CN107623233A - A kind of 3-D abnormal cinch connector and implementation method - Google Patents
A kind of 3-D abnormal cinch connector and implementation method Download PDFInfo
- Publication number
- CN107623233A CN107623233A CN201710823182.6A CN201710823182A CN107623233A CN 107623233 A CN107623233 A CN 107623233A CN 201710823182 A CN201710823182 A CN 201710823182A CN 107623233 A CN107623233 A CN 107623233A
- Authority
- CN
- China
- Prior art keywords
- interface
- connector
- dimensional
- abnormal
- realized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a kind of 3-D abnormal cinch connector and implementation method, including three-dimensional structure, circuit and interface；The interface includes low frequency part interface and radio frequency part interface；The low frequency part interface is connected on connector body by the way of surface-mount type welding, for transmission of control signals and/or power supply；The radio frequency part interface is connected in the main body of connector by the way of soldering, for transmitting radio frequency signal；After three dimensional design structure is realized, laser activation processing first is carried out to the part of metallic circuit, then carry out wired foil.The low-and high-frequency mixing interconnection of any complex three-dimensional space structure is suitable for, a kind of simple mutual contact mode is provided for complex three-dimensional broadband integrated products, solves interiors of products all of the port interconnection problem with a connector.This mode can simplify integrating process, shorten life cycle of the product, reduce production cost, improve product and integrate reliability.
Description
Technical field
The present invention relates to a kind of 3-D abnormal cinch connector and implementation method, is applied to complicated electricity more particularly to one kind
The 3-D abnormal cinch connector and implementation method of sub- product.
Background technology
Existing connector is divided into low-frequency connector and radio frequency connector.The interface arrangement of low-frequency connector is all to concentrate on one
Rise, the transmission of its signal typically uses high temperature wire.Radio frequency connector is single one by one, and the transmission of its signal typically uses glass
Glass insulator.
Machine is connected to 3-D abnormal broadband, be there are no in the prior art on implementation method, especially had no and penetrated comprising multiple
The cinch connector of the low-and high-frequency mixing of frequency passage.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of manufacturing cost is low, product integrated level is high, and reliability is high, energy
Enough include multiple radio-frequency channels, and the 3-D abnormal cinch connector and implementation method of low-and high-frequency mixing.
The technical solution adopted by the present invention is as follows：
A kind of 3-D abnormal cinch connector, including three-dimensional structure, circuit and interface；The interface include low frequency part interface and
Radio frequency part interface；The low frequency part interface is connected on connector body by the way of surface-mount type welding, for transmitting
Control signal and/or power supply；The radio frequency part interface is connected in the main body of connector by the way of soldering, for transmitting
Radiofrequency signal.
The circuit layer of connector include two layers and more than.
Radio-frequency transmission line is arranged between double layer of metal wire, is shielded by the plain conductor of adjacent two layers, is realized
Electromagnetic isolation.
A kind of implementation method of above-mentioned 3-D abnormal cinch connector, specific method step are：
S1, three-dimensional modeling：After product structure and interface relationship design, by three-dimensional modeling, design the three-dimensional of connector and tie
Structure, configuration and interface layout；
S2, three-dimensional structure are realized：
Using plastics as body, realized by injection molding manner；Or,
Using metal as body, by forging and pressing, casting, welding and machining mode realizes matrix, then on metallic matrix
By spraying, organic thin film in covering；
S3, laser activation：According to configuration, the part for needing metallic circuit is subjected to activation process with laser；
S4, wired foil：By way of chemical plating or plating, the part that laser activation is crossed plates the coat of metal；
S5, interface processing：According to the performance requirement of distinct interface, difference is installed by different connected modes to each interface
Connectivity port；The different connected mode includes bonding, welding and mechanically connected；The connectivity port and its corresponding ports
Matching.
A kind of implementation method of 3-D abnormal cinch connector, specific method step are：
S1, three-dimensional modeling：After product structure and interface relationship design, by three-dimensional modeling, design the three-dimensional of connector and tie
Structure, configuration and interface layout；
S2, three-dimensional structure are realized：
Using plastics as body, realized by injection molding manner；Or,
Using metal as body, by forging and pressing, casting, welding and machining mode realizes matrix, then on metallic matrix
By spraying, organic thin film in covering；
S3, laser activation：According to configuration, the part for needing metallic circuit is subjected to activation process with laser；
S4, wired foil：By way of chemical plating or plating, the part that laser activation is crossed plates the coat of metal；
S5, interface processing：According to the performance requirement of distinct interface, difference is installed by different connected modes to each interface
Connectivity port；The different connected mode includes bonding, welding and mechanically connected；The connectivity port and its corresponding ports
Matching.
Methods described also includes：The port to match each other uses convention connectors.
Methods described also includes：When carrying out the circuit production of two layers and the above, spraying, laser activation and wired foil are repeated
Change step to realize.
Compared with prior art, the beneficial effects of the invention are as follows：It is suitable for the low-and high-frequency of any complex three-dimensional space structure
Mixing interconnection, working frequency range 0-40GHz, provides a kind of simple mutual contact mode, with one for complex three-dimensional broadband integrated products
Individual connector solves interiors of products all of the port interconnection problem.This mode can simplify integrating process, shorten life cycle of the product,
Production cost is reduced, product is improved and integrates reliability.
Brief description of the drawings
Fig. 1 is the 3-D abnormal connector construction schematic diagram of a wherein embodiment of the invention.
Fig. 2 is the low frequency part interface diagram in embodiment illustrated in fig. 1.
Fig. 3 is the radio frequency part interface diagram in embodiment illustrated in fig. 1.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
This specification（Including summary and accompanying drawing）Disclosed in any feature, unless specifically stated otherwise, can be equivalent by other
Or the alternative features with similar purpose are replaced.I.e., unless specifically stated otherwise, each feature is a series of equivalent or class
Like an example in feature.
As shown in figure 1, a kind of 3-D abnormal cinch connector, including three-dimensional structure, circuit and interface；Such as the interface bag
Include low frequency part interface and radio frequency part interface；As shown in Fig. 2 the low frequency part interface is connected by the way of surface-mount type welding
It is connected on connector body, for transmission of control signals and/or power supply；As shown in figure 3, the radio frequency part interface uses soldering
Mode be connected in the main body of connector, for transmitting radio frequency signal.
Specific embodiment 2
On the basis of specific embodiment 1, effectiveness during in order to ensure radio frequency transmission, the circuit layer of connector includes
Two layers and more than.
Specific embodiment 3
On the basis of specific embodiment 1 or 2, radio-frequency transmission line is arranged between double layer of metal wire, passes through adjacent two layers
Plain conductor is shielded, and realizes electromagnetic isolation.
Specific embodiment 4
On the basis of one of specific embodiment 1 to 3, a kind of implementation method of above-mentioned 3-D abnormal cinch connector, specific side
Method step is：
S1, three-dimensional modeling：After product structure and interface relationship design, by three-dimensional modeling, design the three-dimensional of connector and tie
Structure, configuration and interface layout；
S2, three-dimensional structure are realized：
Using plastics（It is engineering plastics in this specific embodiment）As body, realized by injection molding manner；Or,
Using metal as body, matrix is realized by the mode such as forging and pressing, casting, welding and machining, then in metallic matrix
Upper pass through sprays, organic thin film in covering；
S3, laser activation：According to configuration, the part for needing metallic circuit is subjected to activation process with laser；
S4, wired foil：By way of chemical plating or plating, the part that laser activation is crossed plates the coat of metal；Coating
Species and thickness are carried out as needed；
S5, interface processing：According to the performance requirement of distinct interface, difference is installed by different connected modes to each interface
Connectivity port；The different connected mode includes bonding, welding and mechanically connected；The connectivity port and its corresponding ports
Matching.
In this specific embodiment, in S1, pass through CAD software（CATIA or PRO/E etc.）Design the three of connector
Tie up structure, configuration and interface layout.The connector need to include all intraconnection ports of product, it is desirable to a connector
Realize the interconnection of all internal ports.It is stereochemical structure in view of complex assemblies, so connector construction can be designed to space
Abnormal shape, also need to consider abnormally-structured strength demand when designing connector.
Specific embodiment 5
A kind of implementation method of 3-D abnormal cinch connector, specific method step are：
S1, three-dimensional modeling：After product structure and interface relationship design, by three-dimensional modeling, design the three-dimensional of connector and tie
Structure, configuration and interface layout；
S2, three-dimensional structure are realized：
Using plastics（It is engineering plastics in this specific embodiment）As body, realized by injection molding manner；Or,
Using metal as body, matrix is realized by the mode such as forging and pressing, casting, welding and machining, then in metallic matrix
Upper pass through sprays, organic thin film in covering；
S3, laser activation：According to configuration, the part for needing metallic circuit is subjected to activation process with laser；
S4, wired foil：By way of chemical plating or plating, the part that laser activation is crossed plates the coat of metal；Coating
Species and thickness are carried out as needed；
S5, interface processing：According to the performance requirement of distinct interface, difference is installed by different connected modes to each interface
Connectivity port；The different connected mode includes bonding, welding and mechanically connected；The connectivity port and its corresponding ports
Matching.
In this specific embodiment, in S1, pass through CAD software（CATIA or PRO/E etc.）Design the three of connector
Tie up structure, configuration and interface layout.The connector need to include all intraconnection ports of product, it is desirable to a connector
Realize the interconnection of all internal ports.It is stereochemical structure in view of complex assemblies, so connector construction can be designed to space
Abnormal shape, also need to consider abnormally-structured strength demand when designing connector.
Connector body can use plastics, be realized by injection molding manner, can be any engineering plastics, and common engineering is moulded
Material；Connector body can also use metal coating organic thin film, by the mode such as forging and pressing, casting, welding and machining
Matrix is realized, then by spraying on metallic matrix, organic thin film in covering.Above-mentioned organic thin film can arbitrarily be had
Machine thing film.Metallization coating can be metallic copper, silver, copper, nickel, tin etc. or its combination.Match port and three-dimensional connector sheet
Connected mode between body can be bonding, welding, mechanical connection or its combination.
Specific embodiment 6
On the basis of one of specific embodiment 4 to 5, methods described also includes：The port to match each other uses convention connectors.
Specific embodiment 7
On the basis of one of specific embodiment 4 to 6, methods described also includes：When carrying out the circuit production of two layers and the above, weight
Multiple spraying, laser activation and wired foil step are realized.
The present invention replaces multiple different types of connectors in a product using a 3-D abnormal cinch connector
Complex three-dimensional infrastructure product is interconnected, interiors of products interconnection assembly method is simplified, shortens assembly period, improve production
Product reliability.Production to complex three-dimensional integrated products is brought great convenience, and particularly bandwidth is produced in 0-40GHz broadband
Product.
Claims (9)
- A kind of 1. 3-D abnormal cinch connector, it is characterised in that：Including three-dimensional structure, circuit and interface；The interface includes Low frequency part interface and radio frequency part interface；The low frequency part interface is connected to connector master by the way of surface-mount type welding On body, for transmission of control signals and/or power supply；The radio frequency part interface is connected to the master of connector by the way of soldering On body, for transmitting radio frequency signal.
- 2. 3-D abnormal cinch connector according to claim 1, it is characterised in that：The circuit layer of connector includes two layers More than and.
- 3. 3-D abnormal cinch connector according to claim 1, it is characterised in that：Radio-frequency transmission line is arranged at two layers of gold medal Between belonging to wire, shielded by the plain conductor of adjacent two layers, realize electromagnetic isolation.
- 4. a kind of implementation method of one of Claim 1-3 3-D abnormal cinch connector, specific method step are：S1, three-dimensional modeling：After product structure and interface relationship design, by three-dimensional modeling, design the three-dimensional of connector and tie Structure, configuration and interface layout；S2, three-dimensional structure are realized：Using plastics as body, realized by injection molding manner；Or,Using metal as body, by forging and pressing, casting, welding and machining mode realizes matrix, then on metallic matrix By spraying, organic thin film in covering；S3, laser activation：According to configuration, the part for needing metallic circuit is subjected to activation process with laser；S4, wired foil：By way of chemical plating or plating, the part that laser activation is crossed plates the coat of metal；S5, interface processing：According to the performance requirement of distinct interface, difference is installed by different connected modes to each interface Connectivity port；The different connected mode includes bonding, welding and mechanically connected；The connectivity port and its corresponding ports Matching.
- 5. according to the method for claim 4, methods described also includes：The port to match each other uses convention connectors.
- 6. the method according to claim 4 or 5, methods described also include：When carrying out the circuit production of two layers and the above, weight Multiple spraying, laser activation and wired foil step are realized.
- 7. a kind of implementation method of 3-D abnormal cinch connector, specific method step are：S1, three-dimensional modeling：After product structure and interface relationship design, by three-dimensional modeling, design the three-dimensional of connector and tie Structure, configuration and interface layout；S2, three-dimensional structure are realized：Using plastics as body, realized by injection molding manner；Or,Using metal as body, by forging and pressing, casting, welding and machining mode realizes matrix, then on metallic matrix By spraying, organic thin film in covering；S3, laser activation：According to configuration, the part for needing metallic circuit is subjected to activation process with laser；S4, wired foil：By way of chemical plating or plating, the part that laser activation is crossed plates the coat of metal；S5, interface processing：According to the performance requirement of distinct interface, difference is installed by different connected modes to each interface Connectivity port；The different connected mode includes bonding, welding and mechanically connected；The connectivity port and its corresponding ports Matching.
- 8. according to the method for claim 7, methods described also includes：The port to match each other uses convention connectors.
- 9. the method according to claim 7 or 8, methods described also include：When carrying out the circuit production of two layers and the above, weight Multiple spraying, laser activation and wired foil step are realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710823182.6A CN107623233A (en) | 2017-09-13 | 2017-09-13 | A kind of 3-D abnormal cinch connector and implementation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710823182.6A CN107623233A (en) | 2017-09-13 | 2017-09-13 | A kind of 3-D abnormal cinch connector and implementation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107623233A true CN107623233A (en) | 2018-01-23 |
Family
ID=61088352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710823182.6A Pending CN107623233A (en) | 2017-09-13 | 2017-09-13 | A kind of 3-D abnormal cinch connector and implementation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107623233A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101634018A (en) * | 2008-07-27 | 2010-01-27 | 比亚迪股份有限公司 | Selective chemical plating method for plastic base material |
| CN104218405A (en) * | 2014-08-27 | 2014-12-17 | 西安空间无线电技术研究所 | Spaceborne integrated miniaturized composite connector |
| CN104916895A (en) * | 2015-05-31 | 2015-09-16 | 中国电子科技集团公司第十研究所 | Radio frequency and band-shaped wire interface assembly method |
| CN105101656A (en) * | 2015-07-31 | 2015-11-25 | 歌尔声学股份有限公司 | Conductor line and manufacture method thereof |
| CN105282957A (en) * | 2014-06-27 | 2016-01-27 | 激制实业（上海）有限公司 | Three-dimensional stereo circuit and production method thereof |
| CN105555038A (en) * | 2016-02-02 | 2016-05-04 | 深圳光韵达光电科技股份有限公司 | Method for forming circuit on nonmetallic substrate |
| US20170244199A1 (en) * | 2012-03-19 | 2017-08-24 | Holland Electronics Llc | Shielded and multishielded coaxial connectors |
-
2017
- 2017-09-13 CN CN201710823182.6A patent/CN107623233A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101634018A (en) * | 2008-07-27 | 2010-01-27 | 比亚迪股份有限公司 | Selective chemical plating method for plastic base material |
| US20170244199A1 (en) * | 2012-03-19 | 2017-08-24 | Holland Electronics Llc | Shielded and multishielded coaxial connectors |
| CN105282957A (en) * | 2014-06-27 | 2016-01-27 | 激制实业（上海）有限公司 | Three-dimensional stereo circuit and production method thereof |
| CN104218405A (en) * | 2014-08-27 | 2014-12-17 | 西安空间无线电技术研究所 | Spaceborne integrated miniaturized composite connector |
| CN104916895A (en) * | 2015-05-31 | 2015-09-16 | 中国电子科技集团公司第十研究所 | Radio frequency and band-shaped wire interface assembly method |
| CN105101656A (en) * | 2015-07-31 | 2015-11-25 | 歌尔声学股份有限公司 | Conductor line and manufacture method thereof |
| CN105555038A (en) * | 2016-02-02 | 2016-05-04 | 深圳光韵达光电科技股份有限公司 | Method for forming circuit on nonmetallic substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2019228500B2 (en) | Snap-RF interconnections | |
| CN102783259B (en) | Electromagnetic coupled structure, the manufacture method of multilamellar transmission lines plate, electromagnetic coupled structure and the manufacture method of multilamellar transmission lines plate | |
| AU2019229254B2 (en) | Additive manufacturing technology (AMT) low profile signal divider | |
| TWI823009B (en) | Beamformer and beamformer array | |
| CN103201897A (en) | Cavity filter | |
| CN105142329B (en) | The suspended substrate stripline circuit and its implementation of multilayer circuit board riveted structure and its composition | |
| CN102480852A (en) | Method for manufacturing circuit boards | |
| CN110022641A (en) | A kind of manufacture craft of radio-frequency front-end high density composite substrate | |
| CN107623233A (en) | A kind of 3-D abnormal cinch connector and implementation method | |
| CN106463226A (en) | Magnetic plate and method for manufacturing same | |
| KR20200091301A (en) | A cavity filter and an antenna module including the cavity filter | |
| CN104576616B (en) | Module integrated circuit packaging structure and preparation method thereof | |
| CN107086397A (en) | The manufacture method and its electric connector of electric connector | |
| WO2020253147A1 (en) | Shielding process for sip packaging | |
| CN204482148U (en) | Circuit board and circuit board apparatus | |
| CN102933026A (en) | Circuit board for frequency generator and manufacturing method thereof | |
| CN104902698B (en) | The processing method of circuit edge connector and the circuit board with golden finger | |
| CN110021831A (en) | Microwave vertical transition connection structure and microwave device | |
| CN103533749A (en) | Circuit board of power amplifier and manufacturing method of circuit board | |
| CN113540768B (en) | Connection structure applied to microwave system | |
| CN203386796U (en) | LED luminous strip packaging structure | |
| CN202998643U (en) | Printed circuit board with a plurality of blind holes and two buried holes | |
| CN102780140A (en) | Power source connector | |
| CN102811568A (en) | Manufacturing method for printed circuit board with concave and convex copper design | |
| CN105338455B (en) | Have the micro-electro-mechanical microphone packaging structure and its preparation method of Improvement type back-cover |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180123 |
|
| RJ01 | Rejection of invention patent application after publication |