CN107262970A - High strength weldable structure band - Google Patents

High strength weldable structure band Download PDF

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Publication number
CN107262970A
CN107262970A CN201610210673.9A CN201610210673A CN107262970A CN 107262970 A CN107262970 A CN 107262970A CN 201610210673 A CN201610210673 A CN 201610210673A CN 107262970 A CN107262970 A CN 107262970A
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CN
China
Prior art keywords
weight
structure band
band according
epoxy
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610210673.9A
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Chinese (zh)
Inventor
周艳飞
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Zephyros Inc
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Zephyros Inc
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Filing date
Publication date
Application filed by Zephyros Inc filed Critical Zephyros Inc
Priority to CN201610210673.9A priority Critical patent/CN107262970A/en
Priority to PCT/US2017/026058 priority patent/WO2017176832A1/en
Publication of CN107262970A publication Critical patent/CN107262970A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J121/00—Adhesives based on unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/10—Joining materials by welding overlapping edges with an insertion of plastic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/32—Properties characterising the ingredient of the composition containing low molecular weight liquid component
    • C08L2207/324—Liquid component is low molecular weight polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention relates to high strength weldable structure band.A kind of solderable adhesive or sealant configuration including structure band, the structure band include solid rubber, liquid rubber and epoxy material, and the wherein band is solderable and substantially without any bat wool, and including any electroconductive stuffing less than about 20%.

Description

High strength weldable structure band
Technical field
The disclosure is usually directed to solderable sealant and adhesive.More specifically, this disclosure relates to including rubber The sealant and adhesive of the metal component of component and minimum (for example, below 20 weight %).
Background technology
Solderable sealant and adhesive configuration, which is generally utilized, causes sealant/adhesive to have narrow model Blank state (green state) (for example, the activation before) viscosity enclosed electroconductive stuffing (for example, carbon black, Iron phosphide, graphite, iron powder and nickel powder etc.).Compared with low viscosity so that sealant/adhesive material from base material it Between spot welding " tip " region " extrusion " carried so that electroconductive stuffing builds bridge the gap between material For the low resistance needed for suitable resistance welding.Alternatively, higher blank state viscosity tends to improve close The mechanicalness of agent/adhesive solidify afterwards (post-cure) is sealed, and improves the demand of processing, operation and packaging. However, the sealant/adhesive with the higher blank state viscosity less can fully " extrusion " so that gold Belong to base material engagement (engage) electroconductive stuffing.
The electroconductive stuffing that sealant/adhesive field is representatively used for improve solderability can be led by non- Conductive polymers material, wetting agent and plasticizer etc. are inadvertently encapsulated in adhesive or encapsulant composition Interior, it is used to provide intensity and corrosion resistance.These of electroconductive stuffing are encapsulated in its supply suppression in form System and/or limitation material are not " electric conductivity ".Only applied pressure by resistance welding and drawn by application pressure Material is set to become sufficiently thin really during the adhesive/sealant displacement (if pressure and displacement are abundant) risen Sufficient welding condition is provided with engaged conductive material.
Various non-conductive fibers shape materials are (for example, cellulose, Ke Weila (Kevlar), polyethylene, glass Glass etc.) it is also commonly used in sealant/adhesive configuration.Under blank state, fiber is to sealant/bonding Agent offer flowing control, dimensional stability, extrusion mould-outlet expansion are controlled and cracking.Unfortunately, in weldering During connecing, these conductive fillers, which have, to be prevented sealant/adhesive material from removing or is applying pressure Trend of the period from solder joint fully " extrusion ".In addition, fiber can prevent from welding filling for the gap between base material Divide and build bridge, so as to deleteriously increase resistance.Conducting fibre such as carbon fiber can help to remedy therein one A little problems, but they tend to be expensive and brittle for mixing and forming.The glass marble of nickel coating changes The conductance entered under high load level, but can be crushed under the application pressure of spot welding/resistance welding, It has deleteriously cut off the conductive path needed for suitable spot welding/resistance welding.
It is therefore desirable for be to provide and overcome the sealant/adhesive configuration of above mentioned problem to cause with high-strength The material of degree and the suitable viscosity of permission displacement forms highly solderable material.
The content of the invention
The disclosure is configured to the configuration of following structure band to meet some or all the demand by offer： The structure band include solid rubber, liquid rubber and epoxy material (epoxy), wherein the band be it is solderable and Substantially without any bat wool, and including any electroconductive stuffing less than about 20 weight %.Liquid Rubber can with least about 1 weight %, at least about 2 weight %, at least about 3 weight % or even at least about 4 weight % amount is present.Liquid rubber can be with less than about 10 weight %, less than about 7 weight % or very Exist to the amount for being less than about 5 weight %.Epoxy material can be solids epoxy thing, semi-solid epoxy material, liquid Epoxy material or its any combinations.Epoxy material may include at least about 5 weight %, at least about 10 weight %, extremely Few about 20 weight % or even at least about 25 weight % liquid epoxies.Epoxy material may include at least About 5 weight %, at least about 10 weight % or even at least about 20 weight % solid epoxy.Epoxy Thing may include at least about 1 weight %, at least about 3 weight % or even at least about 5 weight % semi-solid ring Oxygen tree fat.The band may include any electroconductive stuffing less than 15 weight %.The band may include non-conductive Filler.The band may include at least about 4 weight %, at least about 6 weight %, at least about 8 weight % or even At least about 10 weight % conductive fillers.Exposed to the 2mm of at least about 165 DEG C of stove baking temperature The band of thickness has less than 1mm, less than 0.8mm or the even less than sagging of 0.5mm generation (resulting sag).The band can be substantially without any core shell component.Band 40rpm at 60 DEG C such bar The viscosity that torque Rhemoter testing machines (XSS-300) are used under part can be at least 8Nm and be not higher than 28Nm.The ratio of liquid rubber and solid rubber can be from about 2:1 to about 1:2.Liquid rubber and solid rubber Than can be about 1:1.The ratio of liquid rubber and solid rubber can be about 4:5.
The disclosure herein provide electroconductive stuffing (for example, about less than 15%) with than relatively low amount and Allow the salable sealant of viscosity fully moved while maintenance minimum sagging during spot welding Configuration.
Embodiment
Explanation and diagram presented herein is intended to know others skilled in the art by the disclosure Its principle and practical application.Those skilled in the art can adjust and apply the disclosure in a variety of forms, with Just the specific requirement used can be best adapted to.Therefore, the specific embodiment party of the illustrated disclosure Case is not configured to exhaustive or limitation the disclosure.Therefore, the model for determining the disclosure is not used in reference to foregoing description Enclose, but should refer to appended claims and be equal with these claim limited ranges it is complete Portion scope determines the scope of the present disclosure.All articles and reference text including patent application and publication The disclosure offered is incorporated by reference into for various purposes.Other combinations are also possible to obtain from the claims below Arrive, it is incorporated into also by reference in the description write.
The disclosure herein utilizes the combination of liquid rubber and solid rubber and multi-functional epoxy material, Come produce maintain high intensity and minimum sagging simultaneously also with it is sufficiently low so that sealant during welding by The solderable sealant for the viscosity that need to be moved.
Include one herein according to the sealant material (it is also called adhesive or band herein) of the disclosure Plant the rubber components of the above.The rubber can be liquid or solid-state.The rubber can be with both liquid and solid-state Supply.The rubber can be make epoxy resin keep solidification before, solidification after or some ductility of the two (i.e., Reduce adhesive fragility), any rubber of toughness.The rubber can make adhesive elongation disconnected without occurring Split (breaking), rupture (cracking), cracking (fracturing), become it is unbonded to one of surface or it Combination.Some workable rubber are：Butadiene acrylonitrile (CTBN), the carboxyl of carboxy blocking The butadiene (CTB) of end-blocking；Nucleocapsid, polybutadiene, the polybutadiene with maleic anhydride, or they Combination.The rubber can be non-reactive to epoxy resin.The reality of component comprising not reactive rubber Example is the Kane Ace MX 136 purchased from Kaneka.Kane Ace MX 136 are by being based on polybutadiene 25 weight % core shell rubbers and the dispersion constituted based on Bisphenol F for 75 weight % liquid epoxies.The rubber Glue can have the reactive group that can be reacted with epoxy resin.With the base that can be reacted with epoxide group The example of the rubber of group is butadiene acrylonitrile (CTBN) rubber of carboxy blocking.CTBN rubber can be mixed Into epoxy resin, reactive component is generated by using heating and possible catalyst such as triphenylphosphine. Epoxy material may include rubber more than about 5 weight %, more than about 15 weight % rubber, or preferably from about 25 More than weight % rubber.The epoxy material may include below about 45 weight %, below about 35 weight %, or Below about 30 weight % rubber (that is, about 30 weight % rubber).The epoxy material may include about 20 weight % extremely About 30 weight % rubber.Total composition may include more than about 3 weight %, more than about 5 weight %, or More than about 7 weight % rubber (that is, about 7.5 weight % rubber).Total composition may include about 2 weight % Rubber to about 15 weight % or about 5 weight % to about 10 weight %.The reactive component herein can finger ring A part for oxygen thing.For example, the rubber can be mixed into resin, then the addition of rubber to composition can Described by one of percetage by weight of epoxy material for describing herein.However, rubber is to adhesive Addition can be substantial amount so that adhesive include ductility, toughness or its both.The addition of rubber can For substantial amount so that the elongation for the adhesive being cured is about more than 1%, about more than 2%, or even about More than 2.5%.The addition of rubber can be substantial amount so that the elongation for the adhesive being cured is about 1% To about 10%, preferably from about 2% to about 7%, or more preferably from about 2.5% to about 6%.
Adhesive/sealant can be substantially without any bat wool.The missing of such bat wool can be helped Help and maintain substantially low viscosity to allow the displacement in welding process.
Epoxy resin used herein means to include any Conventional epoxy of at least one epoxy-functional Material.Epoxy resin can be available for any epoxy resin that more than two materials are bonded together. Epoxy resin can be for epoxy resin once more than two materials are bonded together once solidifying and cause quilt The adhesive of solidification less brittle any epoxy resin.In addition, rubber components can together with epoxy material by It is included to provide adhesive, wherein gained adhesive is not as in the absence of the adhesive of rubber components It is brittle.Epoxy resin can be bonded to metal and glass and can keep out temperature humidity change any epoxy Resin.Epoxy resin can be two functionalities, trifunctional, multi-functional, or its any combinations.In addition, Term epoxy resin can be used for the combination for representing a kind of epoxy resin or a variety of epoxy resin.Epoxy resin can For solids epoxy thing or liquid epoxy thing.Adhesive material may include epoxy materials more than about 5 weight %, Preferably from about more than 15 weight % epoxy material, more preferably from about more than 25 weight %, even more preferably about 40 weights Measure more than % epoxy material, or most preferably from about more than 50 weight % epoxy material.Adhesive material can be wrapped Include below the epoxy material below about 90 weight %, below about 85 weight % epoxy material, or about 80 weight % Epoxy material.Adhesive material may include about 20 weight % to about 85 weight % epoxy resin, preferably from about 45 weight % to about 80 weight % epoxy resin, and more preferably from about 50 weight % are to about 78 weight %'s Epoxy resin.As described above, the percentage of epoxy resin by weight includes solids epoxy thing and Breakup of Liquid Ring Both oxygen things.Be used as example, it is contemplated that when such as elastomer, impact modifying agent, crosslinking agent, filler, Other compositions such as washability polymer and combinations thereof are used with greater or lesser percetage by weight When, percetage by weight can be lower or higher.
Epoxy material can be aliphatic, alicyclic or aromatics etc..Epoxy material can be provided as solid (for example, making For thin slice or pill) or liquid or the two.By epoxy resin added to adhesive material to generate thermosetting, And increase the bonding force of material, mobility or the two.As example, epoxy resin can be phenolic resin, It can be phenolic varnish type (novolac type) resin or other type of resin.For example, bisphenol-A can be used Resin, bisphenol F resin, or combinations thereof.In addition, also it is also possible to use several different epoxy resin Various mixtures.The example of suitable epoxy resin with from Dow Chemical Company, Midland, Mich. the trade (brand) name being obtained commercially(for example, DER 331, DER 661, DER 662, DER 664) name sale.
Epoxy resin may include to be calculated as about more than 20%, more typically about more than 30%, and very with its weight Extremely may about more than 40% liquid epoxies (for example, with make its at 23 DEG C be liquid molecular weight Resin).Epoxy resin may include to be calculated as about less than 100%, about less than 90% or excellent with its weight The liquid epoxies of choosing about less than 80%.Viscosity typical case of such liquid epoxies at a temperature of 23 DEG C Ground is about more than 5Pas, and typically about below 22Pas, but higher and lower value is also possible 's.Liquid epoxies may include that it can be the glycidol ether of aromatics phenols (bisphenol-A or F), such as with business Those of entitling DER 331 (being obtained commercially from Dow Chemical Company) name sale.Liquid Epoxy resin can for epoxy phenol novolaks class such as with trade (brand) name Epalloy 8250 (from CVC Thermoset Specialties, Moorestown, N.J. are obtained commercially) name sale those.
Sealant may include solids epoxy thing and liquid epoxy thing.The ratio of solids epoxy thing and liquid epoxy thing Can be to cause when blank adhesive and second surface including epoxy mixture are applied to first surface, the Two surfaces and/or adhesive will not be moved along first surface, or be slid or the two any from first surface Ratio.The ratio of solids epoxy thing and liquid epoxy thing can be to make the viscosity of blank adhesive sufficiently low so that viscous Mixture can be evenly applied to any ratio on surface.The ratio of solids epoxy thing and liquid epoxy thing can be to make base The adhesive of material state before curing, solidification during or the two keep first surface and second surface it is quiet each other The relative any ratio of state.The ratio of solids epoxy thing and liquid epoxy thing can be about 1:More than 1, about 1.2:1 More than, or about 1.4:More than 1.The ratio of solids epoxy thing and liquid epoxy thing can be about 1:Less than 2, about 1:1.5 Hereinafter, or about 1:1.2 it is following.The ratio of solids epoxy thing and liquid epoxy thing is about 1:1 to about 3:1, and It can be about 1.2:1 to about 2.5:1.
Discrete metal part (discrete metallic portions) may include carbon steel, aluminium, brass, iron, Stainless steel, bronze, copper, chromium steel, tin or any conductive material.Discrete metal part may include Material with film.For example, film can be the material for contributing to conductive material to avoid corrosion.
Discrete metal part can be solid.They can be hollow.The maximum gauge of solid metal part.It Can be at least about 0.10mm.The maximum gauge of solid metal part.It can be at least about 0.20mm.Solid gold The maximum gauge for belonging to part can be at least about 0.30mm.The maximum gauge of solid metal part.It may be less than About 2.5mm.The maximum gauge of solid metal part.It can be at least about 1.0mm.Solid metal part.It is most Major diameter can be at least about 0.50mm.
Configuration specifically described herein allows adhesive and sealant with higher viscosity more solderable than tradition The solderability of configuration or improved solderability.The viscosity of configuration specifically described herein at room temperature can be more than 30,000Pa·s.The viscosity of configuration specifically described herein at room temperature can be more than 40,000Pas.Institute herein The viscosity of the configuration stated at room temperature can be more than 50,000Pas.Configuration specifically described herein is at room temperature Viscosity can be more than 60,000Pas.The viscosity of configuration specifically described herein at room temperature can be more than 70,000Pa·s.The viscosity of configuration specifically described herein at room temperature can be more than 80,000Pas.
Solid metal part.It can exist with least about 1 volume % of configuration amount.Solid metal part.It can To exist with least about 2 volume % of configuration amount.Solid metal part.It can be with least about 5 bodies of configuration Product % amount is present.Solid metal part.It can exist with least about 10 volume % of configuration amount.Solid Metal part can exist with the amount less than about 30 volume % of configuration.Solid metal part.It can be with configuration Amount less than about 20 volume % exist.Solid metal part.It can be less than about 15 volume %'s with configuration Amount is present.The percentage by volume of solid metal part.It can be according to the thickness and covering of adhesive or encapsulant Area and change.
Adhesive specifically described herein or sealant material can via it is following come by for inter metallic bond Shunting weldering (shunt weld) experiment (material described herein is therebetween)：Make since shunting 2 inches to 6 The gained loss of cycle (cycle loss) for the welding that any position between inch occurs is less than 2.0 or even Less than 1.0.
Generally, the disclosure herein provides the solderable sealant or viscous for including plurality of discrete solid metal part.It Mixture, sealant or adhesive material can be with the viscosity higher than traditional weldable material whereby, and this returns Because the presence in discrete metal part and their generations improve the ability of the node (nodes) of solderability.
Adhesive or sealant substantially can be structural.Alternatively, adhesive can be elastic adhesive Or sealant material.Therefore, resulting materials can be structural or can be encapsulant.The material can shape As band.
Adhesive or sealant can include the ring of addition forms blending or pre-reaction in various proportions Oxygen material.These materials can be with the polymerization suitable with typical epoxy chemical and crosslinking scheme come configuration.It is viscous Mixture or sealant may also include low smell and/or non-ignitibility polymeric material.Adhesive or sealant can enter One step includes being used for more than one material of promotion bonding and more than one the material as curing agent. It may include various polymeric materials such as elastomeric material, thermoplastic (polyethylene, polyurethane) and impact Modifying agent etc..The additional materials that may also include in adhesive or sealant include but is not limited to antioxidant, Stabilizer, solvent, initiator and crosslinking agent.
Adhesive or sealant can further comprise that more than one impact modifying agent is used to improve adhesive Or the toughness (toughness) of sealant.Impact modifying agent can be overall with adhesive or encapsulant composition By weight at least 1%, at least 5%, at least 10%, at least 20% or even at least 25% amount deposit .Impact modifying agent can with adhesive or encapsulant composition it is overall be less than 40% by weight, it is small In 30%, less than 20% or even less than 10% amount exist.Structural material may include by weight The impact modifying agent of about 5% to about 20%.Elastomeric material may include about 15% to about 30% to rush by weight Hit modifying agent.
Adhesive or sealant can further comprise any amount of toughener (toughening agents), steady Determine agent, catalyst, adhesion promotor (adhesion promoters) and/or filler.These additional materials Any or any combinations can with composition by weight at least 2%, at least 5%, at least 10%, Or even at least 15% amount is present.Any or any combinations of these additional materials can be with composition By weight be less than 20%, less than 15% or even less than 10% amount exist.Structural material can be wrapped Include one of about 5% to about 15% these additional materials or any combinations by weight.Elastomeric material may include One of about 5% to about 10% these additional materials or any combinations by weight.
Impact modifying agent may include more than one core shell polymer.As used herein, term core shell Polymer refers to wherein its major part (for example, being more than 30%, 50%, more than 70% by weight) by substantially The first polymer material all encapsulated by second polymer material (that is, the second material or shell material) is (i.e., First material or nuclear material) composition impact modifying agent.As used herein, first polymer material and Second polymer material can be made up of a kind of, more than two or three polymer, these combination of polymers And/or reaction together (for example, sequential polymerization) or can for independent or identical core shell system a part. First polymer material that core shell impact modifying agent includes, second polymer material or the two is substantially all (for example, by weight at least 70%, 80%, more than 90%) is made up of more than one thermoplastic. Exemplary thermoplastic's plastics include but is not limited to, polystyrene, acrylic, acrylic ester, acetic acid It is ester system, polyamide-based or polyethylene-based etc..First polymer material or nuclear polymer material can be expected Glass transition temperature is less than 23 DEG C, and the glass transition of second polymer material or shell polymeric material Temperature is higher than 23 DEG C, but not necessarily.
The example of available core-shell structure copolymer graft copolymer is, wherein such as styrene, acrylonitrile or first will be included The hard portion of the compounds such as base methyl acrylate, graft to by comprising such as butadiene or butyl acrylate etc. change The graft copolymer for the core that the soft part of compound or the polymer of elastomer portion are made.It is incorporated by reference into This paper United States Patent (USP) No.3,985,703 disclose available core-shell polymer, and its core is by butyl acrylate It is made but acrylic acid ethyl isobutyl ester, acrylic acid-2-ethyl caproite or other alkyl acrylates can be based on Or its mixture.Nuclear polymer may also include other comprising such as styrene, vinyl acetate, metering system The copolymerizable thing of the compounds such as sour methyl esters, butadiene or isoprene.Shell parts can be by methyl methacrylate Ester and optional other alkyl methacrylates such as EMA, butyl methacrylate or it Mixture polymerization.The example of core-shell structure copolymer graft copolymer includes but is not limited to, " MBS " (metering system Acid esters-butadiene-styrene) polymer, it is in the presence of polybutadiene or polybutadiene copolymer rubber Polymerizing methyl methacrylate is made.MBS graft copolymer resins generally have styrene butadiene ribber The shell of core and acrylic acid series polymeric compounds or copolymer.The reality of other available core-shell structure copolymer graft copolymer resins Example includes, ABS (acrylonitrile-butadiene-styrene (ABS)), MABS (methacrylate-acrylonitriles-butadiene - styrene), ASA (Acrylate-styrene bipolymer-acrylonitrile), whole acrylic acid series, SAEPDM (grafting To the styrene-acrylonitrile of the elastomer matrix of ethylene-propylendiene monomer), MAS (methacrylic acids-the third Olefin(e) acid system rubber styrene), etc. and their mixture.
Adhesive or sealant may also include more than one additional polymer and/or copolymer material, such as Thermoplastic, elastomer, plastic body or combinations thereof.Adhesive or sealant may include polyurethane System.Can be suitably introduced into the polymer of adhesive or sealant includes epoxy material (epoxies).Using ring The combination of oxygen thing and polyurethane series.Using epoxy material and acrylic ester (for example, methacrylate System) combination.It may include silane modified polymer.
It may include more than one additional polymer material.Such polymeric material may include but be not limited to, Halogenated polymer, polycarbonate-based, polyketone system, polyurethane series, Polyester, silane system, sulfone system, alkene Propyl group system, olefin-based, polystyrene, acrylic ester, methacrylate ester, silicone-based, phenolic aldehyde System, rubber, Polyphony Ether (polyphenylene oxides), terephthalate system, acetic acid esters system (example Such as, EVA), acrylic ester, methacrylate ester (for example, ethylene methyl acrylate polymer) or Their mixture.Other potential polymeric materials can for or may include to be not limited to, polyolefin (example Such as, polyethylene, polypropylene), polystyrene, polyacrylate, poly- (oxirane), it is poly- that (ethene is sub- Amine) (poly (ethyleneimine)), polyester, polysiloxanes, polyethers, poly-phosphine piperazine (polyphosphazine), Polyamide, polyimides, polyisobutene, polyacrylonitrile, poly- (vinyl chloride), poly- (methyl methacrylate), Poly- (vinyl acetate), poly- (vinylidene chloride), polytetrafluoroethylene (PTFE), polyisoprene, polyacrylamide, Polyacrylic acid, polymethacrylates.
Adhesive or sealant may include curing agent (for example, initiator).The example bag of appropriate curing agent Include selected from following material：It is aliphatic series or aromatics amine system or their own addition product, amide groups amine system, poly- Acid amides system, alicyclic amine system, acid anhydrides system, the Polyester of polybasic carboxylic acid, isocyanates system, phenol resin (for example, phenol or cresol novolac resin, such as phenol terpenes, polyvinylphenol these copolymer, Or bisphenol A formaldehyde copolymer, or dihydroxy phenyl alkane system etc.) or their mixture.Particularly preferably Curing agent include modified or unmodified polyamine system or polyamide-based such as trien, two sub- second Base triamine, tetren, cyanoguanidines and dicyandiamide system (dicyandiamides) etc..Curing agent can For peroxide or sulfur curable agent.The accelerator for curing agent be may also provide (for example, being modified or not changing Urea such as methylenediphenyl allophanamide, imidazoles or the combinations thereof of property) prepare adhesive or sealant.
Adhesive or sealant material can solidify without extra stimulation at room temperature.Adhesive is close Envelope agent material can undergo any induced curing, microwave curing that can occur at a temperature of room temperature or rise, purple Outside line activation solidification or moisturecuring (moisture cure).Adhesive or sealant can pass through redox reaction Curing system solidifies.Adhesive or sealant material may include two curing components systems, wherein at two groups Solidify when dividing mixing.Typically, in the range of about 15 DEG C to about 40 DEG C at a temperature of solidify bonding Agent or sealant material.
During manufacture, adhesive or sealant material can under its blank state by cross cutting, extrusion, Injection moulding, calendering, hand finishing (hand shaping) are shaped by gravity.Discrete metal portion Then calender roll can be located on the adhesive of extrusion or sealant and be pressed into material to prevent from drawing by dividing The metal part for playing corrosion is exposed.
Any numerical value cited herein is included from lower limit to higher limit using a unit as the complete of increment Portion is worth, and condition is the spacing that there is at least two unit between any lower limit and any higher limit.As Example, if describing the amount of component or being such as the value of temperature, pressure and the state-variable the time Such as 1 to 90, preferably 20 to 80, more preferably 30 to 70, be intended to clearly to enumerate in this manual as The value of 15 to 85,22 to 68,43 to 51,30 to 32 grades.For the value less than 1, a unit is appropriate Ground is considered 0.0001,0.001,0.01 or 0.1.These are only particularly desirable examples, and are being enumerated Minimum and peak between the possible combination of whole of numerical value will be considered as existing in a similar manner Clear stipulaties in the application.So visible, the disclosure that the amount of " parts by weight " is expressed as herein is also allowed for The identical scope of the expression in terms of weight %.Therefore, with " gained polymerize the x parts by weight of blend composition " The statement in specific embodiments of the present invention in the range of meter contemplates " gained polymerization blending group The teaching of the scope of the x weight % " of compound identical recited amounts.
Unless otherwise prescribed, four corner includes all numerical value between two-end-point and end points.With scope phase The use of the "about" or "approximately" of pass is applied to the two ends of scope.Therefore, " about 20 to 30 " are intended to covering bag Include " about 20 to about 30 " including at least defined end points.
Including patent application and announce whole articles and reference disclosure be incorporated by reference with In all purposes.Describe combination term "consisting essentially of ..." should include specify key element, composition, Component or step, and have substantially no effect on such other key elements of the basic and novel characteristics of combination, composition, Component or step.Description key element herein, composition, the term "comprising" of the combination of component or step or " bag Include " use also allow for embodiments below：Substantially it is made up of key element, composition, component or step. Pass through the use of term herein " can with ", it is intended that the attribute for any description that " can with " includes is optional.
Multiple key elements, composition, component or step can by the key element of single integration, composition, component or Step is provided.Alternatively, the key element of single integration, composition, component or step can be divided into individually Multiple key elements, composition, component or step.Key element, composition, component or " one kind " of step or " one are described It is individual " disclosure be not intended to exclude other key element, composition, component or step.Belong to the element of specific race Or metal herein all referring to refer to by CRC Press, Inc., 1989 publish and acquisition of copyright member Plain periodic table.Any reference of race or multiple races should be using IUPAC systems come by race number should The race or multiple races of element reflection in the periodic table of elements.
What will be understood is that can use the concentrate or dilution of amount listed herewith.Generally, enumerate The relative scale of composition will keep identical.Therefore, by embodiment, if the disclosure needs 30 parts by weight Component A and 10 parts by weight component B, then technical staff will be considered to such disclosure and also constitute with relative Than for 3:1 component A and component the B disclosure used.The disclosure of concentration can be in setting in embodiment About 25% (more than) within change, and expected similar result.In addition, such composition of embodiment This method can be successfully used to.
It should be understood that description above be intended to it is illustrative and not restrictive.Except the reality of offer Apply many embodiments beyond example and many people in the art applied to reading description above Member will be apparent.Therefore, the scope of the present invention should be determined without reference to description above, but should Together with the four corner suitable with assigning such claim, determined with reference to appended claims. It is incorporated by reference including patent application and the whole articles and the disclosure of reference announced for institute Purposefully.Omission in the following claims of any aspect of purport disclosed herein is not such master The disclaimer of purport, also should not be regarded as one as invention disclosed purport that the present inventor thinks little of Partial such purport.

Claims (18)

1. a kind of structure band, it includes：
Solid rubber；
Liquid rubber；With
Epoxy material；
Wherein described structure band is solderable and substantially without any bat wool, and including less than about 20 Weight % any electroconductive stuffing.
2. structure band according to claim 1, wherein the liquid rubber with least about 1 weight %, At least about 2 weight %, at least about 3 weight % or even at least about 4 weight % amount are present.
3. structure band according to claim 1 or 2, wherein the liquid rubber is with less than about 10 weights Measure %, the amount presence less than about 7 weight % or even less than about 5 weight %.
4. the structure band according to any one of preceding claims, wherein the epoxy material is solids epoxy Thing, semi-solid epoxy material, liquid epoxy thing or any combination of them.
5. the structure band according to any one of preceding claims, wherein the epoxy material is included at least about 5 weight %, at least about 10 weight %, at least about 20 weight % or even at least about 25 weight % liquid Epoxy resin.
6. the structure band according to any one of preceding claims, wherein the epoxy material is included at least about 5 weight %, at least about 10 weight % or even at least about 20 weight % solid epoxy.
7. the structure band according to any one of preceding claims, wherein the epoxy material is included at least about 1 weight %, at least about 3 weight % or even at least about 5 weight % semi-solid epoxy resin.
8. the structure band according to any one of preceding claims, wherein the structure band includes being less than 15 Weight % any electroconductive stuffing.
9. the structure band according to any one of preceding claims, wherein the structure band is including non-conductive Property filler.
10. the structure band according to any one of preceding claims, wherein the structure band is included at least About 4 weight %, at least about 6 weight %, at least about 8 weight % or even at least about 10 the non-of weight % are led Conductive fillers.
11. the structure band according to any one of preceding claims, wherein exposed at least about 165 DEG C The band of the 2mm thickness of stove baking temperature has less than 1mm, less than 0.8mm or even less than 0.5mm Generation sagging.
12. the structure band according to any one of preceding claims, wherein the structure band is substantially without appointing What core shell component.
13. the structure band according to any one of preceding claims, wherein the structure band uses torque Viscosity of the Rhemoter testing machines (XSS-300) at 60 DEG C under conditions of 40rpm is at least 8Nm.
14. the structure band according to any one of preceding claims, wherein the structure band uses torque Viscosity of the Rhemoter testing machines (XSS-300) at 60 DEG C under conditions of 40rpm is less than about 28Nm.
15. the structure band according to any one of preceding claims, wherein the structure band is at room temperature To be sticky.
16. the structure band according to any one of preceding claims, wherein liquid rubber and solid rubber Ratio be about 2:1 to about 1:2.
17. the structure band according to any one of preceding claims, wherein liquid rubber and solid rubber Ratio be about 1:1.
18. the structure band according to any one of preceding claims, wherein liquid rubber and solid rubber Ratio be about 4:5.
CN201610210673.9A 2016-04-06 2016-04-06 High strength weldable structure band Pending CN107262970A (en)

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CN201610210673.9A CN107262970A (en) 2016-04-06 2016-04-06 High strength weldable structure band
PCT/US2017/026058 WO2017176832A1 (en) 2016-04-06 2017-04-05 High strength weldable structural tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610210673.9A CN107262970A (en) 2016-04-06 2016-04-06 High strength weldable structure band

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CN108485594A (en) * 2018-03-27 2018-09-04 点馨（上海）实业有限公司 adhesive and preparation method

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JP5969217B2 (en) * 2011-03-09 2016-08-17 日東電工株式会社 Double-sided adhesive tape
CN105086856A (en) * 2015-08-31 2015-11-25 北京龙苑伟业新材料有限公司 Preformed automobile-damping expandable rubber belt with good oil surface construction and preparation method therefor

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