CN107611554B - Manufacturing method of high-performance airtight waveguide sealing window - Google Patents
Manufacturing method of high-performance airtight waveguide sealing window Download PDFInfo
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- CN107611554B CN107611554B CN201710799015.2A CN201710799015A CN107611554B CN 107611554 B CN107611554 B CN 107611554B CN 201710799015 A CN201710799015 A CN 201710799015A CN 107611554 B CN107611554 B CN 107611554B
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- 238000007789 sealing Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000007747 plating Methods 0.000 claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 19
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 238000005245 sintering Methods 0.000 claims abstract description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010931 gold Substances 0.000 claims abstract description 11
- 229910052737 gold Inorganic materials 0.000 claims abstract description 11
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 238000007689 inspection Methods 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 55
- 239000013078 crystal Substances 0.000 claims description 41
- 238000005219 brazing Methods 0.000 claims description 26
- 238000005476 soldering Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 238000004088 simulation Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
The invention discloses a manufacturing method of a high-performance airtight waveguide sealing window, which comprises the following steps of 1: designing, customizing and processing parts; step 2: cleaning parts; and step 3: carrying out nickel plating treatment on the parts; and 4, step 4: assembling parts by using an assembling tool; and 5: integrally sintering the parts; step 6: carrying out air tightness inspection on the module; and 7: and carrying out gold plating treatment on the waveguide sealing window. The waveguide sealing window manufactured by the manufacturing method of the high-performance airtight waveguide sealing window has the characteristics of wide working frequency band, small volume, low loss, small standing wave, high airtightness guarantee, high reliability and the like, can be widely applied to a microwave millimeter wave module, guarantees the airtightness of the module, guarantees that each functional bare chip in the module is not affected by the external environment, increases the reliability of the module, and effectively prolongs the service life of the module.
Description
Technical Field
The invention relates to the technical field of microwave and millimeter waves, in particular to a manufacturing method of a high-performance airtight waveguide sealing window.
Background
In recent years, with the rapid development of the communication industry, the microwave millimeter wave monolithic integrated circuit has become an important pillar for the current development of various high-tech weapons and equipment by virtue of its advantages of small size, light weight, high reliability, wide operating frequency band, low energy consumption and the like, and is widely applied to various advanced tactical missiles, electronic warfare, communication systems and various advanced phased array radars.
Waveguide, a structure for confining or guiding an electromagnetic wave. The microwave and millimeter wave power generation device is widely applied to the technical field of microwave and millimeter wave by virtue of the characteristics of small loss, large power capacity, no radiation loss, simple structure, easiness in manufacturing and the like.
Therefore, it is urgently needed to provide a method for manufacturing a waveguide sealing window of a microwave millimeter wave functional module and component, which can effectively combine the advantages of a microwave millimeter wave monolithic integrated circuit and a millimeter wave waveguide and has high performance and high reliability.
Disclosure of Invention
The waveguide sealing window manufactured by the manufacturing method of the high-performance airtight waveguide sealing window has the characteristics of wide working frequency band, small volume, low loss, small standing wave, air tightness guarantee, high reliability and the like, can be widely applied to a microwave millimeter wave module, guarantees the airtight characteristic of the module, ensures that each functional bare chip in the module is not influenced by the external environment, increases the reliability of the module, and effectively prolongs the service life of the module.
In order to achieve the above object, the present invention provides a method for manufacturing a high-performance hermetic waveguide sealing window, comprising:
step 1: designing, customizing and processing parts;
step 2: cleaning parts;
and step 3: carrying out nickel plating treatment on the parts;
and 4, step 4: assembling parts by using an assembling tool;
and 5: integrally sintering the parts;
step 6: carrying out air tightness inspection on the module;
and 7: and carrying out gold plating treatment on the waveguide sealing window.
Preferably, step 1 comprises:
a. firstly, determining the size of a waveguide port according to a working frequency band, then simulating a transition circular waveguide and a monocrystalline ceramic piece by using microwave field simulation software, and determining the thickness of the monocrystalline ceramic piece and the diameter and the length of circular waveguides on two sides of the monocrystalline ceramic piece; secondly, designing an upper waveguide, a lower waveguide, a monocrystalline ceramic piece, an outer ring and a brazing piece for brazing according to the simulation result;
b. selecting a brazing sheet with the material specification of AgCu 28;
c. and c, finishing the processing of the upper waveguide, the lower waveguide and the outer ring according to the result designed in the step a.
Preferably, step 2 includes cleaning the upper waveguide, the lower waveguide and the outer ring processing parts before electroplating.
Preferably, step 3 comprises nickel plating the upper waveguide, the lower waveguide and the outer ring processing part in sequence, and the thickness of the nickel plating is 5-12 μm.
Preferably, step 4 comprises:
a. connecting the flat flange surface of the lower waveguide with a tool and fixing the flat flange surface on the tool;
b. firstly, placing 1 single crystal ceramic soldering lug in a single crystal ceramic bearing cavity of a lower waveguide, and then placing the single crystal ceramic wafer in the single crystal ceramic bearing cavity of the lower waveguide and on the soldering lug; finally, 1 single crystal ceramic soldering lug is placed in the single crystal ceramic bearing cavity of the lower waveguide and is positioned on the single crystal ceramic lug;
c. firstly, placing 1 outer ring soldering lug on an outer ring positioning groove of a lower waveguide; then, placing the outer ring on an outer ring positioning groove of the lower waveguide and on an outer ring brazing sheet; then, placing an outer ring soldering lug on the outer ring;
d. placing the bottom end of the upper waveguide in the single crystal ceramic bearing cavity of the lower waveguide and on the brazing sheet;
e. adjusting the positions of the parts to ensure that the waveguide ports of the upper and lower waveguide pieces are aligned and the brazing sheets are discharged evenly;
f. and (4) assembling the upper part of the tool, fixing the upper part by using a pin, and applying certain pressure.
Preferably, the step 5 includes placing the assembled parts and the tool into a hydrogen furnace for sintering, wherein the sintering temperature is 785-800 ℃, and removing the tool after taking out the module and the tool from the hydrogen furnace after welding.
Preferably, the airtightness test in step 6 is a semi-airtightness test of the completely fabricated waveguide sealing window using a helium mass spectrometer leak detector.
Preferably, the gold plating thickness in step 7 is 3-5 μm.
According to the technical scheme, the waveguide sealing window manufactured by the invention has the characteristics of wide working frequency band, small volume, low loss, small standing wave, air tightness guarantee, high reliability and the like, can be widely applied to a microwave millimeter wave module, guarantees the air tightness of the module, prevents each functional bare chip in the module from being influenced by the external environment, increases the reliability of the module, and effectively prolongs the service life of the module.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic cross-sectional view of a high performance hermetic grade waveguide seal window structure provided in accordance with the present invention;
FIG. 2 is a schematic structural diagram of an outer ring positioning groove and a single crystal ceramic pressure ring on an upper waveguide;
FIG. 3 is a schematic diagram of a transition circular waveguide on the upper waveguide;
FIG. 4 is a schematic diagram of the construction of the flange on the upper waveguide;
FIG. 5 is a schematic view of the structure of the flange on the lower waveguide;
FIG. 6 is a schematic view of the outer ring positioning slot on the lower waveguide;
FIG. 7 is a schematic diagram of a transition circular waveguide on the lower waveguide;
FIG. 8 is a schematic structural view of a single crystal ceramic load bearing cavity on a lower waveguide;
fig. 9 is an assembly effect diagram of the tool.
Description of the reference numerals
1-upper waveguide 2-lower waveguide
3-monocrystalline ceramic piece 4-outer ring
5-outer ring positioning groove 6-flange plate
7-screw blind hole 8-standard waveguide port
9-single crystal ceramic pressure ring 10-transition circular waveguide
11-single crystal ceramic bearing cavity 12-single crystal ceramic soldering lug
13-outer ring soldering lug A-tool
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the present invention, unless otherwise specified, the directional words "upper, lower, inner, outer" and the like included in the terms merely represent the orientation of the terms in a conventional use state or are colloquially understood by those skilled in the art, and should not be construed as limiting the terms.
Referring to fig. 1-9, the present invention provides a method for manufacturing a high performance hermetic waveguide sealing window, comprising:
step 1: designing, customizing and processing parts;
step 2: cleaning parts;
and step 3: carrying out nickel plating treatment on the parts;
and 4, step 4: assembling parts by using an assembling tool;
and 5: integrally sintering the parts;
step 6: carrying out air tightness inspection on the module;
and 7: and carrying out gold plating treatment on the waveguide sealing window.
The step 1 comprises the following steps:
a. firstly, determining the size of a waveguide port according to a working frequency band, then simulating a transition circular waveguide and a monocrystalline ceramic piece by using microwave field simulation software, and determining the thickness of the monocrystalline ceramic piece and the diameter and the length of circular waveguides on two sides of the monocrystalline ceramic piece; secondly, designing an upper waveguide, a lower waveguide, a monocrystalline ceramic piece, an outer ring and a brazing piece for brazing according to the simulation result;
b. selecting a brazing sheet with the material specification of AgCu 28;
c. and c, finishing the processing of the upper waveguide, the lower waveguide and the outer ring according to the result designed in the step a.
And step 2, cleaning the upper waveguide, the lower waveguide and the outer ring processing parts before electroplating.
And step 3, sequentially plating nickel on the upper waveguide, the lower waveguide and the outer ring processing part, wherein the thickness of the nickel plating is 5-12 mu m.
a. connecting the flat flange surface of the lower waveguide with a tool and fixing the flat flange surface on the tool;
b. firstly, placing 1 single crystal ceramic soldering lug in a single crystal ceramic bearing cavity of a lower waveguide, and then placing the single crystal ceramic wafer in the single crystal ceramic bearing cavity of the lower waveguide and on the soldering lug; finally, 1 single crystal ceramic soldering lug is placed in the single crystal ceramic bearing cavity of the lower waveguide and is positioned on the single crystal ceramic lug;
c. firstly, placing 1 outer ring soldering lug on an outer ring positioning groove of a lower waveguide; then, placing the outer ring on an outer ring positioning groove of the lower waveguide and on an outer ring brazing sheet; then, placing an outer ring soldering lug on the outer ring;
d. placing the bottom end of the upper waveguide in the single crystal ceramic bearing cavity of the lower waveguide and on the brazing sheet;
e. adjusting the positions of the parts to ensure that the waveguide ports of the upper and lower waveguide pieces are aligned and the brazing sheets are discharged evenly;
f. and (4) assembling the upper part of the tool, fixing the upper part by using a pin, and applying certain pressure.
And step 5, placing the assembled parts and the tool into a hydrogen furnace for sintering, wherein the sintering temperature is 785-800 ℃, taking the module and the tool out of the hydrogen furnace after welding, and removing the tool.
And 6, performing semi-airtightness detection on the manufactured waveguide sealing window by using a helium mass spectrometer leak detector.
Considering that the sealing window needs to be welded with the cavity of the microwave module at the later stage, in order to improve the welding characteristic, a gold plating link is specially added, which can effectively improve the welding wettability of the waveguide sealing window, and preferably, the gold plating thickness in step 7 is 3-5 μm.
In a specific embodiment, the waveguide sealing window with the working frequency of 26.5-40GHz is taken as an example for explanation.
Wherein, the step 1: design, customization and processing of parts
1) And finishing the design of the parts: determining the waveguide as BJ320, and the size of the waveguide port is 7.11 × 3.56 mm; and (3) utilizing HFSS software to carry out simulation to determine that the diameter of the transition circular waveguides at the two ends of the single crystal ceramic wafer is 8mm, and the length of the transition circular waveguides is 1.4 mm. And designing an upper waveguide, a lower waveguide, a monocrystalline ceramic piece, an outer ring and a brazing piece for brazing according to the results.
2) Finishing the customization of the single crystal ceramic wafer and the brazing sheet: the edges of the single crystal ceramic wafer need to be metallized, and a nickel layer is plated, wherein the thickness of the nickel layer is 2-5 micrometers, and the preferred thickness is 3 micrometers. The brazing sheet is a material of the specification of AgCu28, and needs an annealing treatment.
3) Finishing the processing of the upper waveguide, the lower waveguide and the outer ring: and selecting a material of the valve 4J34, and finishing the processing of the upper waveguide, the lower waveguide and the outer ring according to the designed result.
Step 2: cleaning of machined parts
And the oil removal and cleaning of the upper waveguide, the lower waveguide and the outer ring processing parts are finished, and the cleanness of the parts is ensured.
And step 3: nickel plating treatment of processing parts
And (4) finishing nickel plating of the upper waveguide, the lower waveguide and the outer ring processing part, wherein the thickness of the nickel plating is 5-12 micrometers, and preferably 6 micrometers.
And 4, step 4: assembly of parts
1) Connecting the flat flange surface of the lower waveguide with a tool and fixing the flat flange surface on the tool;
2) placing 1 single crystal ceramic soldering lug in a single crystal ceramic bearing cavity of the lower waveguide;
3) placing the single crystal ceramic wafer in a single crystal ceramic bearing cavity of the lower waveguide, and brazing the wafer;
4) placing 1 single crystal ceramic soldering lug in a single crystal ceramic bearing cavity of the lower waveguide, wherein the single crystal ceramic soldering lug is on the single crystal ceramic chip;
5) placing 1 outer ring soldering lug on an outer ring positioning groove of the lower waveguide;
6) placing the outer ring on an outer ring positioning groove of the lower waveguide and on the brazing sheet;
7) placing the outer ring soldering lug on the outer ring;
8) placing the lower end of the upper waveguide into the single crystal ceramic bearing cavity of the lower waveguide and on the brazing sheet;
9) adjusting the positions of the parts to ensure that the waveguide ports of the upper and lower wave guide members are aligned and the brazing sheets are discharged evenly;
10) assembling the upper part of the tool, fixing the upper part by using a pin, applying certain pressure and transferring to the next process;
and 5: integral sintering of parts
1) And placing the assembled parts and the tool into a hydrogen furnace for sintering, wherein the sintering temperature is 785-800 ℃, and the preferred temperature is 790 ℃.
2) And taking the welded module and the tool out of the hydrogen furnace, and removing the tool.
Step 6: air tightness test of waveguide sealing window
And (4) performing semi-air tightness detection on the manufactured waveguide sealing window by using a helium mass spectrometer leak detector.
And 7: gold plating treatment
And finishing gold plating treatment on the waveguide sealing window, wherein the gold plating thickness is 3-5 microns, and preferably 3 microns.
Thus, the manufacturing of the BJ320 waveguide sealing window with high-performance air tightness grade is completed. Wherein, the actual measurement result of the semi-airtightness is 2.8 x 10-9mbar.l/s; the insertion loss is less than 0.2dB, and the standing wave is better than 1.05.
Through the technical scheme, the manufactured waveguide sealing window has the characteristics of wide working frequency band, small volume, low loss, small standing wave, high air tightness guarantee, high reliability and the like, can be widely applied to a microwave millimeter wave module, guarantees the air tightness characteristic of the module, prevents each functional bare chip in the module from being influenced by the external environment, increases the reliability of the module, and effectively prolongs the service life of the module.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (7)
1. A manufacturing method of a high-performance airtight waveguide sealing window is characterized by comprising the following steps:
step 1: designing, customizing and processing parts;
step 2: cleaning parts;
and step 3: carrying out nickel plating treatment on the parts;
and 4, step 4: assembling parts by using an assembling tool;
and 5: integrally sintering the parts;
step 6: carrying out air tightness inspection on the module;
and 7: carrying out gold plating treatment on the waveguide sealing window;
wherein, step 4 includes:
a. connecting the flat flange surface of the lower waveguide with a tool and fixing the flat flange surface on the tool;
b. firstly, placing 1 single crystal ceramic soldering lug in a single crystal ceramic bearing cavity of a lower waveguide, and then placing the single crystal ceramic wafer in the single crystal ceramic bearing cavity of the lower waveguide and on the soldering lug; finally, 1 single crystal ceramic soldering lug is placed in the single crystal ceramic bearing cavity of the lower waveguide and is positioned on the single crystal ceramic lug;
c. firstly, placing 1 outer ring soldering lug on an outer ring positioning groove of a lower waveguide; then, placing the outer ring on an outer ring positioning groove of the lower waveguide and on an outer ring brazing sheet; then, placing an outer ring soldering lug on the outer ring;
d. placing the bottom end of the upper waveguide in the single crystal ceramic bearing cavity of the lower waveguide and on the brazing sheet;
e. adjusting the positions of the parts to ensure that the waveguide ports of the upper and lower waveguide pieces are aligned and the brazing sheets are discharged evenly;
f. and (4) assembling the upper part of the tool, fixing the upper part by using a pin, and applying certain pressure.
2. The method for manufacturing a high performance hermetic grade waveguide seal window according to claim 1, wherein step 1 comprises:
a. firstly, determining the size of a waveguide port according to a working frequency band, then simulating a transition circular waveguide and a monocrystalline ceramic piece by using microwave field simulation software, and determining the thickness of the monocrystalline ceramic piece and the diameter and the length of circular waveguides on two sides of the monocrystalline ceramic piece; secondly, designing an upper waveguide, a lower waveguide, a monocrystalline ceramic piece, an outer ring and a brazing piece for brazing according to the simulation result;
b. selecting a brazing sheet with the material specification of AgCu 28;
c. and c, finishing the processing of the upper waveguide, the lower waveguide and the outer ring according to the result designed in the step a.
3. The method for manufacturing the high-performance hermetic grade waveguide sealing window according to claim 1, wherein the step 2 comprises cleaning the upper waveguide, the lower waveguide and the outer ring processing parts before electroplating.
4. The method for manufacturing the high-performance hermetic grade waveguide sealing window according to claim 1, wherein the step 3 comprises sequentially plating nickel on the upper waveguide, the lower waveguide and the outer ring processing component, and the thickness of the nickel plating is 5-12 μm.
5. The method for manufacturing the high-performance air-tight waveguide sealing window according to claim 1, wherein the step 5 comprises placing the assembled parts and the tool into a hydrogen furnace for sintering, wherein the sintering temperature is 785 and 800 ℃, and removing the tool after taking the module and the tool out of the hydrogen furnace after the module and the tool are welded.
6. The method for manufacturing a high-performance hermetic waveguide sealing window according to claim 1, wherein the hermeticity test in step 6 is a semi-hermeticity test of the waveguide sealing window completed by using a helium mass spectrometer leak detector.
7. The method of claim 1, wherein the gold plating in step 7 is 3-5 μm thick.
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| CN201710799015.2A CN107611554B (en) | 2017-09-07 | 2017-09-07 | Manufacturing method of high-performance airtight waveguide sealing window |
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| CN113675570A (en) * | 2021-07-08 | 2021-11-19 | 中国电子科技集团公司第二十九研究所 | 3mm subassembly airtight structure based on E face microstrip probe |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103236390A (en) * | 2013-04-16 | 2013-08-07 | 中国电子科技集团公司第十二研究所 | Diamond energy transmission window for short millimeter wave traveling tubes and manufacturing method of diamond energy transmission window |
| CN105887149A (en) * | 2016-05-27 | 2016-08-24 | 中国电子科技集团公司第五十五研究所 | Metalized ceramic electroplating method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103236390A (en) * | 2013-04-16 | 2013-08-07 | 中国电子科技集团公司第十二研究所 | Diamond energy transmission window for short millimeter wave traveling tubes and manufacturing method of diamond energy transmission window |
| CN105887149A (en) * | 2016-05-27 | 2016-08-24 | 中国电子科技集团公司第五十五研究所 | Metalized ceramic electroplating method |
Non-Patent Citations (1)
| Title |
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| "特种模块封装工艺研究";詹为宇;《万方数据》;20130627;说明书第15段 * |
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