CN107511752B - A planetary wheel for regular polygon wafer grinds - Google Patents
A planetary wheel for regular polygon wafer grinds Download PDFInfo
- Publication number
- CN107511752B CN107511752B CN201711007952.6A CN201711007952A CN107511752B CN 107511752 B CN107511752 B CN 107511752B CN 201711007952 A CN201711007952 A CN 201711007952A CN 107511752 B CN107511752 B CN 107511752B
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- CN
- China
- Prior art keywords
- regular polygon
- buckling
- base body
- fluted disc
- wafer grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 235000012431 wafers Nutrition 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the field of wafer grinding, in particular to a star wheel for regular polygon wafer grinding, which comprises the following components: the base body fluted disc and the spiral ring that set up with one heart, base body fluted disc outer lane is provided with the tooth, the inside circumference equipartition of base body fluted disc has a plurality of regular polygon holes, every apex angle department in regular polygon hole all is provided with the clamp lever, be provided with the spout on the clamp lever, be provided with in the spout and detain the post, on the adjacent apex angle the clamp lever pass through the spout with detain post interconnect, detain the quantity of post with clamp lever quantity is the same, all equals the limit number of regular polygon, adjacent detain and be provided with tensioning spring between the post, the spiral ring pass through the connecting rod with one detain the post and link to each other, revolve the ring eye-splice in the center of base body fluted disc.
Description
Technical Field
The invention relates to the field of wafer grinding, in particular to a star wheel for regular polygon wafer grinding.
Background
In the production of optical wafers, the grinding process is a very important step. The double-sided grinding machine is mainly used for double-sided grinding of crystal parts with two parallel sides, and the crystal is clamped by adopting the star wheel. The traditional star wheel has fixed open position, so that the same star wheel can only clamp crystals with the same shape, the utilization rate of the star wheel is low, and the production cost is increased. For example, an abrasive quartz wafer star wheel disclosed in the grant publication No. CN202804917U can only process wafers of a fixed size, and if wafers of other sizes need to be processed, the star wheel must be replaced, which is disadvantageous for production.
Disclosure of Invention
The invention aims to solve the problems in the background art and provides a star wheel for grinding regular polygon wafers.
The technical aim of the invention is realized by the following technical scheme:
a star wheel for regular polygon wafer grinding, comprising: the base body fluted disc and the spiral ring that set up with one heart, base body fluted disc outer lane is provided with the tooth, the inside circumference equipartition of base body fluted disc has a plurality of regular polygon holes, every apex angle department in regular polygon hole all is provided with the clamp lever, be provided with the spout on the clamp lever, be provided with in the spout and detain the post, on the adjacent apex angle the clamp lever pass through the spout with detain post interconnect, detain the quantity of post with clamp lever quantity is the same, all equals the limit number of regular polygon, adjacent detain and be provided with tensioning spring between the post, the spiral ring pass through the connecting rod with one detain the post and link to each other, revolve the ring eye-splice in the center of base body fluted disc.
According to the technical scheme, when the rotary ring belt type polishing clamp is used, the rotary ring belt type movable connecting rod is rotated to pull the clamping rod away through the buckling column, then the object to be polished is placed in the clamp, and under the action of the tensioning spring, the clamping rod is automatically tightened, so that clamping is completed. Thereby achieving the purpose of processing the objects to be polished with different sizes.
Preferably, the length and the elastic coefficient of the tensioning springs between the adjacent buckling posts are equal.
Preferably, the clamping rod comprises a sliding groove, a hinge joint and a movable head, wherein the hinge joint is hinged and fixed outside the regular polygon hole, and the movable head rotates by taking the hinge joint as a circle center.
Preferably, the buckling column comprises an upper top cap, a lower top cap and a connecting column, wherein the connecting column is arranged in the sliding groove, and the upper top cap and the lower top cap are respectively arranged on the upper side and the lower side of the adjacent clamping rod.
Preferably, a guide rod is arranged at the movable head, and a circular ring groove is arranged outside the regular polygon hole, so that the clamping performance is improved.
Preferably, the circular grooves are in one-to-one correspondence with the clamping rods.
Preferably, two ends of the connecting rod are hinged with the buckling post and the rotary ring respectively. .
Preferably, the regular polygon hole is a regular triangle hole, and the number of the clamping rod, the buckling column and the tensioning spring is three.
In summary, the cylindrical workpiece is positioned by adopting the mode of folding the clamping rod, so that the same planetary wheel can be used for clamping and processing regular polygon objects to be processed with different sizes, the universality of the planetary wheel is improved, and the production and processing of factories are facilitated.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the structure of the clamping bar of the present invention;
FIG. 3 is a practical schematic of the present invention;
fig. 4 is a schematic structural view of embodiment 2 of the present invention.
Detailed Description
The following specific examples are intended to be illustrative of the invention and are not intended to be limiting, as modifications of the invention will be apparent to those skilled in the art upon reading the specification without inventive contribution thereto, and are intended to be protected by the patent law within the scope of the appended claims.
The invention is described in detail below with reference to the accompanying drawings.
Example 1:
referring to fig. 1 to 2, a star wheel for regular polygon wafer polishing, comprising: the base body fluted disc 1 and the spiral ring 2 of concentric setting, base body fluted disc 1 outer lane is provided with the tooth, the inside circumference equipartition of base body fluted disc 1 has a plurality of regular polygon holes 11, in this embodiment regular polygon holes 11 are regular triangle hole, every apex angle department of regular polygon holes 11 all is provided with clamping lever 12, be provided with spout 121 on the clamping lever 12, be provided with in the spout 121 and detain post 13, on the adjacent apex angle clamping lever 12 pass through spout 121 with detain post 13 interconnect, be provided with tensioning spring 14 between the adjacent detaining post 13, clamping lever 12 detain post 13 and tensioning spring 14's quantity is three, spiral ring 2 pass through connecting rod 21 with one detain post 13 links to each other, spiral ring 2 eye-splice in the center of base body fluted disc 1, connecting rod 21 both ends respectively with detain post 13 with spiral ring 2 looks articulates.
The length and the elastic coefficient of the tensioning springs 14 between the adjacent buckling posts 13 are equal.
The clamping rod 12 comprises a sliding groove 121, a hinge 122 and a movable head 123, the hinge 122 is hinged and fixed outside the regular polygon hole 11, the movable head 123 rotates by taking the hinge 122 as a circle center, the buckling column 13 comprises an upper top cap 131, a lower top cap 133 and a connecting column 132, the connecting column 132 is arranged in the sliding groove 121, and the upper top cap 131 and the lower top cap 133 are respectively arranged on the upper side and the lower side of the adjacent clamping rod 12.
When the star wheel is used, the rotary ring 2 is rotated to drive the connecting rod 21 to pull the clamping rod 12 through the buckling column 13, then the regular triangle wafer is put in, and the clamping rod 12 is automatically tightened under the action of the tensioning spring 14, so that clamping is completed. According to fig. 3, the double-sided lapping machine comprises an external internal gear and an external gear in the middle, and the planetary gear is arranged between the internal gear and the external gear to perform lapping.
Example 2:
unlike the above embodiment 1, as shown in fig. 2 and 4, the movable head 123 is provided with a guide rod 124, the regular polygon hole 11 is provided with a circular groove 15, the guide rod 124 is fastened in the circular groove 15, and the circular groove 15 corresponds to the clamping rod 12 one by one. Thereby improving the gripping performance.
Claims (6)
1. A star wheel for regular polygon wafer grinding, comprising: the base body fluted disc (1) and the rotary ring (2) which are concentrically arranged are arranged on the outer ring of the base body fluted disc (1), a plurality of regular polygon holes (11) are uniformly distributed on the inner circumference of the base body fluted disc (1), clamping rods (12) are arranged at each vertex angle of each regular polygon hole (11), sliding grooves (121) are arranged on the clamping rods (12), buckling columns (13) are arranged in the sliding grooves (121), the clamping rods (12) on adjacent vertex angles are connected with the buckling columns (13) through the sliding grooves (121), the number of the buckling columns (13) is the same as the number of the clamping rods (12), the number of edges of the regular polygons is equal, tension springs (14) are arranged between the adjacent buckling columns (13), the rotary ring (2) is connected with one buckling column (13) through connecting rods (21), the rotary ring (2) is inserted and buckled at the center of the base body fluted disc (1),
the length and the elastic coefficient of the tensioning springs (14) between the adjacent buckling posts (13) are equal,
the clamping rod (12) comprises a sliding groove (121), a hinge joint (122) and a movable head (123), wherein the hinge joint (122) is hinged and fixed outside the regular polygon hole (11), and the movable head (123) rotates by taking the hinge joint (122) as a circle center.
2. The planetary wheel for regular polygon wafer grinding according to claim 1, wherein the buckling column (13) comprises an upper top cap (131), a lower top cap (133) and a connecting column (132), the connecting column (132) is arranged in the sliding groove (121), and the upper top cap (131) and the lower top cap (133) are respectively arranged on the upper side and the lower side of the adjacent clamping rod (12).
3. The planetary wheel for regular polygon wafer grinding according to claim 1, wherein a guide rod (124) is provided at the movable head (123), and a circular ring groove (15) is provided outside the regular polygon hole (11).
4. A star wheel for regular polygon wafer grinding according to claim 3, characterized in that the circular grooves (15) are in one-to-one correspondence with the clamping bars (12).
5. The planetary wheel for regular polygon wafer grinding according to claim 1, wherein two ends of the connecting rod (21) are hinged to the buckling post (13) and the spin ring (2) respectively.
6. A star wheel for regular polygon wafer grinding according to claim 1, characterized in that the regular polygon hole (11) is a regular triangle hole, the number of clamping bars (12), the buckling posts (13) and the tension springs (14) is three.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711007952.6A CN107511752B (en) | 2017-10-25 | 2017-10-25 | A planetary wheel for regular polygon wafer grinds |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711007952.6A CN107511752B (en) | 2017-10-25 | 2017-10-25 | A planetary wheel for regular polygon wafer grinds |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107511752A CN107511752A (en) | 2017-12-26 |
| CN107511752B true CN107511752B (en) | 2024-03-15 |
Family
ID=60727645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711007952.6A Active CN107511752B (en) | 2017-10-25 | 2017-10-25 | A planetary wheel for regular polygon wafer grinds |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107511752B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE393606C (en) * | 1923-03-12 | 1924-04-05 | Frederic Beck | Chuck |
| EP0780696A1 (en) * | 1995-12-22 | 1997-06-25 | Sinano Electronics Co., Ltd. | IC test handler |
| JP2000061828A (en) * | 1998-08-20 | 2000-02-29 | Hamai Co Ltd | Work carrier stop position control device for epicyclic gear type parallel flat surface finishing machine |
| CN201195279Y (en) * | 2008-04-30 | 2009-02-18 | 佛山市一鼎科技有限公司 | Planetary casting and grinding disc with excellent lubricating ability |
| JP2009178806A (en) * | 2008-01-31 | 2009-08-13 | Seiko Epson Corp | Polishing carrier, and polishing device |
| CN102049728A (en) * | 2010-08-27 | 2011-05-11 | 中国航空工业第六一八研究所 | Laser gyro lens excircle grinding and polishing method |
| JP2014172148A (en) * | 2013-03-12 | 2014-09-22 | Sii Crystal Technology Inc | Carrier |
| CN104669106A (en) * | 2015-02-10 | 2015-06-03 | 盐城工学院 | Double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for large-sized A-directional sapphire mobile phone screen |
| CN207309694U (en) * | 2017-10-25 | 2018-05-04 | 德清凯晶光电科技有限公司 | A kind of erratic star wheel for regular polygon wafer grinding |
-
2017
- 2017-10-25 CN CN201711007952.6A patent/CN107511752B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE393606C (en) * | 1923-03-12 | 1924-04-05 | Frederic Beck | Chuck |
| US1512078A (en) * | 1923-03-12 | 1924-10-21 | Beck Frederic | Automatic chuck |
| EP0780696A1 (en) * | 1995-12-22 | 1997-06-25 | Sinano Electronics Co., Ltd. | IC test handler |
| JP2000061828A (en) * | 1998-08-20 | 2000-02-29 | Hamai Co Ltd | Work carrier stop position control device for epicyclic gear type parallel flat surface finishing machine |
| JP2009178806A (en) * | 2008-01-31 | 2009-08-13 | Seiko Epson Corp | Polishing carrier, and polishing device |
| CN201195279Y (en) * | 2008-04-30 | 2009-02-18 | 佛山市一鼎科技有限公司 | Planetary casting and grinding disc with excellent lubricating ability |
| CN102049728A (en) * | 2010-08-27 | 2011-05-11 | 中国航空工业第六一八研究所 | Laser gyro lens excircle grinding and polishing method |
| JP2014172148A (en) * | 2013-03-12 | 2014-09-22 | Sii Crystal Technology Inc | Carrier |
| CN104669106A (en) * | 2015-02-10 | 2015-06-03 | 盐城工学院 | Double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for large-sized A-directional sapphire mobile phone screen |
| CN207309694U (en) * | 2017-10-25 | 2018-05-04 | 德清凯晶光电科技有限公司 | A kind of erratic star wheel for regular polygon wafer grinding |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107511752A (en) | 2017-12-26 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240208 Address after: In Datong Industry and Trade Park, Tongling Bridge Economic Development Zone, Suburbs of Tongling City, Anhui Province, 244000 Applicant after: Anhui Baowei Intelligent Technology Co.,Ltd. Country or region after: China Address before: South Gate of Building 3, No. 345 Changhong East Street, Wukang Town, Deqing County, Huzhou City, Zhejiang Province, 313000 Applicant before: DEQING KAIJING PHOTOELECTRIC TECHNOLOGY CO.,LTD. Country or region before: China |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |