CN107531348B - Impedance matching circuit, high-frequency welding device, and continuous filling device - Google Patents
Impedance matching circuit, high-frequency welding device, and continuous filling device Download PDFInfo
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- CN107531348B CN107531348B CN201680025301.7A CN201680025301A CN107531348B CN 107531348 B CN107531348 B CN 107531348B CN 201680025301 A CN201680025301 A CN 201680025301A CN 107531348 B CN107531348 B CN 107531348B
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- A—HUMAN NECESSITIES
- A22—BUTCHERING; MEAT TREATMENT; PROCESSING POULTRY OR FISH
- A22C—PROCESSING MEAT, POULTRY, OR FISH
- A22C11/00—Sausage making ; Apparatus for handling or conveying sausage products during manufacture
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- A—HUMAN NECESSITIES
- A22—BUTCHERING; MEAT TREATMENT; PROCESSING POULTRY OR FISH
- A22C—PROCESSING MEAT, POULTRY, OR FISH
- A22C13/00—Sausage casings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/26—Devices specially adapted for producing transverse or longitudinal seams in webs or tubes
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Wood Science & Technology (AREA)
- Zoology (AREA)
- Food Science & Technology (AREA)
- Package Closures (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention provides a technique for stabilizing welding strength in high-frequency welding. An impedance matching circuit (E) is connected between a seal electrode (8a) for high-frequency welding of a tubular body (F2) and a high-frequency output unit (A) for supplying high-frequency power between the seal electrode and a ground electrode (8b), and has a pass characteristic in which the signal level of the high-frequency power is at a peak value at a frequency fc corresponding to the design frequency of the high-frequency output unit and the semi-amplitude value is 0.15 times or more the frequency fc.
Description
Technical Field
The present invention relates to an impedance matching circuit connected between a high-frequency electrode for high-frequency welding of an object to be welded and a high-frequency output unit for supplying high-frequency power to the high-frequency electrode, a high-frequency welding apparatus provided with the impedance matching circuit, and a continuous filling apparatus provided with the high-frequency welding apparatus.
Background
A package filled with contents such as a sausage (sausages) and a cheese stick (cheese sticks) is produced by filling a cylindrical body formed in a cylindrical shape with the contents and tying both ends of the cylindrical body. The tubular body is formed by winding a strip-shaped film into a tubular shape, and overlapping and welding both side end portions of the film. A technique related to high-frequency welding, which is one of the methods for welding the films, has been developed.
For example, patent document 1 discloses a high-frequency welding apparatus: high-frequency power is supplied from a high-frequency output unit to a pair of high-frequency electrodes via an impedance matching circuit, and the overlapping portion of the films sandwiched between the high-frequency electrodes is subjected to high-frequency dielectric heating to weld the films. The high-frequency welding device is provided with a detection circuit, and the detection circuit is provided with: a coupling section which is capacitively coupled to the high-voltage side electrodes of the pair of high-frequency electrodes; and a rectifying circuit rectifying a signal obtained from the coupling section. Then, the detection circuit detects a high-frequency voltage supplied to the high-frequency electrode of the high-frequency welding apparatus. Patent document 1 describes: in the high-frequency welding apparatus, a high-quality film package can be obtained by performing impedance matching adjustment while monitoring the high-frequency voltage detected by the detection circuit.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 6-238754 (published 8/30 1994) "
Disclosure of Invention
Problems to be solved by the invention
In the case of a high-frequency welding apparatus that performs high-frequency welding while feeding a material to be welded, the feeding speed of the material to be welded is slow immediately after the start of the high-frequency welding apparatus, and gradually increases from this state to reach a predetermined speed. However, in the conventional technique, there is a problem that it is difficult to stabilize the welding strength because the welding strength varies greatly when the feeding speed of the object to be welded is slow or when the feeding speed is fast.
The present invention has been made in view of the above problems, and an object thereof is to provide a technique for stabilizing welding strength in high-frequency welding as compared with the conventional technique.
Technical scheme
In order to solve the above-described problems, an impedance matching circuit according to an aspect of the present invention is an impedance matching circuit connected between a high-frequency electrode for high-frequency welding of an object to be welded and a high-frequency output unit for supplying high-frequency power to the high-frequency electrode, wherein a signal level of the high-frequency power has a peak value at a frequency fc corresponding to a design frequency of the high-frequency output unit, and the impedance matching circuit has a pass characteristic in which a semiamplitude value is 0.15 times or more of the frequency fc.
Further, according to an aspect of the present invention, there is provided an impedance matching circuit connected between a high-frequency electrode for high-frequency welding of an object to be welded and a high-frequency output unit for supplying high-frequency power to the high-frequency electrode, the impedance matching circuit including a coil wound in a tubular shape.
Effects of the invention
According to an aspect of the present invention, it is possible to provide a technique for stabilizing welding strength in high-frequency welding compared to the conventional technique.
Drawings
Fig. 1 is a block diagram showing a high-frequency welding apparatus according to embodiment 1 of the present invention.
Fig. 2 is a configuration diagram of a cylindrical body manufacturing apparatus including a seal electrode and a ground electrode according to embodiment 1 of the present invention.
Fig. 3 is an external view of an inductance element and an impedance matching circuit unit according to embodiment 1 of the present invention.
FIG. 4 is a graph showing the measurement results of example 1.
Fig. 5 is a photograph of a cross section and a photograph of a surface of a welded portion of the tubular body obtained in example 2.
FIG. 6 is a graph showing the measurement results of example 3.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail.
(constitution of high-frequency welding apparatus 100)
Fig. 1 is a block diagram showing a high-frequency welding apparatus 100 according to embodiment 1 of the present invention. As shown in fig. 1, a high-frequency welding apparatus (continuous filling apparatus) 100 includes: a high-frequency output unit A, an impedance matching circuit unit E, and a cylindrical body manufacturing apparatus 1. In the high-frequency welding apparatus 100, the high-frequency power output from the high-frequency output unit a is supplied to the tubular body manufacturing apparatus 1 via the impedance matching circuit unit E. Then, in the tubular body manufacturing apparatus 1, the object to be welded is welded at high frequency, and the welded tubular body is continuously filled with the contents. Each part constituting the high-frequency welding apparatus 100 will be described in detail.
According to the high-frequency welding apparatus 100 having the following configuration, it is possible to realize an impedance matching circuit having a pass characteristic in which the signal level of high-frequency power is a peak value and the semiamplitude is 0.15 times or more the frequency fc at the frequency fc corresponding to the design frequency of the high-frequency output unit a to be described later.
The upper limit value of the semiamplitude value of the pass characteristic does not limit the invention described in the present specification, but as described below, the pass characteristic in which the semiamplitude value is 0.15 times or more and 0.26 times or less the frequency fc is realized. Furthermore, it is also clear that: as long as those skilled in the art who refer to the present specification can realize the passing characteristic in which the upper limit value of the semilunar value is about 0.30 times the frequency fc.
(constitution of cylindrical body manufacturing apparatus 1)
Fig. 2 is a configuration diagram of a cylindrical body manufacturing apparatus 1 including a seal electrode 8a and a ground electrode 8b according to embodiment 1 of the present invention. The tubular body manufacturing apparatus 1 is an apparatus for manufacturing a tubular body to be filled with contents such as sausages or cheese sticks. The tubular body manufacturing apparatus 1 will be described with reference to fig. 2.
The vertical direction on the paper surface in fig. 2 corresponds to the vertical direction in practice, and the tubular body is fed so as to flow from top to bottom in the drawing. That is, the upper side in the drawing corresponds to the upstream side in the feeding direction of the tubular body in the filling operation, and the lower side in the drawing corresponds to the downstream side in the feeding direction.
In the tubular body manufacturing apparatus 1, a strip-shaped film (object to be welded) F is supplied by a film blank roll (original roll) 2, a guide roller 3A, and a guide roller 3B. The film F is drawn from the film blank roll 2 wound in a roll shape, guided by the guide rollers 3A and 3B, and guided to the forming plate 6. The film F is preferably made of a vinylidene chloride copolymer resin.
The forming plate 6 has a cylindrical shape with an upper opening and a lower opening, and has a circumferential gap extending in the longitudinal direction at one circumferential position. The upper edge of the forming plate 6 is curved and inclined, and the film F is guided so as to follow the inner surface of the forming plate 6, thereby forming a continuous tubular film F1 having overlapping portions where the side edges overlap each other.
A guide tube 7 is hung down on the downstream side of the forming plate 6, and the continuous tubular film F1 is fed to the guide tube 7 while being held in a tubular shape. The continuous tubular film F1 guided by the guide tube 7 is welded at the overlapping portion by the seal electrode 8a and the ground electrode 8b as high-frequency electrodes for high-frequency welding.
A pump 4 and a nozzle 5 for filling the content C into the formed continuous cylindrical film F1 are provided on the upstream side of the forming plate 6. One tip of the nozzle 5 is introduced into the guide tube 7, and the other tip is connected to the pump 4. The tip of the nozzle 5 introduced into the guide cylinder 7 is open on the downstream side of the seal electrode 8a and the ground electrode 8 b. The pump 4 is not limited to the position above the forming plate 6, and may be disposed at another position where the content C can be appropriately replenished, and may be connected to the nozzle 5 through a pipe.
A feed roller 9a and a roller 9b as feed means are provided downstream of the guide cylinder 7 and the nozzle 5. The cylindrical body F2 filled with the content C in the continuous cylindrical film F1 is continuously nipped and conveyed downward in a state where the content C is pressed by the pair of cylindrical feed rollers 9a and 9 b.
The tubular body F2, which is being pinched and conveyed, is flattened by the pressing device, and thereby a content-free portion in which the content C is not present is formed. The tubular body F2 is sealed or ligated to the content-free portion, and cut (dicing) into a package by cutting with a cutter or the like.
(high frequency Power supply route)
A high-frequency power supply path as a path for supplying high-frequency power between the seal electrode 8a and the ground electrode 8b of the tubular body manufacturing apparatus 1 will be described. The high-frequency power supply path is provided with a high-frequency output unit a and an impedance matching circuit unit E.
The high-frequency output unit a includes: a crystal oscillation circuit a1 as a high-frequency oscillation circuit and a power amplification circuit a2 as a subsequent stage thereof. The crystal oscillation circuit a1 is a circuit that transmits in synchronization with the natural frequency of the crystal oscillator 11. As the natural frequency of the crystal resonator 11, a frequency in an industrial scientific medical band (ISM band), such as 13.56MHz, 27.12MHz, or 40.68MHz, is generally selected as the design frequency. As a vibration element capable of generating vibration of a natural frequency, for example, a SAW element using a surface acoustic wave or the like can be used in addition to the crystal resonator 11.
The power amplifier circuit a2 amplifies the high-frequency output signal from the crystal oscillator circuit a1 to the power necessary for high-frequency welding. The high-frequency output signal amplified by the power amplifier circuit a2 is supplied to the impedance matching circuit E. As the power amplifier circuit a2, a push-pull amplifier circuit using a known FET is preferably used.
The impedance matching circuit section E performs impedance matching between the high-frequency output section a and a load (more specifically, a load circuit including the seal electrode 8a and the ground electrode 8b and the single-core power feed line 16) based on a case where an overlapping portion of the continuous tubular film F1 is sandwiched between the pair of seal electrode 8a and the ground electrode 8b for welding. The impedance matching circuit section E is an L-type impedance matching circuit having an inductance element (coil) L and a variable capacitor Vc. The distance between the impedance matching circuit section E and the seal electrode 8a and the ground electrode 8b is set to the shortest distance allowed in the device arrangement. Therefore, the installation position of the impedance matching circuit section E is limited, and therefore, the impedance matching circuit section E must be of a size that can be installed at that position. The impedance matching circuit section E and the seal electrode 8a are connected by a single feed line 16. In the impedance matching circuit section E, impedance matching adjustment is performed by adjusting the capacitance of the variable capacitor Vc.
When the output impedance of the power amplifier circuit a2 is Zo and the impedance obtained by adding to the electrode side is Zi, the impedance matching circuit E performs setting adjustment as shown in the following equation using the relationship between the Q value and the frequency f of the impedance matching circuit E.
[ equation 1]
Next, the inductance element L of the impedance matching circuit section will be described in detail with reference to fig. 3. Fig. 3 is an external view of an inductance element L and an impedance matching circuit section E according to embodiment 1 of the present invention, and fig. 3(a) is an external view of the inductance element L. As shown in fig. 3(a), the winding of the inductance element L is tubular (the inside is a cavity). The wire is made of copper having an inner diameter of 2mm and an outer diameter of 4 mm. Further, the inner diameter of the inductance element L was 28 mm. In this way, the impedance matching circuit section E of the present invention includes a coil wound in a tubular shape. Therefore, the impedance matching circuit section E can realize an impedance matching circuit having a wider pass characteristic than that of a conventional impedance matching circuit in which the signal level of the high-frequency power is a peak and the frequency band at a predetermined signal level (for example, 12 times the signal level of the peak) is set to a frequency (hereinafter, also referred to as fc) corresponding to the design frequency of the high-frequency output section a.
Fig. 3 (b) is an external view of the impedance matching circuit section E. As shown in fig. 3 (b), the impedance matching circuit section E has a rectangular parallelepiped shape with a size of 80mm in a direction perpendicular to the paper surface (hereinafter, referred to as x-axis direction), 135mm in a left-right direction of the paper surface (hereinafter, referred to as y-axis direction), and 120mm in a vertical direction of the paper surface (hereinafter, referred to as z-axis direction). The impedance matching circuit E shown in fig. 3 (b) includes an inductance element L and a variable capacitor Vc inside thereof. The impedance matching circuit section E shown in fig. 3 (b) has an input terminal Ein connected to the high-frequency output section a side and an output terminal Eout connected to the sealing electrode 8a side. In addition, since the inductance element L of the present invention has a tubular winding as shown in fig. 3(a), it can be easily fixed inside the impedance matching circuit section E by using an insulator (plastic) as a core.
On the other hand, in the case where an inductance element having the same characteristics as the inductance element L is realized using two windings having no cavity inside, for example, the two windings must be fixed so as not to come into contact. Further, since the impedance matching circuit section E may also vibrate due to the vibration transmission of the tubular body manufacturing apparatus 1, it is necessary to fix the two windings to such an extent that the impedance matching circuit section E does not contact even when vibrating. However, as described above, since the size of the impedance matching circuit section E is limited, the inductance element cannot be fixed using a complicated configuration. On the other hand, since the winding of the inductance element L of the present invention is tubular, it can be provided inside the impedance matching circuit section E whose size is limited. (initial adjustment of high-frequency welding apparatus 100)
The initial adjustment of the high-frequency welding apparatus 100 will be described.
(1) The overlapped portion of the continuous cylindrical film F1 is sandwiched between the seal electrode 8a and the ground electrode 8b, and the continuous cylindrical film F1 is continuously fed downward by driving the rollers 9a and 9 b.
(2) The variable capacitor Vc of the impedance matching circuit E matches the output impedance Zo of the high-frequency output unit a and the impedance Zi of the electrode side, and the tubular body manufacturing apparatus 1 can weld the superposed portion of the continuous tubular film F1 most efficiently.
(during operation)
As described above, the frequency band at a predetermined signal level (for example, 1/2 of the peak signal level) of the impedance matching circuit section E is wider than the pass characteristic of the conventional impedance matching circuit. Therefore, even if the speed of the continuous tubular film F1 changes and the impedance on the side of the seal electrode 8a fluctuates, the attenuation of the signal level of the impedance matching circuit E is small, and therefore, control during operation is not necessary. In other words, the impedance matching circuit E stabilizes the welding strength regardless of the speed of the continuous tubular film F1.
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims, and embodiments obtained by appropriately combining the disclosed embodiments are also included in the technical scope of the present invention.
The present invention will be described in further detail below with reference to examples, but the present invention is not limited to these examples as long as the invention does not depart from the gist thereof.
(example 1)
An embodiment of the present invention will be described below with reference to fig. 4.
In an automatic filling and packaging apparatus (KAP) manufactured by wuyu corporation, the passage characteristics of an impedance matching circuit unit using an inductance element "14T (4-2 tube)" and an impedance matching circuit unit using a conventional inductance element "TA 26" were measured. Specifically, "14T (4-2 tube)" is a copper coil formed by winding a tubular winding wire having an inner diameter of 2mm and an outer diameter of 4mm by 14 turns. "TA 26" is a copper coil formed by winding 15 turns of a 2.6mm diameter wire. Then, a vinylidene chloride resin film (krehalon, 40 μm in thickness, 80mm in width, manufactured by wu feather corporation) was sandwiched between the electrodes, and the passage characteristics were measured using a network Analyzer (handhelld RF Combination Analyzer, field dfox N9914A) of the Keysight Technologies. The measurement results are shown in fig. 4.
Fig. 4 is a graph showing the measurement results of the present example, fig. 4(a) is a graph showing the measurement results, and fig. 4(b) is a table showing the peak signal and the semiamplitude value.
As shown in fig. 4, the peak signal is higher in the case of "TA 26" than in the case of "14T (4-2 tube)". However, for the band (semi-amplitude) where the signal level is attenuated by 6dB, "14T (4-2 tubes)" is wider than "TA 26". More specifically, in the case of "TA 26", the semiamplitude value of 3.9MHz is less than 0.15 times (about 0.14 times) the frequency of 27.35MHz at which the signal is at a peak. On the other hand, in the case of using "14T (4-2 tube)", the semiamplitude value of 5.8MHz is 0.15 times or more (about 0.21 times) the peak value of 27.25 MHz. Therefore, the impedance matching circuit unit using "14T (4-2 tube)" can suppress attenuation of the signal level even when the impedance on the side of the seal electrode varies, and therefore can stabilize the welding strength as compared with the conventional one.
(example 2)
Another embodiment of the present invention will be described below with reference to fig. 5.
In an automatic filling and packaging apparatus (KAP) manufactured by wuyu corporation, an impedance matching circuit section using an inductance element "14T (4-2 tube)" and an impedance matching circuit section using a conventional inductance element "TA 26" were used and welded to each other. Specifically, "14T (4-2 tube)" is a copper coil formed by winding a tubular winding wire having an inner diameter of 2mm and an outer diameter of 4mm by 14 turns. "TA 26" is a copper coil formed by winding 15 turns of a 2.6mm diameter wire. Then, a tubular body was produced using a vinylidene chloride resin film (krehalon, thickness 40 μm, width 80mm, manufactured by wu feather corporation) while moving the object to be welded at speeds of 15 m/min and 36 m/min, respectively, and photographs of the surface and cross-section of the welded portion were taken. The photograph taken is shown in fig. 5.
Fig. 5 is a photograph of a cross section and a photograph of a surface of a welded portion of the tubular body produced in this example. Fig. 5 (a) to (d) are photographs of a cross section of the welded portion on the upper side and a surface of the welded portion on the lower side, respectively. Fig. 5 (a) to (d) are photographs of a cylindrical body produced under the following conditions, respectively.
(a) A cylindrical body was produced by using "14T (4-2 tube)", while moving the object to be welded at a speed of 15 m/min
(b) A cylindrical body was produced by using "14T (4-2 tube)", while moving the object to be welded at a speed of 36 m/min
(c) A tubular body was produced by using "TA 26" while moving an object to be welded at a speed of 15 m/min
(d) A tubular body was produced by using "TA 26" while moving an object to be welded at a speed of 36 m/min
As shown in fig. 5, when "14T (4-2 pipe)" is used, the surface and cross section of the welded portion are substantially indistinguishable regardless of whether the velocity of the object to be welded is 15 m/min or 36 m/min. On the other hand, when "TA 26" is used, the surface and cross section of the welded portion are the same as those in the case of "14T (4-2 pipe)" when the velocity of the object to be welded is 36 m/min. However, when the speed of the object to be welded is 15 m/min, the thickness of the cross section of the welded portion becomes thin, and the width of the weld at the outer surface also becomes wide. In this way, in the impedance matching circuit section using the "14T (4-2 tube)", even when the impedance on the side of the seal electrode fluctuates due to a change in the speed of the package as the object to be welded, the cross section and the surface of the welded portion are not changed, and therefore, the welding strength can be stabilized as compared with the conventional one.
(example 3)
Still another embodiment of the present invention will be described below with reference to fig. 6.
In an automatic filling and packaging apparatus (KAP) manufactured by wuyu corporation, the passing characteristics of the impedance matching circuit sections using the inductance elements "13T", "14T", and "15T" were measured. Specifically, "13T" is a copper coil formed by winding 13 turns of a tubular winding wire having an inner diameter of 2mm and an outer diameter of 4 mm. Further, "14T" is a copper coil formed by winding a tubular winding wire having an inner diameter of 2mm and an outer diameter of 4mm by 14 turns. Further, "15T" is a copper coil formed by winding a tubular winding wire having an inner diameter of 2mm and an outer diameter of 4mm by 15 turns. Then, a vinylidene chloride resin film (krehalon, thickness 40 μm, width 80mm, manufactured by wuyu corporation) was used to prepare a cylindrical body while moving the object to be welded at speeds of 20 m/min, 30 m/min and 40 m/min, respectively. The passing characteristics were measured in the same manner as in example 1. Then, the T-peel strength of the welded portion of the resulting welded article was measured under the respective conditions of a test piece width of 10mm and a drawing speed of 200 mm/min in accordance with JIS Z0238: 1995. The measurement results are shown in fig. 6.
Fig. 6 is a graph showing the measurement results of the present example, fig. 6(a) is a graph showing the measurement results, and fig. 6(b) is a table showing T-peel strength, peak signal, and semiamplitude.
For each of "13T", "14T", and "15T", the frequency fc at which the signal level is a peak value is a value below.
13T：27.65MHz
14T：27.25MHz
15T：26.95MHz
Therefore, in any of "13T", "14T", and "15T", the semiamplitude value is 0.15 times or more and 0.30 times or less (more specifically, 0.26 times or less) the frequency fc of the peak value. In particular, the semiamplitude values of "13T" and "14T" are 0.21 times or more the frequency fc at which the signal level becomes the peak.
In any of the cases of "13T", "14T" and "15T", the signal level is-20 dB or more at 27.12MHz, which is the frequency of the ISM band, and particularly, the signal level is-18 dB or more for "14T".
In addition, the T-peel strength of the welded portion was 1.80kg/10mm or more regardless of the film speed, regardless of the types of "13T", "14T" and "15T". In view of the fact that it is generally required that the T-peel strength of the welded portion of the package filled with the contents such as sausage or cheese sticks is 1.50kg/10mm or more, it can be said that the T-peel strength is sufficient in any case. In particular, in the case of "14T", the T-peel strength at the welded portion was 2.00kg/10mm or more regardless of the film speed, and therefore, a more stable weld strength was produced.
In this way, in the above-described embodiment, the semiamplitude value of the impedance matching circuit having the coil wound in a tubular shape with an inner diameter of 2mm and an outer diameter of 4mm is 0.15 times or more and 0.30 times or less (more specifically, 0.26 times or less) the frequency fc at which the signal level is the peak. In particular, when the coil is wound with 13 or 14 turns, the semiamplitude fc is 0.21 times or more. When the coil wire is wound by 14 turns, the signal level is-18 dB or more at 27.12MHz, which is the frequency of the ISM band. Then, the T-peel strength of the impedance matching circuit was 1.80kg/10mm or more even when the film speed was 20 m/min, 30 m/min, and 40 m/min. Particularly, when the coil is wound with 14 turns of the coil, the T-peel strength is 2.00kg/10mm or more. That is, the impedance matching circuit produces a welding strength more stable than that of the conventional one.
[ additional items ]
In order to solve the above-described problems, an impedance matching circuit according to an aspect of the present invention is an impedance matching circuit connected between a high-frequency electrode for high-frequency welding of an object to be welded and a high-frequency output unit for supplying high-frequency power to the high-frequency electrode, wherein a signal level of the high-frequency power has a peak value at a frequency fc corresponding to a design frequency of the high-frequency output unit, and the impedance matching circuit has a pass characteristic in which a semiamplitude value is 0.15 times or more of the frequency fc.
According to the above configuration, since the amplitude of the impedance matching circuit is 0.15 times or more the frequency fc at which the signal level becomes the peak, attenuation of the signal level with respect to the variation of the impedance of the high-frequency electrode is reduced. Therefore, the welding strength of high-frequency welding can be stabilized compared to conventional welding.
Further, the impedance matching circuit according to one aspect of the present invention may have a pass characteristic in which the semiamplitude is 0.21 times or more the frequency fc.
According to the above configuration, the impedance matching circuit can further suppress attenuation of the signal level with respect to the impedance variation of the high-frequency electrode, and thus the welding strength can be further stabilized.
In the impedance matching circuit according to one aspect of the present invention, the signal level of the high-frequency power may be-18 dB or higher at the design frequency of the high-frequency output unit.
According to the above configuration, the impedance matching circuit can reduce the high-frequency power supplied from the high-frequency output unit because the attenuation of the signal level is small at the design frequency of the high-frequency output unit.
Further, the impedance matching circuit according to one aspect of the present invention may include a coil wound in a tubular shape.
According to the above configuration, the impedance matching circuit can be easily realized.
An impedance matching circuit according to an aspect of the present invention is an impedance matching circuit connected between a high-frequency electrode for high-frequency welding of an object to be welded and a high-frequency output unit for supplying high-frequency power to the high-frequency electrode, and includes a coil wound in a tubular shape.
According to the above configuration, the impedance matching circuit can reduce attenuation of the signal level with respect to the impedance variation of the high-frequency electrode, and thus can stabilize the welding strength.
Further, the impedance matching circuit described above can easily fix the coil as compared with a case where a coil having the same characteristics is realized by two windings, and therefore, a vibration-resistant impedance matching circuit can be realized. Further, since the impedance matching circuit does not require a complicated structure for fixing the coil, it is possible to suppress an increase in the size of the impedance matching circuit.
In the impedance matching circuit according to one aspect of the present invention, the coil may be wound with: the inner diameter is 2mm, and the outer diameter is 4 mm.
According to the above configuration, the impedance matching circuit can stabilize the welding strength.
In the impedance matching circuit according to one aspect of the present invention, the number of turns of the coil may be 13 to 15 turns.
According to the above configuration, the impedance matching circuit can stabilize the welding strength.
A continuous filling device according to an aspect of the present invention includes any one of the impedance matching circuits described above.
According to the above configuration, a continuous filling device that achieves the same effect as the impedance matching circuit can be realized.
A high-frequency welding apparatus according to an aspect of the present invention includes any of the impedance matching circuits described above.
According to the above configuration, a high-frequency welding apparatus can be realized that achieves the same effects as those of the impedance matching circuit.
The continuous filling device according to one aspect of the present invention includes the high-frequency welding device, which performs high-frequency welding by winding a belt-shaped film into a cylindrical shape and overlapping both side end portions of the film.
According to the above configuration, a continuous filling device for continuously filling contents into a tubular body formed by overlapping and welding both side end portions of a band-shaped film by the high-frequency welding device can be realized, and a continuous filling device capable of obtaining the same effect as the impedance matching circuit can be realized.
In the continuous filling device according to one aspect of the present invention, the film may be a vinylidene chloride-based resin film.
According to the above configuration, a tubular body for filling sausages, cheeses and the like can be provided. Industrial applicability of the invention
The present invention is applicable to an impedance matching circuit connected between a high-frequency electrode for high-frequency welding of an object to be welded and a high-frequency output unit for supplying high-frequency power to the high-frequency electrode.
Description of the symbols
1 apparatus for producing cylindrical body
8a sealed electrode
8b ground electrode
100 high frequency welding device
A high frequency output unit
E impedance matching circuit section
L-inductance element
Vc variable capacitor
Claims (9)
1. An impedance matching circuit connected between a high-frequency electrode for high-frequency welding of an object to be welded and a high-frequency output unit for supplying high-frequency power to the high-frequency electrode,
when fc is a frequency at which a signal level of high-frequency power becomes a peak value according to a design frequency of the high-frequency output unit, the impedance matching circuit has a pass characteristic in which a semiamplitude is 0.15 times or more of the frequency fc, and a winding wire forming a coil as an inductance element is tubular.
2. The impedance matching circuit according to claim 1, wherein the pass characteristic has a semi-amplitude of 0.21 times or more the frequency fc.
3. The impedance matching circuit according to claim 1 or 2, wherein a signal level of high-frequency power is-18 dB or more at a design frequency of the high-frequency output section.
4. The impedance matching circuit of claim 3, wherein the inner diameter of the winding of the coil is 2mm and the outer diameter is 4 mm.
5. The impedance matching circuit of claim 3, wherein the coil has 13 to 15 turns.
6. The impedance matching circuit of claim 4, wherein the coil has 13 to 15 turns.
7. A high-frequency welding apparatus comprising the impedance matching circuit according to any one of claims 1 to 6.
8. A continuous filling apparatus comprising the high-frequency welding apparatus according to claim 7,
the high-frequency welding device winds a strip-shaped film into a cylinder shape, and overlaps two side end parts of the film to perform high-frequency welding.
9. The continuous filling apparatus according to claim 8, wherein the film is a vinylidene chloride-based resin film.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015088347 | 2015-04-23 | ||
| JP2015-088347 | 2015-04-23 | ||
| PCT/JP2016/061282 WO2016170985A1 (en) | 2015-04-23 | 2016-04-06 | Impedance matching circuit, high-frequency welding device, and continuous filling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107531348A CN107531348A (en) | 2018-01-02 |
| CN107531348B true CN107531348B (en) | 2019-12-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680025301.7A Active CN107531348B (en) | 2015-04-23 | 2016-04-06 | Impedance matching circuit, high-frequency welding device, and continuous filling device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6534735B2 (en) |
| CN (1) | CN107531348B (en) |
| WO (1) | WO2016170985A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1093998A (en) * | 1993-02-17 | 1994-10-26 | 吴羽化学工业株式会社 | The film packaging of high frequency welding device and this device of use |
| JPH1119945A (en) * | 1997-07-07 | 1999-01-26 | Bridgestone Corp | Method for cleaning vulcanization mold |
| CN1817622A (en) * | 2006-03-13 | 2006-08-16 | 方先其 | Method for high-frequency heat sealing valve-opening bag with polythene and special shielding plate |
| CN101754509A (en) * | 2008-12-17 | 2010-06-23 | 陈建 | Method and circuit for controlling operation of high-frequency welding machine by using program |
| JP2014101534A (en) * | 2012-11-16 | 2014-06-05 | Nippon Steel & Sumitomo Metal | Post-heat-treatment device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5232785B2 (en) * | 1973-10-30 | 1977-08-24 | ||
| JPH0720039B2 (en) * | 1991-03-28 | 1995-03-06 | 株式会社芝浦製作所 | High frequency impedance matching circuit |
| JP2560190B2 (en) * | 1993-02-17 | 1996-12-04 | 呉羽化学工業株式会社 | High frequency welding device and film packaging device using the same |
-
2016
- 2016-04-06 WO PCT/JP2016/061282 patent/WO2016170985A1/en active Application Filing
- 2016-04-06 JP JP2017514058A patent/JP6534735B2/en active Active
- 2016-04-06 CN CN201680025301.7A patent/CN107531348B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1093998A (en) * | 1993-02-17 | 1994-10-26 | 吴羽化学工业株式会社 | The film packaging of high frequency welding device and this device of use |
| JPH1119945A (en) * | 1997-07-07 | 1999-01-26 | Bridgestone Corp | Method for cleaning vulcanization mold |
| CN1817622A (en) * | 2006-03-13 | 2006-08-16 | 方先其 | Method for high-frequency heat sealing valve-opening bag with polythene and special shielding plate |
| CN101754509A (en) * | 2008-12-17 | 2010-06-23 | 陈建 | Method and circuit for controlling operation of high-frequency welding machine by using program |
| JP2014101534A (en) * | 2012-11-16 | 2014-06-05 | Nippon Steel & Sumitomo Metal | Post-heat-treatment device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016170985A1 (en) | 2016-10-27 |
| CN107531348A (en) | 2018-01-02 |
| JP6534735B2 (en) | 2019-06-26 |
| JPWO2016170985A1 (en) | 2018-02-08 |
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