CN107516695A - A kind of cooling device of polycrystal silicon cell groove type etching equipment - Google Patents
A kind of cooling device of polycrystal silicon cell groove type etching equipment Download PDFInfo
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- CN107516695A CN107516695A CN201710712018.8A CN201710712018A CN107516695A CN 107516695 A CN107516695 A CN 107516695A CN 201710712018 A CN201710712018 A CN 201710712018A CN 107516695 A CN107516695 A CN 107516695A
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- 238000001816 cooling Methods 0.000 title claims abstract description 90
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 42
- 239000010703 silicon Substances 0.000 title claims abstract description 42
- 238000005530 etching Methods 0.000 title claims abstract description 40
- 210000005056 cell body Anatomy 0.000 claims abstract description 65
- 210000004027 cell Anatomy 0.000 claims abstract description 40
- 239000000498 cooling water Substances 0.000 claims abstract description 36
- 239000012530 fluid Substances 0.000 claims abstract description 24
- 239000002826 coolant Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000003814 drug Substances 0.000 claims description 4
- 229940079593 drug Drugs 0.000 claims description 3
- 210000000635 valve cell Anatomy 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 210000002268 wool Anatomy 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 235000008216 herbs Nutrition 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910021418 black silicon Inorganic materials 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
A kind of cooling device of polycrystal silicon cell groove type etching equipment disclosed in the embodiment of the present invention, including cooling-water machine and decoction recycle unit, decoction recycle unit include heat exchanger, cell body, decoction cooling line, shielding pipeline and circulating pump；One end of decoction cooling line and the outlet of cell body, the other end connect with the liquid return hole of cell body, and pass through heat exchanger；Circulating pump is connected on decoction cooling line, the first valve being in series with decoction cooling line between heat exchanger and cell body and the second valve between heat exchanger and circulating pump；Shielding pipeline one end is communicated on the decoction cooling line between circulating pump and the second valve, and the other end is communicated on the decoction cooling line between the first valve cell body；The 3rd valve is provided with shielding pipeline.Whether the present invention remains cooling medium without having to worry about in heat exchanger, will not be in the presence of heat exchanger, and decoction is by continued down so that fluid temperature is more easily controlled, and has reached the purpose of accurate temperature controlling.
Description
Technical field
The present invention relates to polycrystal silicon cell technical field, is set more specifically to a kind of polycrystal silicon cell groove type etching
Standby cooling device.
Background technology
The reserves of the traditional energies such as worldwide coal, oil and natural gas are increasingly declining, the ring brought using traditional energy
Border problem is increasingly serious, and in face of energy crisis and environmental protection problem, China advocates development New Energy Industry, therefore photovoltaic energetically
Battery manufacture industry develops growth rapidly in China.
Although as technology develops, the manufacturing cost of photovoltaic cell has declined a lot, in order to realize par early
The target of online, photovoltaic cell manufacturing are actively promoting Buddha's warrior attendant wire cutting polysilicon chip and are being superimposed black silicon making herbs into wool technology.It is more
Crystal silicon battery groove type etching equipment is different from more ripe monocrystalline silicon etching device, and polycrystal silicon cell groove type etching equipment is to silicon
The bubble groove time of piece and the requirement of technological temperature are all more strict.During making herbs into wool, with silicon chip chemistry occurs polysilicon for decoction
Heat is released in reaction, and the cell body of difference in functionality is different to temperature requirement, typically according to technological requirement, it is necessary to temperature by 2 cell bodies
Degree controls at 8 ± 1 DEG C and 25 ± DEG C respectively, and accurate temperature controlling is to restrict a great problem that multi-crystal trough type wool making develops.
In the prior art, the temperature of cell body is controlled by cooling device, cooling device includes cooling-water machine and decoction circulation is set
It is standby.Decoction recycle unit includes heat exchanger, cell body and circulating pump.Cooling-water machine is used to cool for cooling medium, and by after cooling
Cooling medium circulate again in heat exchanger, keep the low-temperature condition in heat exchanger.Circulating pump is used for the decoction in cell body
Circulated in heat exchanger, to be reached for the purpose of decoction cooling.After fluid temperature is down to suitable temperature, cut-out cooling-water machine with
The path of heat exchanger, but cooling medium can be remained in heat exchanger, causes the decoction by heat exchanger, continued down,
There is an inertia in temperature-fall period, can not accurate temperature controlling.
Therefore, how to reach the purpose of accurate temperature controlling, turn into those skilled in the art's technical problem urgently to be resolved hurrily.
The content of the invention
In view of this, it is an object of the invention to provide a kind of cooling device of polycrystal silicon cell groove type etching equipment, with
Reach the purpose of accurate temperature controlling.
To achieve the above object, the present invention provides following technical scheme：
A kind of cooling device of polycrystal silicon cell groove type etching equipment, including cooling-water machine and decoction recycle unit, the medicine
Liquid recycle unit includes heat exchanger, cell body, decoction cooling line, shielding pipeline and circulating pump；
The cooling-water machine is used to cool for the heat exchanger；
One end of the decoction cooling line and the outlet of the cell body, the other end of the decoction cooling line with
The liquid return hole connection of the cell body, and the decoction cooling line passes through the heat exchanger；
The circulating pump is connected on the decoction cooling line, be in series with the decoction cooling line the first valve and
Second valve, and first valve, between the heat exchanger and the cell body, second valve is located at the heat
Between exchanger and the circulating pump；
One end of the shielding pipeline is communicated in the decoction cooling tube between the circulating pump and second valve
Lu Shang, the other end are communicated on the decoction cooling line between cell body described in first valve；
The 3rd valve is provided with the shielding pipeline.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, in addition to：
For detecting the temperature sensor of the fluid temperature in the cell body；
Controller, when the fluid temperature C1 is more than preset temperature C2, first valve and the second valve is controlled to beat
Open, the 3rd valve is closed, and in C1≤C2, controls first valve and the second valve to close, the 3rd valve is beaten
Open.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, first valve, the second valve
It is pneumatic ball valve with the 3rd valve.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, in addition to host computer, it is described upper
Machine is used to input preset temperature C2, and shows the fluid temperature C1 that the temperature sensor detects in operation interface.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, the cell body includes what is be connected
Major trough and secondary groove, the outlet of the cell body and liquid return hole are located at the major trough and secondary groove respectively, and the volume of the secondary groove is more than institute
The volume of major trough is stated, and the secondary groove is located at the bottom of the major trough.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, the decoction recycle unit is simultaneously
Two of connection.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, two decoction recycle units
Preset temperature C2 it is different.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, set in one of them described cell body
Heating plate is equipped with, it is described to add when the fluid temperature C1 in the cell body with the heating plate is more than its corresponding preset temperature C2
Hot plate works.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, there is the cell body of the heating plate
Corresponding preset temperature is 25 DEG C, and preset temperature corresponding to another cell body is 8 DEG C.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, the cooling medium of the cooling-water machine
Loop exit connects with the water inlet of the heat exchanger, and the cooling medium of the cooling-water machine is recycled back to the mouth of a river and the heat exchange
The outlet of device.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, the cooling of the cooling-water machine is connected
Medium circulation water return outlet is connected the unidirectional of oriented heat exchanger direction cut-off with the pipeline of the outlet of the heat exchanger
Valve.
Preferably, in the cooling device of above-mentioned polycrystal silicon cell groove type etching equipment, in addition to it is arranged at the cold water
In machine, for measuring the float switch of the liquid level inside cooling-water machine, when liquid level is less than setting value, the cooling-water machine
Stopping alarm.
It can be seen from the above technical scheme that the cooling dress of polycrystal silicon cell groove type etching equipment provided by the invention
Put, cooling-water machine is used to circulate the cooling medium of low temperature in heat exchanger so that the decoction circulated in heat exchanger passes through
Cooling is realized in heat exchange.When fluid temperature in cell body is not up to cooling and required, the first valve and the second valve are opened, and the 3rd
Valve is closed so that decoction flows on decoction cooling line, i.e., decoction cools through over-heat-exchanger.Decoction temperature in cell body
When degree reaches cooling and required, the first valve and the second valve are closed, and the 3rd valve is opened so that decoction flows on shielding pipeline
Dynamic, decoction cooling line is shielded, i.e., decoction is no longer pass through heat exchanger cooling, is directly followed by shielding pipeline in cell body
Ring.Whether the present invention remains cooling medium without having to worry about in heat exchanger, will not be in the presence of heat exchanger, and decoction is continued
Cooling so that fluid temperature is more easily controlled, and has reached the purpose of accurate temperature controlling.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the cooling device of polycrystal silicon cell groove type etching equipment provided in an embodiment of the present invention；
Fig. 2 is the structural representation of the cooling device for the polycrystal silicon cell groove type etching equipment that another embodiment of the present invention provides
Figure.
Wherein, 101 be host computer, and 102 be controller, and 103 be temperature sensor, and 104 be cell body, and 105 be circulating pump,
106 be the 3rd valve, and 107 be the first valve, and 108 be the second valve, and 109 be heat exchanger, and 110 be check valve, and 111 be valve
Door, 112 be valve, and 113 be float switch, and 114 be cooling-water machine, and 115 be valve, and 116 be valve, and 117 be heating plate, and 118 are
Three-way interface.
Embodiment
The core of the present invention is to provide a kind of cooling device of polycrystal silicon cell groove type etching equipment, to reach accurate control
The purpose of temperature.
Hereinafter, embodiment is illustrated referring to the drawings.In addition, embodiments illustrated below is not to described in claim
The content of the invention rise any restriction effect.In addition, the full content of the composition represented by example below is not limited to as right
It is required that necessary to the solution of described invention.
Referring to Fig. 1, Fig. 1 is the knot of the cooling device of polycrystal silicon cell groove type etching equipment provided in an embodiment of the present invention
Structure schematic diagram.
The embodiment of the invention discloses a kind of cooling device of polycrystal silicon cell groove type etching equipment to include the He of cooling-water machine 114
Decoction recycle unit, wherein, decoction recycle unit include heat exchanger 109, cell body 104, decoction cooling line, shielding pipeline and
Circulating pump 105.
Cooling-water machine 114 is used to cool for heat exchanger 109, that is, is used to circulate cooling medium in heat exchanger 109, from
And the low-temperature condition of heat exchanger 109 is kept, think into the decoction in heat exchanger 109 and cooled.
One end of decoction cooling line and the outlet of cell body 104, the other end and the cell body 104 of decoction cooling line
Liquid return hole connects, and decoction cooling line passes through heat exchanger 109.Circulating pump 105 is connected on decoction cooling line, is being circulated
In the presence of pump 105, decoction circulates in cell body 104, and the size of decoction internal circulating load can pass through Frequency Converter Control circulating pump 105
Rotating speed adjust.
The first valve 107 and the second valve 108 are in series with decoction cooling line, and the first valve 107 is located at heat exchange
Between device 109 and cell body 104, the second valve 108 is between heat exchanger 109 and circulating pump 105.
One end of shielding pipeline is communicated on the decoction cooling line between the valve 108 of circulating pump 105 and second, the other end
It is communicated on the decoction cooling line between the cell body 104 of the first valve 107, shields and be provided with the 3rd valve 106 on pipeline.Pass through
The first valve 107 and the second valve 108 are opened, the 3rd valve 106 is closed and may be such that decoction exchanges heat through over-heat-exchanger 109, close
The first valve 107 and the second valve 108 are closed, the 3rd valve 106 is opened and may be such that decoction exchanges heat without over-heat-exchanger 109, from
And reach the purpose of accurate temperature controlling.
The cooling device of polycrystal silicon cell groove type etching equipment provided by the invention, cooling-water machine 114 are used for the cold of low temperature
But medium (being usually water) circulates in heat exchanger 109 so that the decoction of circulation is real by heat exchange in heat exchanger 109
Now cool.When fluid temperature in cell body 104 is not up to cooling and required, the first valve 107 and the second valve 108 are opened, and
Three valves 106 are closed so that decoction flows on decoction cooling line, i.e., decoction cools through over-heat-exchanger 109.In cell body
When fluid temperature in 104 reaches cooling and required, the first valve 107 and the second valve 108 are closed, and the 3rd valve 106 is opened, and is made
Decoction stream on shielding pipeline is dynamic, decoction cooling line is shielded, i.e. decoction is no longer pass through heat exchanger 109 and cooled, directly
Circulated by shielding pipeline in cell body 104.The present invention, will not without having to worry about whether cooling medium is remained in heat exchanger 109
In the presence of heat exchanger 109, decoction is by continued down so that fluid temperature is more easily controlled, and has reached accurate temperature controlling
Purpose.
In a specific embodiment of the invention, the present invention may also include temperature sensor 103 and controller 102.Wherein, it is warm
Degree sensor 103 is used to detect the fluid temperature in cell body 104, when fluid temperature C1 is more than preset temperature C2, control first
The valve 108 of valve 107 and second is opened, and the 3rd valve 106 is closed, and in C1≤C2, controls the first valve 107 and the second valve
108 are closed, and the 3rd valve 106 is opened.Preset temperature C2 can be set according to target temperature, such as target temperature is 8 ± 1 DEG C and 25
± DEG C, preset temperature can be respectively set as to 8 DEG C and 25 DEG C.In order to facilitate the control of control, the first valve 107, the second valve
108 and the 3rd valve 106 be pneumatic ball valve, or magnetic valve.
In a specific embodiment of the invention, the present invention may also include host computer 101, and host computer 101 is default for inputting
Temperature C2, and the fluid temperature C1 detected in operation interface displays temperature sensor 103, according to different cell bodies 104, setting
Corresponding preset temperature C2.
In an of the invention specific embodiment, cell body 104 includes the major trough being connected and secondary groove, the outlet of cell body 104 and
Liquid return hole is located at major trough and secondary groove respectively, and the volume of secondary groove is more than the volume of major trough, and secondary groove is located at the bottom of major trough, circulating pump
105 work realize decoction in major trough and secondary groove internal circulation flow, and circulating pump 105 is preferably provided in secondary groove side, for by pair
Decoction in groove conveys into major trough, and the decoction in major trough is back to secondary groove under gravity.
Referring to Fig. 2, Fig. 2 is the cooling device for the polycrystal silicon cell groove type etching equipment that another embodiment of the present invention provides
Structural representation.
In a specific embodiment of the invention, decoction recycle unit is in parallel two, and it is two medicines that cooling-water machine 114, which is used for,
The heat exchanger 109 of liquid recycle unit provides circulating cooling medium, ensures the cooling of two inner liquid medicines of cell body 104, and cooling water is
By three-way interface 118,2 decoction recycle units are flowed into.Mechanical structure of the present invention is simple, reduces equipment cost, Er Qiegen
According to the requirement of process exploitation, it is easy to improvement and installation.
Further, the preset temperature C2 of two decoction recycle units is different, and the present invention can be with by a cooling-water machine 114
Realize the cooling of 2 technological temperature requirement difference cell bodies 104.
In a specific embodiment of the invention, heating plate 117 is provided with one of cell body 104, there is heating plate 117
Cell body 104 in fluid temperature C1 when being more than its corresponding preset temperature C2, heating plate 117 works.In practical application scene
In, the decoction in some cell bodies 104 requires that temperature is higher, if the cell body 104 relatively low with requiring temperature is using same temperature
Cooling medium, then the problem of cooling rate is too fast occurs.Therefore heating is set in the cell body 104 that fluid temperature requires higher
Plate 117, when fluid temperature C1 is more than preset temperature C2 corresponding to the cell body, except closing the first valve 107 and the second valve
108, open outside the 3rd valve 106, then heating plate 117 is opened, it is the decoction heating in cell body 104, to meet the temperature of decoction
Control requires.
Specifically, it is 25 DEG C with preset temperature corresponding to the cell body 104 of heating plate 117, corresponding to another cell body 104
Preset temperature is 8 DEG C.It should be noted that above-mentioned preset temperature data are only to be directed to a kind of particular situation, preset temperature can
With according to actual use scene, sets itself, it is not limited to 25 DEG C, 8 DEG C etc..
In an of the invention specific embodiment, the cooling medium loop exit of cooling-water machine 114 enters water with heat exchanger 109
Mouth connection, the cooling medium of cooling-water machine 114 are recycled back to the outlet at the mouth of a river and heat exchanger 109.Connect the cold of cooling-water machine 114
But medium circulation water return outlet is with being in series with the unidirectional of the direction of heat exchanger 109 cut-off on the pipeline of the outlet of heat exchanger 109
Valve 110, the check valve 110 is set to prevent cooling water backflow from influenceing temperature control.
In a specific embodiment of the invention, the present invention, which may also include, to be arranged in cooling-water machine 114, for measuring cooling-water machine
The float switch 113 of internal liquid level, when liquid level is less than setting value, the stopping alarm of cooling-water machine 114, set with reminding
Standby personnel overhaul.
In summary, workflow of the invention is as follows：
(1) valve (111,112) that cooling-water machine 114 passes in and out cooling water pipeline, setting cooling water (cooling medium) temperature are opened
Spend upper and lower bound；
(2) process exploitation personnel are required according to concrete technology, and each cell body 104 is inputted in the operation interface of host computer 101
Corresponding preset temperature C2；
(3) temperature sensor 103 (being preferably thermocouple temperature sensor) measurement fluid temperature of the inside of cell body 104 installation
C1, the fluid temperature C1 for gathering temperature sensor 103 by controller 102 include the operation interface in host computer 101；
(4) controller 102 can comparative analysis measurement value sensor-fluid temperature C1 and process set value-preset temperature C2
Size, if C1 ＞ C2, controller 102 send instruction, cool down circulation branch road interior circulation road (shielding pipeline) close, follow outside
Loop (i.e. decoction cooling line) is connected, and decoction flows into outer circulation road, is cooled by heat exchanger 109；If C1=C2, controller
102 send instruction, and the outer circulation road for cooling down circulation branch road is closed, and interior circulation road is connected, and decoction cools down without over-heat-exchanger 109
Cooling；If C1 ＜ C2, controller 102 send instruction, the outer circulation road for cooling down circulation branch road is closed, and interior circulation road is connected, heating
Plate 117 works, and the decoction inside cell body can heat up.The present invention carries out closed-loop control to temperature, can be to difference in functionality
Cell body realizes accurate temperature controlling.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (12)
1. a kind of cooling device of polycrystal silicon cell groove type etching equipment, including cooling-water machine (114) and decoction recycle unit, it is special
Sign is that the decoction recycle unit includes heat exchanger (109), cell body (104), decoction cooling line, shielding pipeline and followed
Ring pump (105)；
The cooling-water machine (114) is used to cool for the heat exchanger (109)；
One end of the decoction cooling line and the outlet of the cell body (104), the other end of the decoction cooling line
Connected with the liquid return hole of the cell body (104), and the decoction cooling line passes through the heat exchanger (109)；
The circulating pump (105) is connected on the decoction cooling line, and the first valve is in series with the decoction cooling line
(107) and the second valve (108), and first valve (107) is located at the heat exchanger (109) and the cell body (104)
Between, second valve (108) is between the heat exchanger (109) and the circulating pump (105)；
One end of the shielding pipeline is communicated in the decoction between the circulating pump (105) and second valve (108)
On cooling line, the other end is communicated in the decoction cooling line between first valve (107) cell body (104)
On；
The 3rd valve (106) is provided with the shielding pipeline.
2. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 1, it is characterised in that also include：
For detecting the temperature sensor (103) of the fluid temperature in the cell body (104)；
Controller (102), when the fluid temperature C1 is more than preset temperature C2, control first valve (107) and second
Valve (108) is opened, and the 3rd valve (106) is closed, and in C1≤C2, controls first valve (107) and the second valve
Door (108) is closed, and the 3rd valve (106) is opened.
3. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 2, it is characterised in that first valve
Door (107), the second valve (108) and the 3rd valve (106) are pneumatic ball valve.
4. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 2, it is characterised in that also including upper
Machine (101), the host computer (101) is used to input preset temperature C2, and shows the temperature sensor (103) in operation interface
The fluid temperature C1 detected.
5. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 1, it is characterised in that the cell body
(104) it is located at the major trough and pair respectively including the major trough being connected and secondary groove, the outlet of the cell body (104) and liquid return hole
Groove, the volume of the secondary groove is more than the volume of the major trough, and the secondary groove is located at the bottom of the major trough.
6. the cooling device of the polycrystal silicon cell groove type etching equipment as described in claim any one of 1-5, it is characterised in that institute
Decoction recycle unit is stated as in parallel two.
7. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 6, it is characterised in that two medicines
The preset temperature C2 of liquid recycle unit is different.
8. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 7, it is characterised in that one of institute
State in cell body (104) and be provided with heating plate (117), have the fluid temperature C1 in the cell body (104) of the heating plate (117) big
When its corresponding preset temperature C2, heating plate (117) work.
9. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 8, it is characterised in that there is described add
Preset temperature corresponding to the cell body (104) of hot plate (117) is 25 DEG C, and preset temperature corresponding to another cell body (104) is 8 DEG C.
10. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 6, it is characterised in that the cold water
The cooling medium loop exit of machine (114) connects with the water inlet of the heat exchanger (109), the cooling-water machine (114) it is cold
But the outlet of medium circulation water return outlet and the heat exchanger (109).
11. the cooling device of polycrystal silicon cell groove type etching equipment as claimed in claim 10, it is characterised in that described in connection
The cooling medium of cooling-water machine (114) be recycled back to the mouth of a river connected with the pipeline of the outlet of the heat exchanger (109) it is oriented described
The check valve (110) of heat exchanger (109) direction cut-off.
12. the cooling device of the polycrystal silicon cell groove type etching equipment as described in claim any one of 1-5, it is characterised in that
Also include being arranged in the cooling-water machine (114), for measuring the float switch (113) of the liquid level inside cooling-water machine, when
When liquid level is less than setting value, cooling-water machine (114) stopping alarm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710712018.8A CN107516695A (en) | 2017-08-18 | 2017-08-18 | A kind of cooling device of polycrystal silicon cell groove type etching equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710712018.8A CN107516695A (en) | 2017-08-18 | 2017-08-18 | A kind of cooling device of polycrystal silicon cell groove type etching equipment |
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| CN107516695A true CN107516695A (en) | 2017-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710712018.8A Pending CN107516695A (en) | 2017-08-18 | 2017-08-18 | A kind of cooling device of polycrystal silicon cell groove type etching equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111180364A (en) * | 2020-01-02 | 2020-05-19 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wet etching device and silicon wafer production system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1713359A (en) * | 2004-06-22 | 2005-12-28 | 茂德科技股份有限公司 | Etching system and treatment of etching agent |
| CN201296672Y (en) * | 2008-12-02 | 2009-08-26 | 沈阳铝镁设计研究院 | Cooling water supply system for equipment |
| CN201695107U (en) * | 2010-06-18 | 2011-01-05 | 常州亿晶光电科技有限公司 | Polysilicon groove type etching and cooling device |
| CN205104507U (en) * | 2015-03-31 | 2016-03-23 | 中建材浚鑫科技股份有限公司 | Polycrystalline silicon solar cell making herbs into wool concentration flow circulation meter device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1713359A (en) * | 2004-06-22 | 2005-12-28 | 茂德科技股份有限公司 | Etching system and treatment of etching agent |
| CN201296672Y (en) * | 2008-12-02 | 2009-08-26 | 沈阳铝镁设计研究院 | Cooling water supply system for equipment |
| CN201695107U (en) * | 2010-06-18 | 2011-01-05 | 常州亿晶光电科技有限公司 | Polysilicon groove type etching and cooling device |
| CN205104507U (en) * | 2015-03-31 | 2016-03-23 | 中建材浚鑫科技股份有限公司 | Polycrystalline silicon solar cell making herbs into wool concentration flow circulation meter device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111180364A (en) * | 2020-01-02 | 2020-05-19 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wet etching device and silicon wafer production system |
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