CN107620067B - A kind of engraving method of silver-copper brazing alloy - Google Patents
A kind of engraving method of silver-copper brazing alloy Download PDFInfo
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- CN107620067B CN107620067B CN201710840677.XA CN201710840677A CN107620067B CN 107620067 B CN107620067 B CN 107620067B CN 201710840677 A CN201710840677 A CN 201710840677A CN 107620067 B CN107620067 B CN 107620067B
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Abstract
The present invention is a kind of engraving method of silver-copper brazing alloy, includes the following steps: (1) alkaline degreasing: soldering semi-finished product shell being put into alkaline degreasing solution and is cleaned；(2) it washes: first being rinsed with tap water, then cleaned up with deionized water；(3) pickling: the shell of washing is put into pickling solution and is cleaned；(4) it dries；High temperature drying and processing is carried out to the shell after washing with high-temperature blast drying oven；(5) etch: shell is put into etching solution；(6) after etching, shell iterative process step (2) washing, step (4) drying are taken out.Advantage: 1) no any corrosion is etched to silver-copper brazing alloy and injured, shell is brazed pattern, size, the level of coverage of solder and subsequent plating high reliablity.2) process for slowing down etching, increases the range of etching period, and 3) reduce environmental pollution；4) at low cost, it is simple and easy；5) " the silver migration " of RF power device shell, significant effect are solved the problems, such as.
Description
Technical field
The present invention relates to a kind of engraving methods of silver-copper brazing alloy, belong to technical field of surface, by the method,
Silver-copper brazing alloy can be selectively removed from whole all positions.This method is brazed the shell that acquisition is intentionally got
Pattern, size, the level of coverage of solder and subsequent plating reliability are particularly useful, in addition, this method is as having, " silver is moved
The pre-treatment for the product that shifting " requires, it is particularly critical.
Background technique
Silver system solder is usage history longest in solder, most widely used a kind of solder.Especially Ag-Cu eutectic
(Ag72-Cu28) solder is using most solders in current electronic encapsulation device brazing process, its fusing point is low, does not crystallize
Interval, free-running property is good, be formed by weld seam thermal conductivity and electric conductivity it is preferable, so Electronic Packaging component manufacture on, it
The total amount of solder of usage amount Zhan 80% or more.In the soldering operation of encapsulation component, the free-running property of silver-copper brazing alloy is to device
Appearance, air-tightness, reliability etc. have a major impact, and the wandering control of silver-copper brazing alloy is appropriate, and Solder Spread is uniform, may be implemented to combine
Interface is smooth, is tightly combined.But work as the wandering excessive of silver-copper brazing alloy, when Solder Spread area is excessive or solder layer is blocked up, then
The influence of following several respects may be brought:
1) shell soldering pattern is unsatisfactory for requiring, and size is poor；
2) solder layer hole increases, the impurity that is mingled with increases, when subsequent progresss plating can not by the processing of these magazines completely,
The ratio for phenomena such as peeling, blistering occur after plating is caused to increase；
3) coating can not preferably realize the generation for leading to silver-colored migration problem to the fully wrapped around of solder；
4) it may have a certain impact to other reliabilities of device.
Therefore, it is badly in need of developing a kind of method that can be selectively removed silver-copper brazing alloy from whole all positions,
And the amount removed can be controlled well, with obtain desired shell soldering pattern, size, solder level of coverage and
Subsequent plating reliability, while the other materials of device can such as not cut down, ceramics, metallization, coating (nickel coating, Gold plated Layer
Deng) etc. have corrosion harmfulness.However, at present there is no a kind of good method specifically for or preferentially lost for silver-copper brazing alloy
It carves, so that solder is removed from all positions of product.
Summary of the invention
Proposed by the present invention is a kind of engraving method of silver-copper brazing alloy, and purpose is intended to overcome upper present in the prior art
State problem, silver-copper brazing alloy be etched, at the same to can cut down, ceramics, metallization, coating (nickel coating, Gold plated Layer etc.) etc. and its
He control effectively in material corrosion harm, and solder can be selectively removed from whole all positions.
Technical solution of the invention: a kind of engraving method of silver-copper brazing alloy includes the following steps:
(1) alkaline degreasing: soldering semi-finished product shell is put into 60-80 DEG C of alkaline degreasing solution and cleans 5-15min；
(2) it washes: first rinsing the shell after alkaline degreasing with tap water, then cleaned up with deionized water；
(3) pickling: the shell of washing is put into 60-80 DEG C of pickling solution and cleans 5-15min；
(4) it dries；High temperature drying and processing is carried out to the shell after washing with 100-120 DEG C of high-temperature blast drying oven；
(5) it etches: the shell after cleaning, drying is put into etching solution, etching solution temperature is -40 DEG C of room temperature, when etching
Between 30-60min；
(6) after etching, shell iterative process step (2) washing, step (4) drying are taken out.
Compared with prior art, beneficial effects of the present invention are as follows:
1) present invention uses the Compound-acid of both accelerator and oxidant, optimum proportioning is had found, silver-bearing copper can be welded
Material is etched, to can cut down, ceramics, metallization, coating (nickel coating, Gold plated Layer etc.) etc. and other metal materials do not have any corruption
Erosion injury is brazed pattern, size, the level of coverage of solder and subsequent plating reliability especially for the shell that acquisition is intentionally got
It is useful；
2) process that corrosion inhibiter slows down etching is added, increases the range of etching period, it is easier to control to obtain desired solder
Etching state；
3) toxic and harmful gas evolution is few in etching process, reduces environmental pollution, improves the working environment of employee；
4) at low cost, it is simple and easy, it is suitable for factory and operation is mass produced；
5) " silver migrates " of the invention for solving the problems, such as RF power device shell, significant effect.
Specific embodiment
A kind of engraving method of silver-copper brazing alloy, includes the following steps:
(1) alkaline degreasing: soldering semi-finished product shell is put into 60-80 DEG C of alkaline degreasing solution and cleans 5-15min；
(2) it washes: first rinsing the shell after alkaline degreasing with tap water, then cleaned up with deionized water；
(3) pickling: the shell of washing is put into 60-80 DEG C of pickling solution and cleans 5-15min；
(4) it dries；High temperature drying and processing is carried out to the shell after washing with 100-120 DEG C of high-temperature blast drying oven；
(5) it etches: the shell after cleaning, drying is put into etching solution, etching solution temperature is -40 DEG C of room temperature, when etching
Between 30-60min；
(6) after etching, shell iterative process step (2) washing, step (4) drying are taken out.
Solution used in oil removing in the step (1) is the electrochemical deoiling powder of 40 ~ 60g/L of concentration.
Solution used in pickling in the step (3) is the sulphur of the OP emulsifier of 5-10mL/L, 75-150g/L
Urea, by 100-200mL/L 95-98wt% sulfuric acid form aqueous solution, stir to dissolve completely after use, after pickling with from
Water cleans up.
Etching solution in the step (5) is aqueous solution, preparation method be first by 200-300 mL/L accelerator and
400-600mL/L oxidizing agent solution is uniformly mixed, mixed liquor total volume 600-900mL, and surplus adds to 1000mL for water, then will
The corrosion inhibiter of 20-100g is added to the water, and stirs to being completely dissolved, gained is etching solution.
The oxidant selects 63-68wt% nitric acid or 98-99.5wt% glacial acetic acid；
The accelerator selects 95-98wt% sulfuric acid or 36-38wt% hydrochloric acid or 83-98wt% phosphoric acid；
The corrosion inhibiter selects 3- nitrobenzene sodium sulfonate or disodium ethylene diamine tetraacetate.
The preference temperature of etching solution is room temperature when etching, is no more than 40 DEG C.
Below with reference to embodiment, the invention will be described in further detail.
Embodiment 1
A kind of engraving method of silver-copper brazing alloy, comprising the following steps:
1. alkaline degreasing
Alkaline degreasing is aqueous solution, wherein the electrochemical deoiling powder containing 40 g/L, is put into 60 DEG C for soldering semi-finished product shell
Alkaline degreasing solution in clean 5min；
2. washing
The shell 3min after alkaline degreasing is first rinsed with tap water, then cleans 3min with deionized water；
3. pickling
Pickling solution is aqueous solution, wherein containing: the OP emulsifier of 5mL/L, the thiocarbamide of 75g/L, 100mL/L sulfuric acid,
The shell of washing is put into 60 DEG C of pickling solution and cleans 5min；
4. washing
The shell 3min after alkaline degreasing is first rinsed with tap water, then cleans 3min with deionized water；
5. drying
High temperature drying and processing is carried out to the shell after washing with 100 DEG C of high-temperature blast drying ovens；
6. etching
Etching solution used includes: the oxidant that volume by volume concentration is 400mL/L, and volume by volume concentration is 200mL/L's
Accelerator, the corrosion inhibiter of 20g/L, the solution temperature are room temperature DEG C, and the shell after cleaning, drying is immersed etching solution and is shaken
30min is put into deionized water after etching and cleans 3min, then dries.
Embodiment 2
A kind of engraving method of silver-copper brazing alloy, comprising the following steps:
1. alkaline degreasing
Alkaline degreasing is aqueous solution, wherein the electrochemical deoiling powder containing 60 g/L, is put into 80 DEG C for soldering semi-finished product shell
Alkaline degreasing solution in clean 15min；
2. washing
The shell 5min after alkaline degreasing is first rinsed with tap water, then cleans 5min with deionized water；
3. pickling
Pickling solution is aqueous solution, wherein containing: the OP emulsifier of 10mL/L, the thiocarbamide of 150g/L, 200mL/L sulphur
The shell of washing is put into 80 DEG C of pickling solution and cleans 15min by acid；
4. washing
The shell 5min after alkaline degreasing is first rinsed with tap water, then cleans 5min with deionized water；
5. drying
High temperature drying and processing is carried out to the shell after washing with 120 DEG C of high-temperature blast drying ovens；
6. etching
Etching solution used includes: the oxidant that volume by volume concentration is 600mL/L, and volume by volume concentration is 300mL/L's
Accelerator, the corrosion inhibiter of 100g/L, the solution temperature are 40 DEG C, and the shell after cleaning, drying is immersed etching solution and is shaken
60min is put into deionized water after etching and cleans 5min, then dries.
Embodiment 3
A kind of engraving method of silver-copper brazing alloy, comprising the following steps:
1. alkaline degreasing
Alkaline degreasing is aqueous solution, wherein the electrochemical deoiling powder containing 50 g/L, is put into 70 DEG C for soldering semi-finished product shell
Alkaline degreasing solution in clean 10min；
2. washing
The shell 4min after alkaline degreasing is first rinsed with tap water, then cleans 4min with deionized water；
3. pickling
Pickling solution is aqueous solution, wherein containing: the OP emulsifier of 7mL/L, the thiocarbamide of 115g/L, 150mL/L sulfuric acid,
The shell of washing is put into 70 DEG C of pickling solution and cleans 10min；
4. washing
The shell 4min after alkaline degreasing is first rinsed with tap water, then cleans 4min with deionized water；
5. drying
High temperature drying and processing is carried out to the shell after washing with 110 DEG C of high-temperature blast drying ovens；
6. etching
Etching solution used includes: the oxidant that volume by volume concentration is 500mL/L, and volume by volume concentration is 250mL/L's
Accelerator, the corrosion inhibiter of 60g/L, the solution temperature are 30 DEG C, and the shell after cleaning, drying is immersed etching solution and is shaken
45min is put into deionized water after etching and cleans 4min, then dries.
Claims (1)
1. a kind of engraving method of silver-copper brazing alloy, it is characterised in that include the following steps:
(1) alkaline degreasing: soldering semi-finished product shell is put into 60-80 DEG C of alkaline degreasing solution and cleans 5-15min；
(2) it washes: first rinsing the shell after alkaline degreasing with tap water, then cleaned up with deionized water；
(3) pickling: the shell of washing is put into 60-80 DEG C of pickling solution and cleans 5-15min；
(4) it dries；High temperature drying and processing is carried out to the shell after washing with 100-120 DEG C of high-temperature blast drying oven；
(5) it etches: the shell after cleaning, drying is put into etching solution, etching solution temperature is -40 DEG C of room temperature, etching period
30-60min；
(6) after etching, shell iterative process step (2) washing, step (4) drying are taken out；
Solution used in oil removing in the step (1) is the electrochemical deoiling powder of 40 ~ 60g/L of concentration；
Solution used in pickling in the step (3) be the OP emulsifier of 5-10mL/L, 75-150g/L thiocarbamide, press
The aqueous solution of the 95-98wt% sulfuric acid composition of 100-200mL/L, uses after stirring to dissolve completely, clear with tap water after pickling
Wash clean；
Etching solution in the step (5) is aqueous solution, and preparation method is first by 200-300 mL/L accelerator and 400-
600mL/L oxidizing agent solution is uniformly mixed, mixed liquor total volume 600-900mL, and surplus is that water adds to 1000mL, then by 20-
The corrosion inhibiter of 100g is added to the water, and stirs to being completely dissolved, gained is etching solution；
The oxidant selects 63-68wt% nitric acid or 98-99.5wt% glacial acetic acid；The accelerator selects 95-98wt% sulphur
Acid or 36-38wt% hydrochloric acid or 83-98wt% phosphoric acid；The corrosion inhibiter selects 3- nitrobenzene sodium sulfonate or ethylenediamine tetra-acetic acid
Disodium；The preference temperature of etching solution is room temperature when etching, is no more than 40 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710840677.XA CN107620067B (en) | 2017-09-18 | 2017-09-18 | A kind of engraving method of silver-copper brazing alloy |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710840677.XA CN107620067B (en) | 2017-09-18 | 2017-09-18 | A kind of engraving method of silver-copper brazing alloy |
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| CN107620067A CN107620067A (en) | 2018-01-23 |
| CN107620067B true CN107620067B (en) | 2019-11-12 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110252732A (en) * | 2019-06-29 | 2019-09-20 | 新乡市七星钎焊科技有限公司 | A kind of cleaning method of brazing solder |
| CN110565096A (en) * | 2019-10-16 | 2019-12-13 | 中电国基南方集团有限公司 | Silver migration prevention method for radio frequency power device shell |
| CN110528038B (en) * | 2019-10-16 | 2021-09-03 | 中电国基南方集团有限公司 | Method for improving welding performance of copper surface for packaging shell after heat sink gold plating |
| CN110993485B (en) * | 2019-11-27 | 2022-06-10 | 江苏富乐华半导体科技股份有限公司 | Surface passivation method of silicon nitride ceramic copper-clad substrate |
Citations (3)
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|---|---|---|---|---|
| JP2014156629A (en) * | 2013-02-15 | 2014-08-28 | Jcu Corp | Etchant for copper or copper alloy, and method for etching copper or copper alloy using the same |
| CN104309357A (en) * | 2014-09-18 | 2015-01-28 | 陈俊达 | Steel ball for anti-counterfeiting sign pen and production method of steel ball |
| CN106783537A (en) * | 2016-12-01 | 2017-05-31 | 武汉新芯集成电路制造有限公司 | A kind of method for removing crystal column surface solder |
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2017
- 2017-09-18 CN CN201710840677.XA patent/CN107620067B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014156629A (en) * | 2013-02-15 | 2014-08-28 | Jcu Corp | Etchant for copper or copper alloy, and method for etching copper or copper alloy using the same |
| CN104309357A (en) * | 2014-09-18 | 2015-01-28 | 陈俊达 | Steel ball for anti-counterfeiting sign pen and production method of steel ball |
| CN106783537A (en) * | 2016-12-01 | 2017-05-31 | 武汉新芯集成电路制造有限公司 | A kind of method for removing crystal column surface solder |
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