CN107497879A - Manufacture method for the compound plate body of electronic equipment - Google Patents
Manufacture method for the compound plate body of electronic equipment Download PDFInfo
- Publication number
- CN107497879A CN107497879A CN201710717575.9A CN201710717575A CN107497879A CN 107497879 A CN107497879 A CN 107497879A CN 201710717575 A CN201710717575 A CN 201710717575A CN 107497879 A CN107497879 A CN 107497879A
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- China
- Prior art keywords
- plate body
- manufacture method
- electronic equipment
- compound
- compound plate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The embodiment of the present invention provides a kind of manufacture method of compound plate body for electronic equipment, and the manufacture method includes the plate body of at least two pieces different materials carrying out roughening treatment；Plate body after above-mentioned roughening treatment is subjected to roller-compaction processing；Plate body after roller-compaction is handled is made annealing treatment.The manufacturing approach craft of compound plate body provided in an embodiment of the present invention for electronic equipment is simple, it is easily manufactured, reduce processing cost, obtained compound plate body excellent performance.
Description
Technical field
The present invention relates to the system in manufacture technology of composite material field, more particularly to a kind of compound plate body for electronic equipment
Make method.
Background technology
As masses are to 3C (Computer, computer；Communication, communication；Consumer Electronics,
Consumer electronics product) electronic appearance part texture, outward appearance and performance pursuit, in recent years, the material of each appearance member is from plastics
Constantly reformed to metal.
But always there are some defects in single material, it is also difficult to develop a kind of the very complete of various demands that can meet masses
Beautiful material.
As aluminium alloy have the advantages that it is light, but its intensity to be present relatively low and the defects of easily scratch；Titanium alloy, stainless steel,
Though it has that hardness is high, the corrosion-resistant characteristic such as strong to the materials such as ceramics, carbon fiber, its one side may density can not meet need
Ask, the difficulty of production and processing on the other hand can be brought the features such as its high rigidity, causes the consuming of substantial amounts of man power and material.Such as pottery
Application of the porcelain on mobile phone, on the one hand there are many technical barriers and need to capture in it in processing technology, while process used
Equipment, consumptive material etc. are also required to update, and this undoubtedly brings very big cost to enterprise.
Usual processing mobile phone metalloid frame needs to complete embryo material, particularly stainless steel-like using forging and stamping, need to reserve
Surplus is completed to finish by CNC, and this is traditional handicraft, forges and presses cost and the cost of raw material occupies very big proportion in totle drilling cost,
CNC processing costs also remain high, in face of smart mobile phone industry with keen competition uncontested advantage.
The content of the invention
The embodiment of the present invention provides a kind of manufacture method of compound plate body for electronic equipment, to solve in the prior art
The problem of the defects of being existed using single material as electronic appearance part and processing cost are higher.
In order to solve the above technical problems, the technical scheme that the embodiment of the present invention uses is：One kind is provided and is used for electronics
The manufacture method of the compound plate body of equipment, the manufacture method include：
The plate body of at least two pieces different materials is subjected to roughening treatment；
Plate body after above-mentioned roughening treatment is subjected to roller-compaction processing；
Plate body after roller-compaction is handled is made annealing treatment.
According to a specific embodiment of the invention, the plate body by least two pieces different materials, which carries out roughening treatment, to be included：
Will at least two pieces of different materials progress surface wire drawing process, wherein adjacent two boards body is with cross one another direction wire drawing,
Or wherein adjacent two boards body is with mutually perpendicular direction wire drawing.
According to a specific embodiment of the invention, the roller-compaction processing includes：Temperature be 200 DEG C -300 DEG C, 200
℃-290℃、200℃-270℃、200℃-260℃、200℃-250℃、200℃-240℃、200℃-230℃、200℃-
Thrust is applied to the plate body of at least two pieces different materials under conditions of 220 DEG C or 200 DEG C -210 DEG C.
According to a specific embodiment of the invention, the roller-compaction processing includes：To at least two pieces of different materials
Plate body apply 800 tons -1200 tons, 800 tons -1150 tons, 800 tons -1100 tons, 800 tons -1000 tons, 800 tons -1050 tons, 800
Ton -950 tons, 800 tons -900 tons of thrust.
According to a specific embodiment of the invention, the roller-compaction processing includes：The plate of at least two pieces different materials
The compression speed of body is 0.5 m/min.
According to a specific embodiment of the invention, the annealing refers to enter under conditions of temperature is 180 DEG C -200 DEG C
OK.
According to a specific embodiment of the invention, the plate body includes stainless steel plate, titanium plate, aluminium sheet and copper coin.
According to a specific embodiment of the invention, the material of the plate body is two kinds.
According to a specific embodiment of the invention, the plate body is stainless steel plate and aluminium sheet
According to a specific embodiment of the invention, the volume ratio of the stainless steel plate and the aluminium sheet is 1：2、1:3、1:4、1:
5、1:6、1:7、1:8、1:9、1:10、1:11、1:12、1:13、1:14、1:15、1:16、1:17、1:18、1:19、1:20。
According to an of the invention specific embodiment, yield strength >=210Mpa of the compound plate body, tensile strength >=
340Mpa。
According to an of the invention specific embodiment, the yield strength of the compound plate body is 210Mpa, 215Mpa, 220Mpa,
230Mpa, 240Mpa, 250Mpa etc., tensile strength 340Mpa, 350Mpa, 360Mpa, 370Mpa, 380Mpa etc..
According to an of the invention specific embodiment, compound plate body elongation percentage >=15%, the hardness of the stainless steel >=
250Hv, hardness >=50Hv of the aluminium.
According to an of the invention specific embodiment, the compound plate body elongation percentage is 17%, 19%, 20%, 22%, 25%,
28%th, 30% etc..
The beneficial effects of the invention are as follows：The situation of prior art is different from, it is provided in an embodiment of the present invention to be set for electronics
The manufacturing approach craft of standby compound plate body is simple, it is easily manufactured, reduce processing cost, obtained compound plate body performance is excellent
Different, each material of composite plate physical efficiency fusion excellent specific property while and can overcome follow-up caused by the introduction of new material
The difficulty of the exploitations such as technique, consumptive material, under the precondition for meeting public demand, the cost of enterprise can be reduced again.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing, wherein：
Fig. 1 is the flow signal of the manufacture method for the compound plate body for electronic equipment that one embodiment of the invention provides
Figure；
Fig. 2 is the flow signal of the manufacture method for the compound plate body for electronic equipment that another embodiment of the present invention provides
Figure；
Fig. 3 is compound obtained by the manufacture method for the compound plate body for electronic equipment that one embodiment of the invention provides
The parameter of plate body introduces table.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
One embodiment of the invention provides a kind of manufacture method of compound plate body for electronic equipment, and manufacture method includes：
The plate body of at least two pieces different materials is subjected to roughening treatment；
Plate body after above-mentioned roughening treatment is subjected to roller-compaction processing；
Plate body after roller-compaction is handled is made annealing treatment.
Wherein, the plate body of at least two pieces different materials is carried out into roughening treatment includes：At least two pieces of different materials it will carry out
Surface wire drawing process, wherein adjacent two boards body is with cross one another direction wire drawing, or wherein adjacent two boards body is to hang down mutually
Straight direction wire drawing.
Wherein, roller-compaction processing includes：To at least two pieces of different materials under conditions of being 200 DEG C -300 DEG C in temperature
Plate body applies 800 tons -1200 tons of thrust, and so that the compression speed of the plate body of at least two pieces different materials is 0.5 m/min
Clock.
Wherein, annealing refers to be made annealing treatment under conditions of 180 DEG C -200 DEG C.
In embodiments of the present invention, plate body is metallic plate, including stainless steel plate, titanium plate, aluminium sheet and copper coin.
In an of the invention specific embodiment, the material of plate body is two kinds, preferably stainless steel plate and aluminium sheet, stainless steel plate and
The volume ratio of aluminium sheet can be 1：2-9, or the volume ratio of stainless steel plate and aluminium sheet can be 1：3-7；Or stainless steel plate and aluminium sheet
Volume ratio can be 1：3-5.
In an alternative embodiment of the invention, compound plate body is combined by stainless steel and aluminium, and the model that stainless steel uses
For SUS304, thickness is 0.24 ± 0.015mm plate body；The model A5052 that aluminium uses, thickness are 0.73 ± 0.025mm's
Plate body.The design parameter of the compound plate body please be asked shown in the chart read in Fig. 3.
In an of the invention specific embodiment, compound plate body can it is compound by two kinds of plate bodys in stainless steel, titanium, aluminium or copper and
Into, and the volume ratio of two kinds of plate bodys is 1：The hardness of 2-19, wherein volume ratio small plate body is more than the hard of the big plate body of volume ratio
Degree, the small plate body of volume ratio use as outer layer, and the big plate body of volume ratio uses as internal layer.Specific combination may include stainless
Steel/titanium composite panel, stainless steel/aluminum composite plate, stainless steel/copper composite plate, titanium/aluminum composite board, composite board of titanium/copper, copper/aluminium are compound
Plate.
In the structural member using the compound plate body as electronic equipment, such as the moulding of mobile phone after composite plate is cut
When, can using the big plate body of hardness as outer layer plate body, to improve resistance type performance, using the small plate body of hardness as internal layer plate body,
In order to carry out internal working process, reduce difficulty of processing, reduce processing cost.
In another specific embodiment of the present invention, compound plate body can be compound by three kinds of plate bodys in stainless steel, titanium, aluminium or copper
Form, and the volume ratio of three kinds of plate bodys is 1：2-5：1, the wherein hardness of the small plate body of volume ratio is more than the big plate body of volume ratio
Hardness, the small plate body of volume ratio are used as outer layer and internal layer, and volume ratio is big to be used as intermediate layer.Specific combination can wrap
Include stainless steel/titanium/aluminum composite board, stainless steel/composite board of titanium/copper, stainless steel/aluminium/copper composite plate, titanium/aluminium/copper composite plate.
Referring to Fig. 1, in one embodiment, wire drawing is passed sequentially through using the plate body of two pieces of different materials, rolls, move back
It is compound that ignition technique carries out physics.
First, the first plate body 110, the second plate body 120 are roughened by drawing process, it is possible thereby to improve
Adhesion between plate body, the first plate body 110, the wire-drawing direction of the second plate body 120 can report to the leadship after accomplishing a task setting, such as wire-drawing direction phase
It is mutually vertical (as shown by arrows in FIG.).Certainly, roughening processing is not limited to drawing process, other techniques can also be used to carry out
Roughening processing.
Secondly, compaction technology is carried out by rolling equipment 150, by the first plate body 110, the second plate after drawing process
Body 120 is through HTHP roll-in, and the first plate body 110, the compression of the second plate body 120 can produce mobility, because produced by material difference
Mobility it is also different, two kinds of plate bodys are perfectly combined together by friction caused by the speed of flowing.
Finally, annealing process is carried out, so as to combine uniformly diffusion, adhesion is further improved and forms the composite plate needed
100。
Referring to Fig. 2, in another specific embodiment, using the plate body of three pieces of different materials pass sequentially through wire drawing, roll,
It is compound that annealing process carries out physics.
First, the first plate body 210, the second plate body 220 and the 3rd plate body 230 are carried out at roughening by drawing process
Reason, it is possible thereby to the adhesion between improving plate body, the wire drawing of the first plate body 210, the second plate body 220 and the 3rd plate body 230
Direction can be reported to the leadship after accomplishing a task setting, such as wire-drawing direction is mutually perpendicular to (as shown by arrows in FIG.).Certainly, roughening processing is not limited to
Drawing process, it can also be roughened using other techniques.
Secondly, compaction technology is carried out by rolling equipment 250, by the first plate body 210, the second plate after drawing process
The plate body 230 of body 220 and the 3rd is pressurized through HTHP roll-in, the first plate body 210, the second plate body 220 and the 3rd plate body 230
Mobility can be produced, because mobility is also different caused by material difference, is rubbed caused by the speed of flowing by two kinds of plate bodys
Perfectly it is combined together.
Finally, annealing process is carried out, so as to combine uniformly diffusion, adhesion is further improved and forms the composite plate needed
200。
In above example, aluminium sheet can be simple substance aluminum or aluminum alloy, and titanium plate can be simple substance titanium or titanium alloy, and copper coin can be single
Matter copper or copper alloy.Stainless steel, copper, titanium, aluminium or the copper-clad of the present invention includes existing all species.As stainless steel includes Ovshinsky
Body stainless steel, ferritic stainless steel, martensitic stain less steel, two phase stainless steel, precipitation-hardening stainless steel etc. are all to belong to stainless steel
The metal material of category.
In summary, it is it should be readily apparent to one skilled in the art that provided in an embodiment of the present invention for the compound of electronic equipment
Plate body structure is novel, easily manufactured, excellent performance, compound plate body, can merge the excellent specific property of each plate body and meanwhile and can overcome by
The difficulty of the exploitations such as the subsequent technique caused by introduction, consumptive material in new plate body, under the precondition for meeting public demand, again
The cost of enterprise can be reduced.
Compound plate body provided in an embodiment of the present invention for electronic equipment can both be met by the compound of multiple material
The popular demand to outward appearance, texture, lightweight, mechanical performance etc., traditional manufacturing process can be directly utilized again, does not increase processing
Difficulty, while also avoid the update of processing technology, equipment and consumptive material caused by the introducing of plastics on new materials etc., from
And the cost of enterprise greatly reduces.
By the way that in the compound resulting composite of multiple material, somewhat expensive material proportion is relatively fewer, because
This can substantially reduce the cost of material.
By the compound resulting composite of multiple material, some high rigidity and the difficult processing of high-strength material are overcome
The characteristics of, reduce the time of processing, so as to improve processing efficiency, reduce production cost.
After stainless steel and aluminium are compound, following defect of the prior art had both been overcome：
Forming technique is not mature enough, it is necessary to which substantial amounts of CNC processing can be realized, the cost of raw material is high, processing efficiency is low,
Cost of charp tool height etc..The excellent properties such as surface tactile sensation effect and high intensity, the high rigidity of stainless steel can also be obtained simultaneously, together
When also have aluminium lightweight feature, original welding technique can directly be utilized in addition by such as being welded in following process, from
And avoid the technological difficulties that stainless steel is difficult to solder to.
The present invention for existing process cost it is high the defects of improve, traditional material shaping side is replaced using aluminum material
Formula, production and processing cost can effectively be reduced by the preparation method of novelty.
Obtained compound plate body has the characteristics that intensity height, lightweight, easy-formation, processing are stable in itself.The preparation side
Method has very big cost advantage than Conventional processing methods, and raw material are only the 1/4 of Forging Technology, punching press suitable for foldable forming, are saved
Cumbersome Forging Technology, can save 80% or so, CNC efficiency than traditional handicraft can lift 25%~30%, and cutter life improves
60% or so.In addition original welding technique can directly be utilized by such as being welded in following process, so as to avoid stainless steel
The technological difficulties being difficult to solder to aluminium.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (10)
1. the manufacture method of a kind of compound plate body for electronic equipment, it is characterised in that the manufacture method includes：
The plate body of at least two pieces different materials is subjected to roughening treatment；
Plate body after above-mentioned roughening treatment is subjected to roller-compaction processing；
Plate body after roller-compaction is handled is made annealing treatment.
2. the manufacture method of the compound plate body according to claim 1 for electronic equipment, it is characterised in that described near
The plate body of few two pieces of different materials, which carries out roughening treatment, to be included：At least two pieces of different materials carry out surface wire drawing process by described in,
Wherein adjacent two boards body is with cross one another direction wire drawing, or wherein adjacent two boards body is with mutually perpendicular direction wire drawing.
3. the manufacture method of the compound plate body according to claim 1 for electronic equipment, it is characterised in that described to roll
Forming processes include：Compression is applied to the plate body of at least two pieces different materials under conditions of being 200 DEG C -300 DEG C in temperature
Power.
4. the manufacture method of the compound plate body for electronic equipment according to claim 1 or 3, it is characterised in that described
Roller-compaction processing includes：800 tons -1200 tons of thrust is applied to the plate body of at least two pieces different materials.
5. the manufacture method of the compound plate body according to claim 1 for electronic equipment, it is characterised in that described to roll
Forming processes include：The compression speed of the plate body of at least two pieces different materials is 0.5 m/min.
6. the manufacture method of the compound plate body according to claim 1 for electronic equipment, it is characterised in that the annealing
Processing is carried out under conditions of temperature is 180 DEG C -200 DEG C.
7. the manufacture method of the compound plate body according to claim 1 for electronic equipment, it is characterised in that the plate body
Including stainless steel plate, titanium plate, aluminium sheet and copper coin.
8. the manufacture method of the compound plate body according to claim 1 for electronic equipment, it is characterised in that the plate body
Material be two kinds.
9. the manufacture method of the compound plate body according to claim 8 for electronic equipment, it is characterised in that the plate body
For stainless steel plate and aluminium sheet.
10. the manufacture method of the compound plate body according to claim 9 for electronic equipment, it is characterised in that it is described not
The volume ratio of rust steel plate and the aluminium sheet is 1：2-19.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710717575.9A CN107497879A (en) | 2017-08-18 | 2017-08-18 | Manufacture method for the compound plate body of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710717575.9A CN107497879A (en) | 2017-08-18 | 2017-08-18 | Manufacture method for the compound plate body of electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN107497879A true CN107497879A (en) | 2017-12-22 |
Family
ID=60691861
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710717575.9A Pending CN107497879A (en) | 2017-08-18 | 2017-08-18 | Manufacture method for the compound plate body of electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020001331A1 (en) * | 2018-06-29 | 2020-01-02 | 比亚迪股份有限公司 | Case and method for manufacturing same, and electronic product |
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|---|---|---|---|---|
| US20100128416A1 (en) * | 2008-11-26 | 2010-05-27 | Industrial Technology Research Institute | Composite cathode foils and solid electrolytic capacitors comprising the same |
| CN102974642A (en) * | 2012-11-19 | 2013-03-20 | 湖州市银鑫轧辊有限公司 | Composite sheet material processing method |
| CN103538313A (en) * | 2012-12-03 | 2014-01-29 | 黎汉东 | Novel hot-rolled titanium-aluminum-stainless steel compound plate, production method and application thereof |
| CN105436230A (en) * | 2015-11-24 | 2016-03-30 | 太原科技大学 | Method for preparing copper-aluminum double-layer medium-thickness composite board |
-
2017
- 2017-08-18 CN CN201710717575.9A patent/CN107497879A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100128416A1 (en) * | 2008-11-26 | 2010-05-27 | Industrial Technology Research Institute | Composite cathode foils and solid electrolytic capacitors comprising the same |
| CN102974642A (en) * | 2012-11-19 | 2013-03-20 | 湖州市银鑫轧辊有限公司 | Composite sheet material processing method |
| CN103538313A (en) * | 2012-12-03 | 2014-01-29 | 黎汉东 | Novel hot-rolled titanium-aluminum-stainless steel compound plate, production method and application thereof |
| CN105436230A (en) * | 2015-11-24 | 2016-03-30 | 太原科技大学 | Method for preparing copper-aluminum double-layer medium-thickness composite board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020001331A1 (en) * | 2018-06-29 | 2020-01-02 | 比亚迪股份有限公司 | Case and method for manufacturing same, and electronic product |
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