CN107619458A - A kind of preparation method of photosensitive resin - Google Patents
A kind of preparation method of photosensitive resin Download PDFInfo
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- CN107619458A CN107619458A CN201710870717.5A CN201710870717A CN107619458A CN 107619458 A CN107619458 A CN 107619458A CN 201710870717 A CN201710870717 A CN 201710870717A CN 107619458 A CN107619458 A CN 107619458A
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- photosensitive resin
- polyfunctionality
- preparation
- acrylate containing
- containing strontium
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Abstract
The invention provides a kind of preparation method of photosensitive resin, including step:Two trimethylolpropane tetra-acrylates are added into polyfunctionality acrylate containing strontium, 1 hydroxycyclohexyl phenyl ketone, 4 boric acid dibenzofuran, 4, the crown ether 6 of 4' dibromos dibenzo 18, N (isobutoxy) Methacrylamide, double (pentamethylcyclopentadiene) cobalts, 4 10h are stirred at 50 65 DEG C, produce photosensitive resin.
Description
Technical field
The present invention relates to a kind of preparation method of photosensitive resin.
Background technology
China initially enters photosensitive field from the 1980s.The production of early stage photosensitive resin is mainly that the U.S. is husky more
Company, the present country such as agate, Japanese synthesis, Bayer Bitterfeld GmbH, Taiwan Changxing have many producers to be also well done, such as three wooden groups,
Appearance coloured silkization work etc..Recently as the enhancing of people's energy conservation and environmental awareness, photosensitive resin varieties and characteristicses constantly strengthen, application field
Constantly expand, yield quickly increases, and shows swift and violent growth momentum.After particularly coating is included in consumption tax range of collection, light
The development of quick resin is expected to further speed up.At present, photocureable coating be not only widely used in paper, plastics, leather, metal,
A variety of base materials such as glass, ceramics, and be successfully applied in materials such as optical fiber, printed circuit board (PCB), electronic component encapsulation.
CN106896641A discloses a kind of formula of photosensitive resin, and it is formulated parts per hundred parts by the component of following parts by weight
Composition:UV-Curable Prepolymer 20-40 parts, monomer 5-20 parts, reactive diluent 15-30 parts, crosslinking agent 5-20 parts, light trigger 0.5-
5 parts, auxiliary agent 0.2-3 parts, conductive particle 10-20 parts, the monomer is benzene oxygen ethyl propylene acid esters, and the reactive diluent is double
Phenol A diacrylate fat, the crosslinking agent are the propylene of three propane of trihydroxy methyl three.The present invention is advantageous in that:Effectively
Solve the problems, such as that present photosensitive resin toughness deficiency, impact resistance are poor, frangible, while add the conductive energy of photosensitive resin
Power.
CN105116686A discloses a kind of 3D printing photosensitive resin, and its raw material includes following components:Oligomer:Oneself
Lactone-modified urethane acrylate;Reactive diluent:Monofunctional acrylates' ester, bifunctional acrylate, more officials
Monofunctional acrylates' ester, the amido-containing acid ester of acrylate, vinyl monomer, vinyl ethers, the end group containing methoxy can be rolled into a ball
Monofunctional acrylates' ester or cyclic carbonate ester monofunctional acrylates' ester;Ultraviolet initiator:Styrax ethers, 2,2- bis-
Methyl alpha-hydroxyacetophenone or azido compound.3D printing photosensitive resin of the present invention, the more existing 3D printing of cost is with photosensitive tree
Fat is low, application easy to spread;Shower nozzle is not easily blocked when in use, and the material printed has excellent compliance and mechanical property
3 D-printing material.
Existing photosensitive resin product, there is the problem of product stability is not strong mostly, product is easily deformed, fragile
Split, easily discoloration, influences overall precision, outward appearance and performance, can not meet some downstreams higher for service life requirement
The requirement of technique.
The content of the invention
The purpose of the present invention is:A kind of production technology of photosensitive resin is provided, overcomes disadvantages mentioned above, it is characterised in that as follows
Step:
By weight, bipentaerythrite is added in a kettle, Isosorbide-5-Nitrae-cyclohexane diisocyanate, is hydrated acetylacetone,2,4-pentanedione strontium,
Under ferric acetyl acetonade catalysis, 1-3h is reacted at 55-65 DEG C, adds 3- perfluoro hexyl -2- hydroxypropyl acrylates, reacts 3-
6h, obtain polyfunctionality acrylate containing strontium;
Two trimethylolpropane tetra-acrylates, 1- hydroxycyclohexylphenyl first are added into polyfunctionality acrylate containing strontium again
Ketone, 4- boric acid dibenzofuran, 4,4'- dibromo dibenzo-18-crown-6 (DB18C6)s, N- (isobutoxy) Methacrylamide, double (pentamethyl rings
Pentadiene) cobalt, stirs 4-10h at 50-65 DEG C, produces photosensitive resin.
The quality dosage of described polyfunctionality acrylate containing strontium raw material is bipentaerythrite:1,4- hexamethylenes two are different
Cyanate:It is hydrated acetylacetone,2,4-pentanedione strontium:Ferric acetyl acetonade:3- perfluoro hexyl -2- hydroxypropyls acrylic acid=1:3.5-4.5:0.001-
0.005:0.1-0.5:8-10。
Two described trimethylolpropane tetra-acrylates, its quality dosage are the 1-6% of polyfunctionality acrylate containing strontium.
Described 1- hydroxycyclohexyl phenyl ketones, its quality dosage are the 0.5-4% of polyfunctionality acrylate containing strontium.
Described 4- boric acid dibenzofuran, its quality dosage are the 5-20% of polyfunctionality acrylate containing strontium.
Described 4,4'- dibromo dibenzo-18-crown-6 (DB18C6)s, its quality dosage are the 1- of polyfunctionality acrylate containing strontium
3%。
Described N- (isobutoxy) Methacrylamide, its quality dosage are the 0.1- of polyfunctionality acrylate containing strontium
0.5%.
Described double (pentamethylcyclopentadiene) cobalts, its quality dosage are the 0.1-0.3% of polyfunctionality acrylate containing strontium.
Described bipentaerythrite is commercially available prod, the product produced such as Puyang Yong'an Chemical Industry Co., Ltd.;1,4- rings
Hexane diisocyanate is commercially available prod, the product produced such as Hangzhou great Yang Chemical Co., Ltd.s;3- perfluoro hexyl -2- hydroxypropyls
Acrylate is commercially available prod, as Wuhan power dimension can Science and Technology Ltd. produce product;Two trimethylolpropane tetras acid
Ester is commercially available prod, the product produced such as Hangzhou Jie Heng Chemical Co., Ltd.s;1- hydroxycyclohexyl phenyl ketones are commercially available prod,
Such as Shanghai Losec Chemical Co., Ltd.;
4- boric acid dibenzofuran, 4,4'- dibromo dibenzo-18-crown-6 (DB18C6)s, N- (isobutoxy) Methacrylamide, double (pentamethyls
Cyclopentadiene) cobalt is commercially available prod.
The product of the present invention has the advantages that:
Photosensitive resin crosslinking degree of the present invention is big, has excellent a flexility and water repelling property, not easily broken, be not easy
Absorb water, be unlikely to deform, can preferably meet the needs of downstream process deforms for long-time storage with not cracky.
Embodiment
Following instance is only to further illustrate the present invention, is not limitation the scope of protection of the invention.
Embodiment 1
Bipentaerythrite 100Kg is added in a kettle, Isosorbide-5-Nitrae-cyclohexane diisocyanate 400Kg, is hydrated acetylacetone,2,4-pentanedione strontium
0.3Kg, ferric acetyl acetonade 30Kg, 2h, 3- perfluoro hexyl -2- hydroxypropyl acrylate 900Kg are reacted at a temperature of 60 DEG C, reacted
4.5h, obtain polyfunctionality acrylate containing strontium;
Two trimethylolpropane tetra-acrylate 3.5Kg, 1- hydroxy cyclohexylphenyls are added into 100Kg polyfunctionalities acrylate containing strontium
Base phenyl ketone 2.25Kg, 4- boric acid dibenzofuran 15Kg, 4,4'- dibromo dibenzo-18-crown-6 (DB18C6) 2Kg, N- (isobutoxy) first
Base acrylamide 0.3Kg, double (pentamethylcyclopentadiene) cobalt 0.2Kg, 7h is stirred at 57 DEG C, obtains photosensitive resin.
Embodiment 2
Bipentaerythrite 100Kg is added in a kettle, Isosorbide-5-Nitrae-cyclohexane diisocyanate 350Kg, is hydrated acetylacetone,2,4-pentanedione strontium
0.1Kg, ferric acetyl acetonade 10Kg, 1h, 3- perfluoro hexyl -2- hydroxypropyl acrylate 800Kg are reacted at a temperature of 55 DEG C, reacted
3h, obtain polyfunctionality acrylate containing strontium;
Two trimethylolpropane tetra-acrylate 1Kg, 1- hydroxy-cyclohexyls are added into 100Kg polyfunctionalities acrylate containing strontium
Phenyl ketone 0.5Kg, 4- boric acid dibenzofuran 5Kg, 4,4'- dibromo dibenzo-18-crown-6 (DB18C6) 1Kg, N- (isobutoxy) methyl-props
Acrylamide 0.1Kg, double (pentamethylcyclopentadiene) cobalt 0.1Kg, 4h is stirred at 50 DEG C, obtains photosensitive resin.
Embodiment 3
Bipentaerythrite 100Kg is added in a kettle, Isosorbide-5-Nitrae-cyclohexane diisocyanate 450Kg, is hydrated acetylacetone,2,4-pentanedione strontium
0.5Kg, ferric acetyl acetonade 50Kg, 3h, 3- perfluoro hexyl -2- hydroxypropyl acrylate 1000Kg are reacted at a temperature of 65 DEG C, instead
6h is answered, obtains polyfunctionality acrylate containing strontium;
Two trimethylolpropane tetra-acrylate 6Kg, 1- hydroxy-cyclohexyls are added into 100Kg polyfunctionalities acrylate containing strontium
Phenyl ketone 4Kg, 4- boric acid dibenzofuran 25Kg, 4,4'- dibromo dibenzo-18-crown-6 (DB18C6) 3Kg, N- (isobutoxy) metering systems
Acid amides 0.5Kg, double (pentamethylcyclopentadiene) cobalt 0.3Kg, 10h is stirred at 65 DEG C, obtains photosensitive resin.
Comparative example 1
4,4'- dibromo dibenzo-18-crown-6 (DB18C6)s are added without, other conditions are the same as embodiment 1.
Comparative example 2
Hydration acetylacetone,2,4-pentanedione strontium is added without, other conditions are the same as embodiment 1.
Comparative example 3
Double (pentamethylcyclopentadiene) cobalts are added without, other conditions are the same as embodiment 1.
Comparative example 4
4- boric acid dibenzofuran is added without, other conditions are the same as embodiment 1.
Comparative example 5
4,4'- dibromo dibenzo-18-crown-6 (DB18C6)s are added without, other conditions are the same as embodiment 1.
Embodiment 4
The photosensitive resin product for respectively being produced embodiment 1-3 and comparative example 1-3, with reference to the inspection of GB/T 2567-200 standards
The quick resin pliability of optometry, and the heat distortion temperature of resin is examined, it is shown in Table 1.
Table 1:The tensile strength and heat distortion temperature for the photosensitive resin product that different process is produced.
Production code member | Tensile strength/Mpa | Heat distortion temperature/DEG C |
Embodiment 1 | 69.8 | 84 |
Embodiment 2 | 68.9 | 83 |
Embodiment 3 | 70.4 | 86 |
Comparative example 1 | 59.2 | 74 |
Comparative example 2 | 62.3 | 76 |
Comparative example 3 | 61.5 | 74 |
Comparative example 4 | 67.5 | 72 |
Comparative example 5 | 67.9 | 79 |
Claims (7)
- A kind of 1. preparation method of photosensitive resin, it is characterised in that following steps:Two trimethylolpropane tetra-acrylates, 1- hydroxycyclohexylphenyl first are added into polyfunctionality acrylate containing strontium Ketone, 4- boric acid dibenzofuran, 4,4'- dibromo dibenzo-18-crown-6 (DB18C6)s, N- (isobutoxy) Methacrylamide, double (pentamethyl rings Pentadiene) cobalt, stirs 4-10h at 50-65 DEG C, produces photosensitive resin.
- A kind of 2. preparation method of photosensitive resin described in claim 1, it is characterised in that:Two described trimethylolpropanes four Acrylate, its quality dosage are the 1-6% of polyfunctionality acrylate containing strontium.
- A kind of 3. preparation method of photosensitive resin described in claim 1, it is characterised in that:Described 1- hydroxycyclohexylphenyls Ketone, its quality dosage are the 0.5-4% of polyfunctionality acrylate containing strontium.
- A kind of 4. preparation method of photosensitive resin described in claim 1, it is characterised in that:Described 4- boric acid dibenzofuran, its matter Measure the 5-20% that dosage is polyfunctionality acrylate containing strontium.
- A kind of 5. preparation method of photosensitive resin described in claim 1, it is characterised in that:Described 4,4'- dibromos dibenzo- 18- crown ether -6, its quality dosage are the 1-3% of polyfunctionality acrylate containing strontium.
- A kind of 6. preparation method of photosensitive resin described in claim 1, it is characterised in that:Described N- (isobutoxy) methyl Acrylamide, its quality dosage are the 0.1-0.5% of polyfunctionality acrylate containing strontium.
- A kind of 7. preparation method of photosensitive resin described in claim 1, it is characterised in that:Described double (pentamethyl rings penta 2 Alkene) cobalt, its quality dosage is the 0.1-0.3% of polyfunctionality acrylate containing strontium.
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CN101812278A (en) * | 2010-05-20 | 2010-08-25 | 上海西怡新材料科技有限公司 | Ultraviolet curable organic silicon-acrylic resin electronic adhesive and application thereof |
CN102766248A (en) * | 2012-07-25 | 2012-11-07 | 广州市博兴化工科技有限公司 | Method for preparing liquid urethane acrylate resin by recovered solid polyurethane |
CN103724556A (en) * | 2013-12-31 | 2014-04-16 | 蚌埠金黄山凹版印刷有限公司 | Preparation method of resin, resin, ink and preparation method thereof |
CN104710548A (en) * | 2014-01-03 | 2015-06-17 | 刘毓海 | 3D printing core material |
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Patent Citations (6)
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CN101157640A (en) * | 2007-09-20 | 2008-04-09 | 湖南大学 | Acrylic polyurethane having star-structure six functional groups and synthesizing method thereof |
CN101812278A (en) * | 2010-05-20 | 2010-08-25 | 上海西怡新材料科技有限公司 | Ultraviolet curable organic silicon-acrylic resin electronic adhesive and application thereof |
CN102766248A (en) * | 2012-07-25 | 2012-11-07 | 广州市博兴化工科技有限公司 | Method for preparing liquid urethane acrylate resin by recovered solid polyurethane |
CN103724556A (en) * | 2013-12-31 | 2014-04-16 | 蚌埠金黄山凹版印刷有限公司 | Preparation method of resin, resin, ink and preparation method thereof |
CN104710548A (en) * | 2014-01-03 | 2015-06-17 | 刘毓海 | 3D printing core material |
CN106810215A (en) * | 2017-01-18 | 2017-06-09 | 深圳摩方新材科技有限公司 | A kind of preparation of ceramic size and 3D printing Stereolithography method |
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