CN107509301A - A kind of circuit board and optical module - Google Patents
A kind of circuit board and optical module Download PDFInfo
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- CN107509301A CN107509301A CN201710591275.0A CN201710591275A CN107509301A CN 107509301 A CN107509301 A CN 107509301A CN 201710591275 A CN201710591275 A CN 201710591275A CN 107509301 A CN107509301 A CN 107509301A
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- Prior art keywords
- circuit board
- cabling
- electric capacity
- circuit
- filter capacitor
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
Abstract
The embodiment of the invention discloses a kind of circuit board and optical module.Circuit board in the program, applied in optical module, laser driving chip and filter capacitor unit are provided with the circuit board；Wherein, the laser driving chip has ce circuit；The ce circuit has frequency locking pin and reference ground pin；Stratum, insulating barrier and the routing layer of stacking are additionally provided with the circuit board；Wherein, one end of the filter capacitor unit is connected by the first cabling of the routing layer with the frequency locking pin, and the other end is connected by the second cabling of the routing layer with the reference ground pin；Wherein：A node on second cabling is connected by via with the stratum so that filter capacitor unit and reference ground the pin ground connection.Solve in existing optical module, the problem of job stability is poor under the maximum conditions of the ce circuit of laser driving chip.
Description
Technical field
The present invention relates to technical field of photo communication, more particularly to a kind of circuit board and optical module.
Background technology
In optical communications, optical module can realize opto-electronic conversion, with the high speed development of optical communications industry, communication network
Transmission rate and distance are significantly increased, and dispersion and link attenuation are also more serious, the performance of optical module it is also proposed higher
Requirement, using the laser driving chip with clock and data recovery (Clock and data recovery, CDR) function,
Clock recovery extraction can be achieved so that distorted signal is recovered, and improves signal quality, is improved to the sensitive of signal identification
Degree, increase link margin, lift robustness.
More ripe, the shown in Figure 1 optical module of integrated CDR technologies in the laser driving chip of optical module
101, one end connection transmitting telecommunication number of electric interfaces 102 of optical module 101, other end connection optical fiber 103 transmits optical signal, optical mode
Block 101 includes single-chip microcomputer 104, light transceiver module (Bi-Directional Optical Sub-Assembly, BOSA)
105 and laser driving chip (Laser Diode Driver, LDD) 106.Wherein, single-chip microcomputer 104 is used to realize control work(
Energy.Wherein, BOSA105 includes light transmitting (Transmitting, TX) unit 107 and light-receiving (Receiving, RX) unit
108.Wherein, LDD chips 106 include transmitting terminal ce circuit 109, laser driving circuit unit 1010, receiving terminal ce circuit
1011 and limiting amplifier 1012.In force, transmission signal enters optical module 101 through optical module electric interfaces 102, passes through
Laser driving circuit unit 1010 is input to after the clock and data recovery of transmitting terminal ce circuit 109 of LDD chips 106, completes hair
The clock and data recovery at end is penetrated, is sent by light TX units 107.The light that light RX units 108 receive input arranges signal
Afterwards, it is converted into by the amplification of internal trans-impedance amplifier after voltage signal and is input to limiting amplifier 1012, after signal transacting
The receiving terminal ce circuit 1011 of LDD chips is input to, extracts clock so that clock and data keep correct phase relation, code
Exported after first synchronization to digital terminal.
Wherein, the transmitting terminal ce circuit 109 and receiving terminal ce circuit 1011 being integrated in LDD chips 106 are based on lock
What phase ring principle was realized, as shown in Fig. 2 ce circuit includes phase discriminator 201, loop filter (Loop Filter, LF) 202 Hes
Voltage controlled oscillator 203.Wherein, phase discriminator 201 completes input signal Vi (t) and output signal Vo (t) phase error computation, by mistake
Poor result is inputted to loop filter 202, and loop filter 202 passes through integral and calculating, filters high fdrequency component and noise, voltage-controlled to shake
Swing the loop filtering voltage V that device (Voltage Controlled, VCO) is exported by loop filterLFControl, make its frequency to defeated
The frequency for entering signal is drawn close, until frequency difference disappears, loop-locking (is referred to as frequency locking process), so as to complete clock and phase recovery.
Wherein, loop filter 202 is grounded by filter capacitor, eliminates noise.Wherein, voltage controlled oscillator 203 is a voltage-frequency
Converter, its instantaneous frequency are the functions of control voltage, can be understood as V hereinLFFunction, due to working as loop filter
When the filter capacitor failure of 202 connections, V can be causedLFChange, thus ultimately result in ce circuit frequency locking exception, produce
The problem of losing lock.In view of VLFImportance, loop filter 202 connect filter capacitor pin can be considered frequency locking pipe
Pin, the voltage of frequency locking pin is exactly VLF。
At present, periphery circuit design corresponding to frequency locking pin is all according in general circuit board (Printed Circuit
Board, PCB) custom is designed to determine, rafferty can be sayed.For example in the prior art, the ce circuit in LDD chips includes connecing
Frequency locking pin TX_LF, RX_LF of receiving end and transmitting terminal, reference ground pin TXVCOVEE, RXVCOVEE, wherein, TX_LF, RX_
The two pins of LF connect filter capacitor respectively, filter capacitor ground connection, eliminate noise；TXVCOVEE, RXVCOVEE are grounded respectively,
Reference ground is provided for ce circuit.At present, mostly by filter capacitor directly with the radiating the earth pads of LDD chip bottoms (i.e. thermally
Pad 1013) connection, the wiring diagram shown in schematic diagram and Fig. 4 shown in Figure 3：
RX_LF pins connection electric capacity C1 ' first end, C1 ' the second end and C11 ' first end connect, and the second of C11 '
End is connected with RXVCOVEE pins, and RXVCOVEE pins are grounded by thermally pad；In figure, from RX_LF pins by C1 ',
C11 ' to crosspoint J1 path length is L1 ', is L2 ' from the path length of crosspoint J1 to RXVCOVEE pins,
The path length of RXVCOVEE pins and thermally pad is L3 '.
TX_LF pins connection electric capacity C2 ' first end, C2 ' the second end and C22 ' first end connect, and the second of C22 '
End is connected with TXVCOVEE pins, and TXVCOVEE pins are grounded by thermally pad；From TX_LF pins by C2 ', C22 ' best friends
Crunode J2 path length is L4 ', and from crosspoint J2 to TXVCOVEE, the path length of pin is L5 ', TXVCOVEE pins with
Thermally the path length between pad is L6 '.
Wherein, electric capacity C1 ', C11 ', C2 ' and C22 ' specification are 0402 encapsulation multi-layer ceramic capacitance.
Typically, if filter capacitor is unstable, certain electric leakage can be produced and flow into frequency locking pin.As described above
PCB trace fabric swatch mode, not only can by thermally pad noise introduce frequency locking pin, because return flow path is longer, PCB
The noise that substantial amounts of stray inductance is brought can also be introduced frequency locking pin by cabling.At this moment, due to electricity that frequency locking pin can bear
It is certain to flow thresholding, with the introducing of noise, occupies certain current margin, causes frequency locking pin to bear leakage current
Degree reduces.The much noise of PCB trace introducing is added if there is larger leakage current, frequency locking pin may be exceeded
Threshold, lead to not the voltage V for identifying frequency locking pinLF, cause ce circuit job insecurity.Especially in test environment
Cataclysm temperature reduce during because test environment temperature drastically decline and optical module in steam accumulation, filtering
The leakage current paths of transient state are formed in passage, on capacitive surface or PCB, cause CDR loop filters V in chipLFVoltage has
One quick change, VLFVoltage is provided that CDR frequency locking point, because ce circuit is unable to quick response VLFChange and lose
Lock can produce a large amount of error codes, it is necessary to frequency locking again in this period, have a strong impact on the stability of ce circuit work, influence optical mode
The performance of block, the packet loss even company of mistake of probability of occurrence.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of circuit board and optical module, for solving in existing optical module, swashs
The problem of job stability of the ce circuit of light device driving chip under severe low temperature environment is poor.
The purpose of the embodiment of the present invention is achieved through the following technical solutions：
A kind of circuit board, applied in optical module, laser driving chip and filter capacitor are provided with the circuit board
Unit；Wherein, the laser driving chip has ce circuit；The ce circuit has frequency locking pin and reference ground pin；
Stratum, insulating barrier and the routing layer of stacking are additionally provided with the circuit board；Wherein, one end of the filter capacitor unit passes through
First cabling of the routing layer is connected with the frequency locking pin, second cabling and the ginseng of the other end by the routing layer
Examine ground pin connection；Wherein：
A node on second cabling is connected by via with the stratum so that the filter capacitor unit and
Reference ground pin is grounded；Wherein, the via runs through the circuit board, and connection second cabling is provided with the via
With the conductive lead wire on the stratum.
It is preferred that the electric capacity employed in the filter capacitor unit is C0G electric capacity or NPO electric capacity.
It is preferred that the filter capacitor unit is made up of single electric capacity；The first end of the electric capacity passes through first cabling
It is connected with the frequency locking pin, the second end is connected by second cabling with the reference ground pin.
It is preferred that the filter capacitor unit is in series by two electric capacity；The first end of one of electric capacity passes through institute
State the first cabling to be connected with the frequency locking pin, the second end is connected with the first end of another electric capacity；The second of another electric capacity
End is connected by second cabling with the reference ground pin.
It is preferred that the track lengths between the node and the electric capacity connected are less than 0.5mm.
It is preferred that the track lengths between the node and the reference ground pin are less than 0.5mm.
A kind of optical module, the optical module include the circuit board as described in any of the above item.
The embodiment of the present invention has the beneficial effect that：
Due to the frequency locking pin of ce circuit in laser driving chip, there is provided be voltage signal, once the severe ring of low temperature
Filter capacitor surface is easy to accumulate steam under border, and electric leakage rheology is big, along with the much noise introduced by PCB trace, reduces
Frequency locking pin is to leakage current Bearing degree, the voltage V of frequency locking pinLFEasily undergo mutation, because ce circuit can not quickly ring
Answer VLFChange and losing lock has a strong impact on ce circuit work, it is necessary to frequency locking again, a large amount of error codes can be produced in this period
Stability, influence the performance of optical module, the packet loss even company of mistake of probability of occurrence.Circuit board and light provided in an embodiment of the present invention
In module, frequency locking pin connection filter capacitor unit be connected by cabling with reference ground pin after, directly in the cabling
Stratum is connected to from routing layer by via nearby at one node so that filter capacitor unit and reference ground pin ground connection, and
It is non-using in the prior art by reference to ground pin connection thermally pad ground connection scheme, compared with prior art, avoid by
Thermally the noise of pad is coupled into frequency locking pin via return flow path by filter capacitor, reduces interference electric current, shortens back
Road track lengths, reduce stray inductance and dead resistance, low-impedance return flow path is provided as far as possible, while reduce returning for signal
Flow area, interference electric current generation is reduced, the influence for bearing program to the leakage current of frequency locking pin is reduced, so as to reduce
Under severe low temperature environment, peripheral circuit losing lock problem caused by frequency locking pin transient changing of ce circuit, CDR is improved
The stability of circuit work, and then improve the performance of optical module.
Brief description of the drawings
Fig. 1 is the structure chart of optical module of the prior art；
Fig. 2 is the structure chart of the ce circuit of optical module of the prior art；
Fig. 3 is the peripheral circuit principle schematic of LDD chips on circuit board of the prior art；
Fig. 4 is the peripheral circuit schematic wiring diagram of LDD chips on circuit board of the prior art；
Fig. 5 a are one of board structure of circuit schematic diagram provided in an embodiment of the present invention；
Fig. 5 b are sectional view of the circuit board provided in an embodiment of the present invention in AA ' directions；
Fig. 6 is the two of board structure of circuit schematic diagram provided in an embodiment of the present invention；
Fig. 7 is the three of board structure of circuit schematic diagram provided in an embodiment of the present invention；
Fig. 8 is circuit board wiring principle schematic provided in an embodiment of the present invention；
Fig. 9 is the four of board structure of circuit schematic diagram provided in an embodiment of the present invention；
Figure 10 is the contrast signal of routing structure for circuit board provided in an embodiment of the present invention and the wire structures of prior art
Figure.
Embodiment
A kind of circuit board provided by the invention and optical module are described in more detail with reference to the accompanying drawings and examples.
As shown in figure 5 a and 5b, the embodiment of the present invention provides a kind of circuit board, applied in optical module, circuit board 501
On be provided with laser driving chip 502 and filter capacitor unit 503；Wherein, laser driving chip 502 has ce circuit；
Ce circuit has frequency locking pin 504 and reference ground pin 505；Stratum 506, the insulating barrier 507 of stacking are additionally provided with circuit board
And routing layer；Wherein, one end of filter capacitor unit 503 is connected by the first cabling 508 of routing layer with frequency locking pin 504,
The other end is connected by the second cabling 509 of routing layer with reference ground pin 505；Wherein：
A node on second cabling 509 is connected by via 510 with stratum 506 so that the He of filter capacitor unit 503
Reference ground pin 505 is grounded；Wherein, via 510 runs through circuit board, and the second cabling 509 of connection and stratum are provided with via
506 conductive lead wire 511.
It should be noted that being additionally provided with other film layer structures on circuit board 501, do not embodied in figure.
Due to the frequency locking pin of ce circuit in laser driving chip, there is provided be voltage signal, once the severe ring of low temperature
Filter capacitor surface is easy to accumulate steam under border, and electric leakage rheology is big, along with the much noise introduced by PCB trace, reduces
Frequency locking pin is to leakage current Bearing degree, the voltage V of frequency locking pinLFEasily undergo mutation, because ce circuit can not quickly ring
Answer VLFChange and losing lock has a strong impact on ce circuit work, it is necessary to frequency locking again, a large amount of error codes can be produced in this period
Stability, influence the performance of optical module, the packet loss even company of mistake of probability of occurrence.In scheme provided in an embodiment of the present invention, lock
After the filter capacitor unit of frequency pin connection is connected by cabling with reference ground pin, directly at a node of the cabling
Stratum is connected to from routing layer by via nearby so that filter capacitor unit and reference ground pin ground connection, rather than using existing
By reference to the ground pin connection scheme that thermally pad is grounded in technology, compared with prior art, avoid thermally pad
Noise is coupled into frequency locking pin via return flow path by filter capacitor, reduces interference electric current, and shortens loop cabling
Length, reduce stray inductance and dead resistance, provide low-impedance return flow path as far as possible, while reduce the backflow surface of signal
Product, interference electric current generation is reduced, the influence for bearing program to the leakage current of frequency locking pin is reduced, is being disliked so as to reduce
Under bad low temperature environment, peripheral circuit losing lock problem caused by frequency locking pin transient changing of ce circuit, ce circuit is improved
The stability of work, and then improve the performance of optical module.
In view of the electric capacity of the relatively low specification of such as X7R/X5R specifications, capacitance is unstable, volume change 15%, electricity
Appearance causes the unstable of filter circuit if changing, in environment temperature dramatic decrease, accumulation and electric capacity due to steam
It is relatively unstable, it is easy in electric capacity, on capacitive surface or optical module interior circuit board formed a transient state leakage current
Path, produce the losing lock problem of the above.Thus, inventor is during the present invention is realized, further from the selection of electric capacity
On be improved.
When it is implemented, further to improve the stability of ce circuit, the electric capacity of high gauge can be used.Typically, it is electric
A circuit connected by resistance, inductance and electric capacity can be equivalent to by holding.Therefore, it is possible to using equivalent series resistance and equivalent string
Join the less electric capacity of inductance and form filter capacitor unit.So, because induction reactance is smaller, the stability of capacitance is higher.
Based on this, it is preferred that the equivalent series resistance of the electric capacity of use in filter capacitor unit is less than the first default threshold
It is worth and equivalent series inductance is less than the second predetermined threshold value.Wherein, the first predetermined threshold value and the second predetermined threshold value can be rule of thumb
It is configured.
It is preferred that the electric capacity used in filter capacitor unit is C0G or negative positive zero (Negative-Positive-
Zero, NPO) electric capacity.In the present embodiment, the temperature stability of the electric capacity of use is higher ranked, and capacitance stability is high.
In addition to electric capacity listed above, other types of electric capacity can also be used, will not enumerate herein.
When it is implemented, it is preferred that the structure of filter capacitor unit have it is a variety of.Two kinds of structures are set forth below：
Consideration in terms of for stability, as shown in fig. 6, filter capacitor unit is in series by two electric capacity；Wherein one
Individual electric capacity C first end is connected by the first cabling with frequency locking pin, and the second end is connected with the first end of another electric capacity；It is another
Individual electric capacity C ' the second end is connected by the second cabling with reference ground pin.So, can if an electric capacity goes wrong
To there is another electric capacity to do alternatively.In the present embodiment, two electric capacity can use the electric capacity of above high standard, and it is steady to improve temperature
Qualitative, capacitance stability, so as to further increase stability in the presence of a harsh environment.
Further, the space that filter capacitor unit accounts for if setting two electric capacity is larger, for small-sized encapsulated optical mode
For block, fabric swatch limited space.To avoid this problem, an electric capacity can be used, as shown in fig. 7, filter capacitor list
Member is made up of single electric capacity；Electric capacity C first end is connected by the first cabling with frequency locking pin, and the second end passes through the second cabling
It is connected with reference ground pin.In the present embodiment, the single electric capacity used improves temperature for the electric capacity of high standard enumerated above
Stability, capacitance stability, so as to further increase stability in the presence of a harsh environment.
When it is implemented, it is preferred that the electric capacity that is connected of the nodal distance on the second cabling is more near better, can be further
Reduce the track lengths of ground connection, reduce return flow path, flow back area, reduces the introducing of interference electric current., can be according to need in implementation
Design node distance is wanted to connect the distance of electric capacity.It is preferred that walking between node on the second cabling and the electric capacity connected
Line length is less than 0.5mm.It is preferred that the track lengths between node and reference ground pin on the second cabling are less than 0.5mm.
Based on same inventive concept, the embodiment of the present invention also provides a kind of optical module, and the optical module is included as more than
Circuit board described in any embodiment.
Below by taking specific structure as an example, a kind of circuit board provided in an embodiment of the present invention and optical module are carried out more detailed
Carefully illustrate.
In the optical module of the present embodiment, the wiring diagram shown in the schematic diagram and Fig. 9 of circuit board shown in Figure 8：
Wherein, optical module includes circuit board 501, laser driving chip 502 and filter capacitor unit 503.Laser drives
Dynamic chip 502 has ce circuit.Stratum (GND) 505, insulating barrier 507 and the routing layer of stacking are provided with circuit board 501.
Wherein, the ce circuit of receiving terminal has a frequency locking pin 504, i.e., the RX_LF pins in figure, reference ground pin 505,
RXVCOVEE pins i.e. in figure；The ce circuit of transmitting terminal has frequency locking pin 504, i.e., the TX_LF pins in figure, reference ground
TXVCOVEE pins in pin 505, i.e. figure.
Wherein, RX_LF pins connect the first of electric capacity C1 (i.e. above-mentioned filter capacitor unit 503) by the first cabling 508
End, electric capacity C1 the second end are connected by the second cabling 509 with RXVCOVEE pins, electric capacity C1 the second end and RXVCOVEE pipes
Pin accesses stratum 506 at a node on the second cabling 509 commonly through via 510；In figure, the section on the second cabling
Point left side, from via by the path length of electric capacity C1, RX_LF pin it is L1, on the right side of the node on the second cabling, from via
Path length to RXVCOVEE pins is L2.L1 and L2 crosspoint J1 is the node on the second cabling 509 in figure.
Wherein, TX_LF pins connect the first of electric capacity C2 (i.e. above-mentioned filter capacitor unit 503) by the first cabling 508
End, electric capacity C2 the second end are connected by the second cabling 509 with TXVCOVEE pins, electric capacity C2 the second end and TXVCOVEE pipes
Pin accesses stratum 506 at a node on the second cabling 509 commonly through via 510；In figure, in the node of the second cabling
Left side, from path length of the via through electric capacity C2, TX_LF pin be L3, on the right side of the node of the second cabling, from via pass through
The path length of TXVCOVEE pins is L4.L3 and L4 crosspoint J2 is the node on the second cabling 509 in figure.
Wherein, the structure of via 510 may refer to Fig. 5 b implementations.
Wherein, J1 and J2 is respectively arranged at the position nearer apart from electric capacity C1 and C2, it is preferred that the cabling between J1 and C1
Distance is less than 0.5mm；Cable run distance between J1 and RXVCOVEE pins is less than 0.5mm.Cable run distance between J2 and C2 is small
In 0.5mm；Cable run distance between J2 and TXVCOVEE pins is less than 0.5mm.
In the present embodiment, electric capacity C1, RXVCOVEE pin are directly grounded by via 510, rather than drive core with laser
The thermally pad 512 of piece 502 connects to be grounded again；Electric capacity C2, TXVCOVEE pin are directly grounded by via 510, rather than with swashing
The thermally pad 512 of light device driving chip 502 connects to be grounded again；The noise coupling by thermally pad 512 can be avoided to enter TX_LF
Pin and RX_LF pins.Also, there is complete stratum 506 (not entirely shown in figure) on general circuit plate 501, lead to from routing layer
Via is equal to the distance on stratum 506, and we are represented with D1 herein, that is to say, that if necessary to contrast the length of distance
It is short, it is only necessary to routing layer can be considered, because vertical range between layers is equal.From fig. 10 it can be seen that phase
Than in traditional peripheral circuit fabric swatch mode from J1 to L2 ', L3 ', from J2 to L5 ', L6 ', the optimization design that the present embodiment proposes,
J1, J2 are mainly reduced to thermally the distance between pad, the punched ground connection directly at J1, J2；Represented according in Figure 10, D1
The traditional fabric swatch mode in ＜ L2 '+L3 '+D1, RX_LF pin periphery has more L2 '+L3 ' distance than the distance after optimization；D1 ＜
The traditional fabric swatch mode in L5 '+L6 '+D1, TX_LF pin periphery has more L5 '+L6 ' distance than the distance after optimization.Thus, this
The scheme of embodiment shortens loop track lengths, reduces stray inductance and dead resistance, provides low-impedance backflow road as far as possible
Footpath, while the backflow area of signal is reduced, reduce interference electric current generation.To sum up, the scheme of the present embodiment reduces by PCB
Cabling introduces the noise of frequency locking pin, the influence for bearing program to the leakage current of frequency locking pin is reduced, so as to solve
Under severe low temperature environment, CDR peripheral circuits are because of the V of frequency locking pinLFLosing lock problem caused by transient changing, improves ce circuit
Stability, so as to improve the stability of optical module.
Further, electric capacity C1 and C2 uses the C0G electric capacity of 0603 encapsulation, by using big encapsulation, temperature stabilization grade
High electric capacity, the stability of capacitance is higher, and the noise of introduction is smaller, the risk for producing transient state leakage current paths is reduced, so as to enter
One step solves under severe low temperature environment CDR peripheral circuits because of the V of frequency locking pinLFLosing lock problem caused by transient changing, is carried
The high stability of ce circuit, so as to improve the stability of optical module.
When it is implemented, according to filter high frequency small capacitances, the principle of filter low frequency bulky capacitor, to choose the electricity of suitable capacitance
Hold, be relatively adapted to PF magnitudes here to the electric capacity of NF magnitudes, according to the application difference of circuit, it is necessary to debug decision.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (7)
1. a kind of circuit board, applied in optical module, laser driving chip and filter capacitor list are provided with the circuit board
Member；Wherein, the laser driving chip has ce circuit；The ce circuit has frequency locking pin and reference ground pin；Institute
State the stratum that stacking is additionally provided with circuit board, insulating barrier and routing layer；Wherein, one end of the filter capacitor unit passes through institute
The first cabling for stating routing layer is connected with the frequency locking pin, second cabling and the reference of the other end by the routing layer
Ground pin connection；Characterized in that, wherein：
A node on second cabling is connected by via with the stratum so that the filter capacitor unit and reference
Ground pin ground connection；Wherein, the via runs through the circuit board, and connection second cabling and institute are provided with the via
State the conductive lead wire on stratum.
2. circuit board as claimed in claim 1, it is characterised in that the electric capacity employed in the filter capacitor unit is C0G
Electric capacity or NPO electric capacity.
3. circuit board as claimed in claim 2, it is characterised in that the filter capacitor unit is made up of single electric capacity；The electricity
The first end of appearance is connected by first cabling with the frequency locking pin, and the second end passes through second cabling and the reference
Ground pin connection.
4. circuit board as claimed in claim 2, it is characterised in that the filter capacitor unit is in series by two electric capacity；
The first end of one of electric capacity is connected by first cabling with the frequency locking pin, and the of the second end and another electric capacity
One end connects；Second end of another electric capacity is connected by second cabling with the reference ground pin.
5. the circuit board as described in claim 3 or 4, it is characterised in that the cabling between the node and the electric capacity connected
Length is less than 0.5mm.
6. the circuit board as described in claim 3 or 4, it is characterised in that walking between the node and the reference ground pin
Line length is less than 0.5mm.
7. a kind of optical module, it is characterised in that the optical module includes the circuit board as described in any one of claim 1~6.
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| CN201710591275.0A CN107509301B (en) | 2017-07-19 | 2017-07-19 | Circuit board and optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710591275.0A CN107509301B (en) | 2017-07-19 | 2017-07-19 | Circuit board and optical module |
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| CN107509301A true CN107509301A (en) | 2017-12-22 |
| CN107509301B CN107509301B (en) | 2019-12-20 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739052A (en) * | 2020-12-02 | 2021-04-30 | 上海伟世通汽车电子系统有限公司 | PCB crystal oscillator wiring method |
| CN113946019A (en) * | 2020-07-15 | 2022-01-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| CN113946019B (en) * | 2020-07-15 | 2022-11-29 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112739052A (en) * | 2020-12-02 | 2021-04-30 | 上海伟世通汽车电子系统有限公司 | PCB crystal oscillator wiring method |
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| CN107509301B (en) | 2019-12-20 |
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