CN107651648A - One kind is based on micro-vibration excitation micro element self-assembly device and method - Google Patents
One kind is based on micro-vibration excitation micro element self-assembly device and method Download PDFInfo
- Publication number
- CN107651648A CN107651648A CN201710985510.2A CN201710985510A CN107651648A CN 107651648 A CN107651648 A CN 107651648A CN 201710985510 A CN201710985510 A CN 201710985510A CN 107651648 A CN107651648 A CN 107651648A
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- substrate
- microcomponent
- pit
- micro
- stack driver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00007—Assembling automatically hinged components, i.e. self-assembly processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0003—MEMS mechanisms for assembling automatically hinged components, self-assembly devices
Abstract
The invention discloses one kind based on micro-vibration excitation micro element self-assembly device and method.The device includes substrate and dividing plate, there is the pit array etched on substrate, the profile of each pit and microcomponent in pit array matches, microcomponent is carried by carrier solution, dividing plate forms assembly cavity with substrate, substrate is rigidly connected by connecting plate and piezoelectricity fold stack driver one end, and the other end of piezoelectricity fold stack driver is packed on hold-down support, and piezoelectricity fold stack driver is controlled by computer and driving power.The present invention enters row energization using piezoelectric vibration to substrate, make do not there is the microcomponent being completely fitted with substrate to obtain the energy for being jumped to by metastable state and it is expected assembling structure on substrate, realization is completely fitted with substrate, after carrier solution removes, under van der Waals interaction, the lower surface of microcomponent and the bottom surface of pit link together.The excitation can be adjusted on frequency, amplitude, waveform, to adapt to the micro assemby requirement of different scale and profile, improve assembly yield.
Description
Technical field
The present invention relates to a kind of assembling device and method of microcomponent, more particularly to a kind of automatic assembling apparatus of microcomponent
And method.
Background technology
Driver and display unit, LED chip in FPD (FPD) equipment carry out high density contraposition and assemble, be miniature
Control system, photoelectron dexterity sensor array and electronic tag etc. are required for the accurate assembling of the repeatability of high-volume microcomponent,
In fluidic self-assembly technology form fit formula contraposition have to high-volume microcomponent on three dimensions concurrently, it is accurately right
The ability of hyte dress, the microcomponent in carrier solution is in self gravitation, the capillary force of liquid binding material and surface tension etc.
In the presence of when can fall into the pit to match on substrate at random, conventional hydraulic pump valve drives the at the uniform velocity flowing of solution, works as infinitesimal
Part close to substrate in batch decorate when, its inertia moved can weaken to the positioning precision on microcomponent and substrate, have part infinitesimal
Part positioning does not have to be completely fitted with substrate, causes efficiency of assembling low.
The content of the invention
For the above-mentioned problems in the prior art, the present invention provides a kind of based on micro-vibration excitation micro element self-assembly
Device and method.
Technical scheme is as follows：
The present invention provides a kind of based on micro-vibration excitation micro element self-assembly device, including substrate and dividing plate, the substrate
It is upper with the pit array etched, each pit in the pit array and the microcomponent that is fabricated out from silicon chip
Profile matches, and the microcomponent is carried by carrier solution, and the dividing plate forms assembly cavity with substrate, and the substrate passes through connection
Plate is rigidly connected with piezoelectricity fold stack driver one end, and the other end of piezoelectricity fold stack driver is packed on hold-down support, piezo stack
Stack driver is controlled by computer and driving power.
The present invention also provides a kind of micro-vibration that is based on and encourages micro element self-chambering method of completing the square, and excessive microcomponent is scattered to be suspended in
In selected carrier solution, flowed through under the driving of pressure between substrate and dividing plate, computer passes through driving power by programming
Piezoelectricity fold stack driver is controlled to control piezo stack by driving power after computer programming using hold-down support as support oscillation crosswise
Amplitude, frequency, the acceleration of stack driver.
As a further improvement on the present invention, pit battle array on substrate is flowed through when carrier solution left floating excessive microcomponent
During row, microcomponent is fallen into the pit to match at random in the presence of the capillary force of liquid binding material and surface tension；
Row energization is entered to substrate using the piezoelectric vibration of piezoelectricity fold stack driver, the microcomponent for making not to be completely fitted with substrate on substrate takes
The energy for being jumped to by metastable state and it is expected assembling structure is obtained, lasting excitation gradually makes the pit of microcomponent and substrate completely embedding
Close；The element for the pit for having an opportunity to enter is rushed out substrate surface.
Beneficial effects of the present invention are as follows：
The present invention is swashed based on micro-vibration excitation micro element self-assembly device and method using piezoelectric vibration to substrate
Encourage, make do not there is the microcomponent being completely fitted with substrate to obtain the energy for being jumped to by metastable state and it is expected assembling structure on substrate,
Realization is completely fitted with substrate, after carrier solution removes, under van der Waals interaction, and the lower surface of microcomponent and the bottom of pit
Face links together.The excitation can be adjusted on frequency, amplitude, waveform, to adapt to micro- dress of different scale and profile
With requiring, assembly yield is improved.Efficiently solve in the prior art because microcomponent positioning in part can not be completely fitted with substrate
And the problem of causing efficiency of assembling low.
Brief description of the drawings
Fig. 1 is structure principle chart of the present invention based on micro-vibration excitation micro element self-assembly device.
In figure：1st, substrate；2nd, microcomponent；3rd, solution；4th, dividing plate；5th, connecting plate；6th, piezoelectricity fold stack driver；7th, fixed branch
Seat；8th, driving power；9th, computer.
Embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings.
Embodiment one
The present embodiment provides a kind of as shown in Figure 1 based on micro-vibration excitation micro element self-assembly device, structure：
There is the pit array of respective shapes etched on 1 on the substrate such as silicon or glass, each pit with from silicon chip
The microcomponent 2 for fabricating out given configuration matches, and microcomponent 2 is carried by carrier solution 3, and dividing plate 4 is formed with substrate 1 and assembled
1 passes through plate 5 and one end rigid connection of piezoelectricity fold stack driver 6 of being rigidly connected, piezoelectric stack driving on the substrates such as chamber, silicon or glass
The other end of device 6 is packed on hold-down support 7, and piezoelectricity fold stack driver is controlled by computer 9 and driving power 8.
Embodiment two
The present embodiment provides a kind of self-chambering method of completing the square based on self-assembly device described in embodiment one.
Excessive microcomponent 2 is scattered to be suspended in selected carrier solution 3, can under the driving of pressure from substrate 1 He
Flowed through in dividing plate 4, computer 9 controls piezoelectricity fold stack driver 6 horizontal for support with hold-down support 7 by programming by driving power 8
To vibration, computer 9 controls amplitude, frequency, the acceleration of piezoelectricity fold stack driver 6 by driving power 8 after programming.
When carrier solution 3, which left floating excessive microcomponent 2, flows through pit array on 1 on substrate, microcomponent, liquid bond
The pit to match on substrate, a part of microcomponent 2 can be fallen into the presence of the capillary force of material and surface tension etc. at random
It is completely fitted with substrate pit, the pit for also having the non-substrate 1 of most microcomponent 2 is completely fitted, and is driven using piezoelectric stack
The piezoelectric vibration of device 6 enters row energization to substrate 1, makes do not have the microcomponent being completely fitted with substrate to obtain by metastable state on substrate
The energy for it is expected assembling structure is jumped to, lasting excitation can gradually make successively completely embedding with the pit of substrate 1 of microcomponent 2
Close, such as assembled building blocks.Through vibrational excitation after a while, ensure that the pit of most of microcomponent 2 and substrate 1 is complete
Chimeric, the element for the pit for having no chance to enter will be rushed out substrate surface.Through over cleaning, into assembling next time.Infinitesimal
It is after part aligns on substrate in batch is decorateeed, solution removal is clean, the assembling of product is completed by pin interconnection.
Computer changes driving power 8 by program parameterization and applies drive signal, control pressure to piezoelectricity fold stack driver 6
The amplitude and frequency and acceleration of electric fold stack driver 6, it can adjust to the excitation energy of substrate 1, to adapt to different shape and chi
The micro assemby requirement of degree.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention.All essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (3)
1. one kind is based on micro-vibration excitation micro element self-assembly device, it is characterised in that：It is described including substrate (1) and dividing plate (4)
There is the pit array that etches on substrate (1), each pit in the pit array and fabricated out from silicon chip
The profile of microcomponent (2) matches, and the microcomponent (2) is carried by carrier solution (3), and the dividing plate (4) is formed with substrate (1)
Assembly cavity, the substrate (1) are rigidly connected by connecting plate (5) and piezoelectricity fold stack driver (6) one end, piezoelectricity fold stack driver
(6) the other end is packed on hold-down support (7), and piezoelectricity fold stack driver (6) is controlled by computer (9) and driving power (8).
2. the self-chambering method of completing the square of claim 1 described device, it is characterised in that：Excessive microcomponent (2) is scattered be suspended in it is selected
Carrier solution (3) in, flowed through under the driving of pressure between substrate (1) and dividing plate (4), computer (9) is passed through by programming
Driving power (8) control piezoelectricity fold stack driver (6) is support oscillation crosswise with hold-down support (7), is led to after computer (9) programming
Amplitude, frequency, the acceleration of power supply (8) of overdriving control piezoelectricity fold stack driver (6).
3. according to the method for claim 2, it is characterised in that：When carrier solution (3) left floating excessive microcomponent (2) stream
During through pit array on substrate (1), microcomponent (2) in the presence of the capillary force of liquid binding material and surface tension with
Machine is fallen into the pit that (2) match；Row energization is entered to substrate (1) using the piezoelectric vibration of piezoelectricity fold stack driver (6), makes base
The microcomponent (2) not being completely fitted on plate (2) with substrate (2) obtains the energy for being jumped to by metastable state and it is expected assembling structure, holds
Continuous excitation is gradually completely fitted the pit of microcomponent (2) and substrate (1)；The element for the pit for having an opportunity to enter is rushed out base
Plate (2) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710985510.2A CN107651648B (en) | 2017-10-20 | 2017-10-20 | One kind motivating micro element self-assembly device and method based on micro-vibration |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710985510.2A CN107651648B (en) | 2017-10-20 | 2017-10-20 | One kind motivating micro element self-assembly device and method based on micro-vibration |
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| CN107651648A true CN107651648A (en) | 2018-02-02 |
| CN107651648B CN107651648B (en) | 2019-11-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190118099A (en) * | 2018-04-09 | 2019-10-17 | 중앙대학교 산학협력단 | Micro device array substrate and manufacturing method thereof |
| CN112802756A (en) * | 2019-11-13 | 2021-05-14 | 成都辰显光电有限公司 | Temporary substrate, preparation method thereof and micro-element transfer method |
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| CN1137329A (en) * | 1993-12-17 | 1996-12-04 | 加利福尼亚大学董事会 | Method for fabricating self-assembling microstructures |
| CN1147153A (en) * | 1995-06-07 | 1997-04-09 | 加利福尼亚大学董事会 | Method and apparatus for fabricating self-assembling microstructures |
| CN1962410A (en) * | 2005-11-10 | 2007-05-16 | 中国科学院电子学研究所 | Liquid-liquid interface magnetic force assisted tridimensional micro part self-assembling method |
| US20070215273A1 (en) * | 2006-03-14 | 2007-09-20 | Regents Of The University Of Minnesota | Approaching programmable self-assembly: heterogeneous integration of chip-scale components on planar and non-planar surfaces |
| US20080023435A1 (en) * | 2005-07-05 | 2008-01-31 | Enboa Wu | Method for self-assembling microstructures |
| CN103065937A (en) * | 2012-12-31 | 2013-04-24 | 中国科学院上海微系统与信息技术研究所 | Pattern-recognition-based method for integrating multiple materials on substrate |
| CN103623748A (en) * | 2013-12-20 | 2014-03-12 | 复旦大学 | Colloid sphere vertical self assembly method based on piezoelectric ceramic vibrational excitation |
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2017
- 2017-10-20 CN CN201710985510.2A patent/CN107651648B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1137329A (en) * | 1993-12-17 | 1996-12-04 | 加利福尼亚大学董事会 | Method for fabricating self-assembling microstructures |
| CN1147153A (en) * | 1995-06-07 | 1997-04-09 | 加利福尼亚大学董事会 | Method and apparatus for fabricating self-assembling microstructures |
| US20080023435A1 (en) * | 2005-07-05 | 2008-01-31 | Enboa Wu | Method for self-assembling microstructures |
| CN1962410A (en) * | 2005-11-10 | 2007-05-16 | 中国科学院电子学研究所 | Liquid-liquid interface magnetic force assisted tridimensional micro part self-assembling method |
| US20070215273A1 (en) * | 2006-03-14 | 2007-09-20 | Regents Of The University Of Minnesota | Approaching programmable self-assembly: heterogeneous integration of chip-scale components on planar and non-planar surfaces |
| CN103065937A (en) * | 2012-12-31 | 2013-04-24 | 中国科学院上海微系统与信息技术研究所 | Pattern-recognition-based method for integrating multiple materials on substrate |
| CN103623748A (en) * | 2013-12-20 | 2014-03-12 | 复旦大学 | Colloid sphere vertical self assembly method based on piezoelectric ceramic vibrational excitation |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190118099A (en) * | 2018-04-09 | 2019-10-17 | 중앙대학교 산학협력단 | Micro device array substrate and manufacturing method thereof |
| KR102158976B1 (en) | 2018-04-09 | 2020-09-24 | 중앙대학교 산학협력단 | Micro device array substrate and manufacturing method thereof |
| CN112802756A (en) * | 2019-11-13 | 2021-05-14 | 成都辰显光电有限公司 | Temporary substrate, preparation method thereof and micro-element transfer method |
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| CN107651648B (en) | 2019-11-22 |
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Effective date of registration: 20201203 Address after: 213000 Jiangsu city of Changzhou province Hehai West New District No. 195 Patentee after: Changzhou Guyu power supply Co.,Ltd. Address before: 213022 Liaohe Road, Xinbei District, Changzhou, Jiangsu Province, No. 666 Patentee before: CHANGZHOU INSTITUTE OF TECHNOLOGY |
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Effective date of registration: 20230707 Address after: 213000 No. 666, Daluo Road, Yaoguan Town, Changzhou Economic Development Zone, Jiangsu Province Patentee after: Mattel (Changzhou) Control System Co.,Ltd. Address before: 213000 No. 195 Hehai West Road, Xinbei District, Changzhou City, Jiangsu Province Patentee before: Changzhou Guyu power supply Co.,Ltd. |