CN107642700A - New-type LED - Google Patents
New-type LED Download PDFInfo
- Publication number
- CN107642700A CN107642700A CN201710935741.2A CN201710935741A CN107642700A CN 107642700 A CN107642700 A CN 107642700A CN 201710935741 A CN201710935741 A CN 201710935741A CN 107642700 A CN107642700 A CN 107642700A
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- CN
- China
- Prior art keywords
- substrate
- heat sink
- ceramics seat
- fan
- air flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a kind of new-type LED, including outer cover, LED wafer, heat sink, fan, substrate, ceramics seat, the outer cover cover is buckled on substrate, substrate middle inside fixes ceramics seat, LED wafer is fixed on top on the inside of ceramics seat, the ceramics seat fixes heat sink close to inner side top end, and heat sink outside forms air flow spaces with substrate madial wall；The substrate side wall fan attachment, fan are oppositely arranged with air flow spaces.Its good heat dissipation effect, extend product service life, improve product job stability, meet market use demand, be advantageous to product promotion.
Description
Technical field
The invention belongs to lighting technical field, and in particular to a kind of new-type LED.
Background technology
Common LED currently on the market is varied.One or more of deficiency mostly be present in the LED in the Changjiang river：
1st, complicated, cost is high；
2nd, poor radiation, life of product is influenceed；
3rd, stability is poor.
The content of the invention
The purpose of the present invention is to propose to a kind of new-type LED, the above-mentioned deficiency of prior art, its radiating effect are overcome
It is good, extend product service life, improve product job stability, meet market use demand, be advantageous to product promotion.
In order to reach above-mentioned purpose of design, the technical solution adopted by the present invention is as follows：
A kind of new-type LED, including outer cover, LED wafer, heat sink, fan, substrate, ceramics seat, the outer cover cover are buckled in
On substrate, substrate middle inside fixes ceramics seat, and LED wafer is fixed on top on the inside of ceramics seat, and the ceramics seat is close to medial roof
Heat sink is fixed at end, heat sink outside forms air flow spaces with substrate madial wall；The substrate side wall fan attachment, wind
Fan is oppositely arranged with air flow spaces.
Radiating slot structure is provided with the outside of the heat sink, radiating groove structure setting improves scattered in air flow spaces
Hot property.
Sealing is provided with the inside of the heat sink, LED wafer is encapsulated on the inside of heat sink by sealing.
The beneficial effect of new-type LED of the present invention is：Its good heat dissipation effect, extend product service life, improve
Product job stability, meets market use demand, is advantageous to product promotion.
Brief description of the drawings
Fig. 1 is the schematic diagram of new-type LED of the present invention.
Embodiment
Preferred embodiment of the invention is described in further detail below.
As shown in figure 1, in embodiment of the present invention, the new-type LED, including outer cover 1, LED wafer 2, sealing 3, dissipate
Hot plate 4, radiating slot structure 5, fan 6, substrate 7, ceramics seat 8, the cover of outer cover 1 are buckled on substrate 7, and the middle inside of substrate 7 is consolidated
Determine ceramics seat 8, LED wafer 2 is fixed on the inner side top of ceramics seat 8, and the ceramics seat 8 fixes heat sink 4 close to inner side top end, dissipates
The outside of hot plate 4 forms air flow spaces with the madial wall of substrate 7；The side wall fan attachment 6 of substrate 7, fan 6 and air flow
Space is oppositely arranged, its good heat dissipation effect, advantageously ensures that product use reliability, extends product service life.
The outside of heat sink 4 is provided with radiating slot structure 5, and radiating slot structure 5 is arranged in air flow spaces, improved
Heat dispersion.
The inner side of heat sink 4 is provided with sealing 3, and LED wafer 2 is encapsulated in into the inner side of heat sink 4 by sealing 3.
Above content is to combine the further description that specific preferred embodiment is done to the present invention, is easy to the skill
The technical staff in art field is understood that and using the present invention, it is impossible to assert that the specific implementation of the present invention is confined to these explanations.
For general technical staff of the technical field of the invention, it can also make without departing from the inventive concept of the premise
Some simple deduction or replace, without by performing creative labour.Therefore, those skilled in the art's taking off according to the present invention
Show, the simple modifications made to the present invention all should be within protection scope of the present invention.
Claims (3)
- A kind of 1. new-type LED, it is characterised in that：It is described including outer cover, LED wafer, heat sink, fan, substrate, ceramics seat Outer cover cover is buckled on substrate, and substrate middle inside fixes ceramics seat, and LED wafer, the ceramics seat are fixed in top on the inside of ceramics seat Heat sink is fixed close to inner side top end, heat sink outside forms air flow spaces with substrate madial wall；The substrate side wall Fan attachment, fan are oppositely arranged with air flow spaces.
- 2. new-type LED according to claim 1, it is characterised in that：Radiating slot structure, radiating groove are provided with the outside of heat sink Structure setting improves heat dispersion in air flow spaces.
- 3. new-type LED according to claim 2, it is characterised in that：Sealing is provided with the inside of the heat sink, passes through sealing LED wafer is encapsulated on the inside of heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710935741.2A CN107642700A (en) | 2017-10-10 | 2017-10-10 | New-type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710935741.2A CN107642700A (en) | 2017-10-10 | 2017-10-10 | New-type LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107642700A true CN107642700A (en) | 2018-01-30 |
Family
ID=61122847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710935741.2A Pending CN107642700A (en) | 2017-10-10 | 2017-10-10 | New-type LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107642700A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066918A (en) * | 2021-04-12 | 2021-07-02 | 深圳市科彤科技有限公司 | Color temperature adjustable flip Chip On Board (COB) packaging structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202719394U (en) * | 2012-03-13 | 2013-02-06 | 上海三思电子工程有限公司 | Ceramic seat light-emitting diode (LED) illuminating lamp |
| CN204029855U (en) * | 2014-08-06 | 2014-12-17 | 东莞市港照照明科技有限公司 | A kind of LED lamp |
| CN204029854U (en) * | 2014-08-06 | 2014-12-17 | 东莞市港照照明科技有限公司 | Led |
| CN204313040U (en) * | 2014-11-26 | 2015-05-06 | 嘉兴并升照明电器有限公司 | A kind of high-efficiency heat radiating LED lamp |
-
2017
- 2017-10-10 CN CN201710935741.2A patent/CN107642700A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202719394U (en) * | 2012-03-13 | 2013-02-06 | 上海三思电子工程有限公司 | Ceramic seat light-emitting diode (LED) illuminating lamp |
| CN204029855U (en) * | 2014-08-06 | 2014-12-17 | 东莞市港照照明科技有限公司 | A kind of LED lamp |
| CN204029854U (en) * | 2014-08-06 | 2014-12-17 | 东莞市港照照明科技有限公司 | Led |
| CN204313040U (en) * | 2014-11-26 | 2015-05-06 | 嘉兴并升照明电器有限公司 | A kind of high-efficiency heat radiating LED lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066918A (en) * | 2021-04-12 | 2021-07-02 | 深圳市科彤科技有限公司 | Color temperature adjustable flip Chip On Board (COB) packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180130 |
|
| RJ01 | Rejection of invention patent application after publication |