CN107529022A - AV interface circuits and its manufacture method - Google Patents
AV interface circuits and its manufacture method Download PDFInfo
- Publication number
- CN107529022A CN107529022A CN201610448981.5A CN201610448981A CN107529022A CN 107529022 A CN107529022 A CN 107529022A CN 201610448981 A CN201610448981 A CN 201610448981A CN 107529022 A CN107529022 A CN 107529022A
- Authority
- CN
- China
- Prior art keywords
- power supply
- interface circuits
- protecting field
- interfaces
- audio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/222—Studio circuitry; Studio devices; Studio equipment
- H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
- H04N5/268—Signal distribution or switching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
- G01R31/002—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/44—Receiver circuitry for the reception of television signals according to analogue transmission standards
Abstract
The invention provides a kind of AV interface circuits and its manufacture method.The AV interface circuits include：Protecting field is provided with around the ground pin of AV interfaces；Isolation strip is provided between the power supply ground of veneer where the protecting field and the AV interfaces；Attachment structure, with being arranged at the power supply between the protecting field, for connect the veneer power supply with the protecting field.By the invention it is possible to solve the problems, such as AV interfaces by electrostatic interference, so that the antistatic effect of AV interfaces significantly increases.
Description
Technical field
The present invention relates to circuit field, in particular to a kind of AV interface circuits and its system
Make method.
Background technology
Electrostatic is a kind of quotidian phenomenon in people's life, and static discharge (ESD) is very
Easily interference and destruction electronic equipment.Therefore the ESD tests of electronic equipment also serve as electricity
The content write-in national standard and international standard that one important in magnetic compatibility test.That is,
For all electronic systems, electrostatic anti-interference test is inevitable in electromagnetic compatibility test
A part.At present, the market competition of the terminal device such as set top box is increasing, mainly price
War, in order to reduce cost, the development trend of set top box --- small size, plastics in the market
Shell, two layers pcb board etc., this in terms of ESD protection just to proposing higher requirement.With this
Kind of small size, plastic housing, two layers pcb board terminal device AV interfaces for, to come round
ESD contact discharges are crossed, very difficult, this is also one in current terminal device evolution
Individual difficult problem.Fig. 1 is the circuit diagram of AV interface circuits among correlation technique.Such as Fig. 1 institutes
Show, because AV interfaces are using the general socket of industry, including 6 stitch, signal definition point
It is not Composite Video Baseband Signal CVBS, audio L, audio R and 3 GND lower margins.
Because the shell of AV interfaces is metal, when static gun is placed on discharged on metal shell when,
System is easy to blue screen or deadlock phenomenon occur.Apparent electrostatic pulse electric current passes through conduction or spoke
The form penetrated enters veneer, causes veneer system disorders occur.Therefore, in correlation technique
It is central also relatively good to solve the problems, such as AV interfaces by electrostatic interference without a kind of.
The content of the invention
The embodiments of the invention provide a kind of AV interface circuits and its manufacture method, at least to solve
The problem of certainly AV interfaces are by electrostatic interference in correlation technique.
According to one embodiment of present invention, there is provided a kind of AV interface circuits, including：
Protecting field is provided with around the ground pin of AV interfaces；The protecting field and the AV interfaces
Isolation strip is provided between the power supply ground of place veneer；Attachment structure, with being arranged at the power supply
Between the protecting field, for connect the veneer power supply with the protecting field.
Alternatively, the attachment structure includes：Magnetic medium, the magnetic medium are used to bridge institute
With stating protecting field and the power supply.
Alternatively, the magnetic medium is that cut-off frequency is more than or waited below 10 ohm of impedance
In 500 megahertzs of magnetic bead.
Alternatively, AV interface Composite Video Baseband Signals are provided with the power supply of the veneer
CVBS, audio L and audio R tri- data lines correspond to stitch.
Alternatively, the member connected with the CVBS, audio L and the data lines of audio R tri-
The bottom plate of the corresponding position of veneer hollows out where part.
Alternatively, the magnetic medium is arranged on the upper surface or lower surface of the isolation strip.
According to still another embodiment of the invention, there is provided a kind of electronic equipment, including above-mentioned note
The AV interface circuits of load.
According to another embodiment of the invention, there is provided a kind of manufacturer of AV interface circuits
Method, including：Protecting field will be set around the ground pin of AV interfaces；In the protecting field and
Isolation strip is set between the power supply ground of veneer where the AV interfaces；In the protecting field and
Attachment structure is set between the power supply ground.
Alternatively, the attachment structure includes：Magnetic medium, the magnetic medium are used to bridge institute
With stating protecting field and the power supply
Alternatively, will data wire corresponding with the CVBS, audio L and audio R difference
Bottom plate corresponding to institute's series element hollows out.
By the present invention, due to setting protecting field by the ground pin in AV interfaces, and lead to
Cross isolation strip to separate with the power supply of veneer, while protecting field and power supply are connected by connecting interface
Ground.Therefore, AV interfaces can be solved the problems, such as by electrostatic interference, so that AV interfaces is anti-
Electrostatic capacity significantly increases.
Brief description of the drawings
Accompanying drawing described herein is used for providing a further understanding of the present invention, forms the application
A part, schematic description and description of the invention is used to explain the present invention, not structure
Into inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is the circuit theory diagrams of AV interface circuits among correlation technique；
Fig. 2 is a kind of circuit diagram of AV interface circuits according to embodiments of the present invention；
Fig. 3 is the TOP schematic diagrames of another AV interface circuits according to embodiments of the present invention；
Fig. 4 is the BOTTOM electricity of another AV interface circuits according to embodiments of the present invention
Lu Tu；
Fig. 5 is a kind of flow of the manufacture method of AV interface circuits according to embodiments of the present invention
Figure；
Fig. 6 is the stream of the manufacture method of another AV interface circuits according to embodiments of the present invention
Cheng Tu.
Embodiment
Describe the present invention in detail below with reference to accompanying drawing and in conjunction with the embodiments.Need what is illustrated
It is that, in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.
It should be noted that the art in description and claims of this specification and above-mentioned accompanying drawing
Language " first ", " second " etc. are for distinguishing similar object, without specific for describing
Order or precedence.
Embodiment 1
A kind of AV interface circuits are provided in the present embodiment, and Fig. 2 is implemented according to the present invention
The circuit diagram of a kind of AV interface circuits of example, as shown in Fig. 2 the circuit diagram includes：
Protecting field 22, it is arranged at around the ground pin of AV interfaces；
Isolation strip 24, the power supply of veneer where being arranged at protecting field 22 and AV interfaces 26
Between；
Alternatively, 26 AV interface Composite Video Baseband Signal CVBS are provided with the power supply,
Audio L and the data lines of audio R tri- correspond to stitch.
Attachment structure 28, with being arranged at the power supply between 26 and the protecting field 22, use
In the power supply for connecting the veneer 26 with the protecting field 22.
Alternatively, the attachment structure includes：Magnetic medium, the magnetic medium are used to bridge institute
With stating protecting field 22 and the power supply 26.
It is pointed out that due to because high frequency, height of protecting field 22 and the power supply ground between 26
Impedance environment, device may not be very suitable because of the selection of parameter, only with isolation strip
Method may result in secondary radiation caused by high-frequency electrostatic interference signal so that AV connects
The electrostatic of mouth is deteriorated.Because magnetic medium has very high high resistant rate and magnetic conductivity, can wait
Imitate as connecting according to the impedance that frequency changes and inductance.Therefore, the ratio of the magnetic medium is common
Inductance has more preferable High frequency filter characteristic, presented in high frequency it is resistive, so can be comparatively wide
Higher impedance is kept in frequency range, so as to improve frequency modulation filter effect.
Specifically, measured after repeated measurement is tested, be the Europe of impedance 10 in the magnetic medium
Below nurse, when cut-off frequency is more than or equal to 500 megahertzs of magnetic bead, the magnetic medium can
Preferably play and suppression absorption is played to electrostatic.
Alternatively, the magnetic medium is arranged on the upper surface or lower surface of the isolation strip,
For ensureing that protecting field 22 and the ground of respective layer where magnetic medium are connected by magnetic medium.
Certainly, in embodiment, magnetic medium illustrates as just a kind of preferable mode,
It is any can be equivalent to according to frequency change impedance and the medium connected or circuit of inductance it is equal
Within the protection domain of the present embodiment.
Another AV interface circuits are provided in the present embodiment, and Fig. 3 is according to of the invention real
The TOP circuit diagrams of another AV interface circuits of example are applied, Fig. 4 is implemented according to the present invention
The BOTTOM circuit diagrams of another AV interface circuits of example.As shown in Figure 3 and Figure 4,
In addition to structure in the circuit diagram in including Fig. 2 in circuit diagram, in addition to：
Bottom corresponding to the element that the CVBS, audio L and the data lines of audio R tri- are connected
Laminate hollows out.
Specifically, for the more veneer of the number of plies (such as being made up of 4 layers of pcb board), Horizon
Face connection is more continuous, and electrostatic is released fully.But for the less veneer of the number of plies (such as
It is made up of 2 layers of pcb board), the path of effectively releasing of electrostatic has seemed weak many.For regarding
Frequency line CVBS, element (such as electric capacity, inductance and the resistance connected by hollowing out the data wire
It is anti-), the electrostatic leakage that on the one hand will be accumulated on veneer, while posting for pad can also be compensate for
Raw electric capacity and inductance, so that video line reaches expected performance indications.And for tone frequency channel wire
L and audio R, by hollowing out bottom plate corresponding to element, it can also subtract to a certain extent
Secondary radiation caused by few high-frequency electrostatic interference signal.
By said structure, solve the problems, such as AV interfaces by electrostatic interference, so that AV interfaces
Antistatic effect significantly increase.
Embodiment 2
A kind of manufacture method of AV interface circuits is additionally provided in the present embodiment.Fig. 5 is root
According to a kind of flow chart of the manufacture method of AV interface circuits of the embodiment of the present invention.Such as Fig. 5 institutes
Show, this method includes：
S502, protecting field will be set around the ground pin of AV interfaces；
S504, set between the power supply ground of veneer where the protecting field and the AV interfaces
Isolation strip；
Alternatively, the power supply region be provided with AV interface Composite Video Baseband Signals
Stitch corresponding to CVBS, audio L and audio R tri- data lines.
S506, attachment structure is set between the protecting field and the power supply ground.
Alternatively, the attachment structure includes：Magnetic medium, the magnetic medium are used to bridge institute
With stating protecting field and the power supply.
It is pointed out that due to because of high frequency, the high impedance ring between protecting field and power supply ground
Border, device may not be very suitable because of the selection of parameter, only with the method for isolation strip
Secondary radiation caused by high-frequency electrostatic interference signal is may result in, so that AV interfaces is quiet
Electricity is deteriorated.Because magnetic medium has very high high resistant rate and magnetic conductivity, root can be equivalent to
According to the impedance of frequency change and connecting for inductance.Therefore, the ratio ordinary inductor of the magnetic medium has
More preferable High frequency filter characteristic, presented in high frequency it is resistive, so can be in comparatively wide frequency model
The higher impedance of interior holding is enclosed, so as to improve frequency modulation filter effect.
Specifically, measured after repeated measurement is tested, be the Europe of impedance 10 in the magnetic medium
Below nurse, when cut-off frequency is more than or equal to 500 megahertzs of magnetic bead, the magnetic medium can
Play and suppression absorption is played to electrostatic.
Alternatively, the magnetic medium is arranged on the upper surface or lower surface of the isolation strip,
For ensureing that protecting field and the ground of respective layer where magnetic medium are connected by magnetic medium.
Certainly, in embodiment, magnetic medium illustrates as just a kind of preferable mode,
It is any can be equivalent to according to frequency change impedance and the medium connected or circuit of inductance it is equal
Within the protection domain of the present embodiment.
Fig. 6 is the stream of the manufacture method of another AV interface circuits according to embodiments of the present invention
Cheng Tu, as shown in figure 5, the device is in addition to including the step shown in Fig. 5, in addition to：
S602, will data wire corresponding with the CVBS, audio L and audio R difference
Bottom plate corresponding to institute's series element hollows out.
Specifically, for the more veneer of the number of plies (such as being made up of 4 layers of pcb board), Horizon
Face connection is more continuous, and electrostatic is released fully.But for the less veneer of the number of plies (such as
It is made up of 2 layers of pcb board), the path of effectively releasing of electrostatic has seemed weak many.For regarding
Frequency line CVBS, element (such as electric capacity, inductance and the resistance connected by hollowing out the data wire
It is anti-), the electrostatic leakage that on the one hand will be accumulated on veneer, while posting for pad can also be compensate for
Raw electric capacity and inductance, so that video line reaches expected performance indications.And for tone frequency channel wire
L and audio R, by hollowing out bottom plate corresponding to element, it can also subtract to a certain extent
Secondary radiation caused by few high-frequency electrostatic interference signal.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention,
For those skilled in the art, the present invention can have various modifications and variations.It is all this
Within the spirit and principle of invention, any modification, equivalent substitution and improvements made etc. all should
Within protection scope of the present invention.
Claims (10)
- A kind of 1. AV interface circuits, it is characterised in that including：Protecting field is provided with around the ground pin of AV interfaces；Isolation strip is provided between the power supply ground of veneer where the protecting field and the AV interfaces；Attachment structure, it is described for connecting with being arranged at the power supply between the protecting field The power supply of veneer with the protecting field.
- 2. AV interface circuits according to claim 1, the attachment structure include： Magnetic medium, the magnetic medium are used for bridging the protecting field and the power supply.
- 3. AV interface circuits according to claim 2, it is characterised in that the magnetic Property medium be that 10 ohm of impedance is following, magnetic bead of the cut-off frequency more than or equal to 500 megahertzs.
- 4. AV interface circuits according to claim 1, it is characterised in that the list The power supply of plate region be provided with AV interfaces Composite Video Baseband Signal CVBS, audio L And stitch corresponding to the data lines of audio R tri-.
- 5. AV interface circuits according to claim 4, it is characterised in thatIt is single where the element connected with the CVBS, audio L and the data lines of audio R tri- The bottom plate of the corresponding position of plate hollows out.
- 6. AV interface circuits according to any one of claim 1 to 5, its feature It is, the magnetic medium is arranged on the upper surface or lower surface of the isolation strip.
- 7. a kind of electronic equipment, including AV interface circuits, it is characterised in that the AV Interface circuit is the AV interface circuits any one of claim 1 to 6.
- A kind of 8. manufacture method of AV interface circuits, it is characterised in that including：Protecting field will be set around the ground pin of AV interfaces；Isolation strip is set between the power supply ground of veneer where the protecting field and the AV interfaces；Attachment structure is set between the protecting field and the power supply ground.
- 9. according to the method for claim 8, the attachment structure includes：Magnetic medium, The magnetic medium is used for bridging the protecting field and the power supply.
- 10. according to the method for claim 7, it is characterised in that will be with power supply on the ground CVBS, audio L and audio R respectively corresponding to bottom plate corresponding to data wire institute series element Hollow out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610448981.5A CN107529022B (en) | 2016-06-21 | 2016-06-21 | AV interface circuit and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610448981.5A CN107529022B (en) | 2016-06-21 | 2016-06-21 | AV interface circuit and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107529022A true CN107529022A (en) | 2017-12-29 |
| CN107529022B CN107529022B (en) | 2021-12-07 |
Family
ID=60734867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610448981.5A Active CN107529022B (en) | 2016-06-21 | 2016-06-21 | AV interface circuit and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107529022B (en) |
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|---|---|---|---|---|
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107529022B (en) | 2021-12-07 |
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