CN102020959B - High heat conductivity and low dissipation factor increased layer bonding varnish - Google Patents
High heat conductivity and low dissipation factor increased layer bonding varnish Download PDFInfo
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- CN102020959B CN102020959B CN200910176410.0A CN200910176410A CN102020959B CN 102020959 B CN102020959 B CN 102020959B CN 200910176410 A CN200910176410 A CN 200910176410A CN 102020959 B CN102020959 B CN 102020959B
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- epoxy resin
- high heat
- adding proportion
- heat conduction
- low dissipation
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Abstract
The invention relates to a high heat conductivity and low dissipation factor increased layer bonding varnish, which is used for coupling printed circuit boards in high density or packaging carrier boards. The high heat conductivity and low dissipation factor increased layer bonding varnish is formed by uniformly mixing an epoxy resin precursor, a double-hardener mixture, a catalyst, a flow modifier, a high heat conductivity inorganic filler and a solvent, wherein the epoxy resin precursor is formed by mixing at least two types of epoxy resin among trifunctional epoxy resin, rubber-modified or dimmer-acid-modified epoxy resin, Br-contained epoxy resin, Br-free/P-contained epoxy resin, Br-free/P-free epoxy resin, long chain Br-free epoxy resin, bisphenol A (BPA) epoxy resin and the like in a certain ratio.
Description
Technical field
The present invention relates to that a kind of thermal conductivity is good, rheological is good, thermostability is good and reduce costs improve the high heat conduction of yield and the increasing layer adhesive for additional of low dissipation coefficient, be applicable to high-density connection stamp printed circuit board or encapsulating carrier plate.
Background technology
In recent years, along with making rapid progress of electronic technology, coming out one after another of many high-tech industries, constantly weeds out the old and bring forth the new electronic product more humane, with better function, and these electronic products are more constantly towards light, thin, short, little trend designs.Various electronic products all have at least one motherboard, it is consisted of many electronic components and circuit card, and the function of circuit card is carry and be electrically connected each electronic component, these electronic components can be electrically connected to each other, and current modal circuit card is printed circuit board (PCB).
Printed circuit board (PCB) can be linked together electronic components, makes its performance allomeric function, is therefore the indispensable basic comprising important documents of all electronics information products.Because PCB design quality is very different, not only directly affect the reliability of electronic product, competitive power that also can left and right system product, so printed circuit board (PCB) be often known as " mother of electronic system product " or " base of 3C industry ".
Now the process technique of market circuit card take information computer with the glass material base material impregnation epoxy resin of resistance to combustion copper clad laminate (FR-4) as large, and thermotolerance, low-k, environmental protection are the main considerations of FR-4 substrate.And high frequency substrate is except meeting above-mentioned performance, dielectric loss (low dissipation coefficient) is also important Consideration.The processing procedure the most often using is at present gum Copper Foil (Resin Coated Copper; RCC) the overlapped method of method or LDPP (Laser Drillable Prepreg).RCC method is Copper Foil to be coated with after roughening treatment to one dielectric layer, and rebake becomes semi-cured state (B-Stage), cuts into afterwards required size and carries out overlapped and pressing; The overlapped rule of LDPP is that deployed glue is impregnated on glasscloth, and rebake becomes B-Stage, then carries out overlapped and pressing, finally cuts into required size.
Yet the adhesive for additional that RCC method or LDPP method are used, because having following shortcoming, makes RCC method or LDPP method processing procedure not perfect:
1, the mobility of resin is poor, therefore cannot fully reach the functional of filling perforation;
2, manufacturing cost is high, and signal transmits imperfect;
3, thermal conductivity, thermostability and rheological are poor;
4, make to produce the yield reduction of printed circuit board (PCB);
5, the restriction of resin content, cannot carry out consent and face simultaneously and be coated with (or increasing layer); And
6, be difficult for producing thick copper printed circuit board (PCB).
The inventor is because above-mentioned disappearance selects differing materials formula to allocate tool different functionalities, meet environmental requirement and increase flexual adhesive for additional (Varnish).
Summary of the invention
Main purpose of the present invention is to provide that a kind of thermal conductivity is good, low-dielectric loss (or is called low dissipation coefficient; Low dissipation factor), rheological is good, thermostability is good and reduce costs the raising high heat conduction of yield and the increasing layer adhesive for additional of low dissipation coefficient.
In order to achieve the above object, the invention provides the increasing layer adhesive for additional of a kind of high heat conduction and low dissipation coefficient, for being used for high-density connection stamp printed circuit board or encapsulating carrier plate, it is by an epoxy resin precursor that this high heat conduction/low dissipation coefficient increases layer adhesive for additional, a pair of stiffening agent mixture, one catalyzer, flow modifier (Flow modifier), after one high heat conduction inorganic filler (Filler) and a solvent are even, form, wherein, this epoxy resin precursor is trifunctional basic ring epoxy resins (Tri-functional), toughness reinforcing upgrading epoxy resin (Rubber-modified or Dimmer-acid-modified), brominated epoxy resin (Br-contained), halogen-free phosphorus-containing epoxy resin (Br-free/P-contained), non-halogen non-phosphate epoxy resin (Br-Free/P-Free), long-chain halogen-free epoxy resin, dihydroxyphenyl propane (Bisphenol A, BPA) epoxy resin etc. wherein at least two kinds of epoxy resin mix to scale.
During enforcement, the adding proportion of trifunctional basic ring epoxy resins can be below 50%, the adding proportion of toughness reinforcing upgrading epoxy resin can be below 50%, the adding proportion of brominated epoxy resin can be below 80%, the adding proportion of halogen-free phosphorus-containing epoxy resin can be below 90%, the adding proportion of non-halogen non-phosphate epoxy resin can be below 90%, and the adding proportion of long-chain halogen-free epoxy resin can be below 50%, and the adding proportion of bisphenol A epoxide resin can be below 80%.
During enforcement, the addition of two stiffening agent mixtures is 2～20phr, and the addition of catalyzer is 0.1～5phr, and the addition of flow modifier is 0.1～5phr, and the addition of high heat conduction inorganic filler is 15～45phr, and the addition of solvent is 3～25phr.
During enforcement, this pair of stiffening agent mixture is the mixture forming after amine type hardeners (Amine) and sour anhydride stiffening agent (Acid Anhydride) evenly mix.This amine type hardeners adding proportion is below 10%, and sour anhydride stiffening agent adding proportion is below 30%.
During enforcement, this catalyzer is imidazoles catalyzer (Imidazole Catalyst), and adding proportion is below 10%.
During enforcement, flow modifier is acrylic copolymer or upgrading acrylic copolymer, and the average molecular weight of copolymer using (M.W.) is 5,000～200,000, and adding proportion is 0.05～10%.
During enforcement, this high heat conduction inorganic filler is selected from silicon nitride (SiN), aluminium nitride (AlN), boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al
2o
3), silicon oxide (SiO
2), magnesium oxide (MgO), zinc oxide (ZnO), beryllium oxide (BeO), aluminium hydroxide Al (OH)
3form wherein a kind of in group with kaolin (Aluminum Silicate), particle diameter is 1～50 μ m, and composition adding proportion is below 90%.
During enforcement, this solvent is selected from dimethyl formamide (DMF), dimethylcyclohexylamine (DMCA), butanone (MEK) and pimelinketone (Cyclohexanone) and forms wherein a kind of in group.
Accompanying drawing explanation
Fig. 1 is the composition diagram of the increasing layer adhesive for additional of the high heat conduction of the embodiment of the present invention and low dissipation coefficient.
The increasing layer adhesive for additional of the high heat conduction of description of reference numerals: 1-and low dissipation coefficient; 2-epoxy resin precursor; The two stiffening agent mixtures of 3-; 4-catalyzer; 5-flow modifier; The high heat conduction inorganic filler of 6-; 7-solvent.
Embodiment
Below in conjunction with accompanying drawing, to the present invention is above-mentioned, be described in more detail with other technical characterictic and advantage.
Refer to Fig. 1, graphic content is an embodiment of the increasing layer adhesive for additional of the high heat conduction of the present invention and low dissipation coefficient, for being used for high-density connection stamp printed circuit board or encapsulating carrier plate.
The increasing layer adhesive for additional 1 of the high heat conduction of the present invention and low dissipation coefficient is to form after being mixed by an epoxy resin precursor 2, a pair of stiffening agent mixture 3, a catalyzer 4, flow modifier 5 (Flow modifier), a high heat conduction inorganic filler 6 (Filler) and a solvent 7.
This epoxy resin precursor 2 is trifunctional basic ring epoxy resins (Trifunctional), toughness reinforcing upgrading epoxy resin (Rubber-modified or Dimmer-acid-modified), brominated epoxy resin (Br-contained), halogen-free phosphorus-containing epoxy resin (Br-free/P-contained), non-halogen non-phosphate epoxy resin (Br-Free/P-Free), long-chain halogen-free epoxy resin, dihydroxyphenyl propane (Bisphenol A; BPA) epoxy resin etc. wherein at least two kinds of epoxy resin mix to scale.
Wherein, the adding proportion of trifunctional basic ring epoxy resins can be below 50%, the adding proportion of toughness reinforcing upgrading epoxy resin can be below 50%, the adding proportion of brominated epoxy resin can be below 80%, the adding proportion of halogen-free phosphorus-containing epoxy resin can be below 90%, the adding proportion of non-halogen non-phosphate epoxy resin can be below 90%, and the adding proportion of long-chain halogen-free epoxy resin can be below 50%, and the adding proportion of bisphenol A epoxide resin can be below 80%.
This pair of stiffening agent mixture 3 is the mixture forming after amine type hardeners (Amine) and sour anhydride stiffening agent (AcidAnhydride) evenly mix, wherein this amine type hardeners adding proportion is below 10%, and sour anhydride stiffening agent adding proportion is below 30%.This catalyzer 4 is imidazoles catalyzer (Imidazole Catalyst), and adding proportion is below 10%.This flow modifier 5 is acrylic copolymer or upgrading acrylic copolymer, and the average molecular weight of copolymer using (M.W.) is 5,000～200,000, and adding proportion is 0.05～10%.This high heat conduction inorganic filler 6 is selected from silicon nitride (SiN), aluminium nitride (AlN), boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al
2o
3), silicon oxide (SiO
2), magnesium oxide (MgO), zinc oxide (ZnO), beryllium oxide (BeO), aluminium hydroxide and kaolin (Aluminum Silicate) forms wherein a kind of in group, particle diameter is 1～50 μ m, composition adding proportion is below 90%.And being selected from dimethyl formamide (DMF), dimethylcyclohexylamine (DMCA), butanone (MEK) and pimelinketone (Cyclohexanone), this solvent 7 forms wherein a kind of in group.The addition of two stiffening agent mixtures 3 is 2～20phr, and the addition of catalyzer 4 is 0.1～5phr, and the addition of flow modifier 5 is 0.1～5phr, and the addition of high heat conduction inorganic filler 6 is 15～45phr, and the addition of solvent 7 is 3～25phr.
Therefore, during enforcement, following list one, user can select trifunctional epoxy resin 10phr, bisphenol A epoxide resin 30phr, long-chain halogen-free epoxy resin 5phr, brominated epoxy resin 30phr and toughness reinforcing upgrading epoxy resin 25phr, come mixing preparation to go out after epoxy resin precursor, make again and weighting agent (silicon nitride 20phr, aluminum oxide 40phr, silicon oxide 40phr), two stiffening agent mixture (amine type hardeners 0.5phr, acid anhydride stiffening agent 2phr), imidazoles catalyzer 0.25phr, after flow improver additive (acrylic copolymer 2phr) and solvent (dimethyl formamide 20phr) mix, can form high heat conduction of the present invention and low dissipation coefficient and increase layer adhesive for additional, adhesive for additional viscosity is 14, 800cps, the heat-conduction coefficient of its hardening thing is 2.3W/m-K, dissipation coefficient is 0.008 (@1GHz).
Table one
Or as table two, as need modulate full-bodied adhesive for additional, user can select trifunctional epoxy resin 10phr, bisphenol A epoxide resin 25phr, long-chain halogen-free epoxy resin 5phr, non-halogen non-phosphate epoxy resin 40phr and toughness reinforcing upgrading epoxy resin 20phr, come mixing preparation to go out after epoxy resin precursor, make again and weighting agent (aluminium nitride 20phr, aluminum oxide 30phr, silicon oxide 30phr, aluminium hydroxide 20phr), two stiffening agent mixture (amine type hardeners 4phr, acid anhydride stiffening agent 10phr), imidazoles catalyzer 1.5phr, after flow improver additive (upgrading acrylic copolymer 1phr) and solvent (dimethyl formamide 20phr) mix, can form full-bodied high heat conduction and low dissipation coefficient and increase layer adhesive for additional, adhesive for additional viscosity is 21, 450cps, the heat-conduction coefficient of its hardening thing is 2.5W/m-K, dissipation coefficient is 0.007 (@1GHz).
Table two
Referring again to lower list three, user can only need to select wherein two kinds of epoxy resin to mix epoxy resin precursor, as trifunctional epoxy resin 50phr in table three and non-halogen non-phosphate epoxy resin 50phr, come mixing preparation to go out after epoxy resin precursor, make again and weighting agent (aluminium nitride 50phr, aluminum oxide 30phr, aluminium hydroxide 20phr), two stiffening agent mixture (amine type hardeners 2phr, acid anhydride stiffening agent 17phr), imidazoles catalyzer 0.5phr, after flow improver additive (upgrading acrylic copolymer 1phr) and solvent (dimethyl formamide 3phr) mix, can form full-bodied high heat conduction and low dissipation coefficient and increase layer adhesive for additional, adhesive for additional viscosity is 22, 100cps, the heat-conduction coefficient of its hardening thing is 3.0W/m-K, dissipation coefficient is 0.006 (@1GHz).
Table three
Therefore, the present invention sees through the epoxy resin precursor that above-mentioned two or more epoxy resin forms, increasing layer adhesive for additional with the evenly rear formed high heat conduction of two stiffening agent mixtures, catalyzer, flow modifier, high heat conduction inorganic filler and solvent and low dissipation coefficient, has advantages of following:
1, increasing layer adhesive for additional of the present invention can significantly reduce dissipation coefficient, is more conducive to the integrity that signal transmits.
2, thermal conductivity and the thermostability of increasing layer adhesive for additional of the present invention are good.
3, use after increasing layer adhesive for additional of the present invention, can reduce the loss of material, and improve and produce yield.
While 4, using increasing layer adhesive for additional of the present invention, can carry out consent and face simultaneously and be coated with (increasing layer), effectively simplify Production Flow Chart.
The foregoing is only preferred embodiment of the present invention, is only illustrative for the purpose of the present invention, and nonrestrictive.Those skilled in the art is understood, and in the spirit and scope that limit, can carry out many changes to it in the claims in the present invention, revise, and even equivalence, but all will fall within the scope of protection of the present invention.
Claims (3)
1. the increasing layer adhesive for additional of a high heat conduction and low dissipation coefficient, for being used for high-density connection stamp printed circuit board or encapsulating carrier plate, it is characterized in that this high heat conduction and low dissipation coefficient increasing layer adhesive for additional form after even by an epoxy resin precursor, a pair of stiffening agent mixture, a catalyzer, flow modifier, a high heat conduction inorganic filler and a solvent, wherein
This epoxy resin precursor be trifunctional basic ring epoxy resins, toughness reinforcing upgrading epoxy resin, brominated epoxy resin, halogen-free phosphorus-containing epoxy resin, non-halogen non-phosphate epoxy resin, long-chain halogen-free epoxy resin, bisphenol A epoxide resin wherein at least two kinds of epoxy resin mix to scale;
This pair of stiffening agent mixture is the mixture forming after amine type hardeners and sour anhydride stiffening agent evenly mix;
The addition of two stiffening agent mixtures is 2～20phr, and the addition of catalyzer is 0.1～5phr, and the addition of flow modifier is 0.1～5phr, and the addition of high heat conduction inorganic filler is 15～45phr, and the addition of solvent is 3～25phr;
This amine type hardeners adding proportion is below 10%, and sour anhydride stiffening agent adding proportion is below 30%.
2. the increasing layer adhesive for additional of high heat conduction as claimed in claim 1 and low dissipation coefficient, the adding proportion that it is characterized in that trifunctional basic ring epoxy resins is below 50%, the adding proportion of toughness reinforcing upgrading epoxy resin is below 50%, the adding proportion of brominated epoxy resin is below 80%, the adding proportion of halogen-free phosphorus-containing epoxy resin is below 90%, the adding proportion of non-halogen non-phosphate epoxy resin is below 90%, the adding proportion of long-chain halogen-free epoxy resin can be below 50%, and the adding proportion of bisphenol A epoxide resin is below 80%.
3. the increasing layer adhesive for additional of high heat conduction as claimed in claim 1 and low dissipation coefficient, is characterized in that this solvent is selected from dimethyl formamide, dimethylcyclohexylamine, butanone and pimelinketone and forms wherein a kind of in group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910176410.0A CN102020959B (en) | 2009-09-14 | 2009-09-14 | High heat conductivity and low dissipation factor increased layer bonding varnish |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910176410.0A CN102020959B (en) | 2009-09-14 | 2009-09-14 | High heat conductivity and low dissipation factor increased layer bonding varnish |
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| Publication Number | Publication Date |
|---|---|
| CN102020959A CN102020959A (en) | 2011-04-20 |
| CN102020959B true CN102020959B (en) | 2014-03-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337097B (en) * | 2011-07-01 | 2015-05-27 | 哈尔滨理工大学 | Preparation method of adhesive for powder-filled high-thermal-conductivity mica tape |
| CN103627144A (en) * | 2013-12-02 | 2014-03-12 | 铜陵浩荣电子科技有限公司 | Manufacturing method of high-heat-resistance copper clad plate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW342410B (en) * | 1997-05-23 | 1998-10-11 | Ind Tech Res Inst | Adhesive for soft printed circuit board (PCB), process for making the same, and use of such an adhesive in making a soft PCB |
| KR20090075736A (en) * | 2000-02-15 | 2009-07-08 | 히다치 가세고교 가부시끼가이샤 | Adhesive Composition, Process for Producing the Same, Adhesive Film Made with the Same, Substrate for Semiconductor Mounting, and Semiconductor Device |
| JP5343335B2 (en) * | 2006-09-29 | 2013-11-13 | 東レ株式会社 | Adhesive sheet for electronic equipment |
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Effective date of registration: 20210719 Address after: 2 Zhangzhou Road, Daojiao Town, Dongguan City, Guangdong Province Patentee after: Guangdong Hezheng Technology Co.,Ltd. Address before: Taoyuan County, Taiwan, China Patentee before: UNIPLUS ELECTRONICS Co.,Ltd. |
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