CN107481956A - Silicon wafer cleaning device - Google Patents
Silicon wafer cleaning device Download PDFInfo
- Publication number
- CN107481956A CN107481956A CN201710577183.7A CN201710577183A CN107481956A CN 107481956 A CN107481956 A CN 107481956A CN 201710577183 A CN201710577183 A CN 201710577183A CN 107481956 A CN107481956 A CN 107481956A
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- connecting plate
- brush
- cleaning device
- conveyor belt
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 26
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- 238000004140 cleaning Methods 0.000 title claims abstract description 24
- 239000002657 fibrous material Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 abstract description 17
- 239000012535 impurity Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 18
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/137—Batch treatment of the devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Brushes (AREA)
Abstract
硅片清洗装置，包括固定架、传送带、驱动电机、连接板、第一刷头、第二刷头；所述固定架设于所述传送带上方，所述固定架顶部的一侧设有所述驱动电机，所述驱动电机的转轴相应设于所述固定架的底部，所述转轴靠近所述传送带的一端上固定有所述连接板，所述连接板靠近所述传送带的一侧上均匀设有若干个所述第一刷头；所述固定架底部的另一侧设有若干个所述第二刷头。本发明的有益效果为：（1）该清洗装置为流动性清洗工作，避免了对同一块硅片重复清洗的可能性，清洗效果良好；（2）由于每根纤维绳上都设有倒钩，当纤维绳触碰到硅片时，倒钩就会处于张开状态，将硅片表面上的一些粘附的杂质通过反作用力清除。
Silicon wafer cleaning device, including a fixed frame, a conveyor belt, a driving motor, a connecting plate, a first brush head, and a second brush head; The motor, the rotating shaft of the driving motor is correspondingly arranged at the bottom of the fixed frame, the connecting plate is fixed on the end of the rotating shaft close to the conveyor belt, and the connecting plate is evenly arranged on the side close to the conveyor belt Several first brush heads; the other side of the bottom of the fixing frame is provided with several second brush heads. The beneficial effects of the present invention are as follows: (1) The cleaning device is fluid cleaning, which avoids the possibility of repeated cleaning of the same silicon chip, and the cleaning effect is good; (2) Since each fiber rope is equipped with a barb , when the fiber rope touches the silicon wafer, the barb will be in an open state, and some adhered impurities on the surface of the silicon wafer will be removed by reaction force.
Description
技术领域technical field
本发明属于太阳能电池片制备技术领域，具体涉及硅片清洗装置。The invention belongs to the technical field of solar cell preparation, and in particular relates to a silicon wafer cleaning device.
背景技术Background technique
太阳能电池板制作的工艺流程为切片→清洗→制备绒面→周边刻蚀→去除背面PN+结→制作上下电极→制作减反射膜→烧结→测试→分档。其中在清洗的程序中，一般存在清洗不彻底的现象，比如硅片表面粘附的一些杂志，不易被清除。The process flow of solar panel production is slicing→cleaning→preparing suede→peripheral etching→removing the PN+ junction on the back→making upper and lower electrodes→making anti-reflection film→sintering→testing→grading. Among them, in the cleaning process, there is generally a phenomenon of incomplete cleaning, such as some magazines adhered to the surface of the silicon wafer, which are not easy to be removed.
发明内容Contents of the invention
本发明的目的是为了克服现有技术中的不足，提供硅片清洗装置。The object of the present invention is to provide a silicon wafer cleaning device in order to overcome the deficiencies in the prior art.
为解决上述技术问题，本发明的技术方案为：In order to solve the problems of the technologies described above, the technical solution of the present invention is:
硅片清洗装置，包括固定架、传送带、驱动电机、连接板、第一刷头、第二刷头；A silicon wafer cleaning device, including a fixed frame, a conveyor belt, a drive motor, a connecting plate, a first brush head, and a second brush head;
所述固定架设于所述传送带上方，所述固定架顶部的一侧设有所述驱动电机，所述驱动电机的转轴相应设于所述固定架的底部，所述转轴靠近所述传送带的一端上固定有所述连接板，所述连接板靠近所述传送带的一侧上均匀设有若干个所述第一刷头，所述第一刷头上均设有第一毛刷；所述固定架底部的另一侧设有若干个所述第二刷头，所述第二刷头上靠近所述传送带的一端设有第二毛刷；The fixed frame is arranged above the conveyor belt, the driving motor is provided on one side of the top of the fixed frame, the rotating shaft of the driving motor is correspondingly arranged at the bottom of the fixed frame, and the rotating shaft is close to one end of the conveyor belt The connecting plate is fixed on the connecting plate, and the side of the connecting plate close to the conveyor belt is evenly provided with a plurality of the first brush heads, and the first brush heads are all provided with first brushes; the fixed The other side of the bottom of the frame is provided with several second brush heads, and the end of the second brush heads close to the conveyor belt is provided with a second brush;
所述第二毛刷均由若干个纤维绳组成，每个所述纤维绳上均设有若干个倒钩。Each of the second brushes is composed of several fiber ropes, and each of the fiber ropes is provided with several barbs.
优选地，所述倒钩均为纤维材质。Preferably, the barbs are made of fiber.
本发明的有益效果为：（1）该清洗装置为流动性清洗工作，避免了对同一块硅片重复清洗的可能性，清洗效果良好；（2）由于每根纤维绳上都设有倒钩，当纤维绳触碰到硅片时，倒钩就会处于张开状态，将硅片表面上的一些粘附的杂质通过反作用力清除。The beneficial effects of the present invention are as follows: (1) The cleaning device is fluid cleaning, which avoids the possibility of repeated cleaning of the same silicon wafer, and the cleaning effect is good; (2) Since each fiber rope is equipped with a barb , when the fiber rope touches the silicon wafer, the barb will be in an open state, and some adhered impurities on the surface of the silicon wafer will be removed by reaction force.
附图说明Description of drawings
附图1为本发明结构示意图；Accompanying drawing 1 is a structural representation of the present invention;
附图2为本发明运行时结构示意图；Accompanying drawing 2 is the schematic diagram of structure when the present invention runs;
附图3为纤维绳结构示意图。Accompanying drawing 3 is the schematic diagram of fiber rope structure.
具体实施方式detailed description
为使对本发明的结构特征及所达成的功效有更进一步的了解与认识，用以较佳的实施例及附图配合详细的说明，说明如下：In order to have a further understanding and understanding of the structural features of the present invention and the achieved effects, the preferred embodiments and accompanying drawings are used for a detailed description, as follows:
如附图1~3所示，硅片清洗装置，包括固定架100、传送带200、驱动电机300、连接板302、第一刷头303、第二刷头400；As shown in Figures 1 to 3, the silicon wafer cleaning device includes a fixed frame 100, a conveyor belt 200, a driving motor 300, a connecting plate 302, a first brush head 303, and a second brush head 400;
如附图1所示，所述固定架100设于所述传送带200上方，所述固定架100顶部的一侧设有所述驱动电机300，所述驱动电机300的转轴301相应设于所述固定架100的底部，所述转轴301靠近所述传送带200的一端上固定有所述连接板302，所述连接板302靠近所述传送带200的一侧上均匀设有若干个所述第一刷头303，所述第一刷头303上均设有第一毛刷3031；所述固定架100底部的另一侧设有若干个所述第二刷头400，所述第二刷头400上靠近所述传送带200的一端设有第二毛刷4001；As shown in Figure 1, the fixed frame 100 is arranged above the conveyor belt 200, the driving motor 300 is arranged on one side of the top of the fixed frame 100, and the rotating shaft 301 of the driving motor 300 is correspondingly arranged on the The bottom of the fixed frame 100, the connecting plate 302 is fixed on the end of the rotating shaft 301 close to the conveyor belt 200, and a plurality of the first brushes are uniformly arranged on the side of the connecting plate 302 close to the conveyor belt 200. head 303, the first brush head 303 is provided with a first brush 3031; the other side of the bottom of the fixed frame 100 is provided with several second brush heads 400, and One end near the conveyor belt 200 is provided with a second brush 4001;
所述第二毛刷4001均由若干个纤维绳4001a组成，每个所述纤维绳4001a上均设有若干个倒钩4001b，所述倒钩4001b均为纤维材质。如附图3所示，附图3为所述纤维绳4001a处于工作状态时，也就是触碰到硅片时，由于每根纤维绳4001a上都设有倒钩4001b，当纤维绳4001a触碰到硅片时，倒钩4001b就会处于张开状态，将硅片表面上的一些粘附的杂质通过反作用力清除。The second brush 4001 is composed of several fiber ropes 4001a, and each of the fiber ropes 4001a is provided with several barbs 4001b, and the barbs 4001b are made of fiber. As shown in Figure 3, Figure 3 shows that when the fiber rope 4001a is in working condition, that is, when it touches the silicon wafer, since each fiber rope 4001a is provided with a barb 4001b, when the fiber rope 4001a touches the When reaching the silicon wafer, the barb 4001b will be in an open state, and some adhering impurities on the surface of the silicon wafer will be removed by reaction force.
首先将所需要清洗的硅片依次放置在所述传送带200上，当整个装置运作时，如附图2所示，图中箭头方向即是所述传送带200的运输方向，所述驱动电机300启动之后带动所述转轴301转动，从而带动所述连接板302转动，固定于所述连接板302上的所述第一毛刷3031就会快速的转动，从而起到初步清洗的作用，硅片继续进入所述第二毛刷4001下方，所述第二毛刷4001会随着硅片的运输而弯曲，当纤维绳4001a触碰到硅片时，倒钩4001b就会处于张开状态，将硅片表面上的一些粘附的杂质通过反作用力清除。First, the silicon wafers that need to be cleaned are placed on the conveyor belt 200 in sequence. When the whole device is in operation, as shown in Figure 2, the direction of the arrow in the figure is the transport direction of the conveyor belt 200, and the drive motor 300 is started. Then drive the rotating shaft 301 to rotate, thereby driving the connecting plate 302 to rotate, and the first brush 3031 fixed on the connecting plate 302 will rotate quickly, thereby playing the role of preliminary cleaning, and the silicon wafer continues to be cleaned. Entering under the second brush 4001, the second brush 4001 will bend along with the transportation of the silicon wafer, when the fiber rope 4001a touches the silicon wafer, the barb 4001b will be in an open state, and the silicon Some adhering impurities on the sheet surface are removed by the counter force.
本发明的有益效果为：（1）该清洗装置为流动性清洗工作，避免了对同一块硅片重复清洗的可能性，清洗效果良好；（2）由于每根纤维绳上都设有倒钩，当纤维绳触碰到硅片时，倒钩就会处于张开状态，将硅片表面上的一些粘附的杂质通过反作用力清除。The beneficial effects of the present invention are as follows: (1) The cleaning device is fluid cleaning, which avoids the possibility of repeated cleaning of the same silicon wafer, and the cleaning effect is good; (2) Since each fiber rope is equipped with a barb , when the fiber rope touches the silicon wafer, the barb will be in an open state, and some adhered impurities on the surface of the silicon wafer will be removed by reaction force.
本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是本发明的原理，在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明的范围内。本发明要求的保护范围由所附的权利要求书及其等同物界定。Those skilled in the art should understand that the present invention is not limited by the above-mentioned embodiments. What are described in the above-mentioned embodiments and the description are only the principles of the present invention. Variations and improvements, which fall within the scope of the claimed invention. The scope of protection required by the present invention is defined by the appended claims and their equivalents.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710577183.7A CN107481956A (en) | 2017-07-14 | 2017-07-14 | Silicon wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710577183.7A CN107481956A (en) | 2017-07-14 | 2017-07-14 | Silicon wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107481956A true CN107481956A (en) | 2017-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710577183.7A Pending CN107481956A (en) | 2017-07-14 | 2017-07-14 | Silicon wafer cleaning device |
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