CN107454805A - Vr产品散热结构 - Google Patents
Vr产品散热结构 Download PDFInfo
- Publication number
- CN107454805A CN107454805A CN201710752029.9A CN201710752029A CN107454805A CN 107454805 A CN107454805 A CN 107454805A CN 201710752029 A CN201710752029 A CN 201710752029A CN 107454805 A CN107454805 A CN 107454805A
- Authority
- CN
- China
- Prior art keywords
- mainboard
- heat
- track
- camera
- conducting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 238000007789 sealing Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 238000005119 centrifugation Methods 0.000 claims 1
- 239000006185 dispersion Substances 0.000 abstract description 6
- 238000007664 blowing Methods 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000013016 damping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710752029.9A CN107454805B (zh) | 2017-08-28 | 2017-08-28 | Vr产品散热结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710752029.9A CN107454805B (zh) | 2017-08-28 | 2017-08-28 | Vr产品散热结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107454805A true CN107454805A (zh) | 2017-12-08 |
CN107454805B CN107454805B (zh) | 2023-10-27 |
Family
ID=60494133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710752029.9A Active CN107454805B (zh) | 2017-08-28 | 2017-08-28 | Vr产品散热结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107454805B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112068653A (zh) * | 2020-09-04 | 2020-12-11 | 天津凌浩科技有限公司 | 一种基于vpx加固主板的计算机系统 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102378550A (zh) * | 2010-08-20 | 2012-03-14 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
CN102455766A (zh) * | 2010-10-29 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 电子装置 |
US20130039752A1 (en) * | 2011-08-09 | 2013-02-14 | Quanta Computer Inc. | Centrifugal fan module, heat dissipation device having the same and electric device having the heat dissipation device |
CN205665639U (zh) * | 2016-05-19 | 2016-10-26 | 成都林动科技有限公司 | 一种迷你主机 |
CN205958846U (zh) * | 2016-07-29 | 2017-02-15 | 合肥宝龙达信息技术有限公司 | 一种紧凑型无线vr/ar头盔 |
US20170184863A1 (en) * | 2015-12-24 | 2017-06-29 | Sulon Technologies Inc. | Cooling system for head mounted device |
CN207185065U (zh) * | 2017-08-28 | 2018-04-03 | 歌尔科技有限公司 | Vr产品散热结构 |
-
2017
- 2017-08-28 CN CN201710752029.9A patent/CN107454805B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102378550A (zh) * | 2010-08-20 | 2012-03-14 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
CN102455766A (zh) * | 2010-10-29 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 电子装置 |
US20130039752A1 (en) * | 2011-08-09 | 2013-02-14 | Quanta Computer Inc. | Centrifugal fan module, heat dissipation device having the same and electric device having the heat dissipation device |
US20170184863A1 (en) * | 2015-12-24 | 2017-06-29 | Sulon Technologies Inc. | Cooling system for head mounted device |
CN205665639U (zh) * | 2016-05-19 | 2016-10-26 | 成都林动科技有限公司 | 一种迷你主机 |
CN205958846U (zh) * | 2016-07-29 | 2017-02-15 | 合肥宝龙达信息技术有限公司 | 一种紧凑型无线vr/ar头盔 |
CN207185065U (zh) * | 2017-08-28 | 2018-04-03 | 歌尔科技有限公司 | Vr产品散热结构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112068653A (zh) * | 2020-09-04 | 2020-12-11 | 天津凌浩科技有限公司 | 一种基于vpx加固主板的计算机系统 |
Also Published As
Publication number | Publication date |
---|---|
CN107454805B (zh) | 2023-10-27 |
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Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201014 Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Applicant after: GoerTek Optical Technology Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Applicant before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20221117 Address after: 266104 No. 500, Songling Road, Laoshan District, Qingdao, Shandong Applicant after: GOERTEK TECHNOLOGY Co.,Ltd. Address before: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronics office building) Applicant before: GoerTek Optical Technology Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |