CN107529283A - The production technology of FPC - Google Patents
The production technology of FPC Download PDFInfo
- Publication number
- CN107529283A CN107529283A CN201610451397.5A CN201610451397A CN107529283A CN 107529283 A CN107529283 A CN 107529283A CN 201610451397 A CN201610451397 A CN 201610451397A CN 107529283 A CN107529283 A CN 107529283A
- Authority
- CN
- China
- Prior art keywords
- fpc
- cover layer
- production technology
- copper foil
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000005516 engineering process Methods 0.000 title claims abstract description 18
- 238000011161 development Methods 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000011889 copper foil Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 238000012545 processing Methods 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 12
- 238000007788 roughening Methods 0.000 claims description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 3
- 239000003814 drug Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 230000004044 response Effects 0.000 abstract description 3
- 238000006467 substitution reaction Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The invention discloses a kind of production technology of FPC, including：The copper foil base material of web-like is cut into fixed dimension；Copper foil base material after cutting is drilled, the processing of copper facing and circuit；The photosensitive development that is sticked on the substrate and presses cover layer；The photosensitive development cover layer is exposed and development treatment；Then the base material after exposed and developed is surface-treated.The present invention substitutes diaphragm and ink of the prior art using photosensitive development cover layer, while can save the flow of response, lifts yield, and the cost of photosensitive development cover layer is low with respect to ink, and thickness can control, and improve Product Precision.
Description
Technical field
The present invention relates to FPC, more particularly to a kind of production technology of FPC.
Background technology
FPC (Flexible Printed Circuit, abbreviation FPC), it is made of the insulating substrate of flexibility
Printed circuit, there is many rigid printed circuit boards the advantages of not possessing.Such as it can with free bend,
Winding, fold, can require any arrangement according to space layout, and arbitrarily moved and flexible in three dimensions,
So as to reach the integration that components and parts assembling connects with wire.Electronics FPC body can be substantially reduced using FPC
Product, is applicable the needs that electronics FPC develops to high density, miniaturization, highly reliable direction.Therefore, FPC exists
The fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or FPC
On be widely used.
In FPC making, existing process step is：Cut → drill → copper facing → circuit → diaphragm pressing
The production procedures such as → wire mark → surface treatment.The production procedure of above-mentioned technique is longer, and caused interior damage is larger,
Yield lmproved is difficult；And diaphragm precision is difficult to reach requirement, and film thickness and ink print thickness is protected to exist
It can not be reduced under prior art so that product gross thickness can not be reduced.
The content of the invention
The present invention provides a kind of production technology of FPC, to solve above-mentioned skill present in prior art
Art problem.
In order to solve the above technical problems, the present invention provides a kind of production technology of FPC, including：Volume
The copper foil base material of shape is cut into fixed dimension；Copper foil base material after cutting is drilled, copper facing and line
Road is handled；The photosensitive development that is sticked on the substrate and presses cover layer；The photosensitive development cover layer is entered
Row exposure and development treatment；Then the base material after exposed and developed is surface-treated.
Preferably, before the photosensitive development cover layer that is sticked, in addition to super roughening treatment step.
Preferably, the super roughening step includes：The copper foil of substrate surface is carried out using super roughening liquid medicine
Processing, makes copper foil surface coarse.
Preferably, the photosensitive development cover layer is pressed together on by the copper foil surface using vacuum pressing-combining machine.
Preferably, processing is exposed to the photosensitive development cover layer using ultraviolet exposure equipment.
Preferably, using Na2CO2Solution carries out development treatment to photosensitive development cover layer.
Preferably, also including baking procedure, the baking procedure performs after development treatment.
Preferably, base material is drilled by the way of ultraviolet light is radium-shine.
Compared with prior art, the present invention has advantages below：
1st, the present invention is using PIC (photosensitive development cover layer) substitution diaphragms and ink, while can save
The flow of response, yield is lifted, reduces total production procedure and production time；
2nd, the present invention uses PIC, opening can be made into precision and be promoted to 0.05mm from 0.1mm, protected
Layer Aperture precision lifting, lifting utilize area, realize high density high accuracy piece；
3rd, the present invention uses PIC, can accurately reduce product thickness, meets slimming product demand, realizes
The making of compact circuit board；
4th, the present invention is reduced waste discharge, is advantageous to environmental protection using PIC substitution CVL and ink flow path.
Brief description of the drawings
Fig. 1 is the production technological process of the FPC of the present invention.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, it is right below in conjunction with the accompanying drawings
The embodiment of the present invention is described in detail.It should be noted that accompanying drawing of the present invention is using simplification
Form and non-accurately ratio is used, only to mesh that is convenient, lucidly aiding in illustrating the embodiment of the present invention
's.
As shown in figure 1, the present invention provides a kind of production technology of FPC, including：
First, the copper foil base material of web-like is cut into fixed dimension；
Then, the copper foil base material after cutting is drilled, the processing of copper facing and circuit etching；Specifically,
Drill process is to carry out laser drilling to the opening position that must be turned on substrate using ultraviolet, and control and be drilled
Through-hole aperture and substrate thickness ratio, then, left when removing and drill using plasmon body plasma-based
Residue, and non-copper foil region forms one layer of carbon film in the through-hole wall being drilled, and makes the area being originally not turned on
Domain conducting electric current, it is easy to follow-up through hole copper facing to play a role, copper facing finally is carried out to through hole again, it is real
Conducting in the two-sided and hole of existing substrate between each layer.
Then, super roughening treatment is carried out to copper foil surface, step includes：Using super roughening liquid medicine to base material table
The copper foil in face is handled, and makes copper foil surface coarse, it is ensured that follow-up photosensitive development cover layer and copper foil surface
It is brought into close contact.
Then, the photosensitive development that is sticked on the substrate and presses cover layer；Specifically, using vacuum pressing-combining
The photosensitive development cover layer is pressed together on the copper foil surface by machine, it is ensured that does not have bubble generation after pressing.
Then, the photosensitive development cover layer is exposed and development treatment；Specifically, using ultraviolet
Exposure sources are exposed processing to the photosensitive development cover layer, consolidate the photosensitive development covering membrane fussion
Change, then using Na2CO3Unpolymerized photosensitive development is covered membrane removal by solution, opening is formed, in order to rear
It is continuous that opening is surface-treated.
Then, baking procedure is performed, i.e., baking-curing is carried out to the base material after development using roasting plant, made
Photosensitive development covering film reaction is complete.
Then, the base material of opening is surface-treated；
Then, electronic component welding/attachment is carried out, obtains solid plate FPC.
To sum up, the production technology of FPC of the invention, including：The copper foil base material of web-like is cut into
Fixed dimension；Copper foil base material after cutting is drilled, the processing of copper facing and circuit；On the substrate
The photosensitive development that is sticked and presses cover layer；The photosensitive development cover layer is exposed and development treatment；Connect
And the base material after exposed and developed is surface-treated.
Compared with prior art, the present invention has advantages below：
1st, the present invention is using PIC (photosensitive development cover layer) substitution diaphragms and ink, while can save
The flow of response, yield is lifted, reduces total production procedure and production time；
2nd, the present invention uses PIC, opening can be made into precision and be promoted to 0.05mm from 0.1mm, protected
Layer Aperture precision lifting, lifting utilize area, realize high density high accuracy piece；
3rd, the present invention uses PIC, can accurately reduce product thickness, meets slimming product demand, realizes
The making of compact circuit board；
4th, the present invention is reduced waste discharge, is advantageous to environmental protection using PIC substitution CVL and ink flow path.
Obviously, those skilled in the art can carry out various changes and modification without departing from the present invention to invention
Spirit and scope.So, if the present invention these modifications and variations belong to the claims in the present invention and its
Within the scope of equivalent technologies, then the present invention is also intended to including these changes and modification.
Claims (8)
- A kind of 1. production technology of FPC, it is characterised in that including：The copper foil base material of web-like is cut into fixed dimension；Copper foil base material after cutting is drilled, the processing of copper facing and circuit；The photosensitive development that is sticked on the substrate and presses cover layer；The photosensitive development cover layer is exposed and development treatment；Then the base material after exposed and developed is surface-treated.
- 2. the production technology of FPC as claimed in claim 1, it is characterised in that photosensitive being sticked Before development cover layer, in addition to super roughening treatment step.
- 3. the production technology of FPC as claimed in claim 2, it is characterised in that the super roughening Step includes：The copper foil of substrate surface is handled using super roughening liquid medicine, makes copper foil surface coarse.
- 4. the production technology of FPC as claimed in claim 3, it is characterised in that using vacuum pressure The photosensitive development cover layer is pressed together on the copper foil surface by conjunction machine.
- 5. the production technology of FPC as claimed in claim 1, it is characterised in that using ultraviolet Exposure sources are exposed processing to the photosensitive development cover layer.
- 6. the production technology of FPC as claimed in claim 1, it is characterised in that using Na2CO3 Solution carries out development treatment to photosensitive development cover layer.
- 7. the production technology of FPC as claimed in claim 1, it is characterised in that also include baking Step, the baking procedure perform after development treatment.
- 8. the production technology of FPC as claimed in claim 1, it is characterised in that using ultraviolet light Radium-shine mode drills to base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610451397.5A CN107529283A (en) | 2016-06-21 | 2016-06-21 | The production technology of FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610451397.5A CN107529283A (en) | 2016-06-21 | 2016-06-21 | The production technology of FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107529283A true CN107529283A (en) | 2017-12-29 |
Family
ID=60734948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610451397.5A Pending CN107529283A (en) | 2016-06-21 | 2016-06-21 | The production technology of FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107529283A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234204A (en) * | 2019-06-11 | 2019-09-13 | 景旺电子科技(龙川)有限公司 | A kind of production method of FPC thickness copper sheet protective layer |
| CN110690124A (en) * | 2019-11-14 | 2020-01-14 | 江苏上达电子有限公司 | Manufacturing method of packaging substrate for improving residual copper in edge curling |
| CN110769607A (en) * | 2019-10-16 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Circuit board and manufacturing method thereof |
| CN114025499A (en) * | 2021-10-28 | 2022-02-08 | 广州安博新能源科技有限公司 | Single-sided flexible circuit board and preparation method and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW544074U (en) * | 2002-09-26 | 2003-07-21 | Pucka Ind Co Ltd | Solder mask layer structure of flexible printed circuit board |
| CN1892427A (en) * | 2005-07-06 | 2007-01-10 | 株式会社有泽制作所 | Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition |
| CN201947537U (en) * | 2011-03-04 | 2011-08-24 | 厦门高威尔电子科技有限公司 | Flexible printed circuit board with developing cover film |
| KR20120002016A (en) * | 2010-06-30 | 2012-01-05 | (주)인터플렉스 | Method of manufacturing flexible printed circuit board |
| CN105144854A (en) * | 2013-04-24 | 2015-12-09 | 太阳油墨制造株式会社 | Laminated resin structure, dry film, and flexible printed wire board |
| CN105657958A (en) * | 2015-12-29 | 2016-06-08 | 广东欧珀移动通信有限公司 | Mobile terminal, flexible circuit board and manufacture method thereof |
-
2016
- 2016-06-21 CN CN201610451397.5A patent/CN107529283A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW544074U (en) * | 2002-09-26 | 2003-07-21 | Pucka Ind Co Ltd | Solder mask layer structure of flexible printed circuit board |
| CN1892427A (en) * | 2005-07-06 | 2007-01-10 | 株式会社有泽制作所 | Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition |
| KR20120002016A (en) * | 2010-06-30 | 2012-01-05 | (주)인터플렉스 | Method of manufacturing flexible printed circuit board |
| CN201947537U (en) * | 2011-03-04 | 2011-08-24 | 厦门高威尔电子科技有限公司 | Flexible printed circuit board with developing cover film |
| CN105144854A (en) * | 2013-04-24 | 2015-12-09 | 太阳油墨制造株式会社 | Laminated resin structure, dry film, and flexible printed wire board |
| CN105657958A (en) * | 2015-12-29 | 2016-06-08 | 广东欧珀移动通信有限公司 | Mobile terminal, flexible circuit board and manufacture method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234204A (en) * | 2019-06-11 | 2019-09-13 | 景旺电子科技(龙川)有限公司 | A kind of production method of FPC thickness copper sheet protective layer |
| CN110769607A (en) * | 2019-10-16 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Circuit board and manufacturing method thereof |
| CN110690124A (en) * | 2019-11-14 | 2020-01-14 | 江苏上达电子有限公司 | Manufacturing method of packaging substrate for improving residual copper in edge curling |
| CN114025499A (en) * | 2021-10-28 | 2022-02-08 | 广州安博新能源科技有限公司 | Single-sided flexible circuit board and preparation method and application thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171229 |