CN107507182B - A kind of BGA soldered ball extracting method based on radioscopic image - Google Patents
A kind of BGA soldered ball extracting method based on radioscopic image Download PDFInfo
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- CN107507182B CN107507182B CN201710871624.4A CN201710871624A CN107507182B CN 107507182 B CN107507182 B CN 107507182B CN 201710871624 A CN201710871624 A CN 201710871624A CN 107507182 B CN107507182 B CN 107507182B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0008—Industrial image inspection checking presence/absence
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/13—Edge detection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/136—Segmentation; Edge detection involving thresholding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10072—Tomographic images
- G06T2207/10081—Computed x-ray tomography [CT]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20048—Transform domain processing
- G06T2207/20061—Hough transform
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20092—Interactive image processing based on input by user
- G06T2207/20104—Interactive definition of region of interest [ROI]
Abstract
The BGA soldered ball extracting method based on radioscopic image that the invention proposes a kind of includes the following steps: S1, obtains solder joint original image, loop truss is carried out to original image, weld point image is obtained, just identification is carried out to the soldered ball of each solder joint, obtains the region of interest ROI of each solder joint；S2 just after the completion of identification, each ROI is identified by the way that coordinate system is arranged, generates edge detection operator according to the coordinate system, ROI and edge detection operator carried out related calculation to obtain new image, then carry out Threshold segmentation to new image, obtain edge image；S3 carries out morphology operations to edge image and obtains complete extraction as a result, the result of each solder joint is mapped to original image, forms the characteristics of image after extracting.
Description
Technical field
The present invention relates to the automatic detection field of BGA soldered ball defect more particularly to a kind of BGA welderings based on radioscopic image
The extracting method of ball target.
Background technique
In the prior art, mainly there are following 3 kinds to BGA solder joint contour extraction method on pcb board:
1. pre-processing laggard row threshold division in noise reduction etc. to extract BGA solder joint；
2. gradually being filled to image using unrestrained water law and improved " based on the seed filling side of scan line " obtaining
Take BGA solder joint；As shown in Figs. 1-2；
3. solder joint edge is identified using edge detection methods such as Canny, to obtain soldered ball target.
The grayscale information of digital picture is only utilized in first method, high to gray scale interference and image quality requirements, and easily
Interference by air entrapment and outer lead；Second method is also easy by complicated surrounding enviroment, such as the connection of more conducting wires and
The non-uniform influence of intensity profile, causes to misidentify；The third method has mainly used gradient information to be detected, but ignores
Target is this round information, so that the result of detection is not accurate enough.So in BGA defect detecting technique, soldered ball target
Accurate segmentation is the underlying issue of this field urgent need to resolve.
Summary of the invention
Present invention seek to address that the technical problems existing in the prior art, especially innovatively propose a kind of based on X-ray
The BGA soldered ball extracting method of image.
It is an object of the invention to which accurate soldered ball target can be obtained from the X-ray detection of BGA, consequently facilitating to every
The profile defects and air entrapment defect of a soldered ball carry out accurate detection and analysis, and the present invention provides one kind to be based on X-ray
The BGA soldered ball extracting method of image, includes the following steps:
S1 obtains solder joint original image, carries out loop truss to original image, obtains weld point image, the weldering to each solder joint
Ball carries out just identification, obtains the region of interest ROI of each solder joint；
S2 is separately provided coordinate system to each ROI and carries out smart identification just after the completion of identification, is generated according to the coordinate system
ROI and edge detection operator are carried out related calculation to obtain new image, then are carried out threshold value point to new image by edge detection operator
It cuts, obtains edge image；
S3 carries out morphology operations to edge image and obtains complete extraction as a result, the result of each solder joint is mapped to original
Beginning image forms the characteristics of image after extracting.
The BGA soldered ball extracting method based on radioscopic image, it is preferred that the S1 includes:
Loop truss based on Hough transformation is carried out to original image, tentatively acquires each solder joint CiCentral coordinate of circle PiAnd
Radius Ri。
The BGA soldered ball extracting method based on radioscopic image, it is preferred that the S2 includes:
The solder joint C identifiedi, with central coordinate of circle PiWith diameter 2RiSquare area multiplied by multiplying power k as side length, as
Characteristic area, the value of multiplying power k need comprehensive solder joint density to account for solder joint circularity.
The BGA soldered ball extracting method based on radioscopic image, it is preferred that the S2 includes:
S2-1 establishes rectangular coordinate system by origin of the center of circle, then image is expressed as z (m, n)；
S2-2, any point p in 1st quadrantiCoordinate be (mi,ni), use piIndicate some in original image
Point
S2-3, to piOperator Q (the m usedi,ni) are as follows:
| 0 | a | b |
| -c | 0 | c |
| -b | -a | 0 |
Wherein:
So a=(sin (α)) × (1-cos (α)), b=(sin (α)) × (cos (α)), c=(1-sin (α)) ×
(cos(α))；
Related operation is carried out using corresponding operator to all the points in first quartile:
The point of the second quadrant, third quadrant and fourth quadrant is calculated using the mode for being transformed into first quartile,
S2-4, F (pi) indicating the value that some in edge detection results is put, F (z) indicates edge detection results,
The BGA soldered ball extracting method based on radioscopic image, it is preferred that the S3 further include:
S3-1 carries out Threshold segmentation to F (z) using fixed threshold T, obtains edge image, and fixed threshold T needs basis to obtain
The difference of the equipment of X-ray is taken to be manually adjusted, all images that a set of equipment obtains use the same fixed threshold T,
S3-2 is filled edge image, is eliminated the interior void of edge image using the mode of morphology operations,
Complete BGA solder joint segmentation result is obtained,
S3-3 eliminates image burr or conducting wire bring interference information with operating method is opened, it is special to form the image after extracting
Sign.The morphological operator used is as follows:
In conclusion by adopting the above-described technical solution, the beneficial effects of the present invention are:
Accurate soldered ball target can be obtained from the X-ray detection of BGA, realized by this method convenient for each weldering
The profile defects and air entrapment defect of ball carry out accurately detection and analysis, thus quickly find solder joint and soldered ball defect or
Person guarantees firm welding and reliable and stable.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is prior art original graph；
Fig. 2 is extraction figure in the prior art；
Fig. 3 is that the present invention establishes rectangular coordinate system schematic diagram；
Fig. 4 is the original graph in the specific embodiment of the invention；
Fig. 5 is just to identify schematic diagram to soldered ball in the specific embodiment of the invention；
Fig. 6 is that the present invention is to extract the ROI schematic diagram of single solder joint；
Fig. 7 is that the present invention is edge detection process result schematic diagram；
Fig. 8 is that the present invention is to carry out Threshold segmentation schematic diagram；
Fig. 9 is the present invention for progress area filling and eliminates burr schematic diagram；
Figure 10 is that the present invention is the result schematic diagram handled single solder joint；
Figure 11 is overall effect figure of the present invention to original image processing；
Figure 12 is work flow diagram of the present invention.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " longitudinal direction ", " transverse direction ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.
In the description of the present invention, unless otherwise specified and limited, it should be noted that term " installation ", " connected ",
" connection " shall be understood in a broad sense, for example, it may be mechanical connection or electrical connection, the connection being also possible to inside two elements can
, can also indirectly connected through an intermediary, for the ordinary skill in the art to be to be connected directly, it can basis
Concrete condition understands the concrete meaning of above-mentioned term.
1, soldered ball identifies: carrying out the loop truss based on Hough transformation to original image as shown in Figure 4, tentatively acquires each
A solder joint CiCentral coordinate of circle PiAnd radius Ri；As a result as shown in Figure 5.Corresponding central coordinate of circle and radius are as follows:
| Circle | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
| Central coordinate of circle | (154,539) | (169,352) | (138,726) | (319,546) | (184,168) | (498,209) | (484,379) | (347,189) |
| Radius | 44 | 45 | 45 | 42 | 45 | 41 | 41 | 43 |
| Circle | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 |
| Central coordinate of circle | (637,226) | (332,366) | (304,727) | (625,392) | (457,727) | (472,553) | (599,727) | (612,561) |
| Radius | 40 | 42 | 42 | 40 | 41 | 40 | 39 | 40 |
2, ROI (area-of-interest) is extracted: loop truss is carried out to original image, obtains the center of circle and the radius of each solder joint,
Then it is extracted using each solder joint and surrounding region as ROI.For the solder joint C identified in step 1i, with the center of circle
Coordinate PiWith diameter 2RiSquare area multiplied by a multiplying power k as side length, as the area-of-interest of standard, k is herein
1.3；As shown in Figure 6.By taking the solder joint 1 in the present embodiment as an example, central coordinate of circle is (154,539), and radius is 44, then extracts x
For coordinate from 97 to 211, y-coordinate is the square area from 482 to 596.Step 1 and step 2 are that soldered ball just identifies.
3, soldered ball essence identification (core procedure): the soldered ball inside each ROI is identified and is divided:
Relevant calculation is carried out to original image using the operator of following dynamic generation
3.1 establish rectangular coordinate system by origin of the center of circle, then image is expressed as z (m, n), are indicated in original image using z
Point set, as shown in figure 3,
Any point p in 3.2 1st quadrantsiCoordinate be (mi,ni), use piIndicate some point in original image
3.3 couples of piOperator Q (the m usedi,ni) are as follows:
| 0 | a | b |
| -c | 0 | c |
| -b | -a | 0 |
Wherein:
A=(sin (α)) × (1-cos (α))
B=(sin (α)) × (cos (α))
C=(1-sin (α)) × (cos (α))
Related operation is carried out using corresponding operator to point each in first quartile:
F(pi)=0 × z (mi-1,ni+1)+a×z(mi,ni+1)+b×z(mi+1,ni+1)-c×z(mi-1,ni)+0×z
(mi,ni)+c×z(mi+1,ni)-b×z(mi-1,ni-1)-a×z(mi,ni-1)+0×z(mi+1,ni-1)
For the image of the two or three four-quadrant, handled using following manner:
By the image of the second quadrant, centered on origin, rotate clockwise 90 degree, though the position in first quartile
It sets.Then it is handled using the method for processing first quartile image.Finally by processing result using origin as the center inverse time
Needle is rotated by 90 °, and returns to the position at its original place.In this way, just completing the processing to the second quadrant image.
By the image of third quadrant, centered on origin, rotate clockwise 180 degree, though the position in first quartile
It sets.Then it is handled using the method for processing first quartile image.Finally by processing result using origin as the center inverse time
Needle rotates 180 degree, returns to the position at its original place.In this way, just completing the processing to third quadrant image.
By the image of fourth quadrant, centered on origin, rotate clockwise 270 degree, though the position in first quartile
It sets.Then it is handled using the method for processing first quartile image.Finally by processing result using origin as the center inverse time
Needle rotates 270 degree, returns to the position at its original place.In this way, just completing the processing to fourth quadrant image.
As, by the image of the two or three four-quadrant respectively centered on origin, the position where first quartile is rotated to, so
After use method identical with first quartile to be handled, finally rotate back to home position.
3.4F(pi) indicating the value that some in edge detection results is put, F (z) indicates edge detection results,
3.5 carry out Threshold segmentation to F (z) using fixed threshold T, obtain edge image, in the present embodiment fixed threshold T
It is 0.09,
The image of 3.6 pairs of previous steps is filled, and obtains complete BGA solder joint segmentation result,
3.7 eliminate burr or the interference of conducting wire bring with the opening operation based on morphology opening operation, the morphology calculation used
It is sub as follows:
| 0 | 0 | 1 | 0 | 0 |
| 0 | 1 | 1 | 1 | 0 |
| 1 | 1 | 1 | 1 | 1 |
| 0 | 1 | 1 | 1 | 0 |
| 0 | 0 | 1 | 0 | 0 |
4. the result of each solder joint of previous step identification is mapped back original image, the characteristics of image after extracting is formed.Such as
Shown in Figure 11.
Fig. 4 is the original graph in the present embodiment；
Fig. 5 is just to identify schematic diagram to soldered ball in the present embodiment；
ROI in Fig. 6 to extract single No. 3 solder joints；
Fig. 7 is the result for carrying out step 3.4 and handling；
Fig. 8 is to carry out step 3.5 to continue Threshold segmentation；
Fig. 9 is the result carried out after step 3.6 and 3.7；
Figure 10 is the result handled single solder joint；
Figure 11 is after carrying out step 4 as a result, the complete result handled for original image；
It as shown in figure 12, is flow diagram.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiment or examples in can be combined in any suitable manner.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.
Claims (5)
1. a kind of BGA soldered ball extracting method based on radioscopic image, which comprises the steps of:
S1 obtains solder joint original image, carries out loop truss to original image, obtains weld point image, to the soldered ball of each solder joint into
Row just identification, obtains the region of interest ROI of each solder joint；
S2 is separately provided coordinate system to each ROI and carries out smart identification just after the completion of identification, generates edge according to the coordinate system
ROI and edge detection operator are carried out related calculation to obtain new image, then are carried out Threshold segmentation to new image by detective operators,
Obtain edge image；
S2-1 establishes rectangular coordinate system by origin of the center of circle, then image is expressed as z (m, n)；
S2-2, any point p in 1st quadrantiCoordinate be (mi,ni), use piIndicate some point in original image；
S2-3, to piOperator Q (the m usedi,ni) are as follows:
Wherein:
So a=(sin (α)) × (1-cos (α)), b=(sin (α)) × (cos (α)), c=(1-sin (α)) × (cos
(α))；
Related operation is carried out using corresponding operator to all the points in first quartile:
The point of the second quadrant, third quadrant and fourth quadrant is calculated using the mode for being transformed into first quartile,
S2-4, F (pi) indicating the value that some in edge detection results is put, F (z) indicates edge detection results,
S3 carries out morphology operations to edge image and obtains complete extraction as a result, the result of each solder joint is mapped to original graph
Picture forms the characteristics of image after extracting.
2. the BGA soldered ball extracting method according to claim 1 based on radioscopic image, which is characterized in that the S1 packet
It includes:
Loop truss based on Hough transformation is carried out to original image, tentatively acquires each solder joint CiCentral coordinate of circle PiAnd radius
Ri。
3. the BGA soldered ball extracting method according to claim 2 based on radioscopic image, which is characterized in that the S2 packet
It includes:
The solder joint C identifiedi, with central coordinate of circle PiWith diameter 2RiSquare area multiplied by multiplying power k as side length, as feature
Region, the value of multiplying power k need comprehensive solder joint density to account for solder joint circularity.
4. the BGA soldered ball extracting method according to claim 3 based on radioscopic image, which is characterized in that the S2 is also wrapped
It includes:
Threshold segmentation is carried out to F (z) using fixed threshold T, obtains edge image, fixed threshold T is needed according to acquisition X-ray
The difference of equipment is manually adjusted, and all images that a set of equipment obtains use the same fixed threshold T.
5. the BGA soldered ball extracting method according to claim 3 based on radioscopic image, which is characterized in that the S3 is also wrapped
It includes:
S3-1 is filled edge image, eliminates the interior void of edge image using the mode of morphology operations, obtains
Complete BGA solder joint segmentation result,
S3-2 eliminates image burr or conducting wire bring interference information with operating method is opened, forms the characteristics of image after extracting, make
Morphological operator is as follows:
。
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108280837B (en) * | 2018-01-25 | 2020-06-26 | 电子科技大学 | Method for extracting BGA solder ball contour in X-ray image based on transformation |
| CN111310726B (en) * | 2020-03-13 | 2023-04-07 | 长光(滁州)高端智能装备研究院 | Visual identification and positioning method for ground wire in data wire |
| CN117274365B (en) * | 2023-11-22 | 2024-02-13 | 武汉罗博半导体科技有限公司 | Wafer solder ball diameter detection method, device, equipment and storage medium |
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