CN107567235A - A kind of WDM - Google Patents

A kind of WDM Download PDF

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Publication number
CN107567235A
CN107567235A CN201610502608.3A CN201610502608A CN107567235A CN 107567235 A CN107567235 A CN 107567235A CN 201610502608 A CN201610502608 A CN 201610502608A CN 107567235 A CN107567235 A CN 107567235A
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CN
China
Prior art keywords
cold drawing
groove
function element
veneer
refrigerant passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610502608.3A
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Chinese (zh)
Inventor
尤晓彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to CN201610502608.3A priority Critical patent/CN107567235A/en
Priority to PCT/CN2017/089540 priority patent/WO2018001165A1/en
Publication of CN107567235A publication Critical patent/CN107567235A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a kind of WDM, including：Wavelength-division veneer and the heat abstractor for being radiated to wavelength-division veneer；Wherein, wavelength-division veneer includes：Veneer body, the function element being arranged on veneer body；Heat abstractor includes：For the refrigerant passage for the refrigerant liquid that circulates and the groove of receiving function element；Wherein, groove is arranged at heat abstractor towards corresponding to the opening position of function element on the outer surface of wavelength-division veneer, and the gap of coated with thermally conductive material is provided between groove and function element；Refrigerant passage tiles in heat sink interior to be extended, and is not connected mutually with groove.Present invention lid on wavelength-division veneer sets a heat abstractor, substitutes wind-cooling heat dissipating using the liquid-cooling heat radiation of conductive-convective mode, radiating efficiency is substantially increased, to overcome the problem of radiating effect of wind-cooling heat dissipating is poor, noise is big.

Description

A kind of WDM
Technical field
The present invention relates to optical communication equipment field, more particularly to a kind of WDM.
Background technology
Wave-division device uses wind-cooling heat dissipating technology at present, but as device-speed is lifted, hardware integration degree carries High demand is increasingly urgent, to noise in wind-cooling heat dissipating ability convergence bottleneck, Attended mode and business environment It is required that the more strict, theory of energy-conserving and environment-protective is gradually rooted in the hearts of the people, also allows for us and big power consuming device is dissipated The improvement of thermal technology has active demand.
The content of the invention
The invention provides a kind of WDM, solves wave-division device in the prior art and is dissipated using air-cooled Thermal technology, the problem of radiating efficiency is low and noise is big.
According to one aspect of the present invention, there is provided a kind of WDM, including：Wavelength-division veneer and For the heat abstractor to be radiated to wavelength-division veneer；Wherein,
Wavelength-division veneer includes：Veneer body, the function element being arranged on veneer body；
Heat abstractor includes：For the refrigerant passage for the refrigerant liquid that circulates and the groove of receiving function element；Its In, groove is arranged at heat abstractor towards the opening position for corresponding to function element on the outer surface of wavelength-division veneer, And the gap of coated with thermally conductive material is provided between groove and function element；Refrigerant passage is in heat sink interior Tiling extension, and do not connected mutually with groove.
Wherein, the heat abstractor also includes：
Lower floor's cold drawing, the surface of veneer body is coated on, and is fixedly connected with veneer body；Groove is arranged at Lower floor's cold drawing corresponds to the position of function element；Wherein, the first of bending extension is additionally provided with lower floor's cold drawing Channel slot；And
Upper strata cold drawing, it is covered on lower floor's cold drawing, the opening position on the cold drawing of upper strata corresponding to first passage groove is opened Second channel groove provided with bending extension, second channel groove are engaged to form refrigerant passage with first passage groove.
Wherein, refrigerant passage bending is extended, and the bending density at the first position of refrigerant passage is more than The bending density of the second place；Wherein, first position is that refrigerant passage corresponds to close to function element position, The second place is position of the refrigerant passage away from function element.
Wherein, refrigerant passage bending is extended, and the bending density of the 3rd opening position of refrigerant passage is more than The bending density of 4th opening position；Wherein, the power consumption of the function element of the 3rd position correspondence is more than the 4th position Corresponding function element power consumption.
Wherein, veneer body includes bottom plate and the pcb board being arranged on bottom plate, and function element is fixed on PCB On plate.
Wherein, the thickness of lower floor's cold drawing meets following relation：
T=(TIt is single-T0-HWork()/2
Wherein, T represents the thickness of lower floor's cold drawing, TIt is singleRepresent the gross thickness of veneer body, T0Represent bottom plate and The gross thickness of pcb board, H represent the height of function element.
Wherein, the channelizing line for wind-cooling heat dissipating is additionally provided with the cold drawing of upper strata.
Wherein, lower floor's cold drawing is fixedly connected with veneer body by screw connection manner.
Wherein, upper strata cold drawing is fixedly connected with lower floor cold drawing by welding manner.
Wherein, the both ends of refrigerant passage are connected to a joint.
The beneficial effect of embodiments of the invention is：
Lid sets a heat abstractor, the refrigerant for being internally provided with tiling extension of the heat abstractor on wavelength-division veneer Passage, cooling fluid conductive-convective in the refrigerant passage, to realize the radiating to wavelength-division veneer, using the party Formula has compared with high cooling efficiency, and will not produce very big noise, and it is big to solve wind-cooling heat dissipating efficiency low noise The problem of.
Brief description of the drawings
Fig. 1 represents the structural representation of the heat abstractor of the present invention；
Fig. 2 represents lower floor's cold drawing of the present invention towards the structural representation of the outer surface of wavelength-division veneer；
Fig. 3 represents structural representation of lower floor's cold drawing backwards to the outer surface of wavelength-division veneer of the present invention；
Fig. 4 represents the upper strata cold drawing of the present invention towards the structural representation of the outer surface of lower floor's cold drawing.
Wherein in figure：10th, heat abstractor；
101st, refrigerant passage, 102, groove, 103, lower floor's cold drawing, 104, upper strata cold drawing；
1031st, first passage groove, 1041, second channel groove.
Embodiment
The exemplary embodiment of the present invention is more fully described below with reference to accompanying drawings.Although shown in accompanying drawing The exemplary embodiment of the present invention, it being understood, however, that may be realized in various forms the present invention without should be by Embodiments set forth here is limited.Conversely, there is provided these embodiments are to be able to be best understood from this Invention, and the scope of the present invention can be completely communicated to those skilled in the art.
Embodiment one
As shown in figure 1, the embodiment provides a kind of WDM, including：Wavelength-division veneer And the heat abstractor 10 for being radiated to wavelength-division veneer.Wherein, wavelength-division veneer includes：Veneer sheet Body, the function element being arranged on veneer body；Wherein, veneer body includes bottom plate and is arranged on bottom plate Pcb board, function element is fixed on pcb board.Heat abstractor includes：For the refrigerant liquid that circulates Refrigerant passage 101 and the groove 102 for accommodating function element.Wherein, groove 102 is arranged at heat abstractor 10 Correspond to the opening position of function element on towards the outer surface of wavelength-division veneer, and groove 102 and function element it Between be provided with the gap of coated with thermally conductive material；Refrigerant passage 101 tiles extension inside heat abstractor 10, And the larger groove 102 of depth dimensions is avoided, do not connected mutually with groove 102.Wherein, it is worthy of note that, The function element accommodated in groove 102 is different, and in the bottom of groove 102, the Heat Conduction Material of coating is different, such as： The groove 102 of the more fragile chip of outer cover intensity is accommodated, it is necessary to reserve 1mm gap coated with thermally conductive glue Mud；The harder optical module of outer cover intensity, the groove 102 of power module are accommodated, it is necessary in module and groove 102 contact position coating silicone grease layer is to reduce thermal resistance.
The coolant media to be circulated in refrigerant passage 101, radiated by using conduction, convection type, So as to substitute the wind-cooling heat dissipating for realizing radiating by radiation, convection type in the prior art, radiating effect is improved Rate, solves the situation of wind-cooling heat dissipating scarce capacity in the case of high heat density in the prior art.It is in addition, logical The mode of overcompression refrigerant is radiated also so that system noise further reduces.Further, heat energy can also be through Refrigerant swaps, and can access therrmodynamic system indirectly and be stored and used to reach the purpose of energy-conserving and environment-protective.
Alternatively, as shown in Figures 2 to 4, the heat abstractor 10 also includes：Lower floor's cold drawing 103 and upper Layer cold drawing 104.
Further, lower floor's cold drawing 103 primarily serves conduction and the fixation of heat, is coated on veneer sheet The surface of body, and be fixedly connected with veneer body.Wherein, in order to save material, lower floor's cold drawing 103 it is outer The total area coverage of function element that shape size radiates according to the needs on veneer body determines.Wherein, lower floor Cold drawing is fixedly connected with veneer body by screw connection manner, can be in lower floor's cold drawing in order to ensure connection reliability 103 peripheral edge sets multiple studs, and stud position determines according to the tie point position of veneer body, spiral shell The size of post determines according to the connection spot size of veneer body；Correspondingly, veneer body and lower floor's cold drawing 103 The one side of contact needs the tapping screw corresponding with stud.Groove 102 is arranged at the correspondence of lower floor's cold drawing 103 In the first passage groove 1031 that bending extension is additionally provided with the opening position of function element, lower floor's cold drawing 103. Wherein, groove 102 and first passage groove 1031 are to mill out shaping, and the position of groove 102 is according to wavelength-division The function element position of veneer determines that the size of groove 102 is true according to the size of the function element of wavelength-division veneer It is fixed, wherein, the function element that size and the needs of groove 102 radiate is similar, such as extension 2mm or according to Space layout it needs to be determined that.The layout of first passage groove 1031 is according to function element position and groove 102 Position dimension determine.That is, the depth of groove 102 need according to corresponding chip on veneer body, The top of module determines with lower floor's cold drawing 103 close to the distance of that plane of pcb board.The height of stud It is exactly cold drawing close to that plane of pcb board and the distance of pcb board.The semicircle of first passage groove 1031 The gateway of shape coolant path, its position need to be chosen according to veneer body remaining space, wherein refrigerant passage 101 radius is less than cold drawing height and determined according to the flow of radiating refrigerant.
Further, upper strata cold drawing 104 plays plugging action, and upper strata cold drawing 104 passes through with lower floor cold drawing 103 Welding manner is fixedly connected.Preferably, upper strata cold drawing 104 is covered on lower floor's cold drawing by argon arc welding technique On 103, the opening position on upper strata cold drawing 104 corresponding to first passage groove 1031 offers bending extension Second channel groove 1041, second channel groove 1041 are engaged to form refrigerant passage with first passage groove 1031 101.Wherein, the layout of second channel groove 1041 determines according to the layout of first passage groove 1031, second Channel slot 1041 and first passage groove 1031 are mirrored arrangement.
Further, if lower floor's cold drawing 103 and upper strata cold drawing 104 be connected with veneer body after height, Less than veneer body height (25mm) more than 3mm, then need lower floor's cold drawing 103 and upper strata cold drawing 104 are connected with the place of working of veneer body, otherwise using hanging mode.It should be noted that two layers of cold drawing is used When on the veneer body for be provided with optical module, because the shell of optical module is connected with the place of working of veneer body, So two layers of cold drawing is necessarily connected with the place of working of veneer body.
Alternatively, the power consumption size according to the chip of contact, module in the layout path of refrigerant passage 101 is true It is fixed, wherein, the opening position dense distribution corresponding to the big function element of power consumption, the function element institute of small power consumption The corresponding appropriate sparse distribution of opening position, and the radius of turn in path can not be too small, prevents that channel resistance is too big； In addition, the layout path of refrigerant passage 101 notes also the groove for avoiding depth close to cold plate thickness.
Wherein, the refrigerant passage 101 bending is extended, with increasing heat radiation area.Wherein, refrigerant passage Bending density at 101 first position is more than the bending density of the second place；First position leads to for refrigerant Road 101 corresponds to close to function element position, and the second place is that refrigerant passage 101 corresponds to away from effector The position of part.
Further, the bending density of the 3rd opening position of refrigerant passage 101 is more than the bending of the 4th opening position Density；Wherein, the power consumption of the function element of the 3rd position correspondence of refrigerant passage 101 is more than the 4th position pair The function element power consumption answered.
Wherein, the thickness of lower floor's cold drawing 103 meets following relation：
T=(TIt is single-T0-HWork()/2
Wherein, T represents the thickness of lower floor's cold drawing, TIt is singleRepresent the gross thickness of veneer body, T0Represent bottom plate and The gross thickness of pcb board, H represent the height of function element, and the lower floor's cold plate thickness designed using the formula can Clearance for insulation between assurance function device and lower floor's cold drawing 103.It is worthy of note that the formula only conduct The decision design of the thickness of lower floor's cold drawing 103 design, other can calculate the lower floor's cold drawing 103 for meeting to require The calculation formula and corresponding relation of thickness also belong to the scope that the present embodiment is covered.
Wherein, upper strata cold drawing 104 mainly plays sealing process, and it is cold and air-cooled two kinds that heat abstractor may also be combined with liquid Radiating mode, the channelizing line for wind-cooling heat dissipating can be so milled out on the cold drawing of upper strata.
Further, lower floor's cold drawing 103 and upper strata cold drawing 104 can use aluminium material, and aluminum has price Low, the advantages that density is small, quality is hard, it can both ensure its changing firmness requirements, and controllable costs.
Wherein, the both ends of refrigerant passage are connected to a joint.Joint is according to lower floor's cold drawing 103 and upper strata Dimension is chosen in the aperture of the refrigerant passage 101 of cold drawing 104, and joint can be led to using engagement thread with refrigerant Road 101 is connected and fixed.
Further, in order to avoid electrochemical corrosion, radiating refrigerant should use pure water under normal temperature state；It is low The anti-icing fluid of corresponding label is used under temperature state.And it be can refer to for the flow of refrigerant in refrigerant passage with lower section Formula calculates and control.
By taking the function element of 200W power consumptions as an example, refrigerant uses pure water under normal temperature state, it is assumed that water temperature It is upgraded to：3 DEG C, the aperture of coolant path is 2mm, and radiating efficiency n=0.7 is (it is contemplated herein that thermal resistance, actual Efficiency is more than this numerical value, and only estimation takes this numerical value herein), it is calculated as follows：
Veneer body generation heat Q=200*60=12000J per minute, the specific heat capacity of water are：4.2*10^3 J/Kg·℃.So the quality m=12000/0.7/4200/3=1.36Kg per minute for needing water (is calculated As a result it is the result of reservation two-decimal), the volume V=1.36L per minute for needing water, flow Qv=1.36 L/min, flow velocity U=Qv/ (π * r^2)=1.36*10^-3/ [3.14* (1*10^-3) ^2]/60=7.22m/s (is calculated As a result it is the result of reservation two-decimal)., can be according to Bernoulli equation (Z1 after drawing refrigerant flow rate + P1/ ρ+V1^2/2g=Z2+P2/ ρ+V2^2/2g+Hw) pressure needed for calculating.
Above-described is the preferred embodiment of the present invention, it should be pointed out that for the ordinary people of the art For member, some improvements and modifications can also be made under the premise of principle of the present invention is not departed from, these Improvements and modifications are also within the scope of the present invention.

Claims (10)

  1. A kind of 1. WDM, it is characterised in that including：Wavelength-division veneer and for the ripple The heat abstractor for dividing veneer to be radiated；Wherein,
    The wavelength-division veneer includes：Veneer body, the function element being arranged on the veneer body；
    The heat abstractor includes：Refrigerant passage and the receiving function element for the refrigerant liquid that circulates Groove；Wherein, the groove is arranged at the heat abstractor towards correspondence on the outer surface of the wavelength-division veneer In the opening position of the function element, and coated with thermally conductive material is provided between the groove and the function element The gap of material；The refrigerant passage tiles in the heat sink interior to be extended, and is not connected mutually with the groove It is logical.
  2. 2. WDM according to claim 1, it is characterised in that the heat abstractor is also Including：
    Lower floor's cold drawing, the surface of the veneer body is coated on, and is fixedly connected with the veneer body；Institute State groove and be arranged at the position that lower floor's cold drawing corresponds to the function element；Wherein, lower floor's cold drawing On be additionally provided with bending extension first passage groove；And
    Upper strata cold drawing, it is covered on lower floor's cold drawing, corresponding to first passage groove on the upper strata cold drawing Opening position offers the second channel groove of bending extension, and the second channel groove matches with the first passage groove Conjunction forms the refrigerant passage.
  3. 3. WDM according to claim 1, it is characterised in that the refrigerant passage is curved Song is extended, and the bending that the bending density at the first position of the refrigerant passage is more than the second place is close Degree；Wherein, the first position is that the refrigerant passage corresponds to close to the function element position, described The second place is position of the refrigerant passage away from the function element.
  4. 4. WDM according to claim 1, it is characterised in that the refrigerant passage is curved Song is extended, and the bending density of the 3rd opening position of the refrigerant passage is close more than the bending of the 4th opening position Degree；Wherein, the power consumption of the function element of the 3rd position correspondence is more than the function of the 4th position correspondence Device power consumption.
  5. 5. WDM according to claim 2, it is characterised in that the veneer body bag Bottom plate and the pcb board being arranged on the bottom plate are included, the function element is fixed on the pcb board.
  6. 6. WDM according to claim 5, it is characterised in that lower floor's cold drawing Thickness meets following relation：
    T=(TIt is single-T0-HWork()/2
    Wherein, T represents the thickness of lower floor's cold drawing, TIt is singleRepresent the gross thickness of the veneer body, T0Represent institute The gross thickness of bottom plate and the pcb board is stated, H represents the height of the function element.
  7. 7. WDM according to claim 2, it is characterised in that on the upper strata cold drawing It is additionally provided with the channelizing line for wind-cooling heat dissipating.
  8. 8. WDM according to claim 2, it is characterised in that lower floor's cold drawing with The veneer body is fixedly connected by screw connection manner.
  9. 9. WDM according to claim 2, it is characterised in that the upper strata cold drawing with Lower floor's cold drawing is fixedly connected by welding manner.
  10. 10. WDM according to claim 1, it is characterised in that the refrigerant passage Both ends are connected to a joint.
CN201610502608.3A 2016-06-30 2016-06-30 A kind of WDM Pending CN107567235A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610502608.3A CN107567235A (en) 2016-06-30 2016-06-30 A kind of WDM
PCT/CN2017/089540 WO2018001165A1 (en) 2016-06-30 2017-06-22 Wavelength division multiplexing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610502608.3A CN107567235A (en) 2016-06-30 2016-06-30 A kind of WDM

Publications (1)

Publication Number Publication Date
CN107567235A true CN107567235A (en) 2018-01-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610502608.3A Pending CN107567235A (en) 2016-06-30 2016-06-30 A kind of WDM

Country Status (2)

Country Link
CN (1) CN107567235A (en)
WO (1) WO2018001165A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111163585A (en) * 2020-01-10 2020-05-15 珠海格力电器股份有限公司 Circuit board for controller and controller

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014047676A1 (en) * 2012-09-25 2014-04-03 Klaas Visser Cooling of exhaust gas of a power generation system
CN104613556A (en) * 2013-11-04 2015-05-13 珠海格力电器股份有限公司 Cooling device of electrical apparatus element and air conditioner having same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204757289U (en) * 2015-06-08 2015-11-11 广东美的暖通设备有限公司 Variable frequency air conditioner refrigerant heat abstractor and variable frequency air conditioner
CN105371687B (en) * 2015-10-27 2017-07-11 珠海格力电器股份有限公司 Heat-exchanging component, heat exchanger and refrigeration system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014047676A1 (en) * 2012-09-25 2014-04-03 Klaas Visser Cooling of exhaust gas of a power generation system
CN104613556A (en) * 2013-11-04 2015-05-13 珠海格力电器股份有限公司 Cooling device of electrical apparatus element and air conditioner having same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111163585A (en) * 2020-01-10 2020-05-15 珠海格力电器股份有限公司 Circuit board for controller and controller
CN111163585B (en) * 2020-01-10 2021-06-25 珠海格力电器股份有限公司 Circuit board for controller and controller

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Publication number Publication date
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