CN107541178A - A kind of preparation method of high performance resin base Ceramic adhesive - Google Patents
A kind of preparation method of high performance resin base Ceramic adhesive Download PDFInfo
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- CN107541178A CN107541178A CN201710809488.6A CN201710809488A CN107541178A CN 107541178 A CN107541178 A CN 107541178A CN 201710809488 A CN201710809488 A CN 201710809488A CN 107541178 A CN107541178 A CN 107541178A
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Abstract
A kind of preparation method of high performance resin base Ceramic adhesive, step are as follows：（1）By methyl phenyl silicone resin, epoxy modified acrylic resin and phenyl POSS in mass ratio 100:（0.01‑90）:（0.001‑60）It is well mixed, prepare resin matrix；（2）By alumina powder, Zirconium powder, bentonite, kaolin, mica powder and land plaster in mass ratio 100：（1‑95）：（1‑85）：（1‑80）：（1‑70）：（1‑60）Homogenizer is added, it is standby that functional filler is stirred in homogenizer；（3）By resin matrix, functional filler, diluent, curing agent, curing accelerator in mass ratio 00:（1‑90）:（0.001‑90）：（0.001‑80）：（0.001‑60）Mixed, well dispersed high-performance ceramic adhesive is made after being sufficiently stirred through homogenizer.Synthesis technique of the present invention is easy, and product can be able to extensive use in the industry such as building, ceramics, chemical industry.
Description
Technical field
The present invention relates to a kind of preparation method of high performance resin base Ceramic adhesive, function of dominant polymer matrix composites
Technical field.
Background technology
Ceramic material has the advantages of heat resistance, wear resistance, high excellent corrosion resistance and intensity, is navigated in automobile, aviation
My god, the field such as electronics have a wide range of applications, especially in the application environment more than 1000 DEG C, than alloy advantageously.But
The fragility of ceramic material and low ductility limit its application in large scale and complicated shape structural member, thus rivet, weldering
The interconnection technique such as connect and be bonded to be particularly important in the application of ceramic material.High-temperature Resistance Adhesives are in ceramic reparation, pottery
Many aspects such as be bonded, ceramics the production processes of the parts such as porcelain and ceramics, metal, alloy play indispensable role.
Particularly in recent years, developed with the broad scale research of ceramic material, ceramic interconnection technique also increasingly causes people's
Concern.High-temperature resistance adhesive is broadly divided into inorganic and organic two class.Inorganic adhesive can typically bear more than 1000 DEG C of height
Temperature, but adhesive property is poor, more crisp and solidification temperature is high, needs to use some special joint forms sometimes, gives practical operation application
Many limitations are brought, and although organic adhesion agent has excellent adhesive property, but its heat resisting temperature is usually no more than 500 DEG C,
It is unfavorable for applying at relatively high temperatures.Thus, a kind of ceramics high-temperature resistance adhesive of excellent performance is researched and developed into closely
Study hotspot over year.
Because ceramic surface has the characteristics that polarity, fragility and rigidity, it is necessary to select polarity is strong, intensity is high, it is rigid big and
On-deformable adhesive bonded ceramics, such as inorganic adhesive and epoxy resin adhesive, phenolic resin adhesive, acrylic acid
The Organic adhesives such as lipid adhesive.
The content of the invention
The object of the present invention is to Nian Jie existing for reparation, ceramics for ceramics and the part such as ceramics, metal, alloy ask
Topic, the present invention disclose a kind of preparation method of high performance resin base Ceramic adhesive.
Realize the technical scheme is that, a kind of preparation method of high performance resin base Ceramic adhesive, step is as follows：
（1）By methyl phenyl silicone resin, epoxy modified acrylic resin and phenyl POSS in mass ratio 100:（0.01-90）:
（0.001-60）It is well mixed, prepare resin matrix；
（2）By alumina powder, Zirconium powder, bentonite, kaolin, mica powder and land plaster in mass ratio 100：（1-
95）：（1-85）：（1-80）：（1-70）：（1-60）Homogenizer is added, functional is stirred in homogenizer
Filler is standby；
（3）A certain amount of resin matrix, functional filler, diluent, curing agent, curing accelerator are mixed, through at a high speed
Well dispersed high-performance ceramic adhesive is made after being sufficiently stirred in mixer.
The diluent is styrene, and curing agent is methyl ethyl ketone peroxide, and curing accelerator is Ludox.
The step（1）Preparation method be, by appropriate methyl phenyl silicone resin, phenyl POSS, epoxy-modified acrylic acid
Resin adds three-necked flask, is warming up to 70 DEG C, is stirred 0.5-3h, is down to room temperature discharging, you can obtain resin matrix.
The step（3）In, resin matrix, functional filler, diluent, the mass ratio of curing agent and curing accelerator are
100:（1-90）:（0.001-90）：（0.001-80）：（0.001-60）.
The beneficial effects of the present invention are, the product prepared by the inventive method to have excellent mechanical performance, weatherability, resistance to
High temperatures and corrosion resistant performance；Synthesis technique of the present invention is easy, and product can be able to extensive use in the industry such as building, ceramics, chemical industry.
Embodiment
Embodiment 1
100.0 grams of methyl phenyl silicone resin, 35.0 grams of epoxy modified acrylic resins are added in 500ML there-necked flasks and are placed in
On electric heating agitator, 70 DEG C are warming up to, adds 1.0 grams of phenyl POSS while stirring, resin is obtained after stirring 1h at such a temperature
Matrix, it is stand-by to be cooled to room temperature.
It is accurate weigh 10.0 grams of alumina powders, 2.0 Zirconium powders, 2.0 grams of bentonites, 1.0 grams of kaolin, 1.5 grams
Mica powder, 1.0 grams of land plasters, functional filler is obtained after well mixed, is poured into above-mentioned resin matrix, then add
20.0 grams of diluent styrene, 1.3 grams of curing agent methyl ethyl ketone peroxides, 1.0 grams of curing accelerator Ludox, start stirring, stir
Stop discharging after mixing mixing 1.0h, you can target product is made.
Embodiment 2
100.0 grams of methyl phenyl silicone resin, 50.0 grams of epoxy modified acrylic resins are added in 500ML there-necked flasks and are placed in
On electric heating agitator, 70 DEG C are warming up to, adds 2.0 grams of phenyl POSS while stirring, resin is obtained after stirring 1h at such a temperature
Matrix, it is stand-by to be cooled to room temperature.
It is accurate weigh 10.0 grams of alumina powders, 1.0 Zirconium powders, 1.0 grams of bentonites, 3.0 grams of kaolin, 1.0 grams
Mica powder, 1.5 grams of land plasters, functional filler is obtained after well mixed, is poured into above-mentioned resin matrix, then add
25.0 grams of diluent styrene, 1.5 grams of curing agent methyl ethyl ketone peroxides, 2.0 grams of curing accelerator Ludox, start stirring, stir
Stop discharging after mixing mixing 1.5h, you can target product is made.
Embodiment 3
100.0 grams of methyl phenyl silicone resin, 60.0 grams of epoxy modified acrylic resins are added in 500ML there-necked flasks and are placed in
On electric heating agitator, 70 DEG C are warming up to, adds 3.0 grams of phenyl POSS while stirring, resin is obtained after stirring 1h at such a temperature
Matrix, it is stand-by to be cooled to room temperature.
It is accurate weigh 10.0 grams of alumina powders, 2.0 Zirconium powders, 1.0 grams of bentonites, 1.0 grams of kaolin, 1.0 grams
Mica powder, 2.0 grams of land plasters, functional filler is obtained after well mixed, is poured into above-mentioned resin matrix, then add
30.0 grams of diluent styrene, 1.5 grams of curing agent methyl ethyl ketone peroxides, 2.5 grams of curing accelerator Ludox, start stirring, stir
Stop discharging after mixing mixing 1.5h, you can target product is made.
Embodiment 4
100.0 grams of methyl phenyl silicone resin, 70.0 grams of epoxy modified acrylic resins are added in 500ML there-necked flasks and are placed in
On electric heating agitator, 70 DEG C are warming up to, adds 4.0 grams of phenyl POSS while stirring, resin is obtained after stirring 1h at such a temperature
Matrix, it is stand-by to be cooled to room temperature.
It is accurate weigh 10.0 grams of alumina powders, 5.0 Zirconium powders, 2.0 grams of bentonites, 1.0 grams of kaolin, 2.0 grams
Mica powder, 1.0 grams of land plasters, functional filler is obtained after well mixed, is poured into above-mentioned resin matrix, then add
35.0 grams of diluent styrene, 2.0 grams of curing agent methyl ethyl ketone peroxides, 3.0 grams of curing accelerator Ludox, start stirring, stir
Stop discharging after mixing mixing 2.0h, you can target product is made.
Embodiment 5
100.0 grams of methyl phenyl silicone resin, 80.0 grams of epoxy modified acrylic resins are added in 500ML there-necked flasks and are placed in
On electric heating agitator, 70 DEG C are warming up to, adds 5.0 grams of phenyl POSS while stirring, resin is obtained after stirring 1h at such a temperature
Matrix, it is stand-by to be cooled to room temperature.
It is accurate weigh 10.0 grams of alumina powders, 3.0 Zirconium powders, 2.0 grams of bentonites, 1.0 grams of kaolin, 2.0 grams
Mica powder, 2.0 grams of land plasters, functional filler is obtained after well mixed, is poured into above-mentioned resin matrix, then add
40.0 grams of diluent styrene, 2.5 grams of curing agent methyl ethyl ketone peroxides, 2.0 grams of curing accelerator Ludox, start stirring, stir
Stop discharging after mixing mixing 2.5h, you can target product is made.
Product of the embodiment of the present invention has excellent mechanical performance, weatherability, heat-resisting quantity and corrosion resistant performance；Its shore A is hard
Degree>80；Tensile strength>90Mpa；(- 20-60 DEG C) constructions at low temperature, there is hardness is high, polishability is good, curing rate is fast etc.
Feature.
Claims (4)
1. a kind of preparation method of high performance resin base Ceramic adhesive, it is characterised in that be the step of methods described：
（1）By methyl phenyl silicone resin, epoxy modified acrylic resin and phenyl POSS in mass ratio 100:（0.01-90）:
（0.001-60）It is well mixed, prepare resin matrix；
（2）By alumina powder, Zirconium powder, bentonite, kaolin, mica powder and land plaster in mass ratio 100：（1-
95）：（1-85）：（1-80）：（1-70）：（1-60）Homogenizer is added, functional is stirred in homogenizer
Filler is standby；
（3）A certain amount of resin matrix, functional filler, diluent, curing agent, curing accelerator are mixed, through at a high speed
Well dispersed high-performance ceramic adhesive is made after being sufficiently stirred in mixer.
2. the preparation method of a kind of high performance resin base Ceramic adhesive according to claim 1, it is characterised in that described
Diluent is styrene, and curing agent is methyl ethyl ketone peroxide, and curing accelerator is Ludox.
3. the preparation method of a kind of high performance resin base Ceramic adhesive according to claim 1, it is characterised in that described
Step（1）Preparation method be, by appropriate methyl phenyl silicone resin, phenyl POSS, epoxy modified acrylic resin add three mouthfuls
Flask, 70 DEG C are warming up to, is stirred 0.5-3h, be down to room temperature discharging, you can obtain resin matrix.
4. the preparation method of a kind of high performance resin base Ceramic adhesive according to claim 1, it is characterised in that described
Step（3）In, resin matrix, functional filler, diluent, the mass ratio of curing agent and curing accelerator are 100:（1-90）:
（0.001-90）：（0.001-80）：（0.001-60）.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710809488.6A CN107541178B (en) | 2017-09-11 | 2017-09-11 | Preparation method of high-performance resin-based ceramic adhesive |
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| CN201710809488.6A CN107541178B (en) | 2017-09-11 | 2017-09-11 | Preparation method of high-performance resin-based ceramic adhesive |
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| CN107541178A true CN107541178A (en) | 2018-01-05 |
| CN107541178B CN107541178B (en) | 2020-09-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020063395A (en) * | 2018-10-18 | 2020-04-23 | 東亞合成株式会社 | Adhesive composition and its use |
Citations (6)
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|---|---|---|---|---|
| KR20110016538A (en) * | 2009-08-12 | 2011-02-18 | 주식회사 이그잭스 | An anisotropic conductive adhesive comprising polyhedral oligomeric silsesquixane (poss) |
| CN104974711A (en) * | 2015-07-10 | 2015-10-14 | 武汉双键开姆密封材料有限公司 | High-temperature resistance organic silicon adhesive |
| CN105001814A (en) * | 2015-07-30 | 2015-10-28 | 安徽硕明安全科技有限公司 | Bright silver reflective fabric complex adhesive and preparation method thereof |
| CN105086922A (en) * | 2015-08-07 | 2015-11-25 | 东莞市新星有机硅科技有限公司 | Novel organic silicon heat conduction adhesive and preparation method thereof |
| CN106634654A (en) * | 2016-12-16 | 2017-05-10 | 东莞市翔龙能源科技有限公司 | Adhesive film with radiant heat dissipation function for LED (Light Emitting Diode) and preparation method of adhesive film |
| CN106634800A (en) * | 2016-12-15 | 2017-05-10 | 中山市得高行知识产权中心（有限合伙） | Sealant for mounting intelligent household air conditioner pipeline |
-
2017
- 2017-09-11 CN CN201710809488.6A patent/CN107541178B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110016538A (en) * | 2009-08-12 | 2011-02-18 | 주식회사 이그잭스 | An anisotropic conductive adhesive comprising polyhedral oligomeric silsesquixane (poss) |
| CN104974711A (en) * | 2015-07-10 | 2015-10-14 | 武汉双键开姆密封材料有限公司 | High-temperature resistance organic silicon adhesive |
| CN105001814A (en) * | 2015-07-30 | 2015-10-28 | 安徽硕明安全科技有限公司 | Bright silver reflective fabric complex adhesive and preparation method thereof |
| CN105086922A (en) * | 2015-08-07 | 2015-11-25 | 东莞市新星有机硅科技有限公司 | Novel organic silicon heat conduction adhesive and preparation method thereof |
| CN106634800A (en) * | 2016-12-15 | 2017-05-10 | 中山市得高行知识产权中心（有限合伙） | Sealant for mounting intelligent household air conditioner pipeline |
| CN106634654A (en) * | 2016-12-16 | 2017-05-10 | 东莞市翔龙能源科技有限公司 | Adhesive film with radiant heat dissipation function for LED (Light Emitting Diode) and preparation method of adhesive film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020063395A (en) * | 2018-10-18 | 2020-04-23 | 東亞合成株式会社 | Adhesive composition and its use |
| JP7210998B2 (en) | 2018-10-18 | 2023-01-24 | 東亞合成株式会社 | Adhesive composition and its use |
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| CN107541178B (en) | 2020-09-04 |
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