CN107505559B - The system of detection chip sensitive position in error injection test - Google Patents
The system of detection chip sensitive position in error injection test Download PDFInfo
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- CN107505559B CN107505559B CN201710749227.XA CN201710749227A CN107505559B CN 107505559 B CN107505559 B CN 107505559B CN 201710749227 A CN201710749227 A CN 201710749227A CN 107505559 B CN107505559 B CN 107505559B
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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Abstract
The system that the present invention discloses detection chip sensitive position in a kind of test of error injection, by during error injection attack test, acquire the status signal, position signal, leakage current signal etc. of chip to be measured, the sensitive position region on chip is determined according to its status signal, position signal, leakage current signal identification, pre-generatmg sensitive position information, it is subsequent further to be tested in determining sensitive position regional scope, and during the test, sensitive position information is updated, is refined.The sensitive position of chip can be accurately positioned out in system of the invention, and test job efficiency is substantially improved, and guarantee accuracy, the validity of test result.
Description
Technical field
The invention belongs to chip information security technology area, it is related to detection chip sensitive position in a kind of error injection test
System.
Background technique
The key messages such as in store userspersonal information, account information in chip, once utilization is attacked by criminal,
The information leakage that will be caused in chip, such as leakage of personal information, user name and password leakage, property are lost, and are caused to user
The loss that can not be retrieved.
The applicant BeiJing UnionPay Gold Card Science Co., Ltd is dedicated to studying the information security technology of chip, by various
Means of testing tests the safety of chip, provides reliable defence prompt in time for the research and development of chip, provides peace for each big bank
Complete effective chip.For the safety for ensuring chip, in the error injection test for preventing criminal from proposing for present patent application
The system and method for detection chip sensitive position proposes that targetedly, further attack method, present patent application request maintain secrecy
It examines, the technology contents of underground present patent application.
With the rapid development of electronic technology, chip has been widely used in bank transaction management, medical insurance, public
The fields such as traffic, mobile communication, provide a great convenience for people's lives, at the same time, the information security of chip
As people's extraordinarily focus of attention.
The existing attack method for chip has been not limited solely to attack Encryption Algorithm itself, and occurs very much
For the attack method of Encryption Algorithm and the cryptographic system for realizing Encryption Algorithm.Error injection attack, refers to and sets in crypto chip
By introducing mistake in cryptographic algorithm in standby, encryption device is caused to generate error result, to error result carry out analysis to
Obtain key.The major way of error injection attack is to make it can not normal work by carrying out energy source interference to encryption device
Make.Chip needs to carry out comprehensively and effectively error injection attack test to it, according to test result as important encryption device
It determines potential loophole existing for chip, repairs loophole in time, realize effective security fence.
It is found in current error injection attack test, during chip runs particular code (such as cryptographic calculation),
And all physical locations of non-attack chip can produce mistake, but the module closely related with operation, as memory module,
Algoritic module, processor module etc., which are interfered, to be possible to generate mistake.Existing test method can not accurately identify determination
The sensitive position of mistake is generated on chip vulnerable to energy interference, testing efficiency is lower.
Summary of the invention
In view of the foregoing, the purpose of the present invention is to provide detection chip sensitive positions in a kind of test of error injection
System can identify, determine sensitive position on chip vulnerable to energy interference, improve testing efficiency, while guaranteeing test result
Accuracy, validity.
To achieve the above object, the invention adopts the following technical scheme:
The system of detection chip sensitive position in a kind of test of error injection, comprising: host computer is set in mobile station
Chip to be measured, leakage current acquisition module, sensitive position analysis module, energy parameter control module,
Host computer acquires the position signal of mobile station for acquiring the status signal of chip to be measured, by the status signal,
Position signal is transmitted to sensitive position analysis module；Sensitive position for being exported according to sensitive position analysis module controls signal
Control mobile station is moved to predetermined position；
Leakage current acquisition module, the leakage current signal of the chip to be measured for acquisition, and to the leakage current signal at
After reason, it is transmitted to sensitive position analysis module；
Sensitive position analysis module, for status signal based on the received, dynamic adjusts the energy parameter of interference source, according to
Energy parameter adjusted controls signal for controlling the energy parameter of energy parameter to the output of energy parameter control module；With
In position signal based on the received, treated leakage current signal, the sensitive position of chip to be measured is determined, according to determining sensitivity
Position, the sensitive position for being moved to predetermined position for controlling mobile station to host computer output control signal；
Energy parameter control module, for controlling signal, the energy of control interference source output according to energy parameter.
The method that the sensitive position analysis module determines sensitive position is:
S1: testing N number of test position on chip to be measured, and according to the status signal of chip to be measured, dynamic is adjusted
Energy parameter determines the energy parameter upper limit；
S2: in the range of the energy parameter upper limit, testing N` test position on chip to be measured, according to
Position signal, the leakage current signal for surveying chip, determine sensitive position region, method is:
The coordinate and the corresponding leakage current mean value of corresponding test position for obtaining each test position, therefrom determine at least one
Maximum point calculates leakage current change rate of the corresponding leakage current mean value of maximum point compared to a benchmark leakage current mean value, will
The leakage current change rate is compared with a preset leakage current change threshold, if leakage current change rate is greater than leakage current and changes threshold
Value, retains corresponding extreme point, otherwise screens out corresponding extreme point；For the extreme point of reservation, determination closes on the extreme point
Several test position points, calculate the leakage current change rate of each test position point, and are compared respectively with leakage current change threshold,
If leakage current change rate is greater than leakage current change threshold, retain corresponding test position point, otherwise screens out corresponding test position
Point；By the position of test position point with a grain of salt determine sensitive position region；
Wherein, N` is greater than N.
The method that the sensitive position analysis module determines sensitive position further include:
S3: in determining sensitive position region, testing N`` test position, adjusts the leakage current variation
Threshold value updates sensitive position region according to the method for the step S2；Wherein, N`` is greater than N`.
The status signal includes whether that latch, whether normal operation occurs, and the sensitive position analysis module dynamic is adjusted
The method of whole energy parameter is:
Does judge 1: latch occur for chip to be measured? if latch occurs, judge that energy injection is excessive, if latch does not occur,
Carry out judgement 2；
Judge 2: chip to be measured is whether normal operation? it runs if normal, judges that energy injection is smaller；
According to the analysis for judging 1-2 as a result, dynamic adjustment energy parameter, generates energy parameter adjusted.
The interference source is laser, and corresponding energy parameter includes energy size, duration of disturbance, interference time
Number, the interference source are electromagnetic jammer, and corresponding energy parameter includes duration of disturbance, electromagnetic drive voltage, electromagnetism
Drive pulsewidth, interference number.
Method based on the detection chip sensitive position that above system is realized, comprising:
S1: testing N number of test position on chip to be measured, and according to the status signal of chip to be measured, dynamic is adjusted
Energy parameter determines the energy parameter upper limit；
S2: in the range of the energy parameter upper limit, testing N` test position on chip to be measured, according to
Position signal, the leakage current signal for surveying chip, determine sensitive position, method is:
The coordinate and the corresponding leakage current mean value of corresponding test position for obtaining each test position, therefrom determine at least one
Maximum point calculates leakage current change rate of the corresponding leakage current mean value of maximum point compared to a benchmark leakage current mean value, will
The leakage current change rate is compared with a preset leakage current change threshold, if leakage current change rate is greater than leakage current and changes threshold
Value, retains corresponding extreme point, otherwise screens out corresponding extreme point；For the extreme point of reservation, determination closes on the extreme point
Several test position points, calculate the leakage current change rate of each test position point, and are compared respectively with leakage current change threshold,
If leakage current change rate is greater than leakage current change threshold, retain corresponding test position point, otherwise screens out corresponding test position
Point；By the position of test position point with a grain of salt determine sensitive position region；
Wherein, N` is greater than N.
The method of detection chip sensitive position, further includes: S3: in determining sensitive position region, to N`` test position
It sets and is tested, adjust the leakage current change threshold, according to the method for the step S2, update sensitive position region；Wherein,
N`` is greater than N`.
Leakage current signal under multi collect chip normal operation to be measured, determines the benchmark leakage current mean value.
The status signal includes whether that latch, whether normal operation, the method for the dynamic adjustment energy parameter occurs
It is:
Does judge 1: latch occur for chip to be measured? if latch occurs, judge that energy injection is excessive, if latch does not occur,
Carry out judgement 2；
Judge 2: chip to be measured is whether normal operation? it runs if normal, judges that energy injection is smaller；
According to the analysis for judging 1-2 as a result, dynamic adjustment energy parameter, generates energy parameter adjusted.
The invention has the advantages that
1, the system of detection chip sensitive position of the invention, is capable of the range of adjust automatically energy parameter, and identification determines
Vulnerable to the sensitive position of energy interference on chip, test job efficiency is substantially improved, improves test automation level, reduces test
Cost；
2, the system of detection chip sensitive position of the invention avoids the subjective factors of tester from influencing completely, protects
Demonstrate,prove objectivity, accuracy, the validity of test result；
3, the system of detection chip sensitive position of the invention determines energy parameter approximate range by first coarse scan
Afterwards, it is further carried out fine scanning, test accuracy is improved, can be avoided the multiplicating energy injection of large energy to core
Piece damages.
Detailed description of the invention
Fig. 1 is the system composition block diagram of the invention.
Fig. 2 is flow chart of the method for the present invention.
Fig. 3 is the method flow diagram of dynamic adjustment energy parameter of the invention.
Fig. 4 is the method flow diagram in determination sensitive position region of the invention.
Specific embodiment
Below in conjunction with drawings and examples, the present invention is described in further detail.
As shown in Figure 1, in error injection disclosed by the invention test detection chip sensitive position system, comprising: it is upper
Machine, the chip to be measured being set in mobile station, leakage current acquisition module, sensitive position analysis module, energy parameter control module,
Interference source etc..
Interference source carries out error injection attack test to chip to be measured for exporting energy；Interference source include laser,
Electromagnetic jammer etc..
Host computer by communication module (module of data connection can be established with chip, such as follow 7816,14443, SWP,
The module of the communication protocols such as UART, USB) and chip to be measured progress data connection, the status signal of chip to be measured can be obtained, the shape
State signal includes whether to occur latch, whether normal operation etc.；Host computer obtains the position signal of mobile station by locating module,
Mobile station, which is controlled, by control module is moved to predetermined position, the status signal for the chip to be measured that host computer will acquire, mobile station
Position signal be transmitted to sensitive position analysis module.
The leakage current signal of chip to be measured is transmitted to sensitive position analysis module after the processing of leakage current acquisition module.Electric leakage
Flowing acquisition module includes leakage current signal amplification circuit, analog to digital conversion circuit, and the leakage current signal output end of chip to be measured is through leaking
After current signal amplifier circuit, analog to digital conversion circuit processing, it is transmitted to sensitive position analysis module.
Sensitive position analysis module, status signal, dynamically adjusts the energy parameter of interference source, according to adjustment based on the received
Energy parameter afterwards controls signal for controlling the energy parameter of energy parameter to the output of energy parameter control module；According to connecing
The position signal of receipts, treated leakage current signal, determine the sensitive position of chip to be measured, according to the quick of determining chip to be measured
Feel position, the sensitive position for being moved to predetermined position for controlling mobile station to host computer output controls signal.
Energy parameter control module, energy parameter controls signal based on the received, controls the energy parameter of interference source, so that
The energy of interference source output can carry out effective energy injection to the sensitive position of chip to be measured.
As shown in Fig. 2, the method for the detection chip sensitive position realized based on above system, comprising:
1, the leakage current signal under chip to be measured works normally is acquired, benchmark leakage current mean value is obtained；
Under chip normal operation to be measured, multi collect leakage current signal calculates the mean value of multiple leakage current values, obtains
Benchmark leakage current mean value.
2, coarse scan determines the energy parameter upper limit
Pass through control mobile station mobile carry out coarse scan, that is, first to individual test positions of chip to be measured (for example,
From chip upper left corner the to the lower right corner, the equidistant N number of point of scanning) energy injection is carried out, each test position carries out multiple energy note
Enter；In multiple energy injection process, dynamic adjusts energy parameter, determines the corresponding energy parameter upper limit of each test position；Such as
Shown in Fig. 3, the method that dynamic adjusts energy parameter is:
Interference source export energy to chip to be measured carry out energy injection, host computer by the status signal transmission of chip to be measured extremely
Sensitive position analysis module, sensitive position analysis module make the following judgment analysis according to the status signal of chip to be measured:
Does judge 1: latch occur for chip to be measured? if latch occurs, judge that energy injection is excessive, if latch does not occur,
Carry out judgement 2；
Judge 2: chip to be measured is whether normal operation? it runs if normal, judges that energy injection is smaller；
According to the analysis for judging 1-2 as a result, dynamic adjustment energy parameter, generates energy parameter adjusted.
Sensitive position analysis module exports energy parameter control according to energy parameter adjusted, to energy parameter control module
Signal processed, energy parameter control module control signal according to energy parameter, and the trigger signal of interference source is controlled by trigger module
(generating interference for triggering interference source), controls the parameters of interference source output signal, by energy adjustment module to carry out
Test process next time.
For laser, corresponding energy parameter includes duration of disturbance, energy size, interference number；For electricity
Magnetic disturbance device, corresponding energy parameter include duration of disturbance, electromagnetic drive voltage, electromagnetic drive pulsewidth, interference number
Deng.
3, fine scanning generates sensitive position information
Within the chip range of coarse scan, by the mobile carry out fine scanning for controlling mobile station, that is, to core to be measured
Multiple test positions (for example, from chip upper left corner the to the lower right corner, N` point of equidistant scanning, N` > 8N) of piece carry out energy note
Entering, energy parameter is no more than the energy parameter upper limit that coarse scan determines, multiple test positions cover each module of chip, with
Determine that the energy tolerance level and sensitivity of the modules of chip to be measured, each test position carry out multiple energy injection；
In multiple energy injection process, dynamic adjusts energy parameter, generates sensitive position information, specific method is:
Multiple energy injection is carried out to a test position, obtains position coordinates (x, y) and test of the test position
The corresponding multiple leakage current values in position, calculate the mean value of multiple leakage current values, obtain coordinate and test position of the test position
Set corresponding leakage current mean value；Multiple energy injection is carried out to multiple test positions, obtains the coordinate and phase of multiple test positions
The corresponding multiple leakage current values of the test position answered, calculate the mean value of multiple leakage current values, obtain the coordinate of multiple test positions
And the corresponding leakage current mean value of corresponding test position；
Setting leakage current change rate threshold value determines at least one from all test positions and corresponding leakage current mean value
A maximum point obtains the corresponding leakage current mean value of maximum point, calculates the leakage current mean value and compares with benchmark leakage current mean value
Leakage current change rate, if the leakage current change rate be greater than leakage current change threshold, retain corresponding maximum point, if electric leakage
Rheology rate is less than leakage current change threshold, then screens out corresponding maximum point；
For the maximum point of reservation, the multiple test position points closed on around the maximum point are chosen, each survey is obtained
The corresponding leakage current mean value of location point is tried, the electric leakage rheology that each leakage current mean value and benchmark leakage current mean value are compared is calculated separately
Each leakage current change rate is compared with leakage current change threshold by rate respectively, if leakage current change rate is greater than leakage current
Change threshold then retains corresponding test position point, if leakage current change rate is less than leakage current change threshold, screens out the test
Location point；Finally, it by the coordinate of all test position points remained, determines the sensitive position region on chip, generates quick
Feel location information, which includes the coordinate endpoint in sensitive position region, that is, includes coordinate (x1, y1), coordinate
(x2, y2), by coordinate (x1, y1), coordinate (x2, y2) determines sensitive position region.
3, the sensitive position information of generation is updated
According to the sensitive position information of generation, subsequent test process is carried out, in test process, further according to core to be measured
Status signal, position signal, the leakage current signal of piece, are according to the method described above updated sensitive position information.
In renewal process, leakage current change threshold is adjusted, by controlling the position of mobile station, in fixed sensitive position
In the range of region, the multiple energy injection of more test positions (N`` > N`) is carried out, the coordinate and phase of each test position are obtained
The leakage current mean value for the test position answered therefrom determines at least one maximum point, calculates the corresponding electric leakage rheology of maximum point
Rate retains corresponding maximum point, if leakage current if the leakage current change rate is greater than leakage current change threshold adjusted
Change rate is less than leakage current change threshold adjusted, then screens out corresponding maximum point.
For the maximum point of reservation, the multiple test position points closed on around the maximum point are chosen, each survey is obtained
The corresponding leakage current mean value of location point is tried, the corresponding leakage current change rate of each test position point is calculated, by each leakage current change rate
It is compared respectively with leakage current change threshold adjusted, if leakage current change rate is greater than leakage current adjusted and changes threshold
Value, then retain corresponding test position point, if leakage current change rate is less than leakage current change threshold adjusted, screens out the survey
Try location point；Finally, determining the sensitive position region on chip by the coordinate of all test position points remained, update
Sensitive position information determines more accurate sensitive position region.
The system and method for detection chip sensitive position in error injection test of the invention, by being attacked in error injection
In test process, status signal, position signal, leakage current signal of chip to be measured etc. are acquired, is believed according to its status signal, position
Number, leakage current signal identification determine the sensitive position region on chip, pre-generatmg sensitive position information is subsequent in determining sensitivity
It is further tested within the scope of the band of position, and during the test, sensitive position information is updated, is refined.The present invention can
Test job efficiency is substantially improved, guarantees accuracy, the validity of test result.
The above is presently preferred embodiments of the present invention and its technical principle used, for those skilled in the art
For, without departing from the spirit and scope of the present invention, any equivalent change based on the basis of technical solution of the present invention
Change, simple replacement etc. is obvious changes, all fall within the protection scope of the present invention.
Claims (6)
1. the system of detection chip sensitive position in error injection test characterized by comprising host computer is set to movement
Chip to be measured, leakage current acquisition module on platform, sensitive position analysis module, energy parameter control module,
Host computer acquires the position signal of mobile station, by the status signal, position for acquiring the status signal of chip to be measured
Signal is transmitted to sensitive position analysis module；Sensitive position control signal control for being exported according to sensitive position analysis module
Mobile station is moved to predetermined position；
Leakage current acquisition module, the leakage current signal of the chip to be measured for acquisition, and after handling the leakage current signal,
It is transmitted to sensitive position analysis module；
Sensitive position analysis module, for status signal based on the received, dynamic adjusts the energy parameter of interference source, according to adjustment
Energy parameter afterwards controls signal for controlling the energy parameter of energy parameter to the output of energy parameter control module；For root
According to received position signal, treated leakage current signal, the sensitive position of chip to be measured is determined, according to determining sensitive position
It sets, the sensitive position for being moved to predetermined position for controlling mobile station to host computer output controls signal；
Energy parameter control module, for controlling signal, the energy of control interference source output according to energy parameter.
2. the system of detection chip sensitive position in error injection test according to claim 1, which is characterized in that described
The method that sensitive position analysis module determines sensitive position is:
S1: testing N number of test position on chip to be measured, and according to the status signal of chip to be measured, dynamic adjusts energy
Parameter determines the energy parameter upper limit；
S2: in the range of the energy parameter upper limit, N` test position on chip to be measured is tested, according to core to be measured
Position signal, the leakage current signal of piece, determine sensitive position region, method is:
The coordinate and the corresponding leakage current mean value of corresponding test position for obtaining each test position therefrom determine at least one greatly
It is worth point, leakage current change rate of the corresponding leakage current mean value of maximum point compared to a benchmark leakage current mean value is calculated, by the leakage
Current changing rate is compared with a preset leakage current change threshold, if leakage current change rate is greater than leakage current change threshold,
Retain corresponding extreme point, otherwise screens out corresponding extreme point；For the extreme point of reservation, determination closes on the several of the extreme point
Test position point, calculates the leakage current change rate of each test position point, and is compared respectively with leakage current change threshold, if leakage
Current changing rate is greater than leakage current change threshold, retains corresponding test position point, otherwise screens out corresponding test position point；By
The position of test position point with a grain of salt determine sensitive position region；
Wherein, N` is greater than N.
3. the system of detection chip sensitive position in error injection test according to claim 2, which is characterized in that described
The method that sensitive position analysis module determines sensitive position further include:
S3: in determining sensitive position region, testing N`` test position, adjusts the leakage current change threshold,
According to the method for the step S2, sensitive position region is updated；Wherein, N`` is greater than N`.
4. the system of detection chip sensitive position in error injection test according to claim 3, which is characterized in that described
Status signal includes whether that latch, whether normal operation occurs, the sensitive position analysis module dynamic adjustment energy parameter
Method is:
Does judge 1: latch occur for chip to be measured? if latch occurs, judge that energy injection is excessive, if latch does not occur, carries out
Judge 2；
Judge 2: chip to be measured is whether normal operation? it runs if normal, judges that energy injection is smaller；
According to the analysis for judging 1-2 as a result, dynamic adjustment energy parameter, generates energy parameter adjusted.
5. the system of detection chip sensitive position in error injection test according to claim 4, which is characterized in that described
Interference source is laser, and corresponding energy parameter includes energy size, duration of disturbance, interference number, the interference source
For electromagnetic jammer, corresponding energy parameter includes duration of disturbance, electromagnetic drive voltage, electromagnetic drive pulsewidth, interference
Number.
6. the system of detection chip sensitive position in error injection test according to claim 2, which is characterized in that repeatedly
The leakage current signal under chip normal operation to be measured is acquired, determines the benchmark leakage current mean value.
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| CN105182207A (en) * | 2014-05-30 | 2015-12-23 | 国民技术股份有限公司 | Chip error injection testing method and device |
| CN105763384A (en) * | 2016-04-26 | 2016-07-13 | 中国银联股份有限公司 | Operation guarantee system of bank card switching center |
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| US9448872B2 (en) * | 2014-02-12 | 2016-09-20 | Apple Inc. | Hardware state data logger for silicon debug |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011053114A (en) * | 2009-09-02 | 2011-03-17 | Hitachi Cable Ltd | Optical transceiver inspection system |
| CN102955124A (en) * | 2011-08-31 | 2013-03-06 | 北京中电华大电子设计有限责任公司 | Test method for burr interference trigger chip latch-up effect |
| CN105182207A (en) * | 2014-05-30 | 2015-12-23 | 国民技术股份有限公司 | Chip error injection testing method and device |
| CN105763384A (en) * | 2016-04-26 | 2016-07-13 | 中国银联股份有限公司 | Operation guarantee system of bank card switching center |
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