CN202580882U - Heat conduction type LED (Light Emitting Diode) module - Google Patents
Heat conduction type LED (Light Emitting Diode) module Download PDFInfo
- Publication number
- CN202580882U CN202580882U CN2012202656420U CN201220265642U CN202580882U CN 202580882 U CN202580882 U CN 202580882U CN 2012202656420 U CN2012202656420 U CN 2012202656420U CN 201220265642 U CN201220265642 U CN 201220265642U CN 202580882 U CN202580882 U CN 202580882U
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- radiating
- fin
- type led
- sheets
- heat conduction
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Abstract
The utility model relates to a heat conduction type LED module, and relates to the technical field of lighting, in particular to an LED light-emitting unit with efficient radiation performance. The heat conduction type LED module comprises a radiating apparatus, an LED light-emitting chip (6) and a lens (7). The radiating apparatus comprises a radiation post (1), fin-shaped radiating sheets (2) and circular radiating sheets (3) which are all fixedly arranged at the back face of a radiating base (5), a chip base (5) is arranged at the front face of the radiating base, the LED light-emitting chip is arranged on the chip base, and the lens covers the exterior of the LED light-emitting chip; an air guide sleeve (9) is arranged above the radiating apparatus, and spiral convex strips (10) are arranged on the side wall of the air guide sleeve; the circular radiating sheets are wound at the periphery of the radiating post in a layer-upon-layer manner and penetrated upwards and downwards, and oblique radiating sheets (8) are arranged between adjacent circular radiating sheets; and the fin-shaped radiating sheets are radially wound and distributed by taking the radiating post as a center. The heat conduction type LED module has the positive effects of reasonable design, flexibility in use, and high radiating efficiency.
Description
Technical field
The utility model relates to and showing and lighting technical field, particularly belongs to a kind of LED luminescence unit with high efficiency and heat radiation performance.
Background technology
In daily life, LED enjoys consumer's favor with advantages such as its low-power consumption, life-span length and security performance are good, be widely used in fields such as lamp ornaments lighting, LED large screen display, traffic lights, household electrical appliances.For LED, because heating has consumed its gross energy of 70%, so radiating treatment is a vital problem; Traditional LED apparatus is integrated in LED on the substrate and constitutes, the shared heat abstractor of all LED, and radiating efficiency is low, is not easy to control and moulding and is restricted, thereby greatly reduce the applicability of LED apparatus.
The utility model content
The purpose of the utility model is to provide a kind of novel heat-conducting type LED module, to reach the radiating efficiency height, install and to make up flexibly, to prolong the LED purpose in service life.
The heat-conducting type LED module that the utility model provided; Comprise heat abstractor, LED luminescence chip and lens, it is characterized in that heat abstractor comprises thermal column, fin-shaped fin, circular heatsink; All be fixedly mounted on the back side of heat dissipation base; The front of heat dissipation base is equipped with chip pad, has the LED luminescence chip on the chip pad, and its outside is covered with lens; The heat abstractor top is equipped with kuppe, and the kuppe madial wall has the helical form raised line; Circular heatsink is looped around the periphery of thermal column layer by layer, penetrates up and down, has the inclination fin between the adjacent circular heatsink; It is radial around distribution that the fin-shaped fin with the thermal column is that central shaft is.
The heat-conducting type LED module that the utility model provided; In use, the heat that the work of LED luminescence chip is produced is absorbed by heat abstractor and distributes, particularly; Owing to have the inclination fin between the adjacent circular heatsink; The comprehensive function of helical form raised line on kuppe and the madial wall thereof in addition forms a kind of eddy airstream thereby hot-air is risen, and has accelerated the flowing velocity and the intensity of air-flow; Thereby can better dispel the heat, have good effect reasonable in design, that use is flexible, radiating efficiency is high.
Description of drawings
Accompanying drawing partly discloses the specific embodiment of the utility model, wherein,
Fig. 1, the structural profile sketch map of the utility model;
Fig. 2, heat abstractor of the utility model and heat dissipation base assembling sketch map.
The specific embodiment
The heat-conducting type LED module that the utility model provided comprises heat abstractor, kuppe 9, LED luminescence chip 6 and lens 7.As shown in Figure 2, heat abstractor comprises thermal column 1, fin-shaped fin 2, circular heatsink 3, all is fixedly mounted on the back side of heat dissipation base 4.Circular heatsink is looped around the periphery of thermal column layer by layer, has inclination fin 8 between the adjacent circular heatsink; It is radial around distribution that the fin-shaped fin with the thermal column is that central shaft is.
As shown in Figure 1, the front of heat dissipation base is equipped with chip pad 5, has LED luminescence chip 6 on the chip pad, and its outside is covered with lens 7.
The main feature of the utility model is that the heat abstractor top is equipped with kuppe 9, and as shown in Figure 1, the kuppe madial wall has helical form raised line 10.
In addition, as shown in Figure 1, above-mentioned circular heatsink is tapered, and promptly the internal diameter with one deck circular heatsink increases from top to bottom gradually, helps improving the flow velocity of rising radiating airflow, can improve radiating efficiency then.
Claims (2)
1. heat-conducting type LED module; Comprise heat abstractor, LED luminescence chip (6) and lens (7), it is characterized in that heat abstractor comprises thermal column (1), fin-shaped fin (2), circular heatsink (3); All be fixedly mounted on the back side of heat dissipation base (4); The front of heat dissipation base is equipped with chip pad (5), has the LED luminescence chip on the chip pad, and its outside is covered with lens; The heat abstractor top is equipped with kuppe (9), and the kuppe madial wall has helical form raised line (10); Circular heatsink is looped around the periphery of thermal column layer by layer, penetrates up and down, has inclination fin (8) between the adjacent circular heatsink; It is radial around distribution that the fin-shaped fin with the thermal column is that central shaft is.
2. heat-conducting type LED module according to claim 1, its characteristic is that also described circular heatsink is tapered.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012202656420U CN202580882U (en) | 2012-05-29 | 2012-05-29 | Heat conduction type LED (Light Emitting Diode) module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012202656420U CN202580882U (en) | 2012-05-29 | 2012-05-29 | Heat conduction type LED (Light Emitting Diode) module |
Publications (1)
Publication Number | Publication Date |
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CN202580882U true CN202580882U (en) | 2012-12-05 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2012202656420U Expired - Fee Related CN202580882U (en) | 2012-05-29 | 2012-05-29 | Heat conduction type LED (Light Emitting Diode) module |
Country Status (1)
Country | Link |
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CN (1) | CN202580882U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107426942A (en) * | 2016-05-24 | 2017-12-01 | 罗伯特·博世有限公司 | For cooling down the cooling body of electronic structure element |
-
2012
- 2012-05-29 CN CN2012202656420U patent/CN202580882U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107426942A (en) * | 2016-05-24 | 2017-12-01 | 罗伯特·博世有限公司 | For cooling down the cooling body of electronic structure element |
CN107426942B (en) * | 2016-05-24 | 2020-12-04 | 罗伯特·博世有限公司 | Cooling body for cooling electronic components and method for producing the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121205 Termination date: 20200529 |