CN107604232B - A kind of hard alloy substrate, machining composite polycrystal-diamond and preparation method thereof - Google Patents
A kind of hard alloy substrate, machining composite polycrystal-diamond and preparation method thereof Download PDFInfo
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- CN107604232B CN107604232B CN201710757760.0A CN201710757760A CN107604232B CN 107604232 B CN107604232 B CN 107604232B CN 201710757760 A CN201710757760 A CN 201710757760A CN 107604232 B CN107604232 B CN 107604232B
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Abstract
The invention belongs to super-hard compound material technical fields, and in particular to a kind of hard alloy substrate, machining composite polycrystal-diamond and preparation method thereof.Hard alloy substrate of the invention is grouped as by the group of following weight percentage: cobalt 12~16%, tungsten carbide 84~88%；Wherein tungsten carbide includes the tungsten carbide and fine-grained tungsten carbide of the tungsten carbide of coarseness, middle granularity, and the tungsten carbide partial size of coarseness is 12~15 μm, and the tungsten carbide partial size of middle granularity is 8~11 μm, and fine-grained tungsten carbide partial size is 3~8 μm.Thick fine-grained tungsten carbide is uniformly distributed in hard alloy substrate of the present invention; the tungsten carbide particle of coarseness, which can be woven into network the cobalt in matrix is forced more uniformly to be swept, during the sintering process more arrives diamond layer; the phenomenon that diamond layer cobalt is unevenly distributed is reduced, the uniformity of its material is improved.
Description
Technical field
The invention belongs to super-hard compound material fields, and in particular to a kind of hard alloy substrate, machining plycrystalline diamond Buddha's warrior attendant
Stone composite sheet and preparation method thereof.
Background technique
Pure diamond sintering condition is harsher, mainly there is both sides reason: first is that diamond is high-melting-point, low diffusion
The substance of coefficient, sintering phenomenon usually occur under the conditions of 2/3 or more of melting point substance temperature, and the particle of substance connects under high temperature
Flow, diffusion and flowing occur first for contact portion point, are finally sintered together each other.It can by the P-T phasor (as shown in Figure 1) of carbon
Know: the fusing point of diamond is 4000K, i.e. sintering temperature must be more than 2700K (2400 DEG C), to make diamond be in P-T phase
Thermodynamically stable area on figure, corresponding pressure are 8GPa or more, and lower than this pressure, then diamond can be at the temperature disclosed above
Enter the Thermodynamically stable area of graphite, diamond can be graphitized, what so high sintering pressure was very difficult to temperature；Second is that golden
Hard rock has high hardness, even if above-mentioned pressure, at a temperature of be not susceptible to flow, so cannot all be connect between particle
Touching, there are gap, the pressure of gap is extremely low, and the diamond of gap will be graphitized under high temperature, as a result forms a kind of performance
The diamond of difference and the sintered body of graphite.Its electric conductivity is wanted only by the content for sweeping more diamond layer bonding agent is improved
Seeking Truth is far from enough, but is influenced by current mixing condition, and the diamond content directly added in diamond compact is got over
The phenomenon of high its mixing unevenness is more serious, eventually leads to the uneven of diamond layer material, the region of rich bonding agent is gold
The synthesis of hard rock composite sheet and use process can be easily graphitized, and eventually lead to cutting edge crushing knife, the damage at rapidoprint interface.
Composite polycrystal-diamond (PCD) due to its superelevation hardness (Vickers hardness 6000MPa or more, hard alloy
Vickers hardness is 2000MPa or so) and wearability be widely used as the cutting edge of superhard cutter, it is resistance in Machining Hardened Steels
Expenditure is 10~50 times of alloy cutter.With the emergence of China's manufacturing industry, the dosage or precision of either PCD cutter are all mentioned
Higher requirement is gone out, the processing efficiency and machining accuracy of common wire cutting have been far from the requirment, main at present to use
The uniformity of EDM-W low-speed WEDM and spark pulse power cutting (EDM-G), electric conductivity and material to product proposes
New requirement.Domestic many producers are numerous and confused by the wearability for sacrificing product in order to reach cutting requirement, increase its bonding agent
Content, obtain the PCD that well easily cuts of electric conductivity, the composite polycrystal-diamond wearability and performance that this method obtains are stablized
Property can be all remarkably decreased, and seriously reduce the service life of PCD.
Summary of the invention
The purpose of the present invention is to provide a kind of hard alloy substrates containing different grain size tungsten carbide.
The present invention second is designed to provide a kind of machining composite polycrystal-diamond, and the composite sheet is resistance in guarantee
With high thermal stability and good electric conductivity while mill property.
The present invention another be designed to provide the preparation method of above-mentioned machining composite polycrystal-diamond.
To achieve the above object, the technical scheme is that
A kind of hard alloy substrate is grouped as by the group of following weight percentage: cobalt 12~16%, and tungsten carbide 84~
88%；The tungsten carbide includes the tungsten carbide and fine-grained tungsten carbide of the tungsten carbide of coarseness, middle granularity, the coarseness
Tungsten carbide partial size is 12~15 μm, and the tungsten carbide partial size of the middle granularity is 8~11 μm, and the fine-grained tungsten carbide partial size is
3~8 μm.
The tungsten carbide of the coarseness, the tungsten carbide of middle granularity, fine-grained tungsten carbide volume ratio be 10~20:10~
20:60~80.
The volume of the tungsten carbide of the coarseness accounts for the 10~20% of the volume of tungsten carbide total in hard alloy substrate.
The volume of the tungsten carbide of the middle granularity accounts for the 10~20% of the volume of tungsten carbide total in hard alloy substrate.
The volume of the fine-grained tungsten carbide accounts for the 60~80% of the volume of tungsten carbide total in hard alloy substrate.
Hard alloy substrate used in traditional composite polycrystal-diamond is 3~8 μm of tungsten carbide particle, matrix
In cobalt sweep more arrive diamond layer when distribution it is very uneven, the electric conductivity in the area Fu Gu is relatively good, and cutting is cut comparatively fast, wearability
Difference；The area Pin Gu poorly conductive, the slow even cutting of electric cutting speed cut not feed, be cutter yield rate main influence because
Element.
Thick fine-grained tungsten carbide is uniformly distributed in hard alloy substrate of the present invention, the carbonization of coarseness during the sintering process
Tungsten particle, which can be woven into network the cobalt in matrix is forced more evenly to be swept, more arrives diamond layer, reduces what diamond layer cobalt was unevenly distributed
Phenomenon improves the uniformity of its material.
A kind of machining composite polycrystal-diamond, including above-mentioned hard alloy substrate and dimond synneusis layer.
The dimond synneusis layer is grouped as by the group of following weight percentage: 90%~100% bortz powder, 0~
10% metallic bond.
The metallic bond is one or more of cobalt, nickel, silicon, tungsten carbide.
The bortz powder is diadust.
The partial size of the diadust is 0.5~40 μm.
The preparation method of above-mentioned machining composite polycrystal-diamond, comprising the following steps: by dimond synneusis layer with
Hard alloy substrate is assembled into assembling block, is then sintered under the conditions of temperature is 1400~1550 DEG C, pressure is 5.5~6.5GPa
10~30min.
The dimond synneusis layer is grouped as by the group of following weight percentage: 90%~100% bortz powder, 0~
10% metallic bond.
The bortz powder is diadust.The partial size of the diadust is 0.5~40 μm.
The metallic bond is one or more of cobalt, nickel, silicon, tungsten carbide.
Above-mentioned assembling block includes the carbon pipe 6 with lumen, and salt pipe 7 is arranged in carbon pipe 6, is provided with hard alloy in salt pipe 7
Matrix 2, dimond synneusis layer 1 and salt piece 9.Specifically, being disposed with the first salt piece, first from salt pipe one end to the other end
Hard alloy substrate, the first dimond synneusis layer, the second dimond synneusis layer, the second hard alloy substrate, the second salt piece.Hard
Shielding material, hard alloy substrate and salt are provided between alloy substrate, the outer peripheral surface of dimond synneusis layer and salt pipe inner peripheral surface
It is also equipped with shielding material between piece, is also equipped with shielding material between the first dimond synneusis layer and the second dimond synneusis layer
Material.The outer surface of first salt piece and the second salt piece is concordant with the end face of the corresponding end of carbon pipe and salt pipe, the first salt piece and its correspondence
Carbon pipe and salt pipe end face on be covered on the end face of the first steel ring, the second salt piece and its corresponding carbon pipe and salt pipe and be covered with
Second steel ring.First steel ring, the outer diameter of the second steel ring are identical as the outer diameter of carbon pipe.The end face of first steel ring and corresponding carbon pipe
Between be equipped with the first carbon plate, between the second steel ring and the end face of corresponding carbon pipe be equipped with the second carbon plate.First carbon plate and the second carbon
The diameter of piece is identical as the outer diameter of the first steel ring.It is enclosed on the outer peripheral surface of carbon pipe equipped with pyrophyllite in lumps, the length etc. of pyrophyllite in lumps
In the sum of carbon length of tube and the first steel ring, the second steel ring, the first carbon plate, the thickness of the second carbon plate.
Hard alloy substrate of the invention uses varigrained tungsten carbide, and thick fine-grained tungsten carbide is uniformly distributed,
The tungsten carbide particle of coarseness, which can be woven into network the cobalt in matrix is forced more evenly to be swept, during follow-up sintering more arrives diamond
Layer reduces the phenomenon that diamond layer cobalt is unevenly distributed, improves the uniformity of its material.
Composite polycrystal-diamond of the invention, by the hard of polycrystalline diamond layer and the interaction distribution of tungsten carbide thickness granularity
Alloy substrate composition, has preferable thermal stability, wear resistance ratio and electric conductivity.
Composite polycrystal-diamond of the invention is added to micro metallic bond in diadust, facilitates
Reaction temperature is reduced, the reaction time is shortened, improves the bonding density of (D-D key) between diamond.Polycrystalline diamond of the present invention is multiple
Close piece has good thermal stability and electric conductivity while guaranteeing wearability, is both able to achieve and improves slow wire feeding and electrical spark working
The processing efficiency of work, and do not influence cutting-tool's used life.
Detailed description of the invention
Fig. 1 is the P-T phasor of carbon in background technique；
Fig. 2 is the structural schematic diagram of the composite polycrystal-diamond in embodiment 1；
Fig. 3 is the structural schematic diagram of the assembling block for preparing composite polycrystal-diamond in embodiment 1.
Specific embodiment
Embodiment 1
The hard alloy substrate of the present embodiment is grouped as by the group of following weight percentage: cobalt 16%, tungsten carbide
84%；Above-mentioned tungsten carbide includes the tungsten carbide of coarseness, the tungsten carbide of middle granularity, fine-grained tungsten carbide, wherein partial size 12
The 10% of the volume of the total tungsten carbide of tungsten carbide volume Zhan of~15 μm of coarseness, the carbonization for the middle granularity that partial size is 8~11 μm
The 10% of the volume of the total tungsten carbide of volume Zhan of tungsten, the total tungsten carbide of volume Zhan for the fine-grained tungsten carbide that partial size is 3~8 μm
The 80% of volume.
The machining composite polycrystal-diamond of the present embodiment, as shown in Fig. 2, including dimond synneusis layer 1 and above-mentioned
Hard alloy substrate 2, dimond synneusis layer are made of the cobalt powder of 98% diadust and 2%.
The preparation method of the machining composite polycrystal-diamond of the present embodiment includes the following steps:
After being measured diadust, the mixing of metallic bond cobalt powder by formula, purified in groups with hard alloy substrate assembly
Fill block, be sintered under the conditions of 1500 DEG C, 6.0GPa using cubic hinge press 14min to get.
Above-mentioned assembling block is arranged with salt pipe 7, setting in salt pipe 7 as shown in figure 3, include the carbon pipe 6 with lumen in carbon pipe 6
There are hard alloy substrate 2, dimond synneusis layer 1 and salt piece 9.Specifically, being disposed with from salt pipe one end to the other end
One salt piece, the first hard alloy substrate, the first dimond synneusis layer, the second dimond synneusis layer, the second hard alloy substrate,
Disalt piece.Shielding material 8, hard are provided between hard alloy substrate, the outer peripheral surface of dimond synneusis layer and salt pipe inner peripheral surface
It is also equipped with shielding material between alloy substrate and salt piece, is also set between the first dimond synneusis layer and the second dimond synneusis layer
It is equipped with shielding material.The outer surface of first salt piece and the second salt piece is concordant with the end face of the corresponding end of carbon pipe and salt pipe, the first salt
The first steel ring 4, the second salt piece and its corresponding carbon pipe and salt pipe are covered on the end face of piece and its corresponding carbon pipe and salt pipe
The second steel ring is covered on end face.First steel ring, the outer diameter of the second steel ring are identical as the outer diameter of carbon pipe.First steel ring with it is corresponding
Carbon pipe end face between be equipped with the first carbon plate 5, between the second steel ring and the end face of corresponding carbon pipe be equipped with the second carbon plate.First
The diameter of carbon plate and the second carbon plate is identical as the outer diameter of the first steel ring.It is enclosed on the outer peripheral surface of carbon pipe equipped with pyrophyllite in lumps 3, leaf wax
The length of stone is equal to the sum of carbon length of tube and the first steel ring, the second steel ring, the first carbon plate, the thickness of the second carbon plate.
After machining obtained by embodiment 1 is processed as finished size with composite polycrystal-diamond, finished product is carried out respectively
Wearability, shock resistance, heat resistance detection, as a result are as follows: wear resistance ratio: turning silicon carbide grinding wheel relative wear ratio >=620,000
(according to professional standard JB/T 3235-2013Q/410BA313-2014)；Heat resistance: 10 points are heated for 750 DEG C under protective atmosphere
Clock, diamond layer do not crack, is layered, carbonization phenomenon；Diamond is cut using slow wire feeding Germany Vollmer QWD760 lathe
Diamond compact of the layer with a thickness of 0.5, overall thickness 1.6, cutting speed 1.3mm/min, and cutting speed is steadily without fracture of wire.
Embodiment 2
The hard alloy substrate of the present embodiment is grouped as by the group of following weight percentage: cobalt 12%, tungsten carbide
88%；Above-mentioned tungsten carbide includes the tungsten carbide of coarseness, the tungsten carbide of middle granularity, fine-grained tungsten carbide, wherein partial size 12
The volume ratio of the total tungsten carbide of volume Zhan of the tungsten carbide of~15 μm of coarseness is 20%, the middle granularity that partial size is 8~11 μm
The volume ratio of the total tungsten carbide of tungsten carbide volume Zhan is 15%, and the volume Zhan for the fine-grained tungsten carbide that partial size is 3~8 μm is always carbonized
The volume ratio of tungsten is 65%.
The machining composite polycrystal-diamond of the present embodiment, including dimond synneusis layer and above-mentioned carbide matrix
Body, dimond synneusis layer are made of 90% diadust, 5% nickel powder, 5% silicon powder.
The preparation method of the machining composite polycrystal-diamond of the present embodiment includes the following steps:
It measures by formula and is assembled in groups after diadust, metallic bond nickel powder, silicon powder mix with hard alloy substrate
Fill block, be sintered under the conditions of 1450 DEG C, 6.5GPa using cubic hinge press 12min to get.
The structure of above-mentioned assembling block is with embodiment 1, and details are not described herein again.
After machining obtained by embodiment 2 is processed as finished size with composite polycrystal-diamond, finished product is carried out respectively
Wearability, shock resistance, heat resistance detection, as a result are as follows: wear resistance ratio: turning silicon carbide grinding wheel relative wear ratio >=510,000
(according to professional standard JB/T 3235-2013Q/410BA313-2014)；Heat resistance: 10 points are heated for 750 DEG C under protective atmosphere
Clock, diamond layer do not crack, is layered, carbonization phenomenon；Diamond is cut using slow wire feeding Germany Vollmer QWD760 lathe
Diamond compact of the layer with a thickness of 0.5, overall thickness 1.6, cutting speed 1.5mm/min, and cutting speed is steadily without fracture of wire.
Embodiment 3
The hard alloy substrate of the present embodiment is grouped as by the group of following weight percentage: cobalt 15%, tungsten carbide
85%；Above-mentioned tungsten carbide includes the tungsten carbide of coarseness, the tungsten carbide of middle granularity, fine-grained tungsten carbide, wherein partial size 12
The volume ratio that the tungsten carbide of~15 μm of coarseness accounts for total tungsten carbide in hard alloy substrate is 15%, and partial size is 8~11 μm
The volume ratio that the tungsten carbide of middle granularity accounts for total tungsten carbide in hard alloy substrate is 15%, the fine-grained carbon that partial size is 3~8 μm
Changing tungsten to account for the volume ratio of total tungsten carbide in hard alloy substrate is 70%.
The machining composite polycrystal-diamond of the present embodiment, including dimond synneusis layer and above-mentioned carbide matrix
Body, dimond synneusis layer are made of the tungsten carbide of 94% diadust and 6%.
The preparation method of the machining composite polycrystal-diamond of the present embodiment includes the following steps:
Assembling is assembled into hard alloy substrate by after formula measurement diadust, the mixing of metallic bond tungsten carbide
Block, be put into cubic hinge press synthesis chamber in, under the conditions of 1500 DEG C, 6.0GPa be sintered 15min to get.
The structure of above-mentioned assembling block is with embodiment 1, and details are not described herein again.
After machining obtained by embodiment 3 is processed as finished size with composite polycrystal-diamond, product is carried out respectively
Wearability, shock resistance, heat resistance detection, as a result are as follows:
Wear resistance ratio: turning silicon carbide grinding wheel relative wear ratio >=580,000 are (according to professional standard JB/T 3235-2013Q/
410BA313-2014)；Heat resistance: it is heated 10 minutes for 750 DEG C under protective atmosphere, diamond layer do not crack, is layered, carbon
Change phenomenon；Slow wire feeding Germany Vollmer QWD760 lathe is used to cut diamond layer thickness as 0.5, the diamond of overall thickness 1.6
Composite sheet, cutting speed 1.6mm/min, and cutting speed are steadily without fracture of wire.
Embodiment 4
The hard alloy substrate of embodiment is grouped as by the group of following weight percentage: cobalt 15%, tungsten carbide 85%；
Above-mentioned tungsten carbide includes the tungsten carbide of coarseness, the tungsten carbide of middle granularity, fine-grained tungsten carbide, wherein partial size is 12~15 μ
The volume ratio that the tungsten carbide of the coarseness of m accounts for total tungsten carbide in hard alloy substrate is 15%, the middle granularity that partial size is 8~11 μm
Tungsten carbide to account for the volume ratio of total tungsten carbide in hard alloy substrate be 15%, partial size is that 3~8 μm of fine-grained tungsten carbide accounts for
The volume ratio of total tungsten carbide is 70% in hard alloy substrate.
The machining composite polycrystal-diamond of the present embodiment, including dimond synneusis layer and above-mentioned carbide matrix
Body, dimond synneusis layer are made of diadust.
The preparation method of the machining composite polycrystal-diamond of the present embodiment includes the following steps:
Diadust is measured by formula and hard alloy substrate is assembled into assembling block, is put into cubic hinge press synthesis chamber
In, under the conditions of 1500 DEG C, 6.0GPa be sintered 15min to get.
The structure of above-mentioned assembling block is with embodiment 1, and details are not described herein again.
Claims (6)
1. a kind of hard alloy substrate, which is characterized in that be grouped as by the group of following weight percentage: cobalt 12~16%, carbon
Change tungsten 84~88%；The tungsten carbide includes the tungsten carbide and fine-grained tungsten carbide of the tungsten carbide of coarseness, middle granularity, described
The tungsten carbide partial size of coarseness is 12~15 μm, and the tungsten carbide partial size of the middle granularity is 8~11 μm, the fine-grained carbonization
Tungsten particle diameter is 3~8 μm；The tungsten carbide of the coarseness, the tungsten carbide of middle granularity, fine-grained tungsten carbide volume ratio be 10~
20:10~20:60~80.
2. a kind of machining composite polycrystal-diamond, which is characterized in that including carbide matrix as described in claim 1
Body and dimond synneusis layer.
3. machining composite polycrystal-diamond according to claim 2, which is characterized in that the dimond synneusis layer
It is grouped as by the group of following weight percentage: 90%~100% bortz powder, 0~10% metallic bond.
4. the preparation method that composite polycrystal-diamond is used in a kind of machining as claimed in claim 2, which is characterized in that including
Following steps: being assembled into assembling block for dimond synneusis layer and hard alloy substrate, is then 1400~1550 DEG C, presses in temperature
Power is sintered 10~30min under the conditions of being 5.5~6.5GPa.
5. the preparation method that composite polycrystal-diamond is used in machining according to claim 4, which is characterized in that the gold
Hard rock plycrystalline diamond layer is grouped as by the group of following weight percentage: 90%~100% bortz powder, 0~10% metallic bond.
6. the preparation method that composite polycrystal-diamond is used in machining according to claim 5, which is characterized in that the gold
Category bonding agent is one or more of cobalt, nickel, silicon, tungsten carbide.
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| CN111455252A (en) * | 2020-05-12 | 2020-07-28 | 江西江钨硬质合金有限公司 | Non-uniform hard alloy prepared by adopting close-packed batching mode and preparation method thereof |
| CN114472899A (en) * | 2022-02-11 | 2022-05-13 | 四川伽锐科技有限公司 | Polycrystalline composite material and preparation method and application thereof |
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|---|---|---|---|---|
| CN103722174A (en) * | 2013-12-30 | 2014-04-16 | 中原工学院 | Self-sharpening polycrystalline diamond compact and preparation method thereof |
| CN103882275A (en) * | 2014-04-04 | 2014-06-25 | 株洲硬质合金集团有限公司 | Toughened hard alloy and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722174A (en) * | 2013-12-30 | 2014-04-16 | 中原工学院 | Self-sharpening polycrystalline diamond compact and preparation method thereof |
| CN103882275A (en) * | 2014-04-04 | 2014-06-25 | 株洲硬质合金集团有限公司 | Toughened hard alloy and preparation method thereof |
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