CN107615098A - Method for manufacturing RFID label tag - Google Patents
Method for manufacturing RFID label tag Download PDFInfo
- Publication number
- CN107615098A CN107615098A CN201680031337.6A CN201680031337A CN107615098A CN 107615098 A CN107615098 A CN 107615098A CN 201680031337 A CN201680031337 A CN 201680031337A CN 107615098 A CN107615098 A CN 107615098A
- Authority
- CN
- China
- Prior art keywords
- label tag
- rfid label
- station
- clothes
- fed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V15/00—Tags attached to, or associated with, an object, in order to enable detection of the object
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Textile Engineering (AREA)
- Theoretical Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Details Of Aerials (AREA)
Abstract
A kind of method for being used to manufacture the RFID used on the products such as clothes, clothes, clothing Related product, soft synthetic resin material product, leather.This method includes the RFID label tag that manufacture includes the encapsulation core of tolerable high pressure.Disclosed method further comprises gain antenna by gain antenna through the insertion encapsulation core so that bad readable minimum.Further, disclosed method minimizes use of the copper product in RFID label tag is manufactured.In addition, the RFID label tag that disclosed method is produced can be stitched on clothes, clothes and other products, to provide seamless mark, and one or more environmental conditions such as tolerable dry-cleaning condition, compression drying condition, hot conditions.
Description
Technical field
The present invention relates generally to radio frequency identification (RFID) equipment, more specifically, be related in such as clothes, clothes and/or
The RFID label tag used in the fabric of clothes etc/clothing Related product.
Background technology
RFID inlay including IC chip and/or RFID antenna can be read out/write the operation of data to it,
The RFID inlay was used to already to manage the data in various fields, i.e., by inserting or being attached to all kinds by RFID inlay
Product on, and be written to afterwards from the tag reader data related to product or by the data related with product on label.
RFID inlay generates a problem, i.e. clothing RFID label tag gradually becomes exposed so that clothing RFID label tag week
The part enclosed or attachment the pocket easily cleaning by clothes/clothes and pressing step in use and during collection
Influence and produce cumulative bad damage.
Further, RFID antenna be made up of thin metal foil or by etch etc. formed, the thin metal foil be by copper,
Aluminium etc. is made.The problem of existing is that RFID antenna easily disconnects.Can not directly it be stitched accordingly, it is possible to which the problem of existing is RFID inlay
Close on clothes/clothes etc..In addition, RFID inlay may be not suitable for using in the case of unappropriate packaging and encapsulation.
RFID inlay possibly can not provide thoughtful mark for the even more important clothes/clothes of wherein style and aesthetic property.
The content of the invention
The present invention has been made in view of above mentioned problem, and in one aspect of the invention, there is provided one kind is used to manufacture
Method for the RFID label tag of clothes, clothes, clothing Related product, soft synthetic resin material product, leather products etc..
According on the other hand, there is provided one kind is adapted to fit into clothes, clothes, clothing Related product, soft synthesis for manufacture
The method of RFID label tag in resin material product, leather products etc..
According on the other hand, there is provided a kind of method for manufacturing RFID label tag, the RFID label tag include tolerable height
The encapsulation core of pressure.According on the other hand, this method further comprises that gain antenna passes through gain antenna and inserts the encapsulation core
So that bad readable minimum.
According on the other hand, there is provided a kind of method for being used to manufacture the RFID label tag for including line, the line are one or more
Conductive particle is isolated to improve ultra-high frequency signal.Further, according on the other hand, there is provided a kind of to mark copper product in manufacture RFID
The method that use in label minimizes.
According on the other hand, there is provided a kind of method for manufacturing RFID label tag, the RFID label tag can be stitched into clothes,
On clothes and other products, to provide seamless mark, and tolerable such as dry-cleaning condition, compression drying condition, high temperature bar
One or more environmental conditions such as part.
After detailed description below in conjunction with the accompanying drawings has been read, it should be appreciated by those skilled in the art that advantages of the present invention and
Superior feature and other importances of the present invention.
Brief description of the drawings
Referring to the drawings following explanation is read, other objects of the present invention, feature and advantage will be evident.In the accompanying drawings,
The part corresponding to the instruction of identical reference wherein in each view：
Fig. 1 shows that description is used for the systematic square frame Figure 100 for manufacturing the method for RFID label tag.
Fig. 2 shows that description is used for the flow chart 200 for manufacturing the conventional method of RFID label tag.
Fig. 3 shows arrangement 300, and it describes the hot compression at the first hot compression station for manufacturing RFID label tag
Process.
Fig. 4 shows arrangement 400, and it describes the hot compression at the second hot compression station for manufacturing RFID label tag
Process.
Embodiment
The preferred embodiments of the present invention are reference will now be made in detail to now, the example of preferred embodiment is shown in the drawings.
The present disclosure describes the method for manufacturing radio frequency identification (RFID, being commonly called as electronic tag) label.Specifically, originally
Open describe is used for clothes, clothes, clothing Related product, soft synthetic resin material product, leather products etc. for manufacturing
The method of RFID label tag.According to an embodiment, there is provided be adapted to fit into clothes, clothes, clothing Related product, soft conjunction for manufacturing
The method of RFID label tag in resin material product, leather products etc..The RFID label tag includes line, base portion antenna, encapsulation core
And RFID chip.
According to another embodiment, there is provided include the method for the RFID label tag of the encapsulation core of tolerable high pressure for manufacturing.It
Afterwards, this method further comprises gain antenna by gain antenna through the insertion encapsulation core so that bad readable minimum.
Further, according to another embodiment, there is provided the method for manufacturing the RFID label tag for including line, the one or more conductions of the line
Particle is isolated to amplify ultra-high frequency signal.Further, according on the other hand, there is provided by copper product making in RFID label tag is manufactured
With the method for minimum.
According to another embodiment, the present invention be advantageous to by RFID label tag be sewn onto in clothes, clothes and other products with
Seamless mark, and further one or more environment such as tolerance dry-cleaning condition, compression drying condition, hot conditions are provided
Condition.
The one or more elements and combination that can be indicated by especially being indexed in claims are disclosed to realize
The purpose and advantage of invention.
One of ordinary skill in the art will be understood that overall description and following detailed description above are exemplary
With explanatory, and non-limiting disclosed invention claimed.
It will be described with reference to the accompanying drawings for manufacturing the RFID label tag used on clothes, clothes, clothing Related product etc.
The various embodiments of disclosed invention.
Fig. 1 shows that description is used for the systematic square frame Figure 100 for manufacturing the method for RFID label tag.Systematic square frame Figure 100 includes
One or more block diagrams in order, it depicts the method for manufacturing RFID label tag.Systematic square frame Figure 100 includes upside-down mounting
Chip jointer 102, the first allocation unit 104, the first buffered station 106 and the first hot compression station 108.Further, system side
Block diagram 100 includes the second buffered station 110, the second allocation unit 112 and the second hot compression station 114.In addition, system block diagram
100 include customization station 116 for producing RFID label tag 118.System block diagram also includes being used to be laminated produced RFID marks
The laminated units 120 of label 118 and the output station unit 122 that finished product RFID label tag is delivered for transmitting.
First, one or more input materials are provided to flip-chip bond device 102.One or more input materials can
Including but not limited at least one of the following or multiple：Antenna, chip (such as 8 " bumped saw chips), chip and
PET base.In one embodiment, one or more input materials of such as antenna etc may include the copper rail above antenna
Road.In one embodiment, to the feed antenna of flip-chip bond device 102.Can use spool form by antenna feed to fall
Cored wafer bonder 102.In another embodiment, the form that antenna can be used together to spool together with chip is fed to upside-down mounting
Chip jointer 102.Afterwards, antenna is handled with least one or more of adhesive in the first allocation unit 104.Should
One or more adhesives may include but be not limited at least one of the following or multiple：AC268, MK055 and EN525.
Tube core searched (to find good unit), pick up, overturn and be placed into the bonding in required die site and distributed
Before above agent position, by least one or more of adhesive distribution in required die position.First allocation unit 104 will
The next position is transferred to repeat whole process again.Further, in one embodiment, the first allocation unit 104, which can index, refers to
Show to be fed to the grafting material at the first hot compression station 108.In one embodiment, when the first hot compression station 108, refusal connects
By such as grafting material etc feedthrough material when, the first buffered station 106 can be placed in the first allocation unit 104 and the first hot pressing
Between contracting station 108.One of ordinary skill in the art will be understood that hot press method needs more times than placing tube core.
In such cases, grafting material can be stored temporarily in such as buffered station of first buffered station 106 etc.Further, this area
Ordinarily skilled artisan will understand that, the number of the unit for the one or more design cells that such as solidify parallel, will depend on
In whole technological process and its design.
Further, in one embodiment, the one or more design cells obtained from the first hot compression station 108 can be temporary transient
It is stored in the second buffered station 110.Afterwards, one or more design cells are fed to the second allocation unit 112 with extremely
Few one or more adhesives are handled.One or more adhesives may include but be not limited to it is at least one of following or
It is a variety of：AC268, MK055 and EN525.For example, can be all to apply by being moved along at the top of copper rail road by 10cc syringes
Such as MK055 etc adhesive.One of ordinary skill in the art will be understood that, in the bar for the scope for not limiting disclosed invention
Under part, the process will be repeated for each unit.
After being handled with least one or more of adhesive one or more design cells, by this or
Multiple design cells are fed to the second hot compression station 114.In one embodiment, at least two are performed at the second hot compression station 114
Individual step.First, silicon ribbon (silicon string) is placed, silicon ribbon is then bonded to copper rail road.In one embodiment, silicon ribbon
Can concurrently it be fed with antenna.In one embodiment, by using the pneumatic movement being combined with one or more guide fingers
Silicon ribbon is fed in particular design fixture by device.In one embodiment, it is special due to silicon ribbon length and the difference of antenna spacing
Determine design fixture (instrument/equipment) to be made into silicon ribbon holding and antenna parallel.When particular design fixture receives ready letter
Number when, silicon ribbon can be placed into above the work station at the second hot compression station 114 to be reduced on antenna.In an embodiment
In, when antenna moves into place, signal is sent so that particular design fixture is reduced to above antenna.Afterwards, the second hot compression station
114 will perform its operation.Second hot compression station 114 uses predetermined force compact silicon band and copper rail road.Predetermined force is applied into pre- spacing
From and the scheduled time to avoid causing any damage to silicon cover strip (silicon cover string).The ordinary skill of this area
Personnel will be understood that, under conditions of the scope of disclosed invention is not limited, repeat the process at the second hot compression station 114.
Customization will be fed to using one or more design cells obtained from the second hot compression station 114 of scroll form
Stand 116.Customization station 116 may include one or more stations, such as, but not limited to cutting station, carry out and without (Go and
NoGo) testing station and mark station.Because one or more design cells use scroll form, therefore silicon ribbon and adjacent cells
Disconnect and carried out with eliminating and carried out and without the interference during test, the progress and without testing will occur in without surveying
Try at station.Before next lamination, molding or encapsulation process occur, the one or more non-functional units of mark station identification.Enter one
Step, the RFID label tag 118 obtained from customization station 116 is laminated.In one embodiment, laminating station 120 be able to can operate, with
RFID label tag 118 is laminated.Finally, laminated RFID label tag is fed to output station unit 122.In delivering finished product
Before RFID label tag, output station unit 122 can perform one or more remaining mass inspections and operation.
Fig. 2 shows that description is used for the flow chart 200 for manufacturing the conventional method of RFID label tag.Stream can be used by sequential order
Journey Figure 200 each step is to manufacture RFID label tag.One of ordinary skill in the art will be understood that, in the system of processing RFID label tag
Before other steps made, the one or more steps in flow chart 200 is repeated.
At step 202, one or more input materials are fed to flip-chip bond device 102 to obtain engagement material
Material.In one embodiment, flip-chip bond device 102 can receive one or more input materials.The one or more inputs
Material may include but be not limited at least one of the following or multiple：Antenna, chip (such as 8 " bumped saw chips), chip
And PET base.In one embodiment, one or more input materials may include layers of copper laminated structure.For example, by copper rail road
It is fed to before flip-chip bond device 102, copper rail road can be applied to the top of antenna.In one embodiment, can be by antenna
Flip-chip bond device 102 is fed to scroll form.In another embodiment, can use spool form by antenna together with
Chip is fed to flip-chip bond device 102 together.One of ordinary skill in the art will be understood that, can be by the one or more
Before input material is used to manufacture RFID label tag, one or more input materials can be checked.Further, in one embodiment,
Can be by antenna feed to the first allocation unit 104.With one or more adhesives (such as AC268, MK055 and EN525)
In at least one or more antenna handled.Regulating time is about 30 minutes at room temperature.However, this area
Ordinarily skilled artisan will understand that it can be used the appropriate duration that one or more adhesives are applied on antenna.Enter
One step, before being handled with one or more adhesives antenna, inspection environment condition can be carried out as requested, such as pressed
Contracting air and temperature.Further, the whole process that can be directed at the first allocation unit 104 of various positions repetition of antenna, to apply
Add one or more adhesives.Finally, the first allocation unit 104, which can index, indicates grafting material.
At step 204, grafting material is fed to the first hot compression station 108, it is single to obtain one or more design
Member.In one embodiment, the first hot compression station 108 can receive grafting material (such as antenna with adhesive coating) as defeated
Enter.One of ordinary skill in the art will be understood that, before the input material of processing such as grafting material etc, hot press method
More times may be needed.In this case, grafting material can be stored temporarily in the first buffered station 106.Later will knot
Fig. 3 is closed to explain the process at the first hot compression station 108.
At step 206, at least one in one or more adhesives is applied to the one or more and designed
Unit.The one or more design cells obtained from the first hot compression station 108 are fed to the second allocation unit 112.
At two allocation units 112, one or more design cells are carried out with least one or more of adhesive (such as MK055)
Processing.10cc syringes can be used to be set by being moved along at the top of copper rail road/layer to apply adhesive to the one or more
Count on unit.
At step 208, one or more design cells are fed to the second hot compression station 114.In one embodiment,
When may being carried out at the second allocation unit 112 with one or more adhesives to one or more design cells
During processing, the second hot compression station 114 can receive one or more design cells as input.In one embodiment, this
Or multiple design cells (antenna for example, at least with copper rail road and/or one or more adhesives) can be in the second hot compression
Stand the one or more processes of experience at 114.First, the silicon ribbon can concurrently be fed with antenna.In one embodiment, can lead to
Cross using the pneumatic transfer devices being combined with one or more guide fingers silicon ribbon is fed in particular design fixture.One
In embodiment, due to silicon ribbon length and the difference of antenna spacing, particular design fixture (instrument/equipment) can be responsible for keeping silicon ribbon
With antenna parallel, to overcome any restrictions.When particular design fixture receives ready signal, silicon ribbon can be placed into the second heat
Above the work station of compressor station 114, it is reduced on antenna.In one embodiment, when antenna has been moved to, can be
Particular design fixture sends signal, to be reduced to above antenna.Afterwards, the second hot compression station 114 will perform one or more
Operation, to produce RFID label tag.Second hot compression station 114 uses predetermined force compact silicon band and copper rail road.Predetermined force is applied pre-
Set a distance and the scheduled time, to avoid causing any damage to silicon cover strip.One of ordinary skill in the art will be understood that, unlimited
Under conditions of the scope of disclosed invention processed, can repeat in any order this at the second hot compression station 114 or
Multiple processes.Later the process at the second hot compression station 114 is explained by Fig. 4 is combined.
At step 210, one or more design cells are cut into one or more single design cells.One
In embodiment, the one or more design cells obtained from the second hot compression station 114 are cut into one or more single
Design cell.In one embodiment, band cutting station can be used to obtain the single design cell of the one or more, and it
Afterwards, by the one or more, individually design cell is fed to progress and without testing station.
At step 212, the non-functional list of the one or more is identified in the one or more individually design cell
Member.In one embodiment, before next lamination, molding or encapsulation process occur, mark station identifies one or more NOT functions
Can unit.
At step 214, to the one or more, individually design cell is laminated, is moulded and encapsulated to obtain RFID
Label.In one embodiment, laminated RFID label tag is fed to output station unit 122.Delivering finished product RFID label tag it
Before, output station unit 122 can perform one or more remaining mass inspections and operation.
One of ordinary skill in the art will be understood that, as described above with reference to the one or more steps described in Fig. 2
One or more processes, it can repeat or implement in any sequence, to manufacture RFID label tag.
Fig. 3 shows arrangement 300, and it describes the hot compression at the first hot compression station for manufacturing RFID label tag
Process.Arrangement 300 as shown in Figure 3 can be used for performing one or more process/operations at the first hot compression station 108.
Arrangement 300 includes 302, heating tool bottom 304 and base portion 306 at the top of heating tool.In one embodiment, there is height
One or more substrates (such as polyethylene terephthalate (PET) film of intensity, high-fire resistance and high hydrolytic resistance
Or PEN (PEN) film) it can be used as base portion 306.In one embodiment, antenna can be made up of conductor foil,
And it can be arranged in the surface portion of base portion 306.Grafting material (such as antenna, chip, copper rail road, adhesive etc.) is placed into
On base portion 306.As shown in arrangement 300, grafting material is heated and made from top side using at the top of heating tool 302
Heated with heating tool bottom 304 from bottom side.In one embodiment, heating is performed at appropriate temperature and pressure.
Fig. 4 shows arrangement 400, and it describes the hot compression at the second hot compression station for manufacturing RFID label tag
Process.Arrangement 400 as shown in Figure 4 can be used for performing one or more process/operations at the second hot compression station 114.
Arrangement 400 includes 402, heating tool bottom 404 and base portion at the top of heating tool.In one embodiment, have high-strength
Degree, high-fire resistance and high hydrolytic resistance one or more substrates (such as polyethylene terephthalate (PET) film or
PEN (PEN) film) it can be used for base portion.Including in antenna, chip, copper rail road, adhesive or silicon ribbon
The one or more design cells of at least one or more can be placed on base portion (not shown).Afterwards, the arrangement can
Heated from top side and bottom side.Fig. 4 shows heating arrangement.In one embodiment, can be in appropriate temperature and pressure
It is lower to perform heating so as to compact silicon band and copper rail road.
One of ordinary skill in the art will be understood that, under conditions of the scope of the present disclosure is not limited, single heat can be used
Compressor station realizes the function at the first hot compression station 108 and the second hot compression station 114.
The various embodiments of the disclosure are related to the RFID label tag for being used for clothes, clothes, clothing Related product etc. for manufacturing
Method.Further, disclosed method is by one or more of the manufacture of RFID label tag input material (such as chip, day
Line and PET base) it minimize.By minimizing Q factor, RFID label tag is redesigned into minimum form factor
The granular encapsulation core of (10mmx6mm) realizes the reduction of the input material in RFID label tag.By such as ABS and epoxy resin it
The curing materials of class protect core, to ensure the intensity of core and globality, so as to avoid being broken.Antenna size reduction is granulated
Core is encapsulated, the label that bad reading will be caused or can not be read.Therefore, gain antenna is inserted across the core.Gain antenna is
It is made up of wire material.Line and any part for being not bonded to core, therefore design efforts be made so that with appropriate line characteristic, base portion
Suitable distance and appropriate encapsulating material characteristic between the suitable thickness of antenna, the suitable length of line, line and base portion antenna,
It is used to ensure high radio frequency magnetic conductivity.Disclosed method production RFID label tag, the RFID label tag can be stitched into clothes, clothing
On clothes and other products, to provide seamless mark, and tolerable such as dry-cleaning condition, compression drying condition, hot conditions
Etc. one or more environmental conditions.
It will be apparent to those skilled in the science, can easily implement this hair using other concrete forms
It is bright, without departing from the essential characteristics of the present invention.Therefore, present example should be considered merely as being exemplary rather than limiting
Property, the scope of the present invention is indicated by claims rather than aforementioned specification, and all changes in the range of it because
This, which is intended to, is included.
Claims (14)
1. a kind of method for being used to manufacture radio frequency identification (RFID) label used on clothes, methods described include：
One or more input materials are fed to flip-chip bond device to obtain grafting material, wherein one or more of
Input material is to enter line feed together with chip by the first allocation unit, a kind of or more to apply one or more adhesives
At least one of kind adhesive；
The grafting material is fed to the first hot compression station, to obtain one or more design cells；And
, will be one or more after at least one of described one or more adhesive one or more adhesives are applied
Individual design cell is fed to the second hot compression station, and at the second hot compression station, silicon ribbon is combined with the track of copper, to obtain
State RFID label tag.
2. according to the method for claim 1, wherein one or more of input materials comprise at least antenna, chip and
PET base.
3. according to the method for claim 2, wherein being fed to the one or more of of the flip-chip bond device
Input material is at least in scroll form.
4. according to the method for claim 3, also comprise at least the copper rail above one or more of input materials
Road.
5. according to the method for claim 1, wherein one or more adhesives comprise at least AC268, MK055 and
EN525。
6. according to the method for claim 1, in addition to when the grafting material is refused to receive in the first hot compression station
By grafting material storage into buffered station.
7. according to the method for claim 1, wherein one or more of design cells are carried out by the second allocation unit
Feeding, to apply at least one of described one or more adhesives.
8. according to the method for claim 7, wherein at least one in one or more adhesives is passed through
Moved along at the top of the copper rail road to apply.
9. according to the method for claim 1, in addition to the silicon ribbon is fed in particular design fixture, the feeding is
Realized by using the pneumatic transfer devices that is combined with one or more guide fingers.
It is 10. described according to the method for claim 9, wherein when one or more of integral materials are moved to
Particular design fixture reception signal, the silicon ribbon is reduced to the top of described one or more integral materials.
11. according to the method for claim 1, the silicon ribbon and the copper rail road are compressed also including the use of predetermined force predetermined
Distance and the scheduled time.
12. according to the method for claim 1, in addition to one or more of design cells are cut into one or more
Single design cell, for progress and/or without test.
13. according to the method for claim 1, in addition to by marking station in one or more of single design cells
In identify one or more non-functional units.
14. according to the method for claim 13, in addition to described in addition to one or more of non-functional units
One or more individually design cells are laminated, are moulded and/or encapsulated, to obtain described RFID label tag.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2015701133 | 2015-04-09 | ||
| MYPI2015701133 | 2015-04-09 | ||
| PCT/MY2016/000019 WO2016163872A1 (en) | 2015-04-09 | 2016-04-08 | Method for manufacturing an rfid tag |
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| CN107615098A true CN107615098A (en) | 2018-01-19 |
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| CN201680031337.6A Pending CN107615098A (en) | 2015-04-09 | 2016-04-08 | Method for manufacturing RFID label tag |
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| WO (1) | WO2016163872A1 (en) |
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| CN110348076B (en) * | 2019-06-24 | 2024-04-09 | 永道射频技术股份有限公司 | RFID (radio frequency identification) index design method corresponding to tiny chip package |
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| WO2016163872A1 (en) | 2016-10-13 |
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