CN107604421A - A kind of heavy copper electroplating device of pcb board - Google Patents

A kind of heavy copper electroplating device of pcb board Download PDF

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Publication number
CN107604421A
CN107604421A CN201711052401.1A CN201711052401A CN107604421A CN 107604421 A CN107604421 A CN 107604421A CN 201711052401 A CN201711052401 A CN 201711052401A CN 107604421 A CN107604421 A CN 107604421A
Authority
CN
China
Prior art keywords
fixed
cell body
pcb board
cover plate
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201711052401.1A
Other languages
Chinese (zh)
Inventor
刘云龙
王建
何舒济
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou City Golmud Transmission Parts Technology Co Ltd
Original Assignee
Huizhou City Golmud Transmission Parts Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou City Golmud Transmission Parts Technology Co Ltd filed Critical Huizhou City Golmud Transmission Parts Technology Co Ltd
Priority to CN201711052401.1A priority Critical patent/CN107604421A/en
Publication of CN107604421A publication Critical patent/CN107604421A/en
Withdrawn legal-status Critical Current

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Abstract

The invention discloses a kind of heavy copper electroplating device of pcb board, including cover plate, cell body, Fixing clamp-seat, pcb board, fixed fixture block, neck, fixed card buckle and retainer ring, four corners of the cell body bottom are mounted on support base, and four corners on cell body top are provided with fixing groove, the middle position on cell body both sides top is mounted on fixing fixture block, and the top of cell body is horizontally installed with cover plate, four corners of the cover plate bottom are mounted on fixing inserted block, and fixed inserted block is inlayed with fixing groove and is connected, the middle position of the cover plate both sides is mounted on fixed seat.The present invention is by being provided with fixed inserted block, fixed seat, fix bar, fixed card buckle and fixed fixture block, the fixation inserted block alignment fixing groove of cover plate is blocked into installation when in use, then fix bar is rotated, so that fixed card buckle is fixedly mounted with fixed fixture block, the sealing of device is added, is easy to inspection and maintenance.

Description

A kind of heavy copper electroplating device of pcb board
Technical field
The present invention relates to pcb board production technical field, the heavy copper electroplating device of specially a kind of pcb board.
Background technology
Basic components of the PCB plates as electronic product, its structure be by multi-layer conductive material and insulating materials superposition and Into conductor material is attached on insulating sheet material by the way of copper and by plating, the technique such as is then etched again and is carried out Circuit is drawn.Female basket that heavy copper electroplating assembly line uses at present, which contains, is plated pcb board, in process of production small-bore and height Bubble is not easy discharge and is also easy to produce bubble type hole without copper in the through hole of the pcb board of aspect ratio, causes product fraction defective to rise, typically Need the PCB plates and hole aspect ratio 8 for 0.2mm apertures:1 PCB plates do secondary heavy copper electroplating processes, otherwise have in hole Bubble type hole declines without copper phenomenon, production cost increase, yields.
The content of the invention
It is an object of the invention to provide a kind of heavy copper electroplating device of pcb board, to solve what is proposed in above-mentioned background technology Problem.
To achieve the above object, the present invention provides following technical scheme:A kind of heavy copper electroplating device of pcb board, including cover plate, Cell body, Fixing clamp-seat, pcb board, fixed fixture block, neck, fixed card buckle and retainer ring, four corners of the cell body bottom are equal Support base is installed, and four corners on cell body top are provided with fixing groove, the interposition on cell body both sides top The place of putting is mounted on fixing fixture block, and the top of cell body is horizontally installed with cover plate, and four corners of the cover plate bottom are pacified Equipped with fixed inserted block, and fixed inserted block is inlayed with fixing groove and is connected, and the middle position of the cover plate both sides is mounted on admittedly Reservation, and side of the fixed seat away from cover plate is hinged with fix bar, the fix bar is respectively mounted close to the bottom of cell body side There is fixed card buckle, and fixed card buckle is fixedly connected with fixed fixture block, the middle position of cover plate top both sides is respectively mounted There is handle, the middle position of the cell body inner bottom is provided with Fixing clamp-seat, and the centre position of the inwall of Fixing clamp-seat Place is provided with neck, and pcb board is vertically provided with the neck, and the top of cell body inside both sides is mounted on retainer ring, And the top of retainer ring is mounted on fixing footstock, the middle position of the fixed footstock bottom is vertically provided with connecting rod Plated material is mounted on through the bottom of retainer ring, and connecting rod.
Preferably, the junction of the cover plate and cell body is provided with insulated enclosure pad.
Preferably, it is mounted on non-slip rubber set on the outside of the fixed inserted block and fixed fixture block.
Preferably, the thickness of the pcb board is less than the width of neck.
Preferably, the retainer ring and the inwall of connecting rod junction are provided with internal thread, and the outside on connecting rod top It is provided with the external screw thread to be cooperated with internal thread.
Compared with prior art, the beneficial effects of the invention are as follows:The pcb board sinks copper electroplating device by being provided with fixed insert Block, fixed seat, fix bar, fixed card buckle and fixed fixture block, the fixation inserted block alignment fixing groove of cover plate is blocked into peace when in use Dress, then rotates fix bar so that fixed card buckle is fixedly mounted with fixed fixture block, adds the sealing of device, is easy to check And maintenance, while device is provided with interior spiral shell by being provided with retainer ring and connecting rod, retainer ring and the inwall of connecting rod junction Line, and the external screw thread to be cooperated with internal thread is provided with the outside of connecting rod top, can directly it be removed at the end of plating Changed, while device is by being provided with Fixing clamp-seat and neck so that pcb board is conveniently replaceable.
Brief description of the drawings
The structure that Fig. 1 is the present invention faces diagrammatic cross-section;
Fig. 2 is the structure schematic elevation view of the present invention;
Fig. 3 is the structure partial diagrammatic cross-section of the present invention;
In figure:1- cover plates;2- fixed seats;3- fix bars;4- plated materials;5- cell bodies;6- support bases;7- Fixing clamp-seats;8- Pcb board;9- connecting rods;10- fixes inserted block;11- handles;12- fixes footstock;13- fixes fixture block;14- necks;15- fixing cards Button;16- fixing grooves;17- retainer rings.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made Embodiment, belong to the scope of protection of the invention.
Refer to Fig. 1-3, a kind of embodiment provided by the invention:A kind of heavy copper electroplating device of pcb board, including cover plate 1, groove Body 5, Fixing clamp-seat 7, pcb board 8, fixed fixture block 13, neck 14, fixed card buckle 15 and retainer ring 17, four of the bottom of cell body 5 turn Support base 6 is mounted at angle, and four corners on the top of cell body 5 are provided with fixing groove 16, the both sides top of cell body 5 Middle position is mounted on fixing fixture block 13, and the top of cell body 5 is horizontally installed with cover plate 1, the handing-over of cover plate 1 and cell body 5 Place is provided with insulated enclosure pad, ensures the sealing of device, and four corners of the bottom of cover plate 1 are mounted on fixing inserted block 10, The outside of fixed inserted block 10 and fixed fixture block 13 is mounted on non-slip rubber set, is easy to fix, and fixed inserted block 10 with fixation Groove 16 inlays connection, and the middle position of the both sides of cover plate 1 is mounted on fixed seat 2, and side of the fixed seat 2 away from cover plate 1 is equal Fix bar 3 is hinged with, fix bar 3 is mounted on fixed card buckle 15 close to the bottom of the side of cell body 5, and fixed card buckle 15 is with consolidating Determine fixture block 13 to be fixedly connected, the middle position of the top both sides of cover plate 1 is mounted on handle 11, the centre of the inner bottom of cell body 5 Opening position is provided with Fixing clamp-seat 7, and the middle position of the inwall of Fixing clamp-seat 7 is provided with neck 14, vertical on neck 14 Pcb board 8 is installed, the thickness of pcb board 8 is less than the width of neck 14, is easily installed and dismantles, the top of the inside both sides of cell body 5 Retainer ring 17 is mounted on, and the top of retainer ring 17 is mounted on fixing footstock 12, the centre position of the fixed bottom of footstock 12 Place is vertically provided with connecting rod 9 and passes through retainer ring 17, and retainer ring 17 and the inwall of the junction of connecting rod 9 are provided with internal thread, And the external screw thread to be cooperated with internal thread is provided with the outside of the top of connecting rod 9, and the bottom of connecting rod 9 is mounted on electroplating Material 4.
Operation principle:In use, external power supply is connected, after plated material 4 is fixedly mounted through retainer ring 17, then will Pcb board 8 is directed at neck 14 and installed, and the fixation inserted block 10 of cover plate 1 finally is directed at into fixing groove 16 blocks installation, then rotates Fix bar 3 so that fixed card buckle 15 is fixedly mounted with fixed fixture block 13, adds the sealing of device, and starter carries out electricity Plating, can effectively it be arranged by the plate for shaking, wave, filtering, five degree being tilted in the presence of ultrasonic wave because pcb board 8 tilts five degree Go out bubble in the through hole of pcb board 8, fully prevent Kong Wutong generation.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling Change is included in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.

Claims (5)

1. a kind of heavy copper electroplating device of pcb board, including cover plate(1), cell body(5), Fixing clamp-seat(7), pcb board(8), fixed fixture block (13), neck(14), fixed card buckle(15)And retainer ring(17), it is characterised in that:The cell body(5)Four corners of bottom It is mounted on support base(6), and cell body(5)Four corners on top are provided with fixing groove(16), the cell body(5)Two The middle position on side top is mounted on fixing fixture block(13), and cell body(5)Top be horizontally installed with cover plate(1), it is described Cover plate(1)Four corners of bottom are mounted on fixing inserted block(10), and fixed inserted block(10)And fixing groove(16)Inlay Connection, the cover plate(1)The middle position of both sides is mounted on fixed seat(2), and fixed seat(2)Away from cover plate(1)One Side is hinged with fix bar(3), the fix bar(3)Close to cell body(5)The bottom of side is mounted on fixed card buckle(15), and Fixed card buckle(15)With fixing fixture block(13)It is fixedly connected, the cover plate(1)The middle position of top both sides is mounted on Handle(11), the cell body(5)The middle position of inner bottom is provided with Fixing clamp-seat(7), and Fixing clamp-seat(7)Inwall Middle position be provided with neck(14), the neck(14)On pcb board is vertically installed(8), the cell body(5)Inside two The top of side is mounted on retainer ring(17), and retainer ring(17)Top be mounted on fixing footstock(12), the fixed top Seat(12)The middle position of bottom is vertically provided with connecting rod(9)Through retainer ring(17), and connecting rod(9)Bottom it is equal Plated material is installed(4).
A kind of 2. heavy copper electroplating device of pcb board according to claim 1, it is characterised in that:The cover plate(1)With cell body (5)Junction insulated enclosure pad is installed.
A kind of 3. heavy copper electroplating device of pcb board according to claim 1, it is characterised in that:The fixed inserted block(10)With Fixed fixture block(13)Outside be mounted on non-slip rubber set.
A kind of 4. heavy copper electroplating device of pcb board according to claim 1, it is characterised in that:The pcb board(8)Thickness Less than neck(14)Width.
A kind of 5. heavy copper electroplating device of pcb board according to claim 1, it is characterised in that:The retainer ring(17)With connecting Extension bar(9)The inwall of junction is provided with internal thread, and connecting rod(9)It is provided with what is cooperated with internal thread on the outside of top External screw thread.
CN201711052401.1A 2017-10-31 2017-10-31 A kind of heavy copper electroplating device of pcb board Withdrawn CN107604421A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711052401.1A CN107604421A (en) 2017-10-31 2017-10-31 A kind of heavy copper electroplating device of pcb board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711052401.1A CN107604421A (en) 2017-10-31 2017-10-31 A kind of heavy copper electroplating device of pcb board

Publications (1)

Publication Number Publication Date
CN107604421A true CN107604421A (en) 2018-01-19

Family

ID=61083834

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711052401.1A Withdrawn CN107604421A (en) 2017-10-31 2017-10-31 A kind of heavy copper electroplating device of pcb board

Country Status (1)

Country Link
CN (1) CN107604421A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110248476A (en) * 2019-06-12 2019-09-17 惠州市盈帆实业有限公司 A kind of circuit board and its preparation process based on the discontinuous mesh of tomography
CN113543525A (en) * 2021-06-02 2021-10-22 谭万国 Chemical copper deposition device for PCB double-sided board production

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110248476A (en) * 2019-06-12 2019-09-17 惠州市盈帆实业有限公司 A kind of circuit board and its preparation process based on the discontinuous mesh of tomography
CN113543525A (en) * 2021-06-02 2021-10-22 谭万国 Chemical copper deposition device for PCB double-sided board production

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PB01 Publication
PB01 Publication
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20180119