CN107471032A - The thin-skinned burnishing device of any chamfering of chip and operating method - Google Patents
The thin-skinned burnishing device of any chamfering of chip and operating method Download PDFInfo
- Publication number
- CN107471032A CN107471032A CN201710641975.6A CN201710641975A CN107471032A CN 107471032 A CN107471032 A CN 107471032A CN 201710641975 A CN201710641975 A CN 201710641975A CN 107471032 A CN107471032 A CN 107471032A
- Authority
- CN
- China
- Prior art keywords
- chip
- motor
- chamfering
- polish
- polish brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of thin-skinned burnishing device of any chamfering of chip, it includes：Polishing disk (12), the rotary shaft (13) being connected with polishing disk (12), the second motor (14) being connected with rotary shaft (13), polish brush (11), the first motor (10) being connected with polish brush (11), first motor (10) is fixed on electric machine support (9), electric machine support (9) is fixed on horizontal pivoted arm (7), horizontal pivoted arm (7) is connected with balladeur train (4), balladeur train (4) is enclosed on screw rod (2) by neck bush (3), the periphery of screw rod (2) is provided with bushing cylinder (5), bushing cylinder (5) is fixed on support base (1).The present invention is reasonable in design, by the way that the polish brush of rotation carries out rough polishing to chip, finishing polish is processed, reaches the purpose of its chamfering mirror polish, high in machining efficiency, the chamfering surface uniformity of chip is good after polishing, and the arbitrary face of chamfering accurately can be polished.
Description
Technical field
The present invention relates to the device and operating method of photoelectron crystal materials fillet surface mirror finish, and in particular to Yi Zhongjing
The thin-skinned burnishing device of any chamfering of piece and operating method method.
Background technology
In order to avoid the chipping of chip, chamfering is carried out to it generally before wafer polishing, and chamfering is polished.It is existing
Wafer chamfering equipment be mainly equipment for grinding, when being polished to wafer chamfering face mainly by manual operations, polish angle
Unmanageable, error is larger, and chamfering surface uniformity uniformity is poor after polishing, and processing efficiency is low, and cost is high.
Therefore, necessary design is a kind of reasonable in design, easy to operate on the basis of existing technology, is easy to pair
Wafer chamfering face is polished, the high wafer chamfering mirror polish device of operating efficiency.
The content of the invention
Goal of the invention：The invention aims to overcome the deficiencies in the prior art.A kind of reasonable in design, behaviour is provided
Make simplicity, be easy to be polished wafer chamfering face, the high wafer chamfering mirror polish device of operating efficiency and its operating method.
Technical scheme：In order to realize the above object main technical schemes of the present invention are：
A kind of thin-skinned burnishing device of any chamfering of chip, it includes：Polishing disk, the rotary shaft being connected with polishing disk, with rotation
The second connected motor of rotating shaft, polish brush, the first motor being connected with polish brush, the first motor are fixed by screws in motor branch
On frame, electric machine support is fixed on horizontal pivoted arm by hexagon socket head cap screw, and horizontal pivoted arm is connected with balladeur train, and balladeur train passes through neck bush
It is enclosed on screw rod, the periphery of screw rod is provided with bushing cylinder, and bushing cylinder is fixed on support base；
Described polishing disk includes internal gear, external gear and the erratic star wheel of intermeshing connection, is opened on described erratic star wheel
Provided with hole, carrier is fixedly mounted on erratic star wheel by screw, and chip is uniformly pasted onto on carrier by paraffin；
Securing cover plate is installed at the top of the screw rod of the burnishing device；
The polish brush is located at the top of polishing disk, and polish brush includes brushing the brush being connected bright, bright with brush and installed in brush
Bristle on head.
The operating method of the thin-skinned burnishing device of any chamfering of chip of the present invention, it comprises the following steps：
A, first the chip after grinding is uniformly pasted onto on carrier by paraffin, then carrier is arranged on by screw
On erratic star wheel, polish brush is arranged on the first motor；
B, horizontal pivoted arm is rotated, polish brush is turned into polishing disk upper surface, is polished by the position adjustment for adjusting balladeur train
The distance of brush and polishing disk；Then the antiscuffing paste even application of 5 micron abrasives prepared is started on chip and polish brush
Second motor, polishing disk internal gear and external gear are driven by rotary shaft, then drive erratic star wheel to rotate, in erratic star wheel
Carrier rotates with the rotation of erratic star wheel, so as to drive the wafer rotational being pasted onto on carrier, installed in the first motor
On polish brush when starting the first motor, rotated with the rotation of the first motor so that polish brush and chip make it is relative
Motion, rough polishing is carried out to chip.
C, after rough polishing terminates, with deionized water rinsing wafer surface and polishing disk, wash on chip and polishing disk
Abrasive material, polish brush is changed, the antiscuffing paste even application of 100 nanometer abrasives is used instead on chip and polish brush, then according to step b
Identical mode of operation carries out finishing polish；
D, after finishing polish terminates, the first motor and the second motor is closed, carrier is unloaded, is removed from carrier polished
Chip.
Preferably, the operating method of the thin-skinned burnishing device of any chamfering of above-described chip, in step b, control
The relative rotation speed for making the first motor is 40 to 80rpm, and rough polishing is carried out to chip.
Preferably, the operating method of the thin-skinned burnishing device of any chamfering of above-described chip, in step c, control
The relative rotation speed for making the first motor and the second motor is 100 to 150rpm.
Preferably, the operating method of the thin-skinned burnishing device of any chamfering of above-described chip, step b and step
In c, described antiscuffing paste includes abrasive material, surfactant, grease and organic solvent.
As more preferred scheme, the operating method of the thin-skinned burnishing device of above-described any chamfering of chip, step b and
In step c, described antiscuffing paste is made up of the raw material of following masses percentage, and the mass percent of abrasive material is：20%~70%,
The mass percent of organic solvent is：20%~50%, the mass percent of surfactant is：0.5%~5%, grease
Mass percent is：0.5%~5%.
As particularly preferred technical scheme, screen to obtain by many experiments, described antiscuffing paste is by following masses hundred
Divide the raw material composition of ratio, the mass percent of abrasive material is：50%, the mass percent of organic solvent is：46%, surfactant
Mass percent be：2%, the mass percent of grease is：2%., the wherein particle diameter of step b abrasive materials is 5 microns, step c mills
The particle diameter of material is 100 nanometers.
Preferably, the operating method of the thin-skinned burnishing device of any chamfering of above-described chip, abrasive material are artificial
One kind or their mixture in diamond differential, carborundum, Brown Alundum, cubic boron, cerium oxide；
Surfactant is sodium sulfate of polyethenoxy ether of fatty alcohol, AESA, fatty alcohol polyoxy
One kind or any two kinds of mixture in vinethene sulfosuccinic acid monoesters disodium；
Grease is one kind in butter or lubricating oil；Organic solvent is one kind in coal Water Oil Or Gas.
Beneficial effect：Compared to the prior art, the present invention has the following advantages：
The thin-skinned burnishing device of any chamfering of chip provided by the invention, reasonable in design, using flexible, processing efficiency
Height, the chamfering surface uniformity of chip is good after polishing, and the arbitrary face of chamfering accurately can be polished.
The present invention, coated on chip and polish brush through chamfering, will pass through the polish brush of rotation by preferable antiscuffing paste
Rough polishing, finishing polish processing are carried out to chip, so as to which the purpose precisely polished to any fillet surface can be realized, can be overcome existing
There is technology polishing angle to be difficult to control, error is big, the shortcomings such as processing efficiency is low.
Brief description of the drawings
Fig. 1 is the structural representation of the thin-skinned burnishing device of any chamfering of chip of the present invention.
Fig. 2 is the structural representation of polish brush of the present invention.
Fig. 3 is the result schematic diagram of polishing disk of the present invention.
Fig. 4 is the result schematic diagram that the present invention posts the polishing disk after chip.
Fig. 5 is the structural representation in Fig. 4 polishing disks section.
Fig. 6 is the surface roughness analysis figure of AFM (AFM) testing result after wafer chamfering mirror polish.
Fig. 7 is the three-dimensional appearance analysis chart of AFM (AFM) testing result after wafer chamfering mirror polish.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate
The present invention rather than limitation the scope of the present invention, after the present invention has been read, those skilled in the art are each to the present invention's
The modification of the kind equivalent form of value falls within the application appended claims limited range.
Embodiment 1
As shown in Figures 1 to 5, the thin-skinned burnishing device of any chamfering of a kind of chip, it includes：Polishing disk 12, with polishing disk
12 connected rotary shafts 13, the second motor 14 being connected with rotary shaft 13, polish brush 11, the first motor being connected with polish brush 11
10, the first motor 10 is fixed by screws on electric machine support 9, and electric machine support 9 is fixed on horizontal pivoted arm by hexagon socket head cap screw 8
On 7, horizontal pivoted arm 7 is connected with balladeur train 4, and balladeur train 4 is enclosed on screw rod 2 by neck bush 3, and the periphery of screw rod 2 is provided with bushing cylinder 5,
Bushing cylinder 5 is fixed on support base 1；
Described polishing disk 12 includes internal gear 1202, external gear 1203 and the erratic star wheel 1201 of intermeshing connection, institute
Hole is offered on the erratic star wheel 1201 stated, carrier 1204 is fixedly mounted on erratic star wheel 1201 by screw 1206, chip
1205 are uniformly pasted onto on carrier 1204 by paraffin；
The top of the screw rod 2 of the burnishing device is provided with securing cover plate 6；
The polish brush 11 is located at the top of polishing disk 12, and polish brush 11 includes brushing bright 1101, is connected with brushing bright 1101
Brush 1102 and the bristle 1103 on brush 1102.
The operating method of the thin-skinned burnishing device of any chamfering of the chip of embodiment 2, it comprises the following steps：
As shown in Fig. 1 to 5, a, first the chip 1205 after grinding is uniformly pasted onto on carrier 1204 by paraffin, then
Carrier 1204 is arranged on erratic star wheel 1201 by screw 1206, polish brush 11 is arranged on the first motor 10；
B, horizontal pivoted arm 17 is rotated, polish brush 11 is turned into the upper surface of polishing disk 12, is adjusted by the position for adjusting balladeur train 4
The distance of whole polish brush 11 and polishing disk 12；Then by the antiscuffing paste even application of 5 micron abrasives prepared in chip 1205
On polish brush 11, the second motor 14, polishing disk internal gear 1202 and external gear 1203 are started by being driven by rotary shaft 13, so
Erratic star wheel 1201 is driven to rotate afterwards, the carrier 1204 in erratic star wheel 1201 turns with the rotation of erratic star wheel 1201
Dynamic, so as to drive the chip 1205 being pasted onto on carrier 1204 to rotate, the polish brush 11 on the first motor 10 is being opened
During dynamic first motor 10, rotated with the rotation of the first motor 10, so that polish brush 11 performs relative motion with chip 1205,
Rough polishing is carried out to chip 1205.It is 80rpm to control the relative rotation speed of the first motor 10 and the second motor 14, and chip 1205 is entered
Row rough polishing.
C, after rough polishing terminates, with the surface of deionized water rinsing chip 1205 and polishing disk 12, the He of chip 1205 is washed
Abrasive material on polishing disk 12, polish brush 11 is changed, use the antiscuffing paste even application of 100 nanometer abrasives instead in chip 1205 and polishing
On brush 11, finishing polish is carried out according to step b identicals mode of operation；Control the relative rotation speed of the first motor 10 and the second motor 14
For 120rpm.
D, after finishing polish terminates, the first motor 10 and the second motor 14 is closed, carrier 1204 is unloaded, from carrier 1204
On remove polished chip.
The operating method of the thin-skinned burnishing device of above-described any chamfering of chip, in step b and step c, described throwing
Light cream is made up of the raw material of following masses percentage, and the mass percent of abrasive material is：50%, the mass percent of organic solvent
For：46%, the mass percent of surfactant is：2%, the mass percent of grease is：2%.Wherein abrasive material is artificial gold
Hard rock differential；Surfactant is sodium sulfate of polyethenoxy ether of fatty alcohol；Grease is butter；Organic solvent is kerosene.
Performance detection：Wafer chamfering face after polishing is detected, its performance is：Surface roughness Ra<0.5nm.It is brilliant
The surface roughness analysis of AFM (AFM) testing result after piece chamfering mirror polish is as shown in fig. 6, three-dimensional appearance point
Analysis is as shown in Figure 7.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (7)
- A kind of 1. thin-skinned burnishing device of any chamfering of chip, it is characterised in that：It includes：Polishing disk (12), with polishing disk (12) Connected rotary shaft (13), the second motor (14) being connected with rotary shaft (13), polish brush (11), it is connected with polish brush (11) First motor (10), the first motor (10) are fixed by screws on electric machine support (9), and electric machine support (9) passes through interior hexagonal spiral shell Bolt (8) is fixed on horizontal pivoted arm (7), and horizontal pivoted arm (7) is connected with balladeur train (4), and balladeur train (4) is enclosed on spiral shell by neck bush (3) On bar (2), the periphery of screw rod (2) is provided with bushing cylinder (5), and bushing cylinder (5) is fixed on support base (1)；Described polishing disk (12) includes internal gear (1202), external gear (1203) and the erratic star wheel of intermeshing connection (1201) hole, is offered on described erratic star wheel (1201), carrier (1204) is fixedly mounted on wandering star by screw (1206) Take turns on (1201), chip (1205) is uniformly pasted onto by paraffin on carrier (1204)；Securing cover plate (6) is installed at the top of the screw rod (2) of the burnishing device；The polish brush (11) is located at the top of polishing disk (12), and polish brush (11) includes brushing bright (1101) and brushes bright (1101) Connected brush (1102) and the bristle (1103) on brush (1102).
- 2. the operating method of the thin-skinned burnishing device of any chamfering of chip described in claim 1, it is characterised in that：Including following step Suddenly：A, first the chip (1205) after grinding is uniformly pasted onto on carrier (1204) by paraffin, then by carrier (1204) It is arranged on by screw (1206) on erratic star wheel (1201), polish brush (11) is arranged on the first motor (10)；B, horizontal pivoted arm (17) is rotated, polish brush (11) is turned into polishing disk (12) upper surface, by the position for adjusting balladeur train (4) Put the distance of adjustment polish brush (11) and polishing disk (12)；Then the antiscuffing paste even application of 5 micron abrasives prepared is existed On chip (1205) and polish brush (11), the second motor (14) is started, polishing disk internal gear (1202) and external gear (1203) are logical Cross and driven by rotary shaft (13), then drive erratic star wheel (1201) to rotate, the carrier in erratic star wheel (1201) (1204) rotated with the rotation of erratic star wheel (1201), so as to drive the chip (1205) being pasted onto on carrier (1204) to turn Dynamic, the polish brush (11) on the first motor (10) is when starting the first motor (10), with the rotation of the first motor (10) And rotate, so that polish brush (11) performs relative motion with chip (1205), rough polishing is carried out to chip (1205).C, after rough polishing terminates, with deionized water rinsing chip (1205) surface and polishing disk (12), chip (1205) is washed With the abrasive material on polishing disk (12), polish brush (11) is changed, uses the antiscuffing paste even application of 100 nanometer abrasives instead in chip (1205) and on polish brush (11), finishing polish is carried out according to step b identicals mode of operation；D, after finishing polish terminates, the first motor (10) and the second motor (14) is closed, carrier (1204) is unloaded, from carrier (1204) polished chip is removed on.
- 3. the operating method of the thin-skinned burnishing device of any chamfering of chip according to claim 1, it is characterised in that：In step b, it is 40 to 80rpm to control the relative rotation speed of the first motor (10) and the second motor (14), to chip (1205) Carry out rough polishing.
- 4. the operating method of the thin-skinned burnishing device of any chamfering of chip according to claim 2, it is characterised in that：Step c In, it is 100 to 150rpm to control the relative rotation speed of the first motor (10) and the second motor (14).
- 5. the operating method of the thin-skinned burnishing device of any chamfering of chip according to claim 2, it is characterised in that：Step b In step c, described antiscuffing paste includes abrasive material, surfactant, grease and organic solvent.
- 6. the operating method of the thin-skinned burnishing device of any chamfering of chip according to claim 5, it is characterised in that：Step b In step c, described antiscuffing paste is made up of the raw material of following masses percentage, and the mass percent of abrasive material is：20%~ 70%, the mass percent of organic solvent is：20%~50%, the mass percent of surfactant is：0.5%~5%, oil The mass percent of fat is：0.5%~5%, the wherein particle diameter of step b abrasive materials is 5 microns, and the particle diameter of step c abrasive materials is received for 100 Rice.
- 7. the operating method of the thin-skinned burnishing device of any chamfering of chip according to claim 6, it is characterised in that：Abrasive material is One kind or their mixture in diamond differential, carborundum, Brown Alundum, cubic boron, cerium oxide；Surfactant is sodium sulfate of polyethenoxy ether of fatty alcohol, AESA, aliphatic alcohol polyethenoxy One kind or any two kinds of mixture in ether sulfosuccinic acid monoester disodium；Grease is one kind in butter or lubricating oil；Organic solvent is one kind in coal Water Oil Or Gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710641975.6A CN107471032A (en) | 2017-07-31 | 2017-07-31 | The thin-skinned burnishing device of any chamfering of chip and operating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710641975.6A CN107471032A (en) | 2017-07-31 | 2017-07-31 | The thin-skinned burnishing device of any chamfering of chip and operating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107471032A true CN107471032A (en) | 2017-12-15 |
Family
ID=60598105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710641975.6A Pending CN107471032A (en) | 2017-07-31 | 2017-07-31 | The thin-skinned burnishing device of any chamfering of chip and operating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107471032A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108994670A (en) * | 2018-08-02 | 2018-12-14 | 叶庆国 | A kind of servo motor rotor Intelligent Machining System |
| CN110871399A (en) * | 2018-08-29 | 2020-03-10 | 东泰高科装备科技（北京）有限公司 | Planetary wheel and polishing method |
| CN113523948A (en) * | 2021-09-09 | 2021-10-22 | 江苏佳晟精密设备科技有限公司 | Automatic machining control method and equipment |
| CN114833715A (en) * | 2022-03-01 | 2022-08-02 | 浙江富芯微电子科技有限公司 | Silicon carbide wafer polishing device and method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201579692U (en) * | 2009-12-30 | 2010-09-15 | 东南大学 | Polishing device of electrochemical electrode |
| CN202964353U (en) * | 2012-12-05 | 2013-06-05 | 有研半导体材料股份有限公司 | Processing equipment for achieving silicon wafer back damage |
| CN103158054A (en) * | 2011-12-19 | 2013-06-19 | 张卫兴 | Two methods of achieving single-side polishing on double-side polishing machine |
| CN205166644U (en) * | 2015-11-30 | 2016-04-20 | 桐乡市凯瑞包装材料有限公司 | Adjustable steel sheet burnishing device |
| CN105538076A (en) * | 2016-02-05 | 2016-05-04 | 刘汝河 | Polishing paste for glass and glass polishing repair method |
| CN205520873U (en) * | 2016-01-20 | 2016-08-31 | 鹰潭市瑞源微型元件有限公司 | But microelement quick replacement brushes first burnishing machine |
| CN106826510A (en) * | 2016-12-30 | 2017-06-13 | 郑州晶润光电技术有限公司 | A kind of chip clears off technique |
-
2017
- 2017-07-31 CN CN201710641975.6A patent/CN107471032A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201579692U (en) * | 2009-12-30 | 2010-09-15 | 东南大学 | Polishing device of electrochemical electrode |
| CN103158054A (en) * | 2011-12-19 | 2013-06-19 | 张卫兴 | Two methods of achieving single-side polishing on double-side polishing machine |
| CN202964353U (en) * | 2012-12-05 | 2013-06-05 | 有研半导体材料股份有限公司 | Processing equipment for achieving silicon wafer back damage |
| CN205166644U (en) * | 2015-11-30 | 2016-04-20 | 桐乡市凯瑞包装材料有限公司 | Adjustable steel sheet burnishing device |
| CN205520873U (en) * | 2016-01-20 | 2016-08-31 | 鹰潭市瑞源微型元件有限公司 | But microelement quick replacement brushes first burnishing machine |
| CN105538076A (en) * | 2016-02-05 | 2016-05-04 | 刘汝河 | Polishing paste for glass and glass polishing repair method |
| CN106826510A (en) * | 2016-12-30 | 2017-06-13 | 郑州晶润光电技术有限公司 | A kind of chip clears off technique |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108994670A (en) * | 2018-08-02 | 2018-12-14 | 叶庆国 | A kind of servo motor rotor Intelligent Machining System |
| CN108994670B (en) * | 2018-08-02 | 2020-08-11 | 湖南德晟智能科技有限公司 | Intelligent machining system for servo motor rotor |
| CN110871399A (en) * | 2018-08-29 | 2020-03-10 | 东泰高科装备科技（北京）有限公司 | Planetary wheel and polishing method |
| CN113523948A (en) * | 2021-09-09 | 2021-10-22 | 江苏佳晟精密设备科技有限公司 | Automatic machining control method and equipment |
| CN114833715A (en) * | 2022-03-01 | 2022-08-02 | 浙江富芯微电子科技有限公司 | Silicon carbide wafer polishing device and method |
| CN114833715B (en) * | 2022-03-01 | 2024-04-16 | 浙江富芯微电子科技有限公司 | Silicon carbide wafer chemical polishing device and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107471032A (en) | The thin-skinned burnishing device of any chamfering of chip and operating method | |
| CN104551900B (en) | Silicon carbide wafer bevel grinding, milling and polishing machine and operation method thereof | |
| CN206855154U (en) | Stainless steel tube sanding apparatus | |
| CN205129589U (en) | Polishing machine | |
| CN104608044B (en) | The method and its device of annular groove magnetic abrasive finishing inside and outside a kind of seal sleeve part | |
| CN104889878A (en) | Coning movement type finishing device suitable for wheel disc type parts and method thereof | |
| CN105215831A (en) | Stainless steel tube diameter polishing device | |
| CN203887674U (en) | Coning motion finishing machining device suitable for wheel disc type part | |
| CN105643428A (en) | Grinding and polishing method using revolving elastomer | |
| CN107671686A (en) | One kind efficiently clears off machine | |
| CN208614487U (en) | A kind of linear R RL type three-axis numerical control rubbing down machining tool | |
| CN208005349U (en) | A kind of rotating device of Domestic glass edge polisher | |
| CN110091247A (en) | A kind of grinding and polishing device | |
| CN208557099U (en) | A kind of automatic polishing device of wood-based product | |
| CN108714851A (en) | A kind of automatic polishing device of wood-based product | |
| CN208246550U (en) | Automatic bathroom polishing machine | |
| CN105234808B (en) | Stainless steel tube internal diameter polishing device | |
| CN206998573U (en) | A kind of automatic waxing apparatus in aluminium alloy production polishing machine | |
| CN108789131A (en) | A kind of screw rod bottom diameter grinder | |
| CN209007235U (en) | A kind of spring end face automatic grinding device | |
| CN102848286B (en) | Sander bottom a kind of storage sphere | |
| CN211193363U (en) | Polishing and wire drawing device | |
| CN209175454U (en) | A kind of condenser polishing machine | |
| CN207358812U (en) | A kind of vertical polishing machine | |
| CN208214987U (en) | A kind of interior base cylindrical grinder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171215 |
|
| RJ01 | Rejection of invention patent application after publication |