CN1074559A - The fusing shell-type gas-sensitive element structure - Google Patents
The fusing shell-type gas-sensitive element structure Download PDFInfo
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- CN1074559A CN1074559A CN92100514.8A CN92100514A CN1074559A CN 1074559 A CN1074559 A CN 1074559A CN 92100514 A CN92100514 A CN 92100514A CN 1074559 A CN1074559 A CN 1074559A
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- gas sensor
- gas
- platinum filament
- coil
- sensitive
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- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000011540 sensing material Substances 0.000 claims abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 70
- 229910052697 platinum Inorganic materials 0.000 claims description 36
- 150000003057 platinum Chemical class 0.000 claims 1
- 239000003054 catalyst Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000001953 sensory effect Effects 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 238000005979 thermal decomposition reaction Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000019633 pungent taste Nutrition 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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Abstract
The present invention relates to gas sensor, feature is that the heating temperature-sensitive coil in the gas sensor is fused, and becomes two electrodes, and a shell with the heating temperature sensing material of the equal UNICOM of two electrodes is arranged.
Description
The present invention relates to gas sensor.Purpose provides novel gas-sensitive element structure.Improve the performance of existing gas sensor.
To different gas sensors, different structure will appear in the present invention, mainly to liking: semiconductor gas sensor, carrier catalyst element, thermal conductance type gas sensor etc.Following elder generation makes brief description to these several gas sensors:
Semiconductor gas sensor is divided into slug type (as Fig. 1, Fig. 4), thick-film type (as Fig. 2), film-type (as Fig. 3) usually from moulding process; From mode of heating, can be divided into heater-type (as Fig. 1,2,3), directly-heated type (as Fig. 4).
Among Fig. 1,2,3,1 be insulator or substrate, by high temperature insulating material such as pottery, Al
2O
3Or moulding such as glass.2a, 2b are test electrode.3 is gas sensory, as SnO
2, ZnO etc.4 is heater, can be heater coil, also can be metal oxide heating material layer.
Among Fig. 4,1 is heater coil.2 is the insulating ceramics pipe.3a, 3b are test electrode.4 is gas sensory.5 is catalyst, improves the selectivity to gas.
The operation principle of semiconductor gas sensor is, heater is heated to certain working temperature with semiconductor air-sensitive material, the conductivity of test gas sensory, in pure air with the atmosphere that has tested gas in, difference will appear in the conductivity of gas sensory, can detect the concentration of tested gas by certain circuit.
Defectives such as semiconductor gas sensor exists poor repeatability, and the response time is long, and power consumption is big, on structure and geometric parameter, cause these defectives to mainly contain following reason:
1, geometry is irregular, has influenced the consistency of each temperature of gas sensor, is subjected to environmental condition such as temperature easily, the influence that humidity and gas flow rate change.
2, volume is too big, is (1.5～3) as the substrate of film-type gas detecting element
2Mm
2Square, the chip area of thick film gas sensing element is bigger, the insulating ceramics length of tube of directly heated gas sensing element is generally at 3～4mm, the about 1.4mm of external diameter, volume is also bigger, and corresponding thermal capacity, area of dissipation are also big, and it is also big in the required power consumption of uniform temperature to keep gas sensor like this; On the other hand, the response time of volume ambassador gas sensor increases.
Carrier urges element to be generally prolate sphere, spheroid or spheroid, structure such as Fig. 5.Wherein 1 is carrier, as Al
2O
3, MgO, TiO
2Deng, 2 are heating temperature-sensitive coil, are become by platinum filament or alloy filament winding, 3 is catalyst, as Pb, Pt etc.
The operation principle of carrier catalyst element is, mode with energising makes heating temperature-sensitive coil generation heat that whole carrier catalyst element is risen to certain working temperature, when running into imflammable gas, catalytic oxidation will take place in the surface of carrier catalyst element, the heat that produces rises the temperature of carrier catalyst element, the resistance that this temperature difference will heat the temperature-sensitive coil produces an increment, this increment has corresponding relation with tested gas concentration, by the circuit of certain way, can detect the concentration of imflammable gas in the environment.
Thermal conductance type gas sensor profile is generally spheroid, its structure such as Fig. 6.Wherein 1 is heating temperature-sensitive coil, and 2 is heat carrier, by sinter moldings such as glass, potteries.
The operation principle of thermal conductance type gas sensor is, mode with energising makes the warm coil generation of heating heat that thermal conductance type gas sensor is risen to certain working temperature, when running into thermal conductivity and air the tested gas of certain difference arranged, because the change of external heat transfer condition, the temperature of thermal conductance type gas sensor will rise or descend, this temperature difference makes the resistance of heating temperature-sensitive coil produce a difference, and circuit is in a certain way handled this difference, can detect the concentration of tested gas.
Carrier catalyst element and thermal conductance type gas sensor, shape be rule, and the main problem that exists is that power consumption is big, sensitivity is not high.The main cause that causes this situation is that normally used platinum filament coil, platinum filament minimum diameter are that 0.010mm(is domestic owing to add the restriction of hotness coil method), resistivity is Cm(0 ℃ of 9.83 μ Ω), the power consumption reduction is restricted like this; On the other hand, the temperature coefficient of resistance of platinum filament is 3.9 * 10
-3/ ℃ about, correspondingly limited sensitivity.
Because what carrier catalyst element detected usually is imflammable gas, from explosion-proof angle, should reduce power consumption as far as possible, increase coefficient of safety, from practical standpoint, help gas detecting instrument to portable development.To thermal conductance type gas sensor, when the thermal conductivity of tested gas and air thermal conductivity are more or less the same, need heating temperature-sensitive coil that very high sensitivity be arranged, but the platinum filament coil is not competent.
The present invention is directed to the problem that above-mentioned normal gas sensor exists, designed novel structure and manufacturing process, explanation is used the present invention and is made carrier catalyst element, thermal conductance type gas sensor, the principle technology and the final structure of semiconductor gas sensor respectively below.
Carrier catalyst element and thermal conductance type gas sensor:
1, uses the platinum filament coil of spooling equipment coiling certain specification.
2, to high temperature insulating material (pottery, glass, the Al of qualified platinum filament coil with the method moulding certain specification of coating sintering or thermal decomposition
2O
3Deng), shown among Fig. 72.
3, go up the heating material shell of operation pieces O.K. with the method moulding certain specification of coating sintering or thermal decomposition, the optional resistivity height of using, the PTC that temperature coefficient of resistance is big, NTC material and metal oxide etc. are shown among Fig. 73.
4, go up the carrier layer of operation pieces O.K., as Al with the method moulding certain specification of coating sintering or thermal decomposition
2O
3, among Fig. 7 shown in 3.
5, upward the platinum filament coil two ends of operation pieces O.K. add power supply, boosted voltage is until fusing (because the platinum filament coiler part is than two ends wire temperature height rapidly, so fusing always occurs in the platinum filament coiler part), shown among Fig. 76, the platinum filament coil just is divided into two like this, become two electrodes that link with the heating material shell, shown in 1a, 1b among Fig. 7.So far work the parts that add the temperature-sensitive effect and just become the heating material shell by original platinum filament coil.
6, go up operation pieces O.K. impregnation catalyst agent solution, form the carrier that one deck contains catalyst, shown among Fig. 75.
Through above-mentioned operation, promptly produce " fusing shell-type carrier catalyst element ".As shown in Figure 7.
The manufacturing of " fusing shell-type thermal conductance type gas sensor " only needs 4 changes of operation in the above-mentioned technology as follows:
4, go up the method moulding one deck high temperature dense matter of operation pieces O.K., as glass, pottery with coating sintering.
So far, making finishes.
Owing to used the semiconductor temperature-sensitive material (PTC) of high resistivity, depress in same electrical, to compare with the platinum filament coil, the operating current of gas sensor will reduce greatly, thereby reduce the power consumption of element; The temperature coefficient of resistance of semiconductor temperature-sensitive material is 1～5 * 10 simultaneously
-2/ ℃, the sensitivity of gas sensor is compared with original use platinum filament coil and is improved 2～10 times.
Semiconductor gas sensor
1, uses the platinum filament coil of spooling equipment coiling certain specification, shown among Fig. 82.
2, go up the operation pieces O.K. and carry out the surface insulation processing,, carry out anodic oxidation then and form fine and close Al on its surface as platinum filament coil and lead-in wire are aluminized earlier
2O
3Thin layer.
3, axially pass a platinum filament along last operation pieces O.K., the platinum filament diameter is not more than 1/10 of platinum filament internal coil diameter usually.
4, go up the operation pieces O.K. with the method moulding high temperature insulating material of thermal decomposition and reach certain specification, as use Al(NO
3)
3See among Fig. 8 shown in 3.
5, go up the operation pieces O.K. and can use coating sintering, the method moulding layer of semiconductor gas sensitive of thermal decomposition or vacuum coating is shown among Fig. 84.
6, the platinum filament coil electricity to last operation pieces O.K. heats, and makes its fusing to axially passing the also rapid boosted voltage of platinum filament energising.See (because platinum filament coil segment temperature is the highest, so axial platinum filament striking point is always in this interval) shown in 6 among Fig. 8.So axial platinum filament just is divided into two, and becomes two test electrodes that link with the gas sensory layer, shown in 1a, 1b among Fig. 8.
7, go up the operation pieces O.K. and mix catalyst on the surface, to improve selectivity, as shown in Figure 5 among Fig. 8 with methods such as dipping or sputters.
So far promptly produce " fusing shell-type semiconductor gas sensor ", as Fig. 8.
Owing to adopted above-mentioned technology, the geometry of gas sensor is sphere or long ball shape, improved the uniformity consistency of element body temperature, the volume of gas sensor also dwindles greatly simultaneously, for example, if the internal diameter φ 0.2mm of platinum filament coil, then the diameter of gas sensor body can be as small as s φ 0.5mm, accordingly, the power consumption of gas sensor be Fig. 1～4 forms the gas sensor power consumption 1/10～1/5; Volume reduce also to make the corresponding shortening of response time of gas sensor, repeatability improves.
Below structural principle of the present invention is made roughly and concluding:
1, the platinum filament coil of coiling certain specification, the geometric parameter of on the one hand definite gas sensor, when guaranteeing the platinum filament coil on the other hand or axially wearing the platinum filament energising fusing of platinum filament coil, striking point is at the platinum filament coil segment.
2, fusing platinum filament coil or axially pass the platinum filament of platinum filament coil forms and heating temperature-sensitive or the gas sensitive shell links and distance is certain two electrodes.
3, moulding one deck heating temperature-sensitive or gas sensitive shell in the gas sensor body, the relevant physical parameter of gas sensor can be controlled by the material composition of shell and the geometric parameter of shell.
Claims (2)
1, a kind of gas-sensitive element structure, feature are that the heating temperature-sensitive coil in the gas sensor is fused, and become two electrodes, and the shell of the heating temperature sensing material of one and two equal UNICOM of electrode is arranged in the gas sensor.
2, a kind of gas-sensitive element structure, feature are to have one axially to pass platinum filament in the heater coil of gas sensor, and this platinum filament becomes two electrodes in the fusing of heater coil Duan Youyi place, and the gas sensitive shell of one and two equal UNICOM of electrode is arranged in the gas sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN92100514.8A CN1074559A (en) | 1992-01-13 | 1992-01-13 | The fusing shell-type gas-sensitive element structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN92100514.8A CN1074559A (en) | 1992-01-13 | 1992-01-13 | The fusing shell-type gas-sensitive element structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1074559A true CN1074559A (en) | 1993-07-21 |
Family
ID=4938636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN92100514.8A Pending CN1074559A (en) | 1992-01-13 | 1992-01-13 | The fusing shell-type gas-sensitive element structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1074559A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105004765A (en) * | 2015-07-02 | 2015-10-28 | 吉林大学 | Mesoporous CuO/SnO2 adsorption enhanced sensor, and detection method |
| CN106415254A (en) * | 2014-05-23 | 2017-02-15 | 通用电气公司 | Fuse for detecting failure of gas trap |
-
1992
- 1992-01-13 CN CN92100514.8A patent/CN1074559A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106415254A (en) * | 2014-05-23 | 2017-02-15 | 通用电气公司 | Fuse for detecting failure of gas trap |
| CN105004765A (en) * | 2015-07-02 | 2015-10-28 | 吉林大学 | Mesoporous CuO/SnO2 adsorption enhanced sensor, and detection method |
| CN105004765B (en) * | 2015-07-02 | 2017-09-26 | 吉林大学 | Mesoporous CuO/SnO2Absorption sensitizing type sensor and detection method |
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| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |