CN107502253A - A kind of glue for high heat conduction type copper-clad plate aluminium base and preparation method thereof - Google Patents
A kind of glue for high heat conduction type copper-clad plate aluminium base and preparation method thereof Download PDFInfo
- Publication number
- CN107502253A CN107502253A CN201710617873.0A CN201710617873A CN107502253A CN 107502253 A CN107502253 A CN 107502253A CN 201710617873 A CN201710617873 A CN 201710617873A CN 107502253 A CN107502253 A CN 107502253A
- Authority
- CN
- China
- Prior art keywords
- parts
- glue
- epoxy resin
- heat conduction
- clad plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
Abstract
The invention discloses a kind of glue for high heat conduction type copper-clad plate aluminium base, include the raw material of following parts by weight：100 ± 2 parts of epoxy resin, 12.5 ± 0.1 parts of amine curing agent, 0.2 ± 0.001 part of curing accelerator, 75 ± 1 parts of solvent, 5.4 ± 0.1 parts of coupling agent, 350 ± 2 parts of inorganic filler, the epoxy resin are 70 ± 2 parts of phosphor-containing halogen-free epoxy resin or bisphenol A-type low brominated epoxy, 30 ± 2 parts of modified zinc oxide bisphenol A type epoxy resin.Preparation method is as follows：Solvent is added after amine curing agent and curing accelerator are well mixed, persistently stirs 2 hours, is allowed to be completely dissolved；Coupling agent is added in three times in impregnation tank, is stirred after adding every time and adds within 20 minutes next group, coupling agent adds inorganic filler after adding, inorganic filler is stirred 30 minutes after all adding, is allowed to stir completely；Epoxy resin is added into impregnation tank, adds rear high-speed stirred 4 ~ 6 hours, until the complete maturation of glue.Obtained product, heat resistance and thermal conductivity are high.
Description
Technical field
The present invention relates to a kind of glue for high heat conduction type copper-clad plate aluminium base and preparation method thereof.
Background technology
With expanding economy, people of various countries' quality of the life is significantly improved, and the safety requirements of various products is also got over
Come stricter.It is such it is big under the conditions of, high heat conduction type copper-clad plate aluminium base is just seasonable and raw, and cutting progressively turns into market development
Trend.In current market sales of heat-conducting plate due to the difference of technical recipe and working condition, the product of thermal conductivity copper-clad plate
Matter is uneven, have impact on degree of belief of some clients to such product to a certain extent, therefore the development to such product is made
Into a certain degree of negative influence, and it is mainly reflected in several aspects：1st, the formula of product is unreasonable, causes product to be protected
It is short to deposit the phase, back segment poor processability；2nd, client causes product fire resistance unstable to save production originally；3rd, filler is selected
It is unreasonable, cause heat conductivility unstable, potential safety hazard be present.
The content of the invention
To solve the above problems, the present invention provides a kind of glue and its preparation side for high heat conduction type copper-clad plate aluminium base
Method, the thermal conductivity and anti-flammability of obtained product are all very stable.
The technical solution adopted by the present invention is：A kind of glue for high heat conduction type copper-clad plate aluminium base, including it is following heavy
Measure the raw material of part：100 ± 2 parts of epoxy resin, 12.5 ± 0.1 parts of amine curing agent, 0.2 ± 0.001 part of curing accelerator, solvent
75 ± 1 parts, 5.4 ± 0.1 parts of coupling agent, 350 ± 2 parts of inorganic filler, the epoxy resin is phosphor-containing halogen-free epoxy resin or double
70 ± 2 parts of phenol A types low brominated epoxy, 30 ± 2 parts of modified zinc oxide bisphenol A type epoxy resin, the amine curing agent is double
1.5 ± 0.1 parts of cyanamide and 4,4 11 ± 0.1 parts of diaminodiphenylsulfones.
The curing accelerator is 2-methylimidazole, and the solvent is dimethylformamide, and the inorganic filler is high-purity
Aluminum oxide and/or high purity silicon nitride aluminium.
The particle diameter of the high purity aluminium oxide is 1 ~ 5um, and the particle diameter of the high purity silicon nitride aluminium is 1 ~ 5um.
The preparation method of the above-mentioned glue for high heat conduction type copper-clad plate aluminium base, comprises the following steps：（1）According to
Fang Liang, impregnation tank is put into after amine curing agent and curing accelerator are well mixed, then adds solvent wherein, lasting stirring
2 hours, it is allowed to be completely dissolved；（2）The coupling agent of formula ratio is added in three times in impregnation tank, 20 points are stirred after adding every time
Clock adds next group, and coupling agent adds inorganic filler after adding, stirring while adding, and inorganic filler is stirred after all adding
30 minutes, it is allowed to stir completely；（3）Epoxy resin is added into impregnation tank, continues height by 500r/min of rotating speed after adding
Speed stirring 4 ~ 6 hours, until the complete maturation of glue.
The beneficial effects of the invention are as follows：1st, the bisphenol-A type ring added by non-interactive metal oxide modified of large scale
Oxygen tree fat, so as to greatly improve the heat resisting temperature of product；2nd, by the use of DDS as main curing agent, sulfone class is belonged to, the product after solidification has
Greater compactness of molecular structure, the crosslink density of product can be improved, increase material thermal resistance and thermal conductivity；3rd, proportion of filler is big, adopts
By the use of aluminum oxide and/or aluminium nitride as filler, the thermal conductivity of material is improved；4th, the high purity aluminium oxide of different-grain diameter is rationally taken
Match somebody with somebody, improve the stacking degree of aluminum oxide, improve the thermal conductivity of material.
Embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be further described, the embodiment
It is only used for explaining the present invention, is not intended to limit the scope of the present invention..
Embodiment 1
A kind of glue for high heat conduction type copper-clad plate aluminium base, including following raw material：Low bromine type A80 epoxy resin（Br contents
18%）70 ± 2Kg, modified zinc oxide bisphenol A type epoxy resin 30 ± 2 Kg, DICY（Dicyandiamide）1.5 ± 0.01Kg, DDS（4,4
Diaminodiphenylsulfone）11 ± 0.01Kg, 2MI（2-methylimidazole）0.2 ± 0.001Kg, DMF（Dimethylformamide）75 ± 1Kg,
5.4 ± 0.01Kg of coupling agent, high purity aluminium oxide（4um）245 ± 1Kg, high purity aluminium oxide（1um）105±1Kg.
The preparation method of the above-mentioned glue for high heat conduction type copper-clad plate aluminium base, comprises the following steps：（1）By curing agent
Impregnation tank is put into after DICY, 4,4 diaminodiphenylsulfones and curing accelerator 2MI are well mixed, solvent is then added wherein, holds
Continuous stirring 2 hours, is allowed to be completely dissolved；（2）The coupling agent of formula ratio is added in three times in impregnation tank, stirred after adding every time
Mix and add within 20 minutes next group, coupling agent adds high purity aluminium oxide after adding（4um）245 ± 1Kg, high purity aluminium oxide
（1um）105 ± 1Kg, stirring while adding, inorganic filler is stirred 30 minutes after all adding, and is allowed to stir completely；（3）Will
Low bromine type A80 epoxy resin（Br contents 18%）Impregnation tank is added, continues high-speed stirred 4 ~ 6 by 500r/min of rotating speed after adding
Hour, until the complete maturation of glue.Available for preparing the high proof voltage high heat conduction type product of flame retardant type.
Common glue includes following raw material：Bisphenol A type epoxy resin 100 ± 1Kg, DICY（Dicyandiamide）2.7±
0.01Kg, 2MI（2-methylimidazole）0.2 ± 0.001Kg, DMF（Dimethylformamide）75 ± 1Kg, coupling agent 5.4 ±
0.01Kg, 350 ± 1Kg of inorganic filler（Include talcum powder, kaolin, magnesium hydroxide, aluminium hydroxide, silica, Firebrake ZB, molybdenum
One or more in sour zinc, magnesia, calcium carbonate, calcium silicates, barium sulfate and boron nitride）.
The glue of the glue of regular convention formula and the present embodiment formula is respectively used to prepare product thermal conductivity copper-clad plate, gone forward side by side
Row related data detects, as a result as shown in table 1：
。
Embodiment 2
A kind of glue for high heat conduction type copper-clad plate aluminium base, including following raw material：Low bromine type A80 epoxy resin（Br contents
18%）70 ± 2Kg, modified zinc oxide bisphenol A type epoxy resin 30 ± 2 Kg, DICY（Dicyandiamide）1.5 ± 0.01Kg, DDS（4,4
Diaminodiphenylsulfone）11 ± 0.01Kg, 2MI（2-methylimidazole）0.2 ± 0.001Kg, DMF（Dimethylformamide）75 ± 1Kg,
5.4 ± 0.01Kg of coupling agent, high purity aluminium oxide（4um）245 ± 1Kg, high purity aluminium oxide（1um）75 ± 1Kg, high purity silicon nitride aluminium
（1um）30±1Kg.
Preparation method is the same as embodiment 1.Available for preparing the high proof voltage high heat conduction type product of flame retardant type.
The glue of the glue of regular convention formula and the present embodiment formula is respectively used to prepare product, and carries out related data inspection
Survey, as a result as shown in table 2：
。
Embodiment 3
A kind of glue for high heat conduction type copper-clad plate aluminium base, including following raw material：Phosphor-containing halogen-free A80 epoxy resin（P content
3.5%）70 ± 2Kg, modified zinc oxide bisphenol A type epoxy resin 30 ± 2（Kg）, DICY（Dicyandiamide）1.5 ± 0.01Kg, DDS
（4,4 diaminodiphenylsulfones）11 ± 0.01Kg, 2MI（2-methylimidazole）0.2 ± 0.001Kg, DMF（Dimethylformamide）75±
1Kg, 5.4 ± 0.01Kg of coupling agent, high purity aluminium oxide（4um）245 ± 1Kg, high purity aluminium oxide（1um）105±1Kg.
Preparation method is the same as embodiment 1.Available for preparing the high proof voltage high heat conduction type product of flame retardant type Halogen.
The glue of the glue of regular convention formula and the present embodiment formula is respectively used to prepare product, and carries out related data inspection
Survey, as a result as shown in table 3：
。
Embodiment 4
A kind of glue for high heat conduction type copper-clad plate aluminium base, including following raw material：Phosphor-containing halogen-free A80 epoxy resin（P content
3.5%）70 ± 1Kg, modified zinc oxide bisphenol A type epoxy resin 30 ± 2（Kg）, DICY（Dicyandiamide）1.5 ± 0.01Kg, DDS
（4,4 diaminodiphenylsulfones）11 ± 0.01Kg, 2MI（2-methylimidazole）0.2 ± 0.001Kg, DMF（Dimethylformamide）75±
1Kg, 5.4 ± 0.01Kg of coupling agent, high purity aluminium oxide（4um）245 ± 1Kg, high purity aluminium oxide（1um）75 ± 1Kg, High Purity Nitrogen
Change aluminium（1um）30±1Kg.
Preparation method is the same as embodiment 1.Available for preparing the high proof voltage high heat conduction type product of flame retardant type Halogen.
The glue of the glue of regular convention formula and the present embodiment formula is respectively used to prepare product, and carries out related data inspection
Survey, as a result as shown in table 4：
。
Claims (4)
1. a kind of glue for high heat conduction type copper-clad plate aluminium base, it is characterised in that include the raw material of following parts by weight：Epoxy
100 ± 2 parts of resin, 12.5 ± 0.1 parts of amine curing agent, 0.2 ± 0.001 part of curing accelerator, 75 ± 1 parts of solvent, coupling agent
5.4 ± 0.1 parts, 350 ± 2 parts of inorganic filler, the epoxy resin is phosphor-containing halogen-free epoxy resin or the low brominated eopxy tree of bisphenol A-type
70 ± 2 parts of fat, 30 ± 2 parts of modified zinc oxide bisphenol A type epoxy resin, the amine curing agent be 1.5 ± 0.1 parts of dicyandiamide and
4,4 11 ± 0.1 parts of diaminodiphenylsulfones.
2. a kind of glue for high heat conduction type copper-clad plate aluminium base according to claim 1, it is characterised in that described solid
It is 2-methylimidazole to change accelerator, and the solvent is dimethylformamide, and the inorganic filler is high purity aluminium oxide and/or high-purity
Aluminium nitride.
A kind of 3. glue for high heat conduction type copper-clad plate aluminium base according to claim 2, it is characterised in that the height
The particle diameter of pure alumina is 1 ~ 5um, and the particle diameter of the high purity silicon nitride aluminium is 1 ~ 5um.
4. a kind of preparation method of the glue as claimed in claim 1 for high heat conduction type copper-clad plate aluminium base, its feature exist
In comprising the following steps：（1）According to formula ratio, impregnation tank is put into after amine curing agent and curing accelerator are well mixed, so
Add solvent wherein afterwards, persistently stir 2 hours, be allowed to be completely dissolved；（2）By the coupling agent of formula ratio point three in impregnation tank
Secondary addition, stirred after adding every time and add within 20 minutes next group, coupling agent adds inorganic filler after adding, and side edged stirs
Mix, inorganic filler is stirred 30 minutes after all adding, and is allowed to stir completely；（3）Epoxy resin is added into impregnation tank, added
Continue high-speed stirred 4 ~ 6 hours by 500r/min of rotating speed afterwards, until the complete maturation of glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710617873.0A CN107502253A (en) | 2017-07-26 | 2017-07-26 | A kind of glue for high heat conduction type copper-clad plate aluminium base and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710617873.0A CN107502253A (en) | 2017-07-26 | 2017-07-26 | A kind of glue for high heat conduction type copper-clad plate aluminium base and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107502253A true CN107502253A (en) | 2017-12-22 |
Family
ID=60690062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710617873.0A Pending CN107502253A (en) | 2017-07-26 | 2017-07-26 | A kind of glue for high heat conduction type copper-clad plate aluminium base and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107502253A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108834325A (en) * | 2018-08-15 | 2018-11-16 | 郑胜 | A kind of production method of one-sided circuit board |
| CN111559139A (en) * | 2020-05-20 | 2020-08-21 | 山东金宝电子股份有限公司 | Preparation method of FR4 copper-clad plate with high relative tracking index and high thermal conductivity |
| CN111823693A (en) * | 2020-06-09 | 2020-10-27 | 湖北宏洋电子股份有限公司 | Preparation method and device of high-thermal-conductivity copper-clad plate |
| CN113603867A (en) * | 2021-08-18 | 2021-11-05 | 天长市京发铝业有限公司 | Preparation method of epoxy resin curing agent for aluminum plate production |
| CN115521731A (en) * | 2022-10-11 | 2022-12-27 | 江苏联瑞新材料股份有限公司 | Functional filler with high heat conductivity and low machining abrasiveness and preparation method thereof |
| CN116896819A (en) * | 2023-06-14 | 2023-10-17 | 江门建滔积层板有限公司 | High-heat-conductivity copper-clad plate and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102786771A (en) * | 2011-05-19 | 2012-11-21 | 腾辉电子（苏州）有限公司 | Resin liquid, metal substrate adopting the resin liquid, and manufacturing method of the metal substrate |
| CN103589111A (en) * | 2012-08-13 | 2014-02-19 | 台燿科技股份有限公司 | Resin composition and use thereof |
| CN103963379A (en) * | 2014-03-05 | 2014-08-06 | 金安国纪科技股份有限公司 | Metal-based CCL (copper clad laminate) and preparation method thereof |
| CN104210182A (en) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | High heat conduction copper-clad plate for LED backlight, glue solution, preparation method of copper-clad plate, and preparation method of glue solution |
| CN105838028A (en) * | 2016-03-25 | 2016-08-10 | 金安国纪科技（杭州）有限公司 | High-heat-conductive resin composition and preparation method thereof |
-
2017
- 2017-07-26 CN CN201710617873.0A patent/CN107502253A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102786771A (en) * | 2011-05-19 | 2012-11-21 | 腾辉电子（苏州）有限公司 | Resin liquid, metal substrate adopting the resin liquid, and manufacturing method of the metal substrate |
| CN103589111A (en) * | 2012-08-13 | 2014-02-19 | 台燿科技股份有限公司 | Resin composition and use thereof |
| CN103963379A (en) * | 2014-03-05 | 2014-08-06 | 金安国纪科技股份有限公司 | Metal-based CCL (copper clad laminate) and preparation method thereof |
| CN104210182A (en) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | High heat conduction copper-clad plate for LED backlight, glue solution, preparation method of copper-clad plate, and preparation method of glue solution |
| CN105838028A (en) * | 2016-03-25 | 2016-08-10 | 金安国纪科技（杭州）有限公司 | High-heat-conductive resin composition and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 周文英等: "《导热高分子材料》", 30 April 2014, 国防工业出版社 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108834325A (en) * | 2018-08-15 | 2018-11-16 | 郑胜 | A kind of production method of one-sided circuit board |
| CN111559139A (en) * | 2020-05-20 | 2020-08-21 | 山东金宝电子股份有限公司 | Preparation method of FR4 copper-clad plate with high relative tracking index and high thermal conductivity |
| CN111823693A (en) * | 2020-06-09 | 2020-10-27 | 湖北宏洋电子股份有限公司 | Preparation method and device of high-thermal-conductivity copper-clad plate |
| CN113603867A (en) * | 2021-08-18 | 2021-11-05 | 天长市京发铝业有限公司 | Preparation method of epoxy resin curing agent for aluminum plate production |
| CN115521731A (en) * | 2022-10-11 | 2022-12-27 | 江苏联瑞新材料股份有限公司 | Functional filler with high heat conductivity and low machining abrasiveness and preparation method thereof |
| CN116896819A (en) * | 2023-06-14 | 2023-10-17 | 江门建滔积层板有限公司 | High-heat-conductivity copper-clad plate and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107502253A (en) | A kind of glue for high heat conduction type copper-clad plate aluminium base and preparation method thereof | |
| CN106671548B (en) | A kind of preparation method of CEM-1 copper-clad plates | |
| US20140087614A1 (en) | Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board | |
| TWI527850B (en) | Prepreg, paste metal laminates and printed circuit boards | |
| JP2008517136A (en) | Non-halogen flame retardant epoxy resin composition, and prepreg and copper clad laminate using the same | |
| WO2017080134A1 (en) | Epoxy resin composition and use thereof | |
| CN105419348B (en) | A kind of resin combination and prepreg and laminate using it | |
| CN104927353A (en) | Inflaming-retarding halogen-free and phosphorus-free resin composition and use thereof and preparation method applying to half-curing piece, laminated board and copper-clad plate | |
| EP0640635A1 (en) | Liquid epoxy resin composition | |
| CN110105716A (en) | A kind of highly effective flame-retardant type cycloaliphatic epoxy resin outdoor insulator castable | |
| CN102093664B (en) | Thermosetting glue solution for copper-clad substrate, preparation method thereof and forming process of halogen-free flame-retardant copper-clad substrate | |
| CN105199619B (en) | Aluminum-based copper-clad plate high-heat-conductivity glue membrane preparation method | |
| JPH03157417A (en) | Brominated epoxy composition and flame-retardant epoxy resin composition for sealing semiconductor | |
| JP2006342217A (en) | Method for producing phosphorus-containing flame-retardant bisphenol-type epoxy resin, the resultant phosphorus-containing flame-retardant bisphenol-type epoxy resin, and phosphorus-containing flame-retardant bisphenol-type epoxy resin composition | |
| JP2005255813A (en) | Epoxy resin composition and its cured product | |
| JP6331500B2 (en) | Epoxy resin composition and cured product | |
| JP2551475B2 (en) | Epoxy resin manufacturing method | |
| CN110283428A (en) | A kind of copper-clad plate halogen-free resin composition and preparation method thereof | |
| TWI290934B (en) | Varnish for laminate or prepreg, laminate or prepared using the varnish, and printed wiring board prepared using the laminate or prepreg | |
| WO2012086840A1 (en) | Diepoxy compound and process for producing same | |
| JPH09165433A (en) | Production of epoxy resin, epoxy resin composition and semiconductor sealing material | |
| CN106393885B (en) | A kind of fire-retardant copper-clad plate composition containing soft-filler | |
| EP0869148B1 (en) | Epoxy resin composition and method for producing the same | |
| JP3062822B2 (en) | Epoxy resin composition | |
| JPS6296521A (en) | Epoxy resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171222 |