CN107546211A - Chip assembly, laser printer, powder box component and its control method - Google Patents
Chip assembly, laser printer, powder box component and its control method Download PDFInfo
- Publication number
- CN107546211A CN107546211A CN201710896459.8A CN201710896459A CN107546211A CN 107546211 A CN107546211 A CN 107546211A CN 201710896459 A CN201710896459 A CN 201710896459A CN 107546211 A CN107546211 A CN 107546211A
- Authority
- CN
- China
- Prior art keywords
- electrical connection
- connection section
- chip
- powder box
- contact pilotage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 title claims abstract description 129
- 238000000034 method Methods 0.000 title claims description 11
- 238000009434 installation Methods 0.000 claims abstract description 51
- 238000000926 separation method Methods 0.000 claims description 2
- 230000002349 favourable effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- GIGQFSYNIXPBCE-UHFFFAOYSA-N alumane;platinum Chemical compound [AlH3].[Pt] GIGQFSYNIXPBCE-UHFFFAOYSA-N 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004482 other powder Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electrophotography Configuration And Component (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
Abstract
The present invention provides a kind of laser printer,Laser printer includes body,Cover and powder box component,Powder box component includes powder box and chip assembly,Chipless powder box is provided with body,Cover is provided with chip assembly and contact pilotage,Chip assembly includes base,Conducting connecting part and contact pilotage installation position,Contact pilotage is located in contact pilotage installation position,Chip is provided with base,Chip is provided with conductive part,Conducting connecting part is provided with the first electrical connection section and the second electrical connection section,First electrical connection section moves along closure,First electrical connection section is located on contact pilotage installation position based on closure,Conductive part and the second electrical connection section are located at outside contact pilotage installation position based on closure,First electrical connection section drives the second electrical connection section the second electrical connection section is connected or is separated with conductive part,First electrical connection section is connected on chip installation position with contact pilotage,Using above structure,The wasting problem of chip need to be changed by effectively solving replacing powder box,And it can solve the problem that other have the compatibility of the powder box of chip.
Description
Technical field
The present invention relates to laser printing field, more particularly, to a kind of chip assembly, laser printer, powder box component and its
Control method.
Background technology
Chip is mounted on the powder box that most laser printer uses, chip is mainly used for powder box authentication
Information, it is easy to printer to identify powder box.Some chips can exchange data with printer, store use information, the residual carbon of powder box
Powder amount etc., to facilitate user monitoring print quality.Some chips can remind user more to renew powder in time when powder box capacity exhaust
Box.
General chip is arranged on powder box, and referring to Fig. 1, chip 10 and the stylus contact on printer, contact pilotage are also corresponding
Ground is arranged in the contact pilotage installation position 20 on powder box, so as to which powder box, chip 10 and contact pilotage are collinearly set in the same direction.When
, it is necessary to change chip simultaneously during the powder box more renewed, and sometimes powder box capacity exhaust when, chip can still be continuing with one or
In several cycles, the wasting of resources can be caused by now changing chip.
Chip is arranged on powder box, and based on cost-effective consideration, general black poly-bag or general is typically used when powder box dispatches from the factory
Logical antistatic poly-bag is packed, and the packaging bag of above aluminium platinum special when being dispatched from the factory to the protectiveness of chip not as chip is prevented quiet
Electric poly-bag is good, causes chip to be damaged because electrostatic protection is improper.During chip is arranged on powder box, including
Chip installation, fixed, powder box printing detection and transport process may cause to damage to chip, and if directly pacifying chip
Dress is on a printer, then terminal user cannot use other powder boxes, and influence printer uses compatibility.
The content of the invention
The first object of the present invention is to provide a kind of chip assembly for having favorable compatibility and effectively protecting chip.
The second object of the present invention is to provide a kind of chip assembly for having favorable compatibility and effectively protecting chip
Powder box component and its control method.
The third object of the present invention is to provide a kind of powder box component for having favorable compatibility and effectively protecting chip
Laser printer.
To realize the first above-mentioned purpose, chip assembly provided by the invention includes base, the first core is provided with base
Piece, the first chip are provided with conductive part；
Conducting connecting part, conducting connecting part are provided with the first electrical connection section and the second electrical connection section, the connection of the first electrical connection section edge
Move in direction；
Contact pilotage installation position, the first electrical connection section are located on contact pilotage installation position based on closure, conductive part and the second electrical connection section
It is located at based on closure outside contact pilotage installation position；
First electrical connection section drives the second electrical connection section the second electrical connection section is connected or is separated with conductive part.
As can be seen here, the contact pilotage of printer is arranged in contact pilotage installation position, and chip assembly is arranged on the cover of printer,
First electrical connection section of contact pilotage and conducting connecting part connect, the first electrical connection section along the first electrical connection section be connected with contact pilotage when company
Direction is connect to be located on contact pilotage installation position, and the second electrical connection section of conducting connecting part is located at outside closure so that connection second
First chip of electrical connection section also is located at outside closure, and when the powder box of chipless is connected with chip assembly, powder box and
One electrical connection section connects, and the second electrical connection section connects the first chip, so as to which conducting connecting part realizes chipless powder box and chipset
The connection of connection between the first chip and the first chip and printer in part so that on powder box in the state of chipless
The connection with chip is realized, realizes that chipless powder box turns on the information of printer, overcome also needs to change core when changing powder box
The wasting problem of piece；When changing chipless powder box, due to being provided with chip on powder box on the market, there is chip powder box
When being connected with the first electrical connection section, the chip extruding contact pilotage on powder box so that the first electrical connection section is also extruded, and drives the second electricity
Connecting portion separates with the first chip in chip assembly, so as to which conducting connecting part realizes the company having between chip powder box and contact pilotage
Connect, realize that newly changes has chip powder box to be turned on the information of printer, so as to realize the compatibility of chip assembly.
Further scheme is that the first electrical connection section and the second electrical connection section move along closure；
Conductive part backwards to closure is set.
Further scheme is, the first electrical connection section and the second electrical connection section not at grade, the second electrical connection section
On the position of outermost end.
It can be seen that the first electrical connection section and the second electrical connection section not at grade can also complete printer and the first core
Information flow between piece and between powder box and the first chip, and when chip assembly compatibility has the powder box of chip, do not exist
The first electrical connection section on same plane and the second electrical connection section cause the second electrical connection section and current-carrying part from effect it is more preferable；
And the second electrical connection section is located on the position of the outermost end of conducting connecting part so that is connected the first chip with the second electrical connection section
Also on the position of outermost end.
Further scheme is that the first electrical connection section and the second electrical connection section move along closure；
Conductive part is set towards contact pilotage installation position.
As can be seen here, when conductive part is set backwards to closure or conductive part is set towards contact pilotage installation position, first is electrically connected
Socket part moves along closure simultaneously with the second electrical connection section, can be achieved with the first electrical connection section and drives the second electrical connection section to connect
Connect or separate conductive part.
Further scheme is that the first electrical connection section moves towards closure；
Second electrical connection section moves backwards to closure；
Conductive part towards closure is set.
Further scheme is that pin joint is provided with base, and pin joint is located at the first electrical connection section and the second electrical connection
Between portion, the first electrical connection section and the second electrical connection section rotate around pin joint.
It can be seen that when the direction of motion of the first electrical connection section and the second electrical connection section is opposite, conductive part need to be towards closure
Set, realize that the first electrical connection section drives the connection of the second electrical connection section or separation conductive part.
Further scheme is that chip assembly also includes fixed seat, and fixed seat surrounds contact pilotage installation position.
To realize the second object of the present invention, powder box component provided by the invention, including：
Powder box, vacant chip installation position is provided with powder box；
Chip assembly, chip assembly are above-mentioned chip assembly；
First electrical connection section is arranged on chip installation position.
As can be seen here, chipless on powder box, the contact pilotage on cover connect the first electrical connection section, when closing cover, centreless
Piece powder box is connected with the first electrical connection section, and the second electrical connection section is connected with the conductive part of the first chip, and conducting connecting part completes nothing
Connection and first chip of the chip powder box with the first chip turn on the information of printer, in chipless powder box and the first chip
Both connections in the case of being separately provided, overcoming also needs replacing chip wasting problem when changing powder box, and the
One chip can be packed alone with chipless powder box, can improve the use quality of the first chip.
To realize the second object of the present invention, powder box component provided by the invention, including：
Powder box, chip installation position is provided with powder box, the second chip is provided with chip installation position；
Chip assembly, chip assembly are above-mentioned chip assembly；
Second electrical connection section of the second chip drives conducting connecting part separates with the first chip；
First electrical connection section is connected between the second chip and contact pilotage installation position.
As can be seen here, when changing powder box, when closing cover, the second chip on powder box extrudes the first electrical connection section and contact pilotage
Contact pilotage in installation position so that the first electrical connection section drive the second electrical connection section and current-carrying part from so that conducting connecting part is complete
Information runner between the second chip and printer on powder box, realize the compatibility of chip assembly.
The present invention also provides a kind of control method of powder box component, and powder box component is above-mentioned powder box component, control method
Including：
First electrical connection section of the second chip drives conducting connecting part moves backwards to closure, makes the second electrical connection section and first
Chip separates；
First electrical connection section is connected between the second chip and contact pilotage installation position.
To realize the third object of the present invention, the present invention provides a kind of laser printer, and laser printer includes body, machine
Lid and powder box component, powder box component are above-mentioned powder box component；
Powder box is provided with body, the side of cover towards powder box is provided with chip assembly and contact pilotage, and contact pilotage is arranged on contact pilotage peace
Fill position.
Brief description of the drawings
Fig. 1 is the background technology chips scheme of installation of the present invention.
Fig. 2 is the chip assembly scheme of installation in laser printer embodiment of the present invention.
Fig. 3 is the structure chart of the first embodiment in chip assembly embodiment one of the present invention.
Fig. 4 is the structure chart of the second embodiment in chip assembly embodiment one of the present invention.
Fig. 5 is another structure chart of the second embodiment in chip assembly embodiment one of the present invention.
Fig. 6 is the structure chart of the first embodiment in chip assembly embodiment two of the present invention.
Fig. 7 is the structure chart of the second embodiment in chip assembly embodiment two of the present invention.
Fig. 8 is the second chip and chip assembly connection diagram in laser printer embodiment two of the present invention.
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment
In the chip assembly application printer of the present invention, chip assembly is arranged on cover, the contact pilotage peace in chip assembly
The contact pilotage of printer is installed, the first electrical connection section of conducting connecting part is arranged on contact pilotage and is connected with the first electrical connection section in dress position
When closure on, and the first chip in chip assembly is arranged on that closure is outer to be connected with the second electrical connection section, works as powder
When chipless powder box in case assembly is connected with the first electrical connection section, conducting connecting part completes chipless powder box and the first chip
Between and the information flow between the first chip and printer, be disposed on situation in the first chip and chipless powder box
Under can also carry out powder box information identification, avoid change powder box when also need change the wasting problem of chip, change simultaneously
During into the powder box for having chip, the second chip on powder box extruding contact pilotage and the first electrical connection section so that the second electrical connection section with
First chip separates, and the second chip and the first electrical connection section connect the information flow for completing have between chip powder box and printer,
Effectively solves the compatibility of chip assembly.
The laser printer of the present invention includes body and cover 1, and contact pilotage 2 is provided with cover 1.
Laser printer embodiment one：
Laser printer also includes powder box component, and powder box component includes powder box and chip assembly 3, powder box, powder are provided with body
Vacant chip installation position is provided with box.
Referring to Fig. 2, the one side of cover 1 towards powder box is provided with chip assembly 3, and chip assembly 3 includes base 31, conduction even
Fitting 34, fixed seat 35, fixed seat 35 are surrounded by contact pilotage installation position 36, and contact pilotage 2 is arranged in contact pilotage installation position 36.
The first chip 32 is provided with base 31, the first chip 32 is provided with conductive part 33.
Conducting connecting part 34 is provided with the first electrical connection section 341 and the second electrical connection section 342, the edge of the first electrical connection section 341
Closure is moved, and closure is closure when contact pilotage 2 is connected with the first electrical connection section 341.
First electrical connection section 341 is located on contact pilotage installation position 36 based on closure, the electrical connection section of conductive part 33 and second
342 are located at outside contact pilotage installation position 36 based on closure.
First electrical connection section 341 drives the second electrical connection section 342 the second electrical connection section 342 is connected or is divided with conductive part 33
From.
First electrical connection section 341 is arranged on chip installation position and is connected with contact pilotage 2.
For the concrete structure of chip assembly 3, the present invention provides two kinds of embodiments, such as following：
Chip assembly embodiment one：
The first electrical connection section 341 and the second electrical connection section 342 of chip assembly 3 move along closure.
First embodiment is：Referring to Fig. 3, conductive part 33 is set backwards to closure.
Second embodiment is：Referring to Fig. 4, conductive part 33 is set towards the ground of contact pilotage installation position 36, referring to Fig. 5, conductive part
33 are alternatively the tentacle stretched out towards contact pilotage installation position 36.
Wherein the first electrical connection section 341 and the second electrical connection section 342 can not at grade, the second electrical connection section 342
On the position of outermost end.The first electrical connection section 341 and the second electrical connection section 342 not at grade can also be completed to beat
Information flow between print machine and the first chip 32 and between powder box and the first chip 32, and have in the compatibility of chip assembly 3
During the powder box of chip, the first electrical connection section 341 and the second electrical connection section 342 not at grade cause the second electrical connection section
342 effects separated with conductive part 33 are more preferable；And the second electrical connection section 342 is located at the position of the outermost end of conducting connecting part 34
On so that the first chip 32 is connected with the second electrical connection section 342 also on the position of outermost end, so as to further realize the first core
The electrical connection section 341 of piece 32 and first is not at grade.
When the first electrical connection section 341 and the second electrical connection section 342 move along closure simultaneously, conductive part 33 is backwards
Closure is set or conductive part 33 is set towards contact pilotage installation position 36, and the electricity of the first electrical connection section 341 driving second can be achieved
Connecting portion 342 connects or separated conductive part 33.
Chip assembly embodiment two：
First electrical connection section 341 moves towards closure, and the second electrical connection section 342 moves backwards to closure, conductive part 33
Towards closure set.
During to realize that the first electrical connection section 341 drives the motion of the second electrical connection section 342, the first electrical connection section 341 and second
For the direction of motion of electrical connection section 342 on the contrary, pin joint 37 can be provided with base 31, pin joint 37 is located at the first electrical connection section
341 and second between electrical connection section 342, and the first electrical connection section 341 and the second electrical connection section 342 rotate around pin joint 37.
First embodiment：Referring to Fig. 6, the second electrical connection section 342 contacts connection with the face of conductive part 33.
Second embodiment：Referring to Fig. 7, the second electrical connection section 342 contacts connection at 33 points with conductive part.
When the direction of motion of first electrical connection section 341 and the second electrical connection section 342 is opposite, conductive part 33 need to be towards connection side
To setting, realize that the first electrical connection section 341 drives the second electrical connection section 342 to connect or separate conductive part 33.
Chipless powder box is arranged in body, and chip assembly 3 is arranged on cover 1, when closure cover 1, chipless powder box
It is connected with the outside of the first electrical connection section 341 in chip assembly 3, touching on the inner side connection cover 1 of the first electrical connection section 341
Pin 2, the second electrical connection section 342 connect the first chip 32 outside closure, so as to which conducting connecting part 34 completes chipless powder
Information flow between box and the first chip 32 and between the first chip 32 and printer, when chipless powder box use finishes
Afterwards, chipless powder box can be directly changed, without changing chip, avoids causing to waste.Chipless on powder box, the contact pilotage 2 on cover 1
The first electrical connection section 341 is connected, when closing cover 1, chipless powder box is connected with the first electrical connection section 341, the second electrical connection
Portion 342 is connected with the conductive part 33 of the first chip 32, and conducting connecting part 34 completes the connection of chipless powder box and the first chip 32
And first chip 32 turned on the information of printer, realize chipless powder box and in the case that the first chip 32 is separately provided it is real
Both existing connections so that chip, which can be stayed in printer, when changing chipless powder box is continuing with, when avoiding changing powder box
Also need to change the wasting situation of chip, and the first chip 32 and chipless powder box being provided separately, it can be wrapped alone
Dress, the use quality of the first chip 32 can be improved.
Laser printer embodiment two：
Chip installation position is provided with powder box in powder box component, the second chip 5, chip assembly 3 are provided with chip installation position
Still it is arranged on cover 1, the contact pilotage 2 on cover 1 is arranged in the contact pilotage installation position 36 in chip assembly 3.Referring to Fig. 8, when
Cover 1 is closed, due to being provided with the second chip 5 on the chip installation position on new powder box so that when closing cover 1, powder box
On the second chip 5 extruding the electrical connection section 341 of contact pilotage 2 and first so that the first electrical connection section 341 drives while being extruded
Second electrical connection section 342 separates with the first chip 32 in chip assembly 3, and the first electrical connection section 341 is connected to the second chip 5
Between contact pilotage 2, now conducting connecting part 34 is not connected with the first chip 32 in chip assembly 3, and with second on powder box
Chip 5 connects so that the conducting connecting part 34 separated with the first chip 32 completes the information flow between the second chip 5 and printer
It is logical, realize chip assembly 3 can compatible different type and structure powder box, effectively improve the compatibility of chip assembly 3.
The contact pilotage 2 of printer is arranged in contact pilotage installation position 36, and chip assembly 3 is arranged on the cover 1 of printer, contact pilotage
2 are connected with the first electrical connection section 341 of conducting connecting part 34, and the first electrical connection section 341 is along the first electrical connection section 341 and contact pilotage 2
Closure during connection is located on contact pilotage installation position 36, and the second electrical connection section 342 of conducting connecting part 34 is located at connection side
Outwards so that the first chip 32 of the second electrical connection section 342 of connection also is located at outside closure, and when the powder box and core of chipless
When piece component 3 connects, powder box is connected with the first electrical connection section 341, and the second electrical connection section 342 connects the first chip 32, so as to lead
Electrical connector 34 realizes connection between the first chip 32 in chipless powder box and chip assembly 3 and the first chip 32 with beating
The connection of print machine so that realized on powder box in the state of chipless with the connection of the first chip 32, realize chipless powder box with
The information conducting of printer, overcome also needs to change chip wasting problem when changing powder box；When replacing chipless powder box
When, due to being provided with the second chip 5 on powder box on the market, when thering is the chip powder box to be connected with the first electrical connection section 341, powder box
On the second chip 5 extruding contact pilotage 2 so that the first electrical connection section 341 is also extruded, and drives the second electrical connection section 342 and chip
The first chip 32 in component 3 separates, so as to which the conducting connecting part 34 separated with the first chip 32 realizes there is chip powder box with touching
Connection between pin 2, that realizes replacing has chip powder box to be turned on the information of printer, so as to realize the compatibility of chip assembly 3
Property.
For the powder box component in corresponding laser printer embodiment two, the present invention also provides a kind of controlling party of powder box component
Method, powder box component are the powder box component in above-mentioned laser printer embodiment two, and control method includes：
First electrical connection section of the second chip drives conducting connecting part moves backwards to closure, makes the second electrical connection section and first
Chip separates；
First electrical connection section is connected between the second chip and contact pilotage installation position.
Finally it is emphasized that the invention is not restricted to above-mentioned embodiment, the preferable implementation of invention the foregoing is only
Example, be not intended to limit the invention, it is all the present invention spirit with principle within made any modification, equivalent substitution and
Improve etc., it should be included in the scope of the protection.
Claims (10)
1. chip assembly, it is characterised in that including：
Base, the first chip is provided with the base, first chip is provided with conductive part；
Conducting connecting part, the conducting connecting part are provided with the first electrical connection section and the second electrical connection section, first electrical connection
Moved along closure in portion；
Contact pilotage installation position, first electrical connection section are located on the contact pilotage installation position based on the closure, the conduction
Portion and second electrical connection section are located at outside the contact pilotage installation position based on the closure；
First electrical connection section drive second electrical connection section make second electrical connection section be connected with the conductive part or
Separation.
2. chip assembly according to claim 1, it is characterised in that：
First electrical connection section and the second electrical connection section move along the closure；
The conductive part is set backwards to the closure.
3. chip assembly according to claim 2, it is characterised in that：
Not at grade, second electrical connection section is located at outermost for first electrical connection section and second electrical connection section
On the position at end.
4. chip assembly according to claim 1, it is characterised in that：
First electrical connection section and the second electrical connection section move along closure；
The conductive part is set towards the contact pilotage installation position.
5. chip assembly according to claim 1, it is characterised in that：
First electrical connection section moves towards closure；
Second electrical connection section moves backwards to the closure；
The conductive part is set towards the closure.
6. chip assembly according to claim 5, it is characterised in that：
Be provided with pin joint on the base, the pin joint be located at first electrical connection section and second electrical connection section it
Between, first electrical connection section and second electrical connection section rotate around the pin joint.
7. powder box component, it is characterised in that including：
Powder box, vacant chip installation position is provided with the powder box；
Chip assembly, the chip assembly described in the chip assembly claim any one of 1-6；
First electrical connection section is arranged on the chip installation position.
8. powder box component, it is characterised in that including：
Powder box, chip installation position is provided with the powder box, the second chip is provided with the chip installation position；
Chip assembly, the chip assembly described in the chip assembly claim any one of 1-6；
The second electrical connection section of conducting connecting part separates with first chip described in second chip drives；
First electrical connection section is connected between second chip and the contact pilotage installation position.
9. the control method of powder box component, it is characterised in that the powder box component be claim 8 described in powder box component, institute
Stating control method includes：
First electrical connection section of the second chip drives conducting connecting part moves backwards to closure, makes the second electrical connection section and first
Chip separates；
First electrical connection section is connected between second chip and contact pilotage installation position.
10. laser printer, including body and cover, it is characterised in that：
The laser printer also includes powder box component, and the powder box component is the powder box component described in claim 7 or 8；
Powder box is provided with the body, the side of the cover towards the powder box is provided with chip assembly and contact pilotage, described
Contact pilotage is arranged in contact pilotage installation position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710896459.8A CN107546211B (en) | 2017-09-28 | 2017-09-28 | Chip assembly, laser printer, powder box assembly and control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710896459.8A CN107546211B (en) | 2017-09-28 | 2017-09-28 | Chip assembly, laser printer, powder box assembly and control method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107546211A true CN107546211A (en) | 2018-01-05 |
| CN107546211B CN107546211B (en) | 2024-07-09 |
Family
ID=60964862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710896459.8A Active CN107546211B (en) | 2017-09-28 | 2017-09-28 | Chip assembly, laser printer, powder box assembly and control method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107546211B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1317207A (en) * | 1970-08-19 | 1973-05-16 | Crosfield Business Mach | Printers |
| CN101034706A (en) * | 2006-03-10 | 2007-09-12 | 精工爱普生株式会社 | Semiconductor device, ink cartridge, and electronic device |
| US20090085992A1 (en) * | 2007-09-27 | 2009-04-02 | Ward Jefferson P | Cartridge Holder |
| WO2010130219A1 (en) * | 2009-05-13 | 2010-11-18 | 珠海纳思达企业管理有限公司 | Adapter and ink cartridge provided on inkjet printer |
| CN201856451U (en) * | 2010-11-10 | 2011-06-08 | 珠海天威技术开发有限公司 | Ink cartridge |
| CN203317890U (en) * | 2013-05-21 | 2013-12-04 | 珠海纳思达企业管理有限公司 | Print cartridge used for ink jet printer |
| CN104417072A (en) * | 2013-08-30 | 2015-03-18 | 珠海纳思达企业管理有限公司 | Memory group, consumable chip, consumable chip group and imaging box |
| WO2017032259A1 (en) * | 2015-08-24 | 2017-03-02 | 珠海纳思达企业管理有限公司 | Ink cartridge and installation method therefor |
| CN207199615U (en) * | 2017-09-28 | 2018-04-06 | 珠海天威飞马打印耗材有限公司 | Chip assembly, laser printer and powder box component |
| US20190047292A1 (en) * | 2016-03-02 | 2019-02-14 | Hangzhou Chipjet Technology Co.,Ltd | Reman Ink Cartridge, Reman Chip and Printer System Communication Method |
-
2017
- 2017-09-28 CN CN201710896459.8A patent/CN107546211B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1317207A (en) * | 1970-08-19 | 1973-05-16 | Crosfield Business Mach | Printers |
| CN101034706A (en) * | 2006-03-10 | 2007-09-12 | 精工爱普生株式会社 | Semiconductor device, ink cartridge, and electronic device |
| US20090085992A1 (en) * | 2007-09-27 | 2009-04-02 | Ward Jefferson P | Cartridge Holder |
| WO2010130219A1 (en) * | 2009-05-13 | 2010-11-18 | 珠海纳思达企业管理有限公司 | Adapter and ink cartridge provided on inkjet printer |
| CN201856451U (en) * | 2010-11-10 | 2011-06-08 | 珠海天威技术开发有限公司 | Ink cartridge |
| CN203317890U (en) * | 2013-05-21 | 2013-12-04 | 珠海纳思达企业管理有限公司 | Print cartridge used for ink jet printer |
| CN104417072A (en) * | 2013-08-30 | 2015-03-18 | 珠海纳思达企业管理有限公司 | Memory group, consumable chip, consumable chip group and imaging box |
| WO2017032259A1 (en) * | 2015-08-24 | 2017-03-02 | 珠海纳思达企业管理有限公司 | Ink cartridge and installation method therefor |
| US20190047292A1 (en) * | 2016-03-02 | 2019-02-14 | Hangzhou Chipjet Technology Co.,Ltd | Reman Ink Cartridge, Reman Chip and Printer System Communication Method |
| CN207199615U (en) * | 2017-09-28 | 2018-04-06 | 珠海天威飞马打印耗材有限公司 | Chip assembly, laser printer and powder box component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107546211B (en) | 2024-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2019126458A (en) | CONTAINER SEALER PERFORMED WITH INFORMATION AND / OR PROTECTION AGAINST COUNTERFEIT | |
| CN207199615U (en) | Chip assembly, laser printer and powder box component | |
| CN104539083B (en) | The waterproof sealing structure and plastic packaging motor of plastic packaging stator and bearing (ball) cover | |
| CN205335591U (en) | Can 360 degrees antiwind power cord connectors of rotation | |
| CN202524224U (en) | Junction box and motor provided therewith | |
| CN107546211A (en) | Chip assembly, laser printer, powder box component and its control method | |
| CN105539929B (en) | A kind of drug dispensing tray | |
| CN208001033U (en) | A kind of high-voltage connecting wire box being filled with heated connector | |
| CN206907927U (en) | Electric power connector | |
| CN108768128A (en) | A kind of epoxy-plastic packaging structure of linear motor Hall element and preparation method thereof | |
| CN102314118A (en) | Driving assembly of photosensitive drum | |
| CN104347271A (en) | Film capacitor | |
| CN207426842U (en) | A kind of winding for electric rotating machine | |
| CN206364056U (en) | LED encapsulation structure | |
| CN206380224U (en) | Binding post proof mechanism of water | |
| CN202217128U (en) | Photosensitive drum connection gear | |
| CN206585114U (en) | Floating type socket | |
| CN208226737U (en) | Motor proof mechanism of water and motor | |
| CN205752684U (en) | A kind of automobile HV Terminal connects sealing structure | |
| CN206283370U (en) | A kind of plastics gland that need to be grounded motor | |
| CN205559506U (en) | Novel electrically conductive packing ring | |
| CN209183885U (en) | A kind of arrangements of electric connection | |
| CN107681394A (en) | A kind of accessible stack bus bar | |
| CN205724172U (en) | Adapter is lifted after one is horizontal | |
| CN207366946U (en) | A kind of selenium drum end cover for being suitable for whole types |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |