiment 1 is：The adhesive layer is silicone adhesive layer, by with
Lower parts by weight of component composition：
The parts by weight of organic silicon adhesive 50, the parts by weight of polysiloxanes 10, the parts by weight of silica 10, the weight of MQ resins 30
Part, the parts by weight of hydroxymethyl cellulose 10, the parts by weight of natural rubber 20, the parts by weight of nano zine oxide 5, the parts by weight of tackifying resin 15,
The parts by weight of curing agent 12.
Embodiment 3：
The present embodiment is based on embodiment 1, and the difference with embodiment 1 is：The adhesive layer is silicone adhesive layer, by with
Lower parts by weight of component composition：
The parts by weight of organic silicon adhesive 35, the parts by weight of polysiloxanes 20, the parts by weight of silica 15, the weight of MQ resins 30
Part, the parts by weight of hydroxymethyl cellulose 10, the parts by weight of natural rubber 15, the parts by weight of nano zine oxide 5, the parts by weight of tackifying resin 10,
The parts by weight of curing agent 10.
Embodiment 4：
The present embodiment is based on embodiment 1, and the difference with embodiment 1 is：The adhesive layer is silicone adhesive layer, by with
Lower parts by weight of component composition：
The parts by weight of organic silicon adhesive 40, the parts by weight of polysiloxanes 15, the parts by weight of silica 12, the weight of MQ resins 25
Part, the parts by weight of hydroxymethyl cellulose 15, the parts by weight of natural rubber 20, the parts by weight of nano zine oxide 8, the parts by weight of tackifying resin 15,
The parts by weight of curing agent 12.
Embodiment 5：
The present embodiment is based on embodiment 1, and the difference with embodiment 1 is：The adhesive layer is silicone adhesive layer, by with
Lower parts by weight of component composition：
The parts by weight of organic silicon adhesive 40, the parts by weight of polysiloxanes 20, the parts by weight of silica 15, the weight of MQ resins 20
Part, the parts by weight of hydroxymethyl cellulose 20, the parts by weight of natural rubber 20, the parts by weight of nano zine oxide 8, the parts by weight of tackifying resin 15,
The parts by weight of curing agent 12.
Embodiment 6：
The present embodiment is based on embodiment 1, and the difference with embodiment 1 is：The adhesive layer is silicone adhesive layer, by with
Lower parts by weight of component composition：
The parts by weight of organic silicon adhesive 30, the parts by weight of polysiloxanes 15, the parts by weight of silica 10, the weight of MQ resins 20
Part, the parts by weight of hydroxymethyl cellulose 10, the parts by weight of natural rubber 15, the parts by weight of nano zine oxide 5, the parts by weight of tackifying resin 10,
The parts by weight of curing agent 8.
Embodiment 7：
The present embodiment is based on embodiment 6, and the difference with embodiment 6 is：Also include the parts by weight of acrylic resin 10, antioxygen
The parts by weight of agent 5, the parts by weight of preservative 8, the parts by weight of toughener 10, the parts by weight of reinforcing agent 8.
Embodiment 8：
The present embodiment is based on embodiment 5, and the difference with embodiment 5 is：Also include the parts by weight of acrylic resin 2, antioxygen
The parts by weight of agent 6, the parts by weight of preservative 10, the parts by weight of toughener 12, the parts by weight of reinforcing agent 10.
Comparative example 1：
This comparative example is based on embodiment 6, and the difference with embodiment 6 is：Without hydroxymethyl cellulose.
Comparative example 2：
This comparative example is based on embodiment 6, and the difference with embodiment 6 is：Without MQ resins and natural rubber.
Comparative example 3：
This comparative example is based on embodiment 6, and the difference with embodiment 6 is：Without hydroxymethyl cellulose, MQ resins and natural
Rubber.
Comparative example 4：
This comparative example is based on embodiment 6, and the difference with embodiment 6 is：Hydroxymethyl cellulose is 40 parts by weight.
Comparative example 5：
This comparative example is based on embodiment 6, and the difference with embodiment 6 is：The parts by weight of hydroxymethyl cellulose 60.
Comparative example 6：
Commercially available organic silicon adhesive.
A kind of preparation method of the diaphragm as described in embodiment 1 to any one of embodiment 8, comprises the following steps：
1), required each component raw material is weighed by fraction scale；
2), take organic silicon adhesive, polysiloxanes, MQ resins and natural rubber to be put into reactor, heat, start simultaneously at
Stirring, is well mixed each material；
3), when temperature is heated to 80-90 DEG C, silica, hydroxymethyl cellulose, nano zine oxide are added into reactor
And tackifying resin, after 30-60min, curing agent is added, 30-40min is persistently stirred and obtains silicone adhesive；
4), the machine silicon adhesive that step 3) obtains uniformly is applied on substrate layer and forms adhesive layer, then peel ply is pasted
Close and obtain diaphragm in adhesive layer, the thickness that the machine silicon adhesive is smeared is the 2/3 of substrate layer thickness.
1st, embodiment 1 to embodiment 8, comparative example 1 to comparative example 6 are used for degumming, cull is tested：
Observe by the naked eye adhesive layer：Embodiment 1 to embodiment 8, comparative example 1 to comparative example 6 does not have degumming phenomenon.
Diaphragm is pasted onto on glass, the residue then torn on sight glass：Comparative example 1, comparative example 2, contrast
Have cull in example 6, its with without cull.
There is above-mentioned comparative test to draw, diaphragm of the present invention has the advantages of not degumming, and passes through addition
Hydroxymethyl cellulose, the problem of can effectively avoiding using rear cull.
2nd, embodiment 1 to embodiment 8, comparative example 1 to comparative example 6 are used for adhesion test,
The detection method of adhesion strength：The test surfaces of test agent are bonded on glass, then the press fit device pressurization 3 with 2Kg
It is individual to come and go, place in 23 DEG C of * 65%RH environment, after 20min, 24hr, 48hr, 72hr, be placed in fixture and carried out with 300mm/min
180 ° of arm-tie tests, record data, a kind of two samples of sample parallel determination, result of the test of averaging is as shown in table 1, table 2：
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | |
| Adhesion strength (20min/N) | 14.5 | 14.6 | 14.3 | 14.8 | 16.1 | 16.4 | 16.7 |
| Adhesion strength (24hr/N) | 14.2 | 14.5 | 14.1 | 14.6 | 15.8 | 16.3 | 16.6 |
| Adhesion strength (48hr/N) | 14.2 | 14.3 | 13.9 | 14.3 | 15.6 | 16.1 | 16.7 |
| Adhesion strength (72hr/N) | 14.1 | 13.9 | 13.6 | 14.0 | 15.4 | 15.9 | 16.5 |
Table 2
| Embodiment 8 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | Comparative example 6 | |
| Adhesion strength (20min/N) | 16.5 | 12.8 | 12.6 | 11.4 | 11.8 | 9.8 | 10.8 |
| Adhesion strength (24hr/N) | 16.5 | 14.7 | 12.6 | 11.3 | 11.8 | 9.8 | 10.6 |
| Adhesion strength (48hr/N) | 16.4 | 12.5 | 12.5 | 10.9 | 11.7 | 9.7 | 10.3 |
| Adhesion strength (72hr/N) | 16.4 | 12.1 | 12.4 | 10.6 | 11.7 | 9.6 | 9.8 |
From the experimental data of table 1, table 2：
Diaphragm of the present invention is respectively provided with good adhesion strength, and compared with commercially available organic silicon adhesive, adhesion strength improves
20-30% or so, especially when the weight of organic silicon adhesive and hydroxymethyl cellulose ratio is 2-3:When 1, adhesion strength is more preferably.
When without hydroxymethyl cellulose or without MQ resins and during natural rubber, adhesion strength somewhat reduces, and is free of when simultaneously
When hydroxymethyl cellulose, MQ resins and natural rubber, adhesion strength substantially reduces；When hydroxymethyl cellulose too high levels, adhesion
Power substantially reduces, and especially when hydroxylmethyl cellulose cellulose content is 2 times of organic silicon adhesive, adhesion strength is than commercially available organic silica gel
Stick is also low.
When being added with antioxidant, preservative, toughener, reinforcing agent in component, the stability of adhesion strength is more preferable.
Above-described embodiment, the purpose of the present invention, technical scheme and beneficial effect are carried out further
Describe in detail, should be understood that the embodiment that the foregoing is only the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution and improvements done etc., all should include
Within protection scope of the present invention.
Claims (10)
1. suitable for the diaphragm of photovoltaic, including substrate layer and the adhesive layer that is located on substrate layer, and it is fitted in bonding
Peel ply on layer, it is characterised in that the adhesive layer is silicone adhesive layer, including following parts by weight of component composition：
Organic silicon adhesive 30-50 parts by weight, polysiloxanes 10-20 parts by weight, silica 1 0-15 parts by weight, MQ resins 20-
30 parts by weight, hydroxymethyl cellulose 10-20 parts by weight, natural rubber 15-20 parts by weight, nano zine oxide 5-8 parts by weight, thickening
Resin 10-15 parts by weight, curing agent 8-12 parts by weight.
2. the diaphragm according to claim 1 suitable for photovoltaic, it is characterised in that the organic silicon adhesive and
The weight ratio of hydroxymethyl cellulose is 2-3:1.
3. the diaphragm according to claim 1 suitable for photovoltaic, it is characterised in that the thickness of the adhesive layer is
The 2/3 of substrate layer thickness.
4. the diaphragm according to claim 1 suitable for photovoltaic, it is characterised in that the machine si adhesion layer by with
Lower parts by weight of component composition：
Organic silicon adhesive 30-50 parts by weight, polysiloxanes 10-20 parts by weight, silica 1 0-15 parts by weight, MQ resins 20-
30 parts by weight, hydroxymethyl cellulose 10-20 parts by weight, natural rubber 15-20 parts by weight, nano zine oxide 5-8 parts by weight, thickening
Resin 10-15 parts by weight, curing agent 8-12 parts by weight.
5. the diaphragm according to claim 1 suitable for photovoltaic, it is characterised in that the machine si adhesion layer by with
Lower parts by weight of component composition：
Organic silicon adhesive 35-40 parts by weight, polysiloxanes 15-20 parts by weight, silica 1 0-15 parts by weight, MQ resins 25-
30 parts by weight, hydroxymethyl cellulose 10-15 parts by weight, natural rubber 15-20 parts by weight, nano zine oxide 5-8 parts by weight, thickening
Resin 10-15 parts by weight, curing agent 8-10 parts by weight.
6. the diaphragm according to claim 1 suitable for photovoltaic, it is characterised in that the machine si adhesion layer by with
Lower parts by weight of component composition：
The parts by weight of organic silicon adhesive 40, the parts by weight of polysiloxanes 15, the parts by weight of silica 12, the parts by weight of MQ resins 25, hydroxyl
The parts by weight of methylcellulose 15, the parts by weight of natural rubber 20, the parts by weight of nano zine oxide 8, the parts by weight of tackifying resin 15, curing agent
12 parts by weight.
7. the diaphragm according to claim 1 suitable for photovoltaic, it is characterised in that the machine si adhesion layer is also wrapped
Include acrylic resin 10-12 parts by weight.
8. the diaphragm according to claim 1 suitable for photovoltaic, it is characterised in that the machine si adhesion layer is also wrapped
Include antioxidant 5-6 parts by weight, preservative 8-10 parts by weight.
9. the diaphragm according to claim 1 suitable for photovoltaic, it is characterised in that the machine si adhesion layer is also wrapped
Include toughener 10-12 parts by weight, reinforcing agent 8-10 parts by weight.
10. a kind of preparation method of the diaphragm as described in claim any one of 1-9, it is characterised in that comprise the following steps：
1), required each component raw material is weighed by fraction scale；
2), take organic silicon adhesive, polysiloxanes, MQ resins and natural rubber to be put into reactor, heat, start simultaneously at and stir
Mix, be well mixed each material；
3), when temperature is heated to 80-90 DEG C, silica, hydroxymethyl cellulose, nano zine oxide and increasing are added into reactor
Viscosity resin, after 30-60min, adds curing agent, persistently stirs 30-40min and obtains silicone adhesive；
4), the machine silicon adhesive that step 3) obtains uniformly is applied on substrate layer and forms adhesive layer, then peel ply is fitted in
Adhesive layer obtains diaphragm, and the thickness that the machine silicon adhesive is smeared is the 2/3 of substrate layer thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710972248.8A CN107652940A (en) | 2017-10-18 | 2017-10-18 | Diaphragm suitable for photovoltaic and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710972248.8A CN107652940A (en) | 2017-10-18 | 2017-10-18 | Diaphragm suitable for photovoltaic and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107652940A true CN107652940A (en) | 2018-02-02 |
Family
ID=61118314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710972248.8A Pending CN107652940A (en) | 2017-10-18 | 2017-10-18 | Diaphragm suitable for photovoltaic and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107652940A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112852325A (en) * | 2020-12-31 | 2021-05-28 | 东莞市深丰光电科技有限公司 | PET composite polyester protective film and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102702532A (en) * | 2012-05-31 | 2012-10-03 | 中科院广州化学有限公司 | Method for preparing organosilicone hybrid resin and power type encapsulating material for light-emitting diodes (LED) thereof and application |
-
2017
- 2017-10-18 CN CN201710972248.8A patent/CN107652940A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102702532A (en) * | 2012-05-31 | 2012-10-03 | 中科院广州化学有限公司 | Method for preparing organosilicone hybrid resin and power type encapsulating material for light-emitting diodes (LED) thereof and application |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112852325A (en) * | 2020-12-31 | 2021-05-28 | 东莞市深丰光电科技有限公司 | PET composite polyester protective film and preparation method thereof |
| CN112852325B (en) * | 2020-12-31 | 2022-05-27 | 东莞市深丰光电科技有限公司 | PET composite polyester protective film and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102010687B (en) | Fast curing reaction type hot melt adhesive and preparation method thereof | |
| CN107286901B (en) | Touch screen full-lamination frame glue and preparation method thereof | |
| CN103666250A (en) | Organic silicon coating rubber and preparation method thereof | |
| CN103265895A (en) | Solvent type chloroprene rubber adhesive with excellent weather ability and preparation method thereof | |
| CN107513367B (en) | Dealcoholized storage-resistant RTV electronic coating adhesive and preparation method thereof | |
| CN104130740A (en) | High stripping force PET (polyethylene terephthalate) protective film pressure sensitive adhesive and preparation method thereof | |
| CN112625218B (en) | Epoxy resin for cutting water-resistant silicon rod and preparation method thereof | |
| CN107238877B (en) | Optical film, display panel module and manufacturing method thereof | |
| CN114058313B (en) | High-adhesion thermosetting adhesive film and preparation method and application thereof | |
| CN107390303B (en) | Optical film, display panel module and manufacturing method thereof | |
| CN107652940A (en) | Diaphragm suitable for photovoltaic and preparation method thereof | |
| CN104312403B (en) | Environment-friendly type aqueous OP protective coating of single-component low temperature solidification and preparation method | |
| CN112662343A (en) | BR and CR blended vulcanized rubber adhesive and preparation method thereof | |
| CN110628369B (en) | Hot melt adhesive capable of being repeatedly attached and preparation method thereof | |
| CN108484916B (en) | Modified vinyl silicone oil, preparation method thereof, printing silica gel base adhesive containing modified vinyl silicone oil, and printing silica gel | |
| CN114316888B (en) | Single-component ketoxime type silicone adhesive and preparation method thereof | |
| CN107474780A (en) | A kind of plastic-aluminum combined bonding agent and plastic-aluminum combined method | |
| CN104031595A (en) | Polyurethane adhesive and manufacturing method and application method thereof | |
| CN105273681B (en) | Modified inorganic Nano filling, additional organosilicon adhesive and preparation method thereof | |
| CN113403004A (en) | Environment-friendly high-adhesion box pasting adhesive and preparation method thereof | |
| CN105368369A (en) | Method for preparing polyurethane adhesive used for timber | |
| CN109837044A (en) | A kind of electronic apparatus adhesive, preparation method and adhesive tape | |
| CN112574679A (en) | Ultra-silent no-backing paper cold laminating film | |
| CN108531126A (en) | A kind of organic pressure-sensitive gel containing boron modification MQ organic silicon rigidity-increasing sticks | |
| CN115197668B (en) | Formula and process of novel transparent high-hardness high-strength modified silica gel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180202 |
|
| RJ01 | Rejection of invention patent application after publication |