CN107506514B - Method and device for predicting rejection rate of PCB (printed circuit board) order - Google Patents

Method and device for predicting rejection rate of PCB (printed circuit board) order Download PDF

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CN107506514B
CN107506514B CN201710530953.2A CN201710530953A CN107506514B CN 107506514 B CN107506514 B CN 107506514B CN 201710530953 A CN201710530953 A CN 201710530953A CN 107506514 B CN107506514 B CN 107506514B
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circuit board
rejection rate
pcb order
copper
pcb
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CN107506514A (en
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宫立军
邱醒亚
张可
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Shenzhen Fastprint Circuit Tech Co Ltd
Guangzhou Fastprint Circuit Technology Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
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Shenzhen Fastprint Circuit Tech Co Ltd
Guangzhou Fastprint Circuit Technology Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
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Priority to PCT/CN2017/120101 priority patent/WO2019000892A1/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"

Abstract

The invention relates to a method and a device for predicting rejection rate of a PCB order, wherein the method comprises the following steps: acquiring a PCB order file of a PCB order to be subjected to rejection rate prediction; determining parameters of the PCB order according to the PCB order file, wherein the parameters comprise circuit board product information of a circuit board product corresponding to the PCB order; and predicting the rejection rate of the PCB order according to the circuit board product information and a preset rejection rate calculation model. By adopting the scheme of the invention, the rejection rate of the PCB order can be predicted without manual intervention, and the efficiency and the accuracy of the rejection rate prediction of the PCB order can be improved.

Description

Method and device for predicting rejection rate of PCB (printed circuit board) order
Technical Field
The invention relates to the technical field of PCBs, in particular to a method and a device for predicting rejection rate of PCB orders.
Background
The PCB (Printed Circuit Board) industry has the characteristics of many customer sources and strong order randomness of the PCB, and the PCB product has the characteristics of strong individuation, many manufacturing parameters and process characteristics, high precision requirement and the like. Due to the characteristics, scrappage is easy to occur in the production process of the PCB, so that enterprises need to predict the manufacturing scrappage of the PCB.
The rejection rate of PCB orders mainly influences the factors: the PCB processing process inevitably has certain rejection conditions, and causes unqualified products and rejection reasons of the products comprise subjective factors and objective factors. The subjective factors mainly refer to the scrap caused by unreasonable artificial design process, misoperation and the like, and the person can be directly traced. The objective factors mainly cause that the product is inevitably scrapped at a certain ratio in the processing and manufacturing process due to the fact that the product needs more processing parameters, the processing characteristics are complex, the process requirement is high, the equipment processing capacity is limited, the environment is uncertain and the like. Obviously, the more complex the product, the higher the feature accuracy requirements, the higher the manufacturing difficulty without improving the manufacturing equipment, and the higher the rejection rate due to objective reasons. The manufacturing difficulty is usually described by an extreme value (product parameter) of the manufacturing parameters of the PCB board, and the closer to the capability boundary, the higher the difficulty, and the exceeding of the capability boundary may cause a rapid increase of the rejection rate. Also, the range of values of one or more characteristics processed by a process directly affects the rejection rate of the process.
In a traditional mode, the rejection rate of PCB orders is mainly predicted by a production scheduling worker according to the difficulty degree of evaluating PCB manufacturing by experience, and the mode has high subjectivity, easily causes inaccurate prediction and consumes long time for prediction.
Disclosure of Invention
In view of this, the present invention provides a method and an apparatus for predicting a rejection rate of a PCB order, a computer-readable storage medium, and a computer device, which can predict the rejection rate of the PCB order without manual intervention, and can improve efficiency and accuracy of predicting the rejection rate of the PCB order.
In a first aspect, a method for predicting rejection rate of a PCB order is provided, which includes:
acquiring a PCB order file of a PCB order to be subjected to rejection rate prediction;
determining parameters of the PCB order according to the PCB order file, wherein the parameters comprise circuit board product information of a circuit board product corresponding to the PCB order;
and predicting the rejection rate of the PCB order according to the circuit board product information and a preset rejection rate calculation model.
With reference to the first aspect, in a possible implementation manner of the first aspect, the circuit board product information includes all or a combination of a plurality of parameter items including the number of layers, plating times of a board, a thickness of a finished board, a minimum hole wall copper thickness, a through hole thickness-diameter ratio, a total hole number, a total flow number, a delivery quantity, a historical yield, a finished unit area, whether copper nickel and gold are plated, whether hard gold is plated, whether a gold finger is provided, whether negative film plating is provided, whether thinning copper is provided, whether a photoelectric board is provided, whether a high-frequency board is provided, whether an IPCIII standard is required to be achieved, whether a line width pitch is smaller than a preset threshold value, and a stitching time.
With reference to the first aspect or some of the foregoing possible implementation manners, in a possible implementation manner of the first aspect, the rejection rate calculation model is:
Rscrapped＝k1*Nlayers+k2*Tplate+k3*TF-plate+k4*Sct-hw+k5*Rth-dm+k6*Nholes+k7*Nt-processes-k8*Qdelivery-k9*Yhis+k10*AF-unit+k11*Wplate1+*k12Wplate2+k13*Wchefs+k14*Wn-plate+k15*Wt-copper+k16*Wp-panel+k17*Wh-fq-board+k18*WIPCIII+k19*WL-width+k20*Npress
wherein R isscrappedIndicates the rejection rate, NlayersNumber of layers, TplateIndicating the number of plate platings, TF-plateShows the thickness of the finished board, Sct-hwDenotes the minimum hole wall copper thickness, Rth-dmRepresents the ratio of the thickness to the diameter of the through hole, NholesDenotes the total number of pores, Nt-processesRepresenting the total flow number, QdeliveryIndicating quantity of delivery, YhisRepresenting the historical yield, AF-unitDenotes the finished unit area, Wplate1Indicates whether the plate is plated with Ni, Au, Wplate2Indicates whether to plate hard gold, WchefsIndicates whether there is a golden finger, Wn-plateIndicating whether or not negative plating is present, Wt-copperIndicates whether there is thinning copper, Wp-panelIndicating whether it is light or notElectric plate, Wh-fq-boardIndicates whether it is a high frequency plate, WIPCIIIIndicates whether the IPCIII standard is required to be met, WL-widthIndicating whether the line width spacing is less than a preset threshold value, NpressIndicates the number of press-fits, k1、k2、k3、k4、k5、k6、k7、k8、k9、k10、k11、k12、k13、k14、k15、k16、k17、k18、k19And k20Coefficient of parameter term.
With reference to the first aspect or some possible implementations described above, in one possible implementation of the first aspect, k1Is 0.3347, k2Is 0.5837, k3Is 0.2654, k4Is 0.0118, k5Is 0.1757, k6Is 0.00006001, k7Is 0.04282, k8Is 0.0002636, k9Is 0.05532, k10Is 42.07, k11Is 2.377, k12Is 0.828, k13Is 0.6899, k14Is 0.886, k15Is 0.6842, k16Is 0.2591, k17Is 0.3622, k18Is 0.4906, k19Is 0.4961, k202.6278;
when the circuit board product is plated with copper, nickel and gold, Wplate1Is 1, otherwise is 0; when the circuit board product is electroplated with hard gold, Wplate2Is 1, otherwise is 0; when the circuit board product has a golden finger, WchefsIs 1, otherwise is 0; when the circuit board product is electroplated with a negative film, Wn-plateIs 1, otherwise is 0; when the circuit board product has thinned copper, Wt-copperIs 1, otherwise is 0; when the circuit board product is a photoelectric board, Wp-panelIs 1, otherwise is 0; when the circuit board product is a high-frequency board, Wh-fq-boardIs 1, otherwise is 0; when the circuit board product is required to reach the IPCIII standard, WIPCIIIIs 1, otherwise is 0; when the line width spacing of the circuit board product is smaller than a preset threshold value, WL-widthIs 1, otherwise is 0;
the predetermined threshold is 3.5 mils.
With reference to the first aspect or some of the foregoing possible implementation manners, in a possible implementation manner of the first aspect, the determining parameters of the PCB order according to the PCB order file includes: and analyzing and processing the PCB order file through a CAM software server to obtain the parameters of the PCB order.
In a second aspect, a PCB order rejection rate prediction apparatus is provided, which includes:
the file acquisition unit is used for acquiring a PCB order file of a PCB order for which the rejection rate is to be predicted;
the information analysis unit is used for determining parameters of the PCB order according to the PCB order file, wherein the parameters comprise circuit board product information of a circuit board product corresponding to the PCB order;
and the rejection rate prediction unit is used for predicting the rejection rate of the PCB order according to the circuit board product information and a preset rejection rate calculation model.
With reference to the second aspect, in a possible implementation manner of the second aspect, the information of the circuit board product includes all or a combination of a plurality of parameter items in the number of layers, the number of times of board plating, the thickness of a finished product board, the minimum hole wall copper thickness, the ratio of thickness to diameter of a through hole, the total number of holes, the total number of flow, the number of delivered products, the historical yield, the area of a finished product unit, whether copper nickel and gold are plated, whether hard gold are plated, whether a gold finger is provided, whether negative film plating is provided, whether thinning copper is provided, whether a photoelectric board is provided, whether a high-frequency board is provided, whether an IPCIII standard is required to be achieved, whether a line width spacing is smaller than a preset threshold value and;
with reference to the second aspect, in a possible implementation manner of the second aspect, the rejection rate calculation model is:
Rscrapped＝k1*Nlayers+k2*Tplate+k3*TF-plate+k4*Sct-hw+k5*Rth-dm+k6*Nholes+k7*Nt-processes-k8*Qdelivery-k9*Yhis+k10*AF-unit+k11*Wplate1+*k12Wplate2+k13*Wchefs+k14*Wn-plate+k15*Wt-copper+k16*Wp-panel+k17*Wh-fq-board+k18*WIPCIII+k19*WL-width+k20*Npress
wherein R isscrappedIndicates the rejection rate, NlayersNumber of layers, TplateIndicating the number of plate platings, TF-plateShows the thickness of the finished board, Sct-hwDenotes the minimum hole wall copper thickness, Rth-dmRepresents the ratio of the thickness to the diameter of the through hole, NholesDenotes the total number of pores, Nt-processesRepresenting the total flow number, QdeliveryIndicating quantity of delivery, YhisRepresenting the historical yield, AF-unitDenotes the finished unit area, Wplate1Indicates whether the plate is plated with Ni, Au, Wplate2Indicates whether to plate hard gold, WchefsIndicates whether there is a golden finger, Wn-plateIndicating whether or not negative plating is present, Wt-copperIndicates whether there is thinning copper, Wp-panelIndicating whether it is a photovoltaic panel, Wh-fq-boardIndicates whether it is a high frequency plate, WIPCIIIIndicates whether the IPCIII standard is required to be met, WL-widthIndicating whether the line width spacing is less than a preset threshold value, NpressIndicates the number of press-fits, k1、k2、k3、k4、k5、k6、k7、k8、k9、k10、k11、k12、k13、k14、k15、k16、k17、k18、k19And k20Coefficient of parameter term.
In combination with the second aspect or some of the possible implementations described above, in one possible implementation of the second aspect, k1Is 0.3347, k2Is 0.5837, k3Is 0.2654, k4Is 0.0118, k5In the order of 0.1757, is,k6is 0.00006001, k7Is 0.04282, k8Is 0.0002636, k9Is 0.05532, k10Is 42.07, k11Is 2.377, k12Is 0.828, k13Is 0.6899, k14Is 0.886, k15Is 0.6842, k16Is 0.2591, k17Is 0.3622, k18Is 0.4906, k19Is 0.4961, k202.6278;
when the circuit board product is plated with copper, nickel and gold, Wplate1Is 1, otherwise is 0; when the circuit board product is electroplated with hard gold, Wplate2Is 1, otherwise is 0; when the circuit board product has a golden finger, WchefsIs 1, otherwise is 0; when the circuit board product is electroplated with a negative film, Wn-plateIs 1, otherwise is 0; when the circuit board product has thinned copper, Wt-copperIs 1, otherwise is 0; when the circuit board product is a photoelectric board, Wp-panelIs 1, otherwise is 0; when the circuit board product is a high-frequency board, Wh-fq-boardIs 1, otherwise is 0; when the circuit board product is required to reach the IPCIII standard, WIPCIIIIs 1, otherwise is 0; when the line width spacing of the circuit board product is smaller than a preset threshold value, WL-widthIs 1, otherwise is 0;
the predetermined threshold is 3.5 mils.
In a third aspect, a computer readable storage medium is provided, on which a computer program is stored, which program, when being executed by a processor, realizes the steps of the PCB order rejection rate prediction method as described above.
In a fourth aspect, a computer device is provided, which includes a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the PCB order rejection rate prediction method as described above.
According to the scheme of the invention, a PCB order file of a PCB order to be subjected to rejection rate prediction is obtained, parameters of the PCB order are determined according to the PCB order file, the parameters comprise circuit board product information of a circuit board product corresponding to the PCB order, and the rejection rate of the PCB order is predicted according to the circuit board product information and a preset rejection rate calculation model. By adopting the scheme of the invention, the rejection rate of the PCB order can be predicted without manual intervention, so that the labor cost can be saved, and the efficiency and the accuracy of prediction can be improved.
Drawings
FIG. 1 is a schematic diagram illustrating an implementation process of a method for predicting rejection rate of a PCB order according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a component of the PCB order rejection rate prediction apparatus in the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
In one embodiment, a PCB order rejection rate prediction method is provided. As shown in fig. 1, the method for predicting rejection rate of PCB orders in this embodiment includes the following steps:
step S101: acquiring a PCB order file of a PCB order to be subjected to rejection rate prediction;
here, the PCB order file is a circuit pattern file that can be used to manufacture a circuit board product.
Step S102: determining parameters of the PCB order according to the PCB order file, wherein the parameters comprise circuit board product information of a circuit board product corresponding to the PCB order;
here, the information of the circuit board product includes parameter values corresponding to each parameter item of the circuit board product, and the parameter values specifically including which parameter items can be determined according to actual needs.
Step S103: and predicting the rejection rate of the PCB order according to the circuit board product information and a preset rejection rate calculation model.
Therefore, according to the scheme of the embodiment, after a PCB order file of a PCB order for which rejection rate prediction is to be performed is obtained, circuit board product information of a circuit board product corresponding to the PCB order is determined according to the PCB order file, and the rejection rate of the PCB order is predicted according to the circuit board product information and a preset rejection rate calculation model. By adopting the scheme of the embodiment, the rejection rate of the PCB order can be predicted without manual intervention, so that the labor cost can be saved, and the prediction efficiency and accuracy can be improved.
In one embodiment, the information of the circuit board product includes the number of layers, the plating times of the board, the thickness of the finished board, the minimum copper thickness of the hole wall, the ratio of the thickness to the diameter of the through hole, the total number of holes, the total number of processes, the delivery quantity, the historical yield, the unit area of the finished product, whether copper nickel and gold are plated, whether hard gold is plated, whether a gold finger is provided, whether negative film plating is provided, whether thinning copper is provided, whether a photoelectric board is provided, whether a high-frequency board is provided, whether an IPCIII standard is required to be reached, whether the line width spacing is smaller than a preset threshold value, and the number of times of pressing. The parameter items included in the circuit board product information can be determined based on actual needs.
In a preferred embodiment, the information of the circuit board product includes the number of layers, the plating times of the board, the thickness of the finished board, the minimum copper thickness of the hole wall, the thickness-diameter ratio of the through hole, the total number of holes, the total number of processes, the delivery number, the historical yield, the unit area of the finished product, whether to be plated with copper, nickel, gold, whether to be plated with hard gold, whether to have a gold finger, whether to have negative plating, whether to have thinning copper, whether to be a photoelectric board, whether to be a high frequency board, whether to require to reach the IPCIII standard, whether to have a line width spacing smaller than a preset threshold. The parameter items included in the circuit board product information in the embodiment are comprehensive, and the accuracy of prediction can be improved. Table 1 shows the parameters of a certain PCB order.
TABLE 1 parameters of PCB orders
Figure BDA0001336487180000061
Figure BDA0001336487180000071
In one embodiment, the rejection rate calculation model may be a weighted sum of all or a combination of a plurality of parameters including the number of layers, plating times of boards, thickness of finished boards, minimum copper thickness of hole walls, thickness-diameter ratio of through holes, total hole number, total flow number, delivery number, historical yield, finished unit area, whether copper nickel gold is plated, whether hard gold is plated, whether gold fingers are provided, whether negative film plating is provided, whether thinned copper is provided, whether photoelectric boards are provided, whether high-frequency boards are provided, whether an IPCIII standard is required to be achieved, whether line width spacing is smaller than a preset threshold and pressing times. Wherein, the weight coefficients of two parameter items of the delivery quantity and the historical yield are negative numbers, and the weight coefficients of the rest parameter items are positive numbers.
In a preferred embodiment, the rejection rate calculation model is the following formula (1):
Figure BDA0001336487180000072
wherein R isscrappedIndicates the rejection rate, NlayersNumber of layers, TplateIndicating the number of plate platings, TF-plateShows the thickness of the finished board, Sct-hwDenotes the minimum hole wall copper thickness, Rth-dmRepresents the ratio of the thickness to the diameter of the through hole, NholesDenotes the total number of pores, Nt-processesRepresenting the total flow number, QdeliveryIndicating quantity of delivery, YhisRepresenting the historical yield, AF-unitDenotes the finished unit area, Wplate1Indicates whether the plate is plated with Ni, Au, Wplate2Indicates whether to plate hard gold, WchefsIndicates whether there is a golden finger, Wh-plateIndicating whether or not negative plating is present, Wt-copperIndicates whether there is thinning copper, Wp-panelIndicating whether it is a photovoltaic panel, Wh-fq-boardIndicates whether it is a high frequency plate, WIPCIIIIndicates whether the IPCIII standard is required to be met, WL-widthIndicating whether the line width spacing is less than a preset threshold value, NpressIndicates the number of press-fits, k1、k2、k3、k4、k5、k6、k7、k8、k9、k10、k11、k12、k13、k14、k15、k16、k17、k18、k19And k20Coefficient of parameter term.
The preset threshold value can be set according to actual needs. Preferably, the predetermined threshold is 3.5 mils, with 1 mil equal to 25.4 microns.
It should be noted that, the rejection rate calculation model in this embodiment considers various main influence factors of the rejection rate of the PCB, and the accuracy of rejection rate prediction can be obviously improved by predicting the rejection rate of the PCB order based on the scheme of this embodiment. However, it should be noted that the rejection rate calculation model is not limited to the formula (1), and for example, when the parameter items included in the circuit board product information are different, the rejection rate calculation model may also have different forms.
In one preferred embodiment, k is calculated by using the formula (1) in the rejection rate calculation model1Is 0.3347, k2Is 0.5837, k3Is 0.2654, k4Is 0.0118, k5Is 0.1757, k6Is 0.00006001, k7Is 0.04282, k8Is 0.0002636, k9Is 0.05532, k10Is 42.07, k11Is 2.377, k12Is 0.828, k13Is 0.6899, k14Is 0.886, k15Is 0.6842, k16Is 0.2591, k17Is 0.3622, k18Is 0.4906, k19Is 0.4961, k202.6278;
when the circuit board product is plated with copper, nickel and gold, Wplate1Is 1, otherwise is 0; when the circuit board product is electroplated with hard gold, Wplate2Is 1, otherwise is 0; when the circuit board product has a golden finger, WchefsIs 1, otherwise is 0; when the circuit board product is electroplated with a negative film, Wn-plateIs 1, otherwise is 0; when the circuit board product has thinned copper, Wt-copperIs 1, otherwise is 0; in thatWhen the circuit board product is a photoelectric board, Wp-panelIs 1, otherwise is 0; when the circuit board product is a high-frequency board, Wh-fq-boardIs 1, otherwise is 0; when the circuit board product is required to reach the IPCIII standard, WIPCIIIIs 1, otherwise is 0; when the line width spacing of the circuit board product is smaller than a preset threshold value, WL-widthIs 1, otherwise is 0;
the predetermined threshold is 3.5 mils.
By adopting the scheme of the embodiment, the accuracy of prediction can be further improved.
Further, the units of the finished plate thickness, the minimum cell wall copper thickness, and the finished unit area are millimeters, micrometers, and square millimeters, respectively.
In one embodiment, the step of determining the parameters of the PCB order according to the PCB order file may include: analyzing and processing the PCB order file through a CAM (computer Aided Manufacturing) software service end to obtain parameters of the PCB order.
Specifically, the PCB order file may be sent to a CAM software server, and parameters of the PCB order returned after the CAM software server performs analysis processing on the PCB order file are received.
Because the CAM software server can rapidly analyze the parameters of the PCB order based on the PCB order file, the prediction efficiency can be further improved by adopting the scheme of the embodiment.
According to the PCB order rejection rate prediction method in the embodiment, the invention also provides a PCB order rejection rate prediction device. Fig. 2 is a schematic structural diagram illustrating a composition of a rejection rate predicting apparatus for PCB orders according to an embodiment of the present invention. As shown in fig. 2, the apparatus for predicting rejection rate of PCB order of the present invention includes a file obtaining unit 201, an information analyzing unit 202, and a rejection rate predicting unit 203, wherein:
a file obtaining unit 201, configured to obtain a PCB order file of a PCB order for which rejection rate prediction is to be performed;
the information analysis unit 202 is configured to determine parameters of the PCB order according to the PCB order file, where the parameters include circuit board product information of a circuit board product corresponding to the PCB order;
and the rejection rate predicting unit 203 is used for predicting the rejection rate of the PCB order according to the circuit board product information and a preset rejection rate calculation model.
In one embodiment, the circuit board product information comprises all parameters or a combination of a plurality of parameters, such as the number of layers, the plating times of the boards, the thickness of finished boards, the minimum wall copper thickness, the thickness-diameter ratio of through holes, the total hole number, the total flow number, the delivery number, the historical yield, the unit area of finished products, whether copper nickel and gold are plated, whether hard gold is electroplated, whether gold fingers exist, whether negative film electroplating exists, whether thinning copper exists, whether photoelectric boards exist or not, whether high-frequency boards exist or not, whether the IPCIII standard is required to be reached, whether the line width spacing is smaller than a preset threshold value and the pressing times;
in one embodiment, the rejection rate calculation model is the above formula (1).
In one embodiment, k1Is 0.3347, k2Is 0.5837, k3Is 0.2654, k4Is 0.0118, k5Is 0.1757, k6Is 0.00006001, k7Is 0.04282, k8Is 0.0002636, k9Is 0.05532, k10Is 42.07, k11Is 2.377, k12Is 0.828, k13Is 0.6899, k14Is 0.886, k15Is 0.6842, k16Is 0.2591, k17Is 0.3622, k18Is 0.4906, k19Is 0.4961, k202.6278;
when the circuit board product is plated with copper, nickel and gold, Wplate1Is 1, otherwise is 0; when the circuit board product is electroplated with hard gold, Wplate2Is 1, otherwise is 0; when the circuit board product has a golden finger, WchefsIs 1, otherwise is 0; when the circuit board product is electroplated with a negative film, Wx-plateIs 1, otherwise is 0; when the circuit board product has thinned copper, Wt-copperIs 1, otherwise is 0; the circuit board product is lightWhen the board is charged, Wp-panelIs 1, otherwise is 0; when the circuit board product is a high-frequency board, Wh-fq-boardIs 1, otherwise is 0; when the circuit board product is required to reach the IPCIII standard, WIPCIIIIs 1, otherwise is 0; when the line width spacing of the circuit board product is smaller than a preset threshold value, WL-widthIs 1, otherwise is 0;
the predetermined threshold is 3.5 mils.
In one embodiment, the information analysis unit 202 may analyze the PCB order file through a CAM software server to obtain parameters of the PCB order.
The description of the PCB order rejection rate prediction device provided by the embodiment of the invention is similar to that of the PCB order rejection rate prediction method, has the beneficial effects of the PCB order rejection rate prediction method, and is not repeated for saving space; therefore, please refer to the above description of the PCB order rejection rate prediction method for the technical details not disclosed in the PCB order rejection rate prediction apparatus provided in the embodiment of the present invention.
Based on the above-mentioned embodiments, an embodiment further provides a computer-readable storage medium, on which a computer program is stored, which when executed by a processor implements the steps of the PCB order rejection rate prediction method as described in any one of the above embodiments.
Based on the above-mentioned embodiments, an embodiment further provides a computer device, which includes a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor executes the computer program to implement the steps of the PCB order rejection rate prediction method in any one of the above-mentioned embodiments. The computer device may be any terminal device including a mobile phone, a tablet computer, a PDA (Personal Digital Assistant), a POS (Point of Sales), a vehicle-mounted computer, a wearable device, and the like.
It will be understood by those skilled in the art that all or part of the processes in the methods of the embodiments described above may be implemented by a computer program, which is stored in a non-volatile computer readable storage medium, and in the embodiments of the present invention, the program may be stored in the storage medium of a computer system and executed by at least one processor in the computer system to implement the processes of the embodiments including the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), or the like.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A method for predicting rejection rate of PCB orders is characterized by comprising the following steps:
acquiring a PCB order file of a PCB order to be subjected to rejection rate prediction;
determining parameters of the PCB order according to the PCB order file, wherein the parameters comprise circuit board product information of a circuit board product corresponding to the PCB order; the circuit board product information comprises the following parameter items: delivery quantity and historical yield;
predicting the rejection rate of the PCB order according to the circuit board product information and a preset rejection rate calculation model; the rejection rate calculation model carries out weighted summation on the parameter items, wherein the weight coefficients of the delivery quantity and the historical yield are negative numbers;
the circuit board product information comprises the number of layers, the plating times of the circuit board, the thickness of a finished product board, the thickness of copper on the minimum hole wall, the thickness-diameter ratio of through holes, the total hole number, the total flow number, the unit area of the finished product, whether copper nickel and gold are plated, whether hard gold is plated, whether a gold finger exists, whether negative film plating exists, whether thinning copper exists, whether a photoelectric board exists, whether a high-frequency board exists, whether the IPCIII standard is required to be reached, whether the line width spacing is smaller than a preset threshold value and whether the combination of all parameters or a plurality of parameters in the pressing times is required;
the rejection rate calculation model is as follows:
Rscrapped＝k1*Nlayers+k2*Tplate+k3*TF-plate+k4*Sct-hw+k5*Rth-dm+k6*Nholes+k7*Nt-processes-k8*Qdelivery-k9*Yhis+k10*AF-unit+k11*Wplate1+*k12Wplate2+k13*Wchefs+k14*Wn-plate+k15*Wt-copper+k16*Wp-panel+k17*Wh-fq-board+k18*WIPCIII+k19*WL-width+k20*Npress
wherein R isscrappedIndicates the rejection rate, NlayersNumber of layers, TplateIndicating the number of plate platings, TF-plateShows the thickness of the finished board, Sct-hwDenotes the minimum hole wall copper thickness, Rth-dmRepresents the ratio of the thickness to the diameter of the through hole, NholesDenotes the total number of pores, Nt-processesRepresenting the total flow number, QdeliveryIndicating quantity of delivery, YhisRepresenting the historical yield, AF-unitDenotes the finished unit area, Wplate1Indicates whether the plate is plated with Ni, Au, Wplate2Indicates whether to plate hard gold, WchefsIndicates whether there is a golden finger, Wn-plateIndicating whether or not negative plating is present, Wt-copperIndicates whether there is thinning copper, Wp-panelIndicating whether it is a photovoltaic panel, Wh-fq-boardIndicates whether it is a high frequency plate, WIPCIIIIndicates whether the IPCIII standard is required to be met, WL-widthIndicating whether the line width spacing is less than a preset threshold value, NpressIndicates the number of press-fits, k1、k2、k3、k4、k5、k6、k7、k8、k9、k10、k11、k12、k13、k14、k15、k16、k17、k18、k19And k20Coefficient of parameter term;
wherein k is1Is 0.3347, k2Is 0.5837, k3Is 0.2654, k4Is 0.0118, k5Is 0.1757, k6Is 0.00006001, k7Is 0.04282, k8Is 0.0002636, k9Is 0.05532, k10Is 42.07, k11Is 2.377, k12Is 0.828, k13Is 0.6899, k14Is 0.886, k15Is 0.6842, k16Is 0.2591, k17Is 0.3622, k18Is 0.4906, k19Is 0.4961, k202.6278;
when the circuit board product is plated with copper, nickel and gold, Wplate1Is 1, otherwise is 0; when the circuit board product is electroplated with hard gold, Wplate2Is 1, otherwise is 0; when the circuit board product has a golden finger, WchefsIs 1, otherwise is 0; when the circuit board product is electroplated with a negative film, Wn-plateIs 1, otherwise is 0; when the circuit board product has thinned copper, Wt-copperIs 1, otherwise is 0; when the circuit board product is a photoelectric board, Wp-panelIs 1, otherwise is 0; when the circuit board product is a high-frequency board, Wh-fq-boardIs 1, otherwise is 0; when the circuit board product is required to reach the IPCIII standard, WIPCIIIIs 1, otherwise is 0; when the line width spacing of the circuit board product is smaller than a preset threshold value, WL-widthIs 1, otherwise is 0;
the predetermined threshold is 3.5 mils.
2. The PCB order rejection rate prediction method of claim 1, wherein the determining the parameters of the PCB order according to the PCB order file comprises: and analyzing and processing the PCB order file through a CAM software server to obtain the parameters of the PCB order.
3. The PCB order rejection rate prediction method of claim 2, wherein the step of obtaining the parameters of the PCB order by analyzing the PCB order file through a CAM software server comprises:
and sending the PCB order file to a CAM software server, and receiving the parameters of the PCB order returned after the CAM software server analyzes and processes the PCB order file.
4. The PCB order rejection rate prediction method of claim 1, wherein the number of layers, the plating times of the board, the thickness of the finished board, the copper thickness of the minimum hole wall, the ratio of the thickness to the diameter of the through hole, the total number of holes, the total number of processes, the area of the finished unit, whether the copper nickel gold is plated or not, whether the hard gold is plated or not, whether the gold finger is plated or not, whether the negative film is plated or not, whether the thinning copper is present or not, whether the photoelectric board is a high frequency board or not, whether the IPCIII standard is required or not, and whether the weight coefficient of the line width spacing is smaller than a preset threshold and the number of pressing is positive.
5. A PCB order rejection rate prediction device is characterized by comprising:
the file acquisition unit is used for acquiring a PCB order file of a PCB order for which the rejection rate is to be predicted;
the information analysis unit is used for determining parameters of the PCB order according to the PCB order file, wherein the parameters comprise circuit board product information of a circuit board product corresponding to the PCB order; the circuit board product information comprises the following parameter items: delivery quantity and historical yield;
the rejection rate prediction unit is used for predicting the rejection rate of the PCB order according to the circuit board product information and a preset rejection rate calculation model; the rejection rate calculation model carries out weighted summation on the parameter items, wherein the weight coefficients of the delivery quantity and the historical yield are negative numbers;
the circuit board product information comprises the number of layers, the plating times of the circuit board, the thickness of a finished product board, the thickness of copper on the minimum hole wall, the thickness-diameter ratio of through holes, the total hole number, the total flow number, the unit area of the finished product, whether copper nickel and gold are plated, whether hard gold is plated, whether a gold finger exists, whether negative film plating exists, whether thinning copper exists, whether a photoelectric board exists, whether a high-frequency board exists, whether the IPCIII standard is required to be reached, whether the line width spacing is smaller than a preset threshold value and whether the combination of all parameters or a plurality of parameters in the pressing times is required;
the rejection rate calculation model is as follows:
Rscrapped＝k1*Nlayers+k2*Tplate+k3*TF-plate+k4*Sct-hw+k5*Rth-dm+k6*Nholes+k7*Nt-processes-k8*Qdelivery-k9*Yhis+k10*AF-unit+k11*Wplate1+*k12Wplate2+k13*Wchefs+k14*Wn-plate+k15*Wt-copper+k16*Wp-panel+k17*Wh-fq-board+k18*WIPCIII+k19*WL-width+k20*Npress
wherein R isscrappedIndicates the rejection rate, NlayersNumber of layers, TplateIndicating the number of plate platings, TF-plateShows the thickness of the finished board, Sct-hwDenotes the minimum hole wall copper thickness, Rth-dmRepresents the ratio of the thickness to the diameter of the through hole, NholesDenotes the total number of pores, Nt-processesRepresenting the total flow number, QdeliveryIndicating quantity of delivery, YhisIndicating calendarShi yield, AF-unitDenotes the finished unit area, Wplate1Indicates whether the plate is plated with Ni, Au, Wplate2Indicates whether to plate hard gold, WchefsIndicates whether there is a golden finger, Wn-plateIndicating whether or not negative plating is present, Wt-copperIndicates whether there is thinning copper, Wp-panelIndicating whether it is a photovoltaic panel, Wh-fq-boardIndicates whether it is a high frequency plate, WIPCIIIIndicates whether the IPCIII standard is required to be met, WL-widthIndicating whether the line width spacing is less than a preset threshold value, NpressIndicates the number of press-fits, k1、k2、k3、k4、k5、k6、k7、k8、k9、k10、k11、k12、k13、k14、k15、k16、k17、k18、k19And k20Coefficient of parameter term;
wherein k is1Is 0.3347, k2Is 0.5837, k3Is 0.2654, k4Is 0.0118, k5Is 0.1757, k6Is 0.00006001, k7Is 0.04282, k8Is 0.0002636, k9Is 0.05532, k10Is 42.07, k11Is 2.377, k12Is 0.828, k13Is 0.6899, k14Is 0.886, k15Is 0.6842, k16Is 0.2591, k17Is 0.3622, k18Is 0.4906, k19Is 0.4961, k202.6278;
when the circuit board product is plated with copper, nickel and gold, Wplate1Is 1, otherwise is 0; when the circuit board product is electroplated with hard gold, Wplate2Is 1, otherwise is 0; when the circuit board product has a golden finger, WchefsIs 1, otherwise is 0; when the circuit board product is electroplated with a negative film, Wn-plateIs 1, otherwise is 0; when the circuit board product has thinned copper, Wt-copperIs 1, otherwise is 0; when the circuit board product is a photoelectric board, Wp-panelIs 1, otherwise is 0; when the circuit board product is a high-frequency board，Wh-fq-boardIs 1, otherwise is 0; when the circuit board product is required to reach the IPCIII standard, WIPCIIIIs 1, otherwise is 0; when the line width spacing of the circuit board product is smaller than a preset threshold value, WL-widthIs 1, otherwise is 0;
the predetermined threshold is 3.5 mils.
6. The PCB order rejection rate prediction device of claim 5, wherein: and the information analysis unit is also used for analyzing and processing the PCB order file through the CAM software service end to obtain the parameters of the PCB order.
7. The PCB order rejection rate prediction device of claim 6, wherein: and the information analysis unit is also used for sending the PCB order file to a CAM software server and receiving the parameters of the PCB order returned after the CAM software server analyzes and processes the PCB order file.
8. The PCB order rejection rate prediction device of claim 5, wherein: the number of layers, the plating times of the board, the thickness of the finished board, the copper thickness of the minimum hole wall, the thickness-diameter ratio of the through holes, the total hole number, the total flow number, the unit area of the finished product, whether copper nickel gold is plated or not, whether hard gold is electroplated or not, whether a gold finger exists or not, whether negative film electroplating exists or not, whether thinning copper exists or not, whether a photoelectric board is adopted or not, whether a high-frequency board is adopted or not, whether the requirement of reaching the IPCIII standard is met or not, and whether the weight coefficient of the line width spacing is smaller than a preset threshold value or not and the pressing times is positive.
9. A computer-readable storage medium, on which a computer program is stored, which program, when being executed by a processor, is adapted to carry out the steps of the PCB order rejection rate prediction method according to one of the claims 1 to 4.
10. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor when executing the program performs the steps of the PCB order scrap rate prediction method according to one of claims 1 to 4.
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