Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art are obtained all on the premise of creative work is not made
Other embodiments, belong to the scope of protection of the invention.
In addition, the explanation of following embodiment is with reference to additional diagram, the spy implemented to illustrate the present invention can be used to
Determine embodiment.The direction term being previously mentioned in the present invention, for example, " top ", " bottom ", " on ", " under ", "front", "rear",
"left", "right", " interior ", " outer ", " side " etc., be only the direction with reference to annexed drawings, therefore, the direction term used be in order to
More preferably, it is illustrated more clearly that and understands the present invention, rather than indicates or infer the device of meaning or element to have specifically
Orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
The number range represented in this specification with "~" refers to using "~" front and rear numerical value recorded as minimum value
And the scope that maximum is included.In the accompanying drawings, structure is similar or identical is indicated by the same numeral.
Referring to Fig. 1, Fig. 1 is a kind of mobile terminal 200 provided in an embodiment of the present invention, the mobile terminal 200 can be with
It is any equipment for possessing communication and store function, such as:Tablet personal computer, mobile phone, electronic reader, remote control, individual calculus
Machine (PersonalComputer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have network function
Smart machine.The mobile terminal 200 includes housing 100, and described housing 100 includes having slit 110.The slit
110 quantity can be a plurality of, such as 110a and 110b in Fig. 1.
Refer to Fig. 2 and Fig. 3, Fig. 2 be housing 100 in mobile terminal 200 in Fig. 1 partial enlarged drawing, Fig. 3 is Fig. 2 edges
The sectional view in AA ` directions.The housing 100 includes the ` of housing base 100.The ` of housing base 100 includes slit 110.It is described
There is the first sealant 150 and the second sealant 160 being stacked in slit 110.First sealant 150 and described
Two sealants 160 are sealing the slit 110.Specifically, first sealant 150 is formed by first medium, described
Second sealant 160 is formed by second medium.The first medium and the second medium can be liquid glue.Due in slit
First medium is filled in 110, and the first medium does not fill up the slit 110, now, the first medium is described micro-
There is preferable mobility in seam 110.
Optionally, Fig. 1  ̄ Fig. 3 is referred to, the housing 100 is metal material, and the ` of housing base 100 is also metal
Material, applied to mobile terminal 200.And metal shell 100 has shielding action for electromagnetic wave so that mobile terminal 200 it is interior
Electric signal can not be received and send by putting antenna.Shielding electromagnetic waves are asked in order to solve the metal shell 100 of mobile terminal 200
Topic, by forming slit 110 on metal shell 100, so that the built-in aerial of mobile terminal 200 is radiated by slit 110
Signal, then the filled media into slit 110, with sealing metal housing 100.However, during slit 110 is formed, filling is situated between
The poor fluidity of matter, the problems such as sealing unreal or generation bubble is likely to result in, so as to influence the overall performance of housing.
In the embodiment of the present application, first medium is filled in the slit 110 by elder generation, to form the first sealant 150,
Second medium is filled on first sealant 150 again, to form the second sealant 160, first sealant 150 and institute
State the second sealant 160 and fill up the slit 110, after being filled due to first medium, can fully be flowed in the slit 110,
To be filled in the gap of the bottom of slit 110 and groove, so as to prevent the bottom of slit 110 from producing bubble, and gap
The problems such as causing leak adhesive is discontented with filling, and then improves the overall performance of the housing 100 of mobile terminal 200.
In a kind of optional embodiment, referring to Fig. 4, the thickness h 1 of first sealant 150 is less than described second
The thickness h 2 of sealant 160.Present embodiment can be by controlling the loading of the first medium to be less than the second medium
Loading realize.
The application does not do specific restriction for the loading of the first medium, it is preferred that is meeting described first
For Filled Dielectrics in the case of the gap of the bottom of slit 110 and recess, the loading of the first medium is as far as possible few.
In present embodiment, the first medium can be identical or different material with the second medium, by setting
The loading for putting the first medium is less than the loading of the second medium, then the first medium has preferably flowing
Property so that the first medium can flow to any corner of the bottom of slit 110, after the first sealant 150 is formed,
First sealant 150 can be brought into close contact with the bottom of slit 110, so as to reduce first sealant 150 and institute
The caused sealant of the defects of stating between the bottom of slit 110 and the defects of gap, bubble be present, and then avoiding the gap, bubble is opened
The problems such as splitting or causing leak adhesive.
In another optional embodiment, the viscosity of the first medium is less than the viscosity of the second medium.
In present embodiment, the first medium can be different materials from the second medium, wherein, described first
The difference of medium and the second medium is that the viscosity of the first medium is smaller.So the first medium has preferably
Mobility, so as to which the first medium is after the slit 110 is filled in, the gap of the bottom of slit 110 can be flowed to
With recess etc., the defects of to reduce formation bubble, poor sealing and leak adhesive when seal the slit 110.
Optionally, the second medium includes colorant, described to have colorant so that white, gold is presented in the second medium
Color, silver color etc., after second sealant 160160 is formed, the second medium 182 forms coloured packaging belt, Ke Yiqi
To the effect of mark and decoration.
Fig. 3 and Fig. 4 is referred to, the ` of housing base 100 includes the first surface 101 and second surface being oppositely arranged
102, wherein, the structure packaged by the first surface 101 towards the housing 100.The slit 110 is through described first
Surface 101 and the second surface 102, and the first opening is formed respectively in the first surface 101 and the second surface 102
120 and second opening 130.The housing 100 also includes substrate 140, and the substrate 140 fits in the first surface 101, and
Block first opening 120.First sealant 150 is sealed in the substrate 140 and is open with described first at 120.Institute
The second sealant 160 is stated to be sealed between first sealant 150 and second opening 130.
Optionally, the substrate 140 can be sizing material, for blocking at the described first opening 120, and will be other first
Part is positioned at the first surface 101.But because the ` of housing base 100 is different from the material of the substrate 140, both knots
It is poor to close reliability, therefore, first surface 101 easily has gap 170 with the substrate 140.Under such configuration, described first
Sealant 150 is to seal between the first surface 101 and the substrate 140, to improve the ` of housing base 100 and institute
State the sealing between substrate 140.
In a kind of specific embodiment, referring to Fig. 5, between having between the substrate 140 and the first surface 101
Gap 170, first sealant 150 are filled in the gap 170.
In present embodiment, because first medium has preferable mobility, during the first medium is filled,
The first medium can be flowed in the gap 170, so that first sealant 150 is filled in the gap 170,
To reduce the seal defect between substrate 140 and the ` of the housing base 100.
Further, referring to Fig. 5, first sealant 150 has the first roof 151 being oppositely arranged and the first bottom
Wall 152 and the first side wall 153 being connected between first roof 151 and first bottom wall 152.First bottom wall
152 fit in the substrate 140.The slit 110 has between the described first opening 120 and second opening 130
Madial wall 111.The first side wall 153 fits in the madial wall 111 and first surface 101.
In present embodiment, by setting first bottom wall 152 to fit in the substrate 140, the first side wall 153 is bonded
In the madial wall 111 and first surface 101 of the slit 110, so that first sealant 150 is sufficient filling with the gap
170, avoid producing bubble between the substrate 140 and the first surface 101 or be not filled by part, so as to reduce the substrate
Sealing between 140 and the slit 110, and avoid causing the ` of housing base 100 easily to release with the substrate 140
The problems such as.
Further, referring to Fig. 5, second sealant 160 has the second roof 161 being oppositely arranged and the second bottom
Wall 162 and the second sidewall 163 being connected between second roof 161 and second bottom wall 162.Second bottom wall
162 fit in first roof 151.The second sidewall 163 fits in the madial wall 111.Second roof 161 with
The second surface 102 is in smoothing junction.
In present embodiment, second sealant 160 is sufficient filling with first sealant 150 and the slit
Slit 110 between 110 madial walls 111, while the slit 110 is also filled up, to ensure the ` slits 110 of housing base 100
The sealing at place.
Preferably, second roof 161 is generally aligned in the same plane with the second surface 102, to increase the housing base
The touch of the ` second surfaces 102 of body 100 is smoothly felt, so as to increase Consumer's Experience.
In another specific embodiment, referring to Fig. 6, the substrate 140 has towards the surface of the slit 110
Depression 171, first sealant 150 are filled in the depression 171.In the injection moulding process of the substrate 140, the substrate
140 inside can produce some stomatas, and after slit 110 is processed, these stomatas can be presented on the bottom of slit 110, form depression
171。
In present embodiment, because first medium has preferable mobility, during the first medium is filled,
The first medium can be flowed in the depression 171, so that first sealant 150 is filled in the depression 171,
To reduce the seal defect between substrate 140 and the ` of the housing base 100.
The application does not limit for the shape of the slit 110, and the slit 110 can be that strip through-hole or circle are logical
Hole or square through hole or the through hole of irregular shape etc..In present embodiment, the slit width of the slit 110 or the internal diameter of through hole are small
In 0.3mm.
Refer to the preparation method 10 that Fig. 2  ̄ Fig. 7, Fig. 7 are a kind of housings 100 provided in an embodiment of the present invention.The system
Make method 10 and can be used for making housing 100 described in any of the above-described embodiment, comprise the following steps.
Step 101, offer housing base 100 `, the ` of housing base 100 have slit 110.
Optionally, the ` of housing base 100 includes the first surface 101 and second surface 102 being oppositely arranged, wherein, institute
State the structure packaged by first surface 101 towards the housing 100.The slit 110 is through the first surface 101 and institute
Second surface 102 is stated, and forms the first opening 120 and second respectively in the first surface 101 and the second surface 102 and opens
Mouth 130.
Optionally, the preparation method 10 also includes:Substrate 140, the substrate are formed on the ` of housing base 100
140 fit in the first surface 101, and block first opening 120, that is to say, that the substrate 140 fits in described
The bottom of slit 110.
Optionally, comprise the following steps before the ` of housing base 100 forms slit 110.
Step 1:Housing former material is cut, multiple mould punching, form housing plate in uniform thickness, wherein, shell
Body former material is metal material.
Step 2:Using computer digital control machine tool (Computernumericalcontrol, CNC) to housing plate
Enter driving, milling, grind, cut, to form the ` of housing base 100.
Optionally, formed in slit 110 and comprised the following steps in the ` of housing base 100.
Step 1:The ` of housing base 100 is molded in a mold, the plastic material of injection is resin, the plastic material
Form the substrate 140 being brought into close contact with first surface 101.
Step 2:The ` of housing base 100 is placed on computer digital control machine tool, with CNC milling cutter in housing base 100
Form antenna slit 110 on `, only milling is broken the ` of housing base 100, is broken substrate 140 without milling, and the substrate 140 can be used for propping up
The ` of housing base 100 is supportted, when forming more strip antenna slits 110, the substrate 140 is kept between adjacent antenna slit 110
The disconnected process of milling does not bend and deformation.
Step 102, fill first medium in the bottom of the slit 110.
After forming the substrate 140 on the ` of housing base 100, the step 102 also includes:Described first is situated between
Matter is sprayed in the substrate 140 from the second opening 130 of the slit 110, to form described first in the substrate 140
Sealant 150.
It is described in the step of substrate 140 are formed on the ` of housing base 100 in a kind of possible embodiment
There is gap 170 between substrate 140 and the ` of the housing base 100.It is described that first sealing is formed in the substrate 140
The step of layer 150, includes:The first medium is sprayed at the substrate 140, the first medium is flowed to the gap
170, and it is filled in the gap 170, that is to say, that first sealant 150 is filled in the gap 170.
In alternatively possible embodiment, in the step of substrate 140 are formed on the ` of housing base 100, institute
State substrate 140 has depression 180 towards the surface of the slit 110.It is described that first sealing is formed in the substrate 140
The step of layer 150, includes:The first medium is sprayed at the depression 180, the first medium is filled in the depression
180, that is to say, that first sealant 150 is filled in the depression 180.
Step 103, second medium is filled in the slit 110, to fill up the slit 110.
In a kind of embodiment, the preparation method 10 includes step 301:Described in underfill in the slit 110
First medium, the first medium is shaped to the first sealant 150, described second is filled on first sealant 150
Medium, and the second medium is shaped to the second sealant 182.First sealant 150 be sealed in the substrate 140 with
At first opening 120.Second sealant 160 be sealed in first sealant 150 with described second opening 130 it
Between.First sealant 150 fills up the slit 110 with second sealant 182.
Optionally, the loading of the first medium is less than the loading of the second medium.It is situated between filling described first
After matter, because the loading of the first medium is few, also there is more space, the first medium tool in the slit 110
There is preferable mobility so that the first medium can flow to any corner of the bottom of slit 110, form first
After sealant 150, first sealant 150 can be brought into close contact with the bottom of slit 110, close so as to reduce described first
The defects of the defects of gap, bubble being present between sealing 150 and the bottom of the slit 110, and then avoiding the gap, bubble causes
Sealant cracking or the problems such as cause leak adhesive.
Specifically, the filling quality of the first medium can be 0.1  ̄ 0.8 of the filling quality of the second medium
Times.
Optionally, the first medium and the second medium are liquid glue, and the viscosity of the first medium is less than institute
State the viscosity of second medium.So the first medium has preferable mobility, so as to which the first medium is being filled in
After stating slit 110, gap and recess of the bottom of slit 110 etc. can be flowed to, the slit 110 is being sealed to reduce
When form bubble, poor sealing and the defects of leak adhesive.
Optionally, after first medium described in the underfill in slit described in step 301 110, the preparation method 10 is also
Including step 302:
Solidify the first medium, be molded first sealant 150, cool down first sealant 150, described the
The second medium is sprayed on one sealant 150, solidifies the second medium, is molded second sealant 160, described in polishing
Second sealant 160, so that the second roof 161 of second sealant 160 and the ` second surfaces 102 of housing base 100
Concordantly.
Optionally, in step 302, technique or UV curing process solidification first Jie of being heating and curing can be passed through
Matter.During the first medium is solidified by the technique that is heating and curing, the temperature of heat cure can be 110 DEG C of 80  ̄, to the greatest extent
Amount choosing is suitable for solidification and relatively low temperature, to avoid solidification temperature too high, the first medium occur cracking or contraction distortion or
Separated with the internal perisporium of the slit 110.Optionally, so the time of heat cure can be 0.5  ̄ 2h.If hardening time mistake
Short, the possible first medium is not fully cured, if hardening time is long, it is also possible to causes the first medium cracking, deformation.
Optionally, in step 302, before the step of spraying the second medium on first sealant 150, institute is cooled down
State 40 DEG C of 150 to 20  ̄ of the first sealant.During the second medium is filled, the second medium is contacted to described in cooling
During the first sealant 150, if the temperature of cooling first sealant 150 is too high, the second medium may be caused to rise suddenly
Temperature, so as to influence the mobility of the second medium and shrinkage, and then influence the sealing property of the housing 100.
Further, during cooling first sealant 150, the cold of first sealant 150 is cooled down
But speed can be 0.1 0.8 DEG C/min of  ̄, be cooled with slower speed, to ensure to cool down the cooling of first sealant 150
During, do not shrink or less contraction occur, and then ensure to cool down first sealant 150 fit in all the time it is described
The madial wall 111 of slit 110, to improve the sealing of the housing 100.
Optionally, in step 302, technique or UV curing process solidification second Jie of being heating and curing can be passed through
Matter.During the technique that is heating and curing solidifies the second medium, the temperature of heat cure can be 110 DEG C of 80  ̄, heat cure
Time can be 1  ̄ 3h.Because the loading of the second medium is more, when the heat cure of the second medium can be set
Between it is longer than the thermal curing time of first medium so that the second medium fully solidifies.
Optionally, the first medium and the second medium are liquid glue.The first medium and described second is situated between
Matter is same or different material.Preferably, the first medium and the second medium have preferably compatibility, to carry
Bonding strength between high first sealant 150 and second sealant 160.
Optionally, before the second medium is filled on first sealant 150 described in step 301, the preparation method 10
Also include:Being added in the second medium has colorant, and the second medium is had into coloring material for mixing with described.Described in solidification
After second medium, the coloured packaging belt of slit 110 is formed, can play a part of marking and decorate.
Optionally, fill second medium in the slit 110 in step 103, the step of to fill up slit 110 after
Comprise the following steps.
Step 1:Using Digit Control Machine Tool processing housing base 100 ` inner chamber, periphery and minutia, minutia includes
Camera receiving hole, earphone jack, power line jack etc..
Step 2:Sanding and polishing, sandblasting and anodic oxidation are carried out to the ` of housing base 100 to change the ` of housing base 100 face
Color and gloss, form housing 100.
In summary, although the present invention is disclosed above with preferred embodiment, the preferred embodiment simultaneously is not used to limit
The present invention, one of ordinary skill in the field, without departing from the spirit and scope of the present invention, it can make various changes and profit
Decorations, therefore protection scope of the present invention is defined by the scope that claim defines.