CN107577835A - A kind of analysis method and device based on ground hole with telltale hole different distance to effect of signals - Google Patents
A kind of analysis method and device based on ground hole with telltale hole different distance to effect of signals Download PDFInfo
- Publication number
- CN107577835A CN107577835A CN201710592590.5A CN201710592590A CN107577835A CN 107577835 A CN107577835 A CN 107577835A CN 201710592590 A CN201710592590 A CN 201710592590A CN 107577835 A CN107577835 A CN 107577835A
- Authority
- CN
- China
- Prior art keywords
- different
- coordinate
- value
- hole
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
The invention provides a kind of analysis method and device based on ground hole with telltale hole different distance to effect of signals, by compare the different ground pitch-row in distance signal hole from, obtain different S parameters, and then it can obtain specifically to the damaed cordition of signal, the present invention is studied different distance signal holes, different S parameters are obtained to the specific data analysis of the loss of signal, when certain block board signal integrity is undesirable, other subcards are able to ensure that signal integrity, and then it ensure that the safety of whole server operation, strengthen the signal integrity and reliability of RACK whole machine cabinet servers.
Description
Technical field
The present invention relates to the technical field of server performance, and in particular to one kind based on ground hole and telltale hole different distance
To the analysis method and device of effect of signals.
Background technology
Constantly expand with the application of cloud computing, shopping online, the appearance of on-line approval, e-Bank payment, people
The development trend of informationization is all presented in many business on Working Life.Calculating performance requirement to the webserver is increasingly
Greatly, therefore the concept of cloud computing also produces, and has preliminarily formed government affairs cloud, hygienic cloud, the new ideas of tax cloud.As traditional machine
Unit cabinet system in room, it is desirable to which it is more and more stronger to be deployed in the data-handling capacity of interior of equipment cabinet server computing node, portion
Affix one's name to density more and more higher.
The demand for development of cloud computing has just been complied with the appearance of RACK equipment cabinet server products.This server cabinet is not only
Possess very high data-handling capacity, and up to 80 calculate nodes can be integrated in the interior of equipment cabinet of 42U height.
Via hole has considerable influence to signal integrity.Ground hole provides path to the return of signal, in high speed multilayer
In PCB, when signal is transferred to internal certain layer from top layer, land used hole can reduce EMI, largely affect the biography of signal
Transmission quality.Prior art is not studied different distance signal holes, only just know that be to signal backflow effect, also without pair
The specific data analysis of the loss of signal.
The content of the invention
Based on above mentioned problem, the present invention proposes a kind of analysis side based on ground hole with telltale hole different distance to effect of signals
Method and device.It is by comparing the different ground pitch-row in distance signal hole from obtaining different S parameters, and then can obtain specific
The damaed cordition to signal.
The present invention provides following technical scheme：
On the one hand, the invention provides a kind of analysis method based on ground hole and telltale hole different distance to effect of signals,
Including：
Step 101, based on the different laminated construction of Intel chips, different dielectric constant D is obtainedkValue, dielectric loss angle
Tangent value DfValue and Thick angle value；
Step 102, different X-coordinate value, Y-coordinate value are set, obtain different VIA models；
Step 103, based on the different VIA models, software parameter is set；
Step 104, under different X-coordinate value, Y-coordinate value, different S parameter values is obtained, is compared and obtains loss of signal feelings
Condition.
Wherein, it is described that different X-coordinate value, Y-coordinate value are set specifically, the VIA WIZARD couple carried by HFSS
Antipad numerical value is configured, and it is 39mil to set coordinate X-coordinate, and Y-coordinate is respectively 25mil, 35mil, 45mil.
Wherein, it is described to set software parameter specifically, setting top, bottom layer, coordinate-system in Soldermask, go
The part overlapped in VIA is subtracted after embedding, Wizard parts are set after PORT is set.
Wherein, based on the different ground pitch-row in distance signal hole from forming different VIA in HFSS and cross hole pattern, via occurs
On mainboard and polylith subcard in server cabinet.
In addition, present invention also offers a kind of analytical equipment based on ground hole and telltale hole different distance to effect of signals,
Described device includes：
Initial module, for based on the different laminated construction of Intel chips, obtaining different dielectric constant DkValue, medium
Loss tangent DfValue and Thick angle value；
Model module, for setting different X-coordinate value, Y-coordinate value, obtain different VIA models；
Parameter module, for based on the different VIA models, setting software parameter；
Comparison module, under different X-coordinate value, Y-coordinate value, obtaining different S parameter values, it is compared and obtains signal damage
Mistake situation.
Wherein, it is described that different X-coordinate value, Y-coordinate value are set specifically, the VIA WIZARD couple carried by HFSS
Antipad numerical value is configured, and it is 39mil to set coordinate X-coordinate, and Y-coordinate is respectively 25mil, 35mil, 45mil.
Wherein, it is described to set software parameter specifically, setting top, bottom layer, coordinate-system in Soldermask, go
The part overlapped in VIA is subtracted after embedding, Wizard parts are set after PORT is set.
Wherein, described device, based on the different ground pitch-row in distance signal hole from, form different VIA in HFSS and cross hole pattern,
Via is appeared on mainboard and polylith subcard in server cabinet.
The invention provides a kind of analysis method and device based on ground hole with telltale hole different distance to effect of signals, lead to
Cross and compare the different ground pitch-row in distance signal hole from obtaining different S parameters, and then the specifically loss to signal can be obtained
Situation, the present invention are studied different distance signal holes, obtain different S parameters to the specific data analysis of the loss of signal,
When certain block board signal integrity is undesirable, other subcards are able to ensure that signal integrity, and then ensure that whole server fortune
Capable safety, strengthen the signal integrity and reliability of RACK whole machine cabinet servers.
Brief description of the drawings
Fig. 1 is flow chart of the method for the present invention；
Fig. 2 is the structured flowchart of the present invention；
Fig. 3 is the laminated information figure of the present invention；
Fig. 4 a-4c are the different Antipad setting figures of the present invention；
Fig. 5 a-5b are the VIA via schematic diagrames of the present invention；
Fig. 6 is the different return loss Parameter Maps of the present invention.
Embodiment
Technical scheme in order to illustrate the embodiments of the present invention more clearly, it will use below required in embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
First, embodiments of the present invention provide a kind of is divided effect of signals based on ground hole and telltale hole different distance
Analysis method, accompanying drawing 1 are flow chart of the method for the present invention, including：
Step 101, based on the different laminated construction of Intel chips, different dielectric constant D is obtainedkValue, dielectric loss angle
Tangent value DfValue and Thick angle value；
Such as accompanying drawing 3, for different projects, using different laminations, so can obtain different Dk and Df value with
And the specific thickness of lamination.By the method for mathematics model analysis, short column resonance can be accurately obtained to whole system circuit
The influence of plate, substantially reduce in whole circuit design judgement of the hole to effect of signals, so as in the operation of whole circuit board
When, the reliability of the overall operation of system can be greatly promoted.
With the continuous improvement of digital circuit speed and clock frequency, in High Speed System, high speed signal is by interconnection
Line can produce the problems of Signal Integrity such as delay, reflection, decay, crosstalk.Problems of Signal Integrity has become high speed number
One of whether successful key issue of word circuit design.
The principal element of high-speed figure PCB signal integrities is influenceed in addition to PCB design and pcb board material select, and ground hole is to letter
Number integrality has considerable influence.In high speed multi-layer PCB, when signal is transferred to internal certain layer from top layer, signal can dissipate, and use
Ground hole can largely affect the transmission quality of signal.
When signal is being transferred to another sandwich circuit of impedance matching through via, has part energy and be passed to four
Week, and this is without any impedance partially due to terminate, it is possible to standard-sized sheet line state is counted as, therefore this branch is just
The total reflection of dump energy can be caused, this greatly weakens signal quality, has damaged the integrality of primary signal.It is and of the invention
Being capable of signal integrity and reliability.
Step 102, different X-coordinate value, Y-coordinate value are set, obtain different VIA models；
It is described that different X-coordinate value, Y-coordinate value are set specifically, the VIA carried by HFSS such as accompanying drawing 4a-4c
WIZARD is configured to Antipad numerical value, and it is 39mil to set coordinate X-coordinate, Y-coordinate be respectively 25mil, 35mil,
45mil。
Such as accompanying drawing 5a-5b, under different distance in, different VIA can be formed in HFSS and cross hole pattern, this via occurs
In the mainboard in server cabinet and polylith subcard.Wherein, the electronic devices such as intel CPU, PCH, BMC are welded on mainboard,
Subcard provides complementary conditions for main card.
Step 103, based on the different VIA models, software parameter is set；
It is described setting software parameter specifically, setting Soldermask in top, bottom layer, coordinate-system, go it is embedding after will
The part overlapped in VIA is subtracted, and Wizard parts are set after PORT is set.Setting program is run after setting, obtains S4P
File.
Step 104, under different X-coordinate value, Y-coordinate value, different S parameter values is obtained, is compared and obtains signal damage
Mistake situation.
As shown in Figure 6, under different X, Y numerical value, different S parameters is obtained, can be obtained in identical X-coordinate
Under, in the case that Y coordinate is respectively 25mil, 35mil, 45mil, the concrete numerical value of S parameter be respectively -0.28696dB, -
0.30654dB、-0.30749dB.It is compared acquisition signal-loss conditions and judges whether possess improved effect.
Technical scheme is also used in server high-speed line link, for SATA, SAS, UPI etc. at a high speed.
The invention provides it is a kind of based on ground hole and telltale hole different distance to the analysis method of effect of signals, pass through and compare
The different ground pitch-row in distance signal hole from, obtain different S parameters, and then can obtain specifically to the damaed cordition of signal,
The present invention is studied different distance signal holes, different S parameters is obtained to the specific data analysis of the loss of signal, in certain block plate
When card signal integrality is undesirable, other subcards are able to ensure that signal integrity, and then ensure that the peace of whole server operation
Entirely, the signal integrity and reliability of RACK whole machine cabinet servers are strengthened.
On the other hand, embodiments of the present invention provide a kind of ground hole and telltale hole different distance of being based on to effect of signals
Analytical equipment, accompanying drawing 3 is the structured flowchart of the present invention, and described device includes：
Initial module 201, for based on the different laminated construction of Intel chips, obtaining different dielectric constant DkValue, it is situated between
Matter loss tangent DfValue and Thick angle value；
Such as accompanying drawing 3, for different projects, using different laminations, so can obtain different Dk and Df value with
And the specific thickness of lamination.By the method for mathematics model analysis, short column resonance can be accurately obtained to whole system circuit
The influence of plate, substantially reduce in whole circuit design judgement of the hole to effect of signals, so as in the operation of whole circuit board
When, the reliability of the overall operation of system can be greatly promoted.
With the continuous improvement of digital circuit speed and clock frequency, in High Speed System, high speed signal is by interconnection
Line can produce the problems of Signal Integrity such as delay, reflection, decay, crosstalk.Problems of Signal Integrity has become high speed number
One of whether successful key issue of word circuit design.
The principal element of high-speed figure PCB signal integrities is influenceed in addition to PCB design and pcb board material select, and ground hole is to letter
Number integrality has considerable influence.In high speed multi-layer PCB, when signal is transferred to internal certain layer from top layer, signal can dissipate, and use
Ground hole can largely affect the transmission quality of signal.
When signal is being transferred to another sandwich circuit of impedance matching through via, has part energy and be passed to four
Week, and this is without any impedance partially due to terminate, it is possible to standard-sized sheet line state is counted as, therefore this branch is just
The total reflection of dump energy can be caused, this greatly weakens signal quality, has damaged the integrality of primary signal.It is and of the invention
Being capable of signal integrity and reliability.
Model module 202, different X-coordinate value, Y-coordinate value are set, obtain different VIA models；
It is described that different X-coordinate value, Y-coordinate value are set specifically, the VIA carried by HFSS such as accompanying drawing 4a-4c
WIZARD is configured to Antipad numerical value, and it is 39mil to set coordinate X-coordinate, Y-coordinate be respectively 25mil, 35mil,
45mil。
Such as accompanying drawing 5a-5b, under different distance in, different VIA can be formed in HFSS and cross hole pattern, this via occurs
In the mainboard in server cabinet and polylith subcard.Wherein, the electronic devices such as intel CPU, PCH, BMC are welded on mainboard,
Subcard provides complementary conditions for main card.
Parameter module 203, based on the different VIA models, set software parameter；
It is described setting software parameter specifically, setting Soldermask in top, bottom layer, coordinate-system, go it is embedding after will
The part overlapped in VIA is subtracted, and Wizard parts are set after PORT is set.Setting program is run after setting, obtains S4P
File.
Comparison module 204, under different X-coordinate value, Y-coordinate value, different S parameter values is obtained, is compared and is believed
Number damaed cordition.
As shown in Figure 6, under different X, Y numerical value, different S parameters is obtained, can be obtained in identical X-coordinate
Under, in the case that Y coordinate is respectively 25mil, 35mil, 45mil, the concrete numerical value of S parameter be respectively -0.28696dB, -
0.30654dB、-0.30749dB.It is compared acquisition signal-loss conditions and judges whether possess improved effect.
Technical scheme is also used in server high-speed line link, for SATA, SAS, UPI etc. at a high speed.
The invention provides it is a kind of based on ground hole and telltale hole different distance to the analytical equipment of effect of signals, pass through and compare
The different ground pitch-row in distance signal hole from, obtain different S parameters, and then can obtain specifically to the damaed cordition of signal,
The present invention is studied different distance signal holes, different S parameters is obtained to the specific data analysis of the loss of signal, in certain block plate
When card signal integrality is undesirable, other subcards are able to ensure that signal integrity, and then ensure that the peace of whole server operation
Entirely, the signal integrity and reliability of RACK whole machine cabinet servers are strengthened.
The foregoing description of the disclosed embodiments, those skilled in the art are enable to realize or using the present invention.To this
A variety of modifications of a little embodiments will be apparent for a person skilled in the art, and generic principles defined herein can
Without departing from the spirit or scope of the present invention, to realize in other embodiments.Therefore, the present invention will not be limited
The embodiments shown herein is formed on, but meets the most wide model consistent with principles disclosed herein and features of novelty
Enclose.
Claims (8)
- A kind of 1. analysis method based on ground hole with telltale hole different distance to effect of signals, it is characterised in that：Step 101, based on the different laminated construction of Intel chips, different dielectric constant D is obtainedkValue, dielectric loss angle tangent Value DfValue and Thick angle value；Step 102, different X-coordinate value, Y-coordinate value are set, obtain different VIA models；Step 103, based on the different VIA models, software parameter is set；Step 104, under different X-coordinate value, Y-coordinate value, different S parameter values is obtained, is compared and obtains loss of signal feelings Condition.
- 2. according to the method for claim 1, it is characterised in that：It is described that different X-coordinate value, Y-coordinate value are set specifically, logical Cross the VIA WIZARD that HFSS is carried to be configured Antipad numerical value, it is 39mil to set coordinate X-coordinate, and Y-coordinate is distinguished For 25mil, 35mil, 45mil.
- 3. according to the method for claim 1, it is characterised in that：The setting software parameter is specifically, setting Top, bottom layer, coordinate-system in Soldermask, go it is embedding after the part overlapped in VIA is subtracted, set after PORT is set Determine Wizard parts.
- 4. according to the method for claim 1, it is characterised in that：Based on the different ground pitch-row in distance signal hole from HFSS Form different VIA and cross hole pattern, via is appeared on mainboard and polylith subcard in server cabinet.
- A kind of 5. analytical equipment based on ground hole with telltale hole different distance to effect of signals, it is characterised in that：Described device bag Include：Initial module, for based on the different laminated construction of Intel chips, obtaining different dielectric constant DkValue, dielectric loss angle Tangent value DfValue and Thick angle value；Model module, for setting different X-coordinate value, Y-coordinate value, obtain different VIA models；Parameter module, for based on the different VIA models, setting software parameter；Comparison module, under different X-coordinate value, Y-coordinate value, obtaining different S parameter values, it is compared and obtains signal damage Mistake situation.
- 6. device according to claim 5, it is characterised in that：It is described that different X-coordinate value, Y-coordinate value are set specifically, logical Cross the VIA WIZARD that HFSS is carried to be configured Antipad numerical value, it is 39mil to set coordinate X-coordinate, and Y-coordinate is distinguished For 25mil, 35mil, 45mil.
- 7. device according to claim 5, it is characterised in that：The setting software parameter is specifically, setting Top, bottom layer, coordinate-system in Soldermask, go it is embedding after the part overlapped in VIA is subtracted, set after PORT is set Determine Wizard parts.
- 8. device according to claim 5, it is characterised in that：Described device, based on the different ground pitch-row in distance signal hole From forming different VIA in HFSS and cross hole pattern, via is appeared on mainboard and polylith subcard in server cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710592590.5A CN107577835A (en) | 2017-07-19 | 2017-07-19 | A kind of analysis method and device based on ground hole with telltale hole different distance to effect of signals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710592590.5A CN107577835A (en) | 2017-07-19 | 2017-07-19 | A kind of analysis method and device based on ground hole with telltale hole different distance to effect of signals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107577835A true CN107577835A (en) | 2018-01-12 |
Family
ID=61049670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710592590.5A Pending CN107577835A (en) | 2017-07-19 | 2017-07-19 | A kind of analysis method and device based on ground hole with telltale hole different distance to effect of signals |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107577835A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4921817B2 (en) * | 2006-03-22 | 2012-04-25 | アイカ工業株式会社 | Multilayer printed wiring board |
| CN104202905A (en) * | 2014-09-28 | 2014-12-10 | 浪潮(北京)电子信息产业有限公司 | PCB and wiring method thereof |
| CN104597324A (en) * | 2013-10-31 | 2015-05-06 | 北大方正集团有限公司 | Determining method of via hole parameter and via hole impedance value on circuit board |
| CN105426635A (en) * | 2015-12-22 | 2016-03-23 | 浪潮集团有限公司 | Skill program implementation method capable of establishing Differential Pair Gnd Vias automatically |
| CN105472907A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | Manufacturing method for shield type differential via holes and impedance calculation method for differential via holes |
-
2017
- 2017-07-19 CN CN201710592590.5A patent/CN107577835A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4921817B2 (en) * | 2006-03-22 | 2012-04-25 | アイカ工業株式会社 | Multilayer printed wiring board |
| CN104597324A (en) * | 2013-10-31 | 2015-05-06 | 北大方正集团有限公司 | Determining method of via hole parameter and via hole impedance value on circuit board |
| CN104202905A (en) * | 2014-09-28 | 2014-12-10 | 浪潮(北京)电子信息产业有限公司 | PCB and wiring method thereof |
| CN105426635A (en) * | 2015-12-22 | 2016-03-23 | 浪潮集团有限公司 | Skill program implementation method capable of establishing Differential Pair Gnd Vias automatically |
| CN105472907A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | Manufacturing method for shield type differential via holes and impedance calculation method for differential via holes |
Non-Patent Citations (2)
| Title |
|---|
| 姜晓黎: "三维模型在信号完整性分析中的应用", 《中国优秀硕士学位论文全文数据库信息科技辑》 * |
| 曹跃胜等: "高密度FDR设计分析与实现", 《第十八届计算机工程与工艺年会暨第四届微处理器技术论坛论文集》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7501586B2 (en) | Apparatus and method for improving printed circuit board signal layer transitions | |
| CN107169233A (en) | The Rack server design methods of research are influenceed on signal integrity based on short column resonance | |
| CN105307390A (en) | PCB structure | |
| US20080264673A1 (en) | Differential signal layout printed circuit board | |
| CN205320364U (en) | PCB (Printed circuit board) structure | |
| US20190041184A1 (en) | Systems and methods for frequency shifting resonance of an unused via in a printed circuit board | |
| CN102958291A (en) | Printed circuit board and manufacture method thereof | |
| CN114417781B (en) | PCB wiring crosstalk evaluation method, system, device, equipment and storage medium | |
| US20150180104A1 (en) | Reduced backdrilling with quarter wavelength transmission line stubs | |
| JP2009217621A (en) | Power source noise analysis method and system for electronic circuit board, and program | |
| CN208044474U (en) | Mainboard and computer device | |
| CN106604550A (en) | Line impedance adjusting method and system | |
| CN111737945A (en) | Back drilling design method, system, terminal and storage medium of PCB | |
| US20070244684A1 (en) | Method to model 3-D PCB PTH via | |
| CN101389183A (en) | Through-hole region design system and method for differential signal line | |
| DE112016004102T5 (en) | System, device and method for connecting printed circuit boards | |
| CN107577835A (en) | A kind of analysis method and device based on ground hole with telltale hole different distance to effect of signals | |
| CN111491451B (en) | Modeling method for crosstalk analysis of via hole differential signals | |
| US9996646B2 (en) | System and method of determining high speed resonance due to coupling from broadside layers | |
| CN115348731A (en) | Frequency response modeling method for multilayer-structure PCB | |
| US5504423A (en) | Method for modeling interactions in multilayered electronic packaging structures | |
| CN109526144B (en) | Method and system for analyzing influence of different via hole diameters on current magnitude | |
| CN218634401U (en) | Printed circuit board via hole structure and electronic device | |
| Kaveri et al. | Signal Integrity Evaluation for Automotive ECU with PCIe Gen 3.0 Interface | |
| CN109063318A (en) | SiP device Power Integrity evaluation method and device based on modeling and simulating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180112 |
|
| RJ01 | Rejection of invention patent application after publication |