CN107652930A - Single-component epoxy paste for harden structure - Google Patents
Single-component epoxy paste for harden structure Download PDFInfo
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- CN107652930A CN107652930A CN201610599512.3A CN201610599512A CN107652930A CN 107652930 A CN107652930 A CN 107652930A CN 201610599512 A CN201610599512 A CN 201610599512A CN 107652930 A CN107652930 A CN 107652930A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/322—Ammonium phosphate
- C08K2003/323—Ammonium polyphosphate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
This teaching relates in general to single-component epoxy system adhesive paste composition, it is included with the liquid-state epoxy resin component at least existing for 20 weight % amount of composition, a certain amount of first fire retardant and a certain amount of second fire retardant, the amount is enough to make the curable adhesive composition of gained to show the sufficient anti-flammability according to UIC 564 2, curing agent, diluent, and first filler and the second filler, it is at least about 1450N with the pulling force of 50mm/min test speed that described adhesive paste, which has when the thick adhesives of 7.5mm are embedded in honeycomb sample, when wherein solidifying.
Description
Technical field
This teaching is related to the pumpable epoxy adhesive paste of one pack system that flame retardancy characteristics improve and have a variety of curing agent
Agent (one-part pumpable epoxy-based adhesive paste) is to realize low initial curing temperature.
Background technology
(such as transported, such as in ship, railcar, motor vehicle, aircraft etc. in many industry；Architecture construction) in performance
Required step when anti-flammability, easy to use, relatively good to the performance of the intended target, and/or use treatment compositions to be intended to
The improved composition that number reduces has constant demand.The example of such application includes adhesive or other compositions, for sealing
Dress, edge sealings, local reinforcement and/or one or more objects are (such as with hollow section, chamber and/or containing gap structure
Object) core splicing.This kind of type objects are usually using the honeycomb panel of type in aerospace applications.
Although two-part formulations often provide good performance, they tend to by relatively short working life, that is, press
ASTM D1338-99 (2011) are determined.As a result, it is relative to the available time quantum of condition of cure from the component for providing formula
It is short, and limit its ability for suitably shaping and being positioned in desired position.That is, because many two-part formulations at room temperature may be used
Solidification, will have the formation of solidification from the time of blending ingredients, and this will increase the firm of viscosity and caused resulting materials therewith
Property.The formation of viscosity and therewith caused rigidity hinder to apply or apply through nozzle (such as pump or rifle) by hand.
It was found that the example of the commercially available material of similar application (is one pack system thermal curable including L-9001 and L-9003
Epoxy system: compositions), it can be bought from L＆L Products, Inc. (Romeo, MI, USA).
Although much composition meets some of the demand, manufacture and/or use, side to simplifying composition
Help the amount of the such composition needed for reducing or meet that the improved material of some other demands persistently has demand.Especially to carrying
(such as so that filling cavity or other spaces, or in its working life allow operation easy in addition for the appropriate balance of viscosity
Property) and good intensity obtained by during solidification and/or the other material of modulus properties (such as compression in) have demand.
The content of the invention
This patent disclosure relates generally to one pack system heat curable composition.Composition can be one-package adhesive paste composition.
For example, composition can be single-component epoxy system adhesive paste composition.Composition may include liquid-state epoxy resin component.
Teaching herein provides single-component epoxy system adhesive paste composition, and it includes liquid-state epoxy resin component, one
The first quantitative fire retardant and a certain amount of second fire retardant (make enough to make the curable adhesive composition of gained show root
According to UIC 564-2 sufficient anti-flammability), curing agent, diluent, and the first filler and the second filler.It is described viscous during solidification
Paste mixture has when the thick adhesives of 7.5mm are embedded in honeycomb sample with the pulling force of 50mm/min test speed for extremely
Few about 1450N.
Paste can be pumpable.Paste in the curing process can be substantially without flowing.Adhesive can bond fastener
To the plate for having multiple openings.Density when adhesive solidifies can be about 1.2g/cm3To about 1.8g/cm3.Adhesive can be about 140
DEG C to the time for solidifying about 15 minutes to about 8 hours at a temperature of about 180 DEG C.Adhesive can solidify at a temperature of about 160 DEG C
The time of about 30 minutes.Adhesive can self-gravitation after being contacted less than 5 seconds with fire.Adhesive can after being contacted less than 2 seconds with fire
Self-gravitation (self-extinguish).First filler can be ceramic material.Second filler can be earth silicon material.Paste can
Including curing agent accelerator.First filler feature can be about 1 micron to about 8 microns of particle diameter.
This teaching further provides for the method for fastener to be attached to cellular board, and methods described includes providing one pack system
Epoxy paste；It is provided with the cellular board of multiple openings；Epoxy paste is pumped into or daubed into the one or more of multiple openings
In；Fastener is positioned into one or more openings containing paste；And solidify the epoxy paste.
Embodiment
The explanation and illustration shown herein is intended to make others skilled in the art know the present invention, its principle and its practice
Using.The specific embodiments of the present invention of explanation are not intended to the exhaustive or limitation present invention.The scope of the present invention should refer to appended
Claim, with authorizing the four corner of equivalent of claim to come together to determine.All articles and bibliography
It is open, including patent application and announcement, it is incorporated by reference into for all purposes.Other combinations and possible, will be from following
Claim is collected, and it is also by being incorporated by this printed instructions.
This teaching relates in general to one pack system heat curable composition.Composition can be single-component epoxy system adhesive paste group
Compound.Composition may include epoxy resin component.Composition may include at least two different filler materials.Composition can also wrap
Include a certain amount of fire retardant (such as halogen-free flame-retardant, such as phosphonium flame retardant), it is sufficient to solidify adhesive paste composition
When will meet that UIC 564-2 such as (are related to passenger trains vehicle or assimilation vehicle (assimilated that international service uses
Vehicle) in fire prevention and fire protection regulation, by quote be fully incorporated for all purposes) illustrated to anti-flammability
Requirement.A certain amount of curing agent may include in the composition.Curing agent accelerator is available in the composition.Blend asphalt mixtures modified by epoxy resin
Fat, filler, any fire retardant and curing agent, to determine the blend of basic homogeneous, thereby determine that the block of adhesive paste.Gu
Change may be less than 2 hours, less than 1 hour or the time of even less than 40 minutes.In addition, it can avoid to double portion's blend (two-
Part admixture) demand and associated possible inconvenience.
As used herein, substantially all solidification refers to elapse over time, and this paper material is in its engineering properties
Substantially the solid state of change is not showed.Paste composition described herein can solidify when contacting thermal source, and can be in such as ASTM
The Shore D hardness (Shore D hardness) for the composition that D-2240-05 is determined is considered as substantially completely when being at least about 20
Solidification.
More complete record is carried out to the composition of composition now.Epoxy resin ingredient may include liquid-state epoxy resin group
Point.The viscosity (cps at 25 DEG C) of epoxy resin ingredient can be about 11,000-14,000.Liquid-state epoxy resin may originate from bis-phenol
A.Liquid-state epoxy resin can have the epoxide equivalent of about 184 to the about 190 grams/equivalent (g/eq) according to ASTM D-1652-11e1
Weight.Liquid-state epoxy resin can by least about 10 weight % of adhesive composition, at least about 20 weight % or even at least about
30 weight % amount is present.Liquid-state epoxy resin can by adhesive composition be less than about 60 weight %, less than about 50 weight %,
Or the amount for being even less than about 40 weight % is present.The example of commercially available liquid-state epoxy resin is YD-128, can be from Kukdo
Chemical Co., Seoul, Korea are bought.
Adhesive can include diluent, and it can be epoxy resin diluent.Epoxy resin diluent can be epichlorohydrin and gather
The reaction product of propane diols.Epoxy resin diluent can be about 50 according to viscosity (cps) of the ASTM D-445-14e2 at 25 DEG C
To about 80, e.g., from about 60 to 70.Epoxy resin diluent can according to ASTM D-1652-11e1 epoxy equivalent weights (g/eq)
It is about 290 to about 350, e.g., from about 310 to about 330.Epoxy resin diluent can be by least about 3 weights of adhesive composition
The amount for measuring %, at least about 5 weight % or even at least about 8 weight % is present.Epoxy resin diluent can be by adhesive composition
Be less than about 20 weight %, less than about 15 weight % or be even less than about 10 weight % amount exist.Epoxy resin diluent can
It is commercially available, such as can be from the D.E.R.732 that Dow Chemical are bought.
Filler may include at least the first filler and the second filler.First filler and/or the second filler can be organic filler, nothing
Machine filler or combination.First filler and/or the second filler can be hollow packing.First filler and/or the second filler can
Including hollow particle, it can be glass microsphere.First filler substantially can be made up of ceramic microsphere.First filler and/or second
Filler can be the geometry extended.First filler and/or the second filler can be spherical geometry.First filler and/or
Second filler can be the form of granulating.Any filler can be the form of rod, pearl, palpus, disk or its any combination.It is any to fill out
Material may include silicon.Any filler may include amorphous silica.Any filler may include soda-lime borosilicate glass
Glass (soda lime borosilicate glass).Second filler substantially can be made up of pyrogenic silica.Filler can
By relative to total epoxy component by weight about 1:5 to about 3:1, e.g., from about 1:3 to about 2:1, or even about 1:1 filler
Ratio is present.Epoxy is about 5 relative to the weight ratio of filler:1 to about 1:2.Filler may include or can be substantially by being characterized as grain
The hollow glass microballoon composition that about 1 micron to about 8 microns of footpath.
Fire retardant may include the first fire retardant and the second fire retardant.First fire retardant may include the compound that phosphorus be present.The
One fire retardant may include polyphosphate.For example, it may include ammonium polyphosphate.The example of commercially available fire retardant is workable for this paper
Can be from JLS-PNP1C-LL the or JLS APP that JLS is bought.Second fire retardant may include aluminium hydroxide.
By way of example, fire retardant altogether can be by about 10 to about 40 weight percents of the composition total weight of teaching
The amount of number, e.g., from about 15 to about 30 percetages by weight, or even about 20 to about 25 percetages by weight is present.Fire retardant is relative to ring
The part by weight amount of oxygen tree fat can be about 2:1 to about 1:3, e.g., from about 1:1.First fire retardant relative to the second fire retardant weight
Proportional quantities can be about 3:1 to about 1:3, e.g., from about 1:2.
One or more curing agent may include suitable epoxy hardener.They may include curing agent accelerator.It is a kind of or
A variety of curing agent can have one or more amine degrees of functionality.Curing agent may include or is made up of polyamide.Curing agent may include
Or be made up of aliphatic amine, such as it may include or is made up of multifunctional aliphatic amine.Curing agent may include cycloaliphatic amines.Solidification
Agent may include one or more imidazole functionalities.The example of commercially available curing agent includes but is not limited to can be from Air Products
Commercially available Dicyanex1400F, the Omicure U-52M commercially available from CVC Thermoset Specialties.
The time of 2 hours is no more than about when adhesive paste composition is cured condition (such as elevated temperature), Gu
The amount of agent is enough to cause adhesive paste composition to be cured to the state of being fully cured.By way of explanation, curing agent can be pressed
To about the 1 of epoxy resin total amount:1 to about 1:20, e.g., from about 1:15 part by weight amount is present.
Can be thickness to obtain the size for the adhesive composition block into solidification rate teaching herein, instructed herein
Degree below about 100mm, below about 50mm, below about 30mm, below about 20mm or even below about 10mm, (such as thickness can be
About 1mm, about 2mm, about 3mm, about 4mm, about 5mm, about 6mm, about 7mm, about 8mm, about 9mm or about 10mm).Long and/or width can be
About 3 meters, about 2 meters, about 1 meter, about 0.5 meter, about 0.3 meter or smaller scope.
Impact modifier may include in adhesive composition disclosed herein.Impact modifier may include one or more
Core/shell polymeric.As used herein, term core/shell polymeric describes impact modifier, and wherein its substantial portion is (such as big
In 30 weight %, 50 weight %, more than 70 weight %) by substantially completely being encapsulated by the second polymeric material (i.e. second or shell material)
The first polymeric material (i.e. first or core material) composition.As used herein first and second polymeric material can include combination
And/or the one kind of (such as polymerizeing successively) of one reacting, two kinds, three or more polymer, or can be separation or identical core/
The part of shell systems.First polymeric material, the second polymeric material or both cores/shell impact modifier include or by a kind of or more
Kind thermoplastic composition (for example, at least 70 weight %, 80 weight %, more than 90 weight %).Exemplary thermoplastic's plastics include
But it is not limited to phenylethylene, vinyl cyanide, esters of acrylic acid, acetates, polyamide-based, polyethylene kind etc..For first or
The glass transition temperature of core polymeric material, it may be desirable to less than 23 DEG C, and second or shell polymeric material glass transition temperature it is high
In 23 DEG C, although being not essential.
The example of useful core-shell graft copolymer is, such as styrene, acrylonitrile or methyl methacrylate etc. are containing hard
Matter compound be grafted on by such as butadiene or butyl acrylate containing soft or elastomer compounds polymer made of core
On core-shell graft copolymer.By quote be incorporated into this paper U.S. Patent number 3,985,703 describe useful core-
Shell polymeric, its core are made up of butyl acrylate, but can be based on ethyl acrylate, isobutyl acrylate, acrylic acid 2- ethyl hexyls
Base ester or other alkyl acrylates or its mixture.Core polymer may also comprise other and contain copolymerizable compound, such as benzene second
Alkene, vinyl acetate, methyl methacrylate, butadiene or isoprene etc..Shell parts can from methyl methacrylate and appoint
The other alkyl methacrylates of selection of land, such as EMA, butyl methacrylate or the polymerization of its mixture.Core-
The example of shell graft copolymer includes but is not limited to " MBS " (metacrylate-butadiene-styrene) polymer, and it passes through
The polymerizing methyl methacrylate in the presence of polybutadiene or polybutadiene copolymer rubber and be made.MBS graft copolymers
Resin generally has styrene butadiene ribber core and the shell of acrylate copolymer or copolymer.Other useful core-shell grafting
The example of copolymer resin includes ABS (acrylonitrile-butadiene-styrene (ABS)), MABS (methacrylate-acrylonitrile-fourths two
Alkene-styrene), ASA (Acrylate-styrene bipolymer-acrylonitrile), all acrylic compounds, SA EPDM (styrene-acrylonitrile grafts
In the elastomer matrix of ethylene-propylendiene monomer), MAS (methacrylic acid-acrylic acid rubber styrene) etc. and its mixing
Thing.
Other additives may include in the composition of this teaching, including UV stabilizer, antioxidant, processing aid, hair
Infusion, plasticizer, curing accelerator, colouring agent, impact modifier, toughener, thickener or reinforcement (such as fibrous reinforcement)
It is one or more.The composition of this teaching can be by releasing layer, operation film or the two offer.
Be blended in give to be blended under conditions of point relatively low shearing force and carry out, thereby aid in avoid can induce it is solid too early
The heat production of change.
The block of adhesive paste can be pumpable form.Composition can honeycomb style (such as non-metal honeycomb form,
Such as the core of interlayer layered product) space in apply.Adhesive can be used for installing one or more second devices (such as pacifying
It is filled to any mechanical fastening device of cellular board).
Composition is positively retained under the conditions of refrigeration (such as freezing) until when its intention uses.Composition is positively retained at room temperature
Down until when its intention uses.For example, teaching herein prediction by this paper composition be maintained at less than about 10 DEG C, 5 DEG C, 0
DEG C, at a temperature of -10 DEG C or even -20 DEG C.It is being intended in use, teaching prediction makes this paper composition be exposed to activation condition
(such as hot, wet, radiation or other).For example, teaching makes composition be warmed to predetermined temperature (e.g., from about more than 23 DEG C)
The sufficient time so that the substantially homogeneous solidification of composition spreads all over the step of composition occurs substantially.
Teaching herein find transportation industry (such as in motor vehicle, aircraft, rail vehicle or other, for example,
Used in harden structure), the application in industrial (such as wallboard) or other is built.
Following table 1-3 composition is blended with low shear mixing, to avoid producing excessive heat.
Table 1
| Composition | Parts by weight |
| Liquid-state epoxy resin | 30.13 |
| Fire retardant (aluminium hydroxide) | 16.44 |
| Fire retardant (ammonium polyphosphate) | 8.22 |
| Curing agent | 1.64 |
| Curing agent accelerator | 0.41 |
| Filler (ceramics) | 27.39 |
| Filler (silica) | 0.82 |
| Diluent | 8.77 |
| Impact modifier | 6.17 |
| Amount to | 100.00 |
The composition of table 1 is shown when the thick adhesives of 7.5mm are embedded in honeycomb sample with 50mm/min experiment
The pulling force of speed is 1630N.Composition shows good flame-retardant nature, and it can the self-gravitation in 2 seconds.
Table 2
| Composition | Parts by weight |
| Liquid-state epoxy resin | 25-35 |
| Fire retardant (aluminium hydroxide) | 13-18 |
| Fire retardant (ammonium polyphosphate) | 5-10 |
| Curing agent | 0.5-2 |
| Curing agent accelerator | 0.5-2 |
| Filler (ceramics) | 25-35 |
| Filler (silica) | 0.5-2 |
| Diluent | 6-11 |
| Amount to | 100.00 |
The composition of table 2 is shown when the thick adhesives of 7.5mm are embedded in honeycomb sample with 50mm/min experiment
The pulling force of speed is 1500N.Composition shows good flame-retardant nature, and it can the self-gravitation in 2 seconds.However, due to low viscosity,
Composition flows out in solidification from honeycomb.
Table 3
| Composition | Parts by weight |
| Liquid-state epoxy resin | 25-65 |
| Curing agent | 0.5-10 |
| Curing agent accelerator | 0.5-10 |
| Filler (ceramics) | 25-55 |
| Filler (silica) | 0.5-10 |
| Amount to | 100.00 |
The composition of table 3 is shown when the thick adhesives of 7.5mm are embedded in honeycomb sample with 50mm/min experiment
The pulling force of speed is 1470N.Composition does not show flame-retardant nature, and is flowed out from honeycomb when composition solidifies at 160 DEG C.
Single epoxy resin, single fire retardant and/or single filler may can be used.Two or more may also can be used
Kind fire retardant, can be used two or more fillers, two or more curing agent can be used.Using two or more resistances
Fire agent, filler or curing agent event in, may any such additional (beyond single kind) fire retardant, filler and/or
The total amount of curing agent can be by the amount for being less than about 20% or even about 10% of the total amount of the fire retardant of difference, filler or curing agent
In the presence of.Thus, such as fire retardant may include the 9 of two kinds of fire retardants:1、4:1 or even 1:1 blend；Filler may include that two kinds are filled out
The 4 of material:1 or even 10:1 blend；Or curing agent may include the 4 of two kinds of curing agent:1 or 8:1 blend.As example, resistance
The total amount for firing agent can be existed by about 20 weight % to about weight 30% amount, and single fire retardant can be by about 8 weight % to about 13
Weight % amount is present.The total amount of curing agent can be existed by about 5 weight % to about 15 weight % amount, and single curing agent can be pressed
About 0.5 weight % to about 3 weight % amount is present.The total amount of filler can be existed by about 10 weight % to about 30 weight % amount,
And single filler can be existed by about 0.5 weight % to about 3 weight % amount.
It is possible this teaching composition block will less than about 2 hours, less than about 1 hour or be even less than about 40 minutes
Time be cured to substantially completely solid state.Composition can solidify when exposed to stimulus, and stimulus can be thermal source
(such as by stove or heat by offers such as sensing heatings).Composition can exposed to scope at about 225 °F to about 300 °F,
Or solidify during even about 250 °F to about 280 °F of elevated temperature.
During solidification and after solidification, the composition of this teaching can not show contraction.
Following comment is adapted to all teachings in general manner.Unless otherwise stated, as long as between any low value and any high level
There is the interval of at least 2 units, herein cited any numerical value includes all values using 1 unit as increment from low value to high level.
It is excellent if amount, property or the process variable value of statement component, such as temperature, pressure, time etc. are such as 1 to 90 as example
Select 20 to 80, more preferably 30 to 70, it is intended that mid-range value (such as 15 to 85,22 to 68,43 to 51,30 to 32 etc.) is said herein
Within the teaching of bright book.Similarly, single median is also within this teaching.For the value less than 1,1 unit suitably regards
For 0.0001,0.001,0.01 or 0.1.The example of specific intent is only for, and institute between the minimum and peak enumerated
Possible combinations of values will be regarded as clearly stating in this application in a similar manner.It can be seen that " parts by weight " are expressed as herein
The teaching of amount be also contemplated for the same range represented in units of percetage by weight.Therefore, in the embodiment of invention,
Expression with " resulting composition ' x ' parts by weight " for the scope of unit is also contemplated for " x " percetage by weight of resulting composition
The teaching of the scope of identical recited amounts.
Unless otherwise stated, herein cited any test method standard is as the earliest submission date for enumerating the standard
Existing version.
Unless otherwise stated, all scopes include all numerals two between end points and end points.It is used in conjunction with scope
The use of "about" or "approximately" is applicable two end points of scope.Therefore, " about 20 to 30 " be intended to covering " about 20 to about 30 ", extremely
Few end points for including indicating.
The disclosure of all articles and bibliography, including patent application and announcement, are incorporated by reference into for all purposes.
Element, composition, component or the step that term "consisting essentially of ..." for describing combination should include validating that, and less shadow
Ring basic and such other elemental compositions, component or the step of new feature of combination.It is used herein to describe element, composition, group
Divide or the use of the term "comprising" or " comprising " of the combination of step is also contemplated for substantially by element, composition, component or step group
Into, or the embodiment being even made up of element, composition, component or step.Multiple elements, composition, component or step can be by lists
One overall element, composition, component or step provide.Alternatively, single overall element, composition, component or step can be divided into
Multiple elements, composition, component or the step of separation.For describing the public affairs of the "a" or "an" of element, composition, component or step
Open and be not intended to exclude other element, composition, component or step.In addition, unless explicitly stated otherwise, " first " or " second " etc. are old
State and be not excluded for other composition, step or other elements.The all references of element or metal is belonged to reference to CRC herein
Press, Inc. were published in 1989 and are gathered around some races of the copyrighted periodic table of elements.Race's (odd number) or race's (plural number) are appointed
What quotes the race's (odd number) or race's (plural number) that should be and reflected in this periodic table of elements with IUPAC systems for numbering race.
It should be understood that described above is intended to explanatory, and not it is restricted.
Many embodiments and many apply beyond the embodiment of offer will be to abilities when reading description above
Field technique personnel are obvious.Therefore the scope of the present invention reference should not be made to description above determination, and should refer to appended right and want
Ask, come together to determine with the full breadth of the equivalence of the claim of this class authority.The public affairs of all articles and bibliography
Open, including patent application and announcement, it is incorporated by reference into for all purposes.In following claims, disclosed herein
The omission of the aspect of what theme is not that this theme is abandoned stating, it is disclosed to be also not construed as inventor and do not account for this theme
The part of subject matter.
Claims (14)
1. a kind of single-component epoxy system adhesive paste composition, it includes：
A. with the liquid-state epoxy resin component at least existing for 20 weight % amount of composition；
B. a certain amount of first fire retardant and a certain amount of second fire retardant, the amount are enough the solidification adhesive combination for making gained
Thing shows the sufficient anti-flammability according to UIC 564-2；
C. curing agent；
D. diluent；With
E. the first filler and the second filler；
Wherein, described adhesive paste has and uses 50mm/ when the thick adhesives of 7.5mm are embedded in honeycomb sample during solidification
The pulling force of min test speed is at least about 1450N.
2. composition according to claim 1, wherein the paste is pumpable.
3. according to the composition described in any one of preceding claims, wherein the paste does not flow substantially in the curing process
It is dynamic.
4. according to the composition described in any one of preceding claims, fastener has been bonded to multiple open by wherein described adhesive
The plate of mouth.
5. according to the composition described in any one of preceding claims, density when wherein described adhesive solidifies is about 1.2g/
cm3To about 1.8g/cm3。
6. according to the composition described in any one of preceding claims, wherein temperature of the described adhesive at about 140 DEG C to about 180 DEG C
The time of the lower solidification about 15 minutes to about 8 hours of degree.
7. according to the composition described in any one of preceding claims, wherein described adhesive solidifies at a temperature of about 160 DEG C
The time of about 30 minutes.
8. according to the composition described in any one of preceding claims, wherein described adhesive with flame contact 5 seconds below it
Self-gravitation afterwards.
9. according to the composition described in any one of preceding claims, wherein described adhesive with flame contact 2 seconds below it
Self-gravitation afterwards.
10. according to the composition described in any one of preceding claims, wherein first filler is ceramic material.
11. according to the composition described in any one of preceding claims, wherein second filler is earth silicon material.
12. according to the composition described in any one of preceding claims, it includes curing agent accelerator.
13. according to the composition described in any one of preceding claims, wherein first filler is characterised by that particle diameter is about 1
Micron is to about 8 microns.
14. a kind of method that fastener is attached to cellular board, methods described include：
Single-component epoxy system paste is provided；It is provided with the cellular board of multiple openings；The epoxy paste is pumped into or daubed into institute
In the one or more for stating multiple openings；The fastener is positioned into one or more openings containing the paste；And
Solidify the epoxy paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610599512.3A CN107652930A (en) | 2016-07-26 | 2016-07-26 | Single-component epoxy paste for harden structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610599512.3A CN107652930A (en) | 2016-07-26 | 2016-07-26 | Single-component epoxy paste for harden structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107652930A true CN107652930A (en) | 2018-02-02 |
Family
ID=61127208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610599512.3A Pending CN107652930A (en) | 2016-07-26 | 2016-07-26 | Single-component epoxy paste for harden structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107652930A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110437782A (en) * | 2019-08-18 | 2019-11-12 | 上海回天新材料有限公司 | A kind of epoxyn and preparation method for aluminum honeycomb structure cold-press process bonding |
| CN110452649A (en) * | 2019-08-18 | 2019-11-15 | 上海回天新材料有限公司 | A kind of epoxyn for aluminum honeycomb structural bond |
| CN112105698A (en) * | 2018-03-08 | 2020-12-18 | 泽费罗斯股份有限公司 | Honeycomb core splice adhesives with improved flame retardancy |
| WO2021094292A1 (en) * | 2019-11-13 | 2021-05-20 | Zephyros, Inc. | Potting paste for honeycomb reinforcement |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105698A (en) * | 2018-03-08 | 2020-12-18 | 泽费罗斯股份有限公司 | Honeycomb core splice adhesives with improved flame retardancy |
| CN112105698B (en) * | 2018-03-08 | 2023-01-31 | 泽费罗斯股份有限公司 | Honeycomb core splicing adhesives with improved flame retardancy |
| CN110437782A (en) * | 2019-08-18 | 2019-11-12 | 上海回天新材料有限公司 | A kind of epoxyn and preparation method for aluminum honeycomb structure cold-press process bonding |
| CN110452649A (en) * | 2019-08-18 | 2019-11-15 | 上海回天新材料有限公司 | A kind of epoxyn for aluminum honeycomb structural bond |
| WO2021094292A1 (en) * | 2019-11-13 | 2021-05-20 | Zephyros, Inc. | Potting paste for honeycomb reinforcement |
| CN114981386A (en) * | 2019-11-13 | 2022-08-30 | 泽费罗斯股份有限公司 | Encapsulation paste for reinforcing honeycomb |
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